Samsung HT-F4500 User manual

5.1CHBlu-ray™Home
EntertainmentSystem
ModelNameHT-F4500
ModelCodeHT-F4500/EN
SERVICEMANUAL
5.1CHBlu-ray™Home
EntertainmentSystem
HT-F4500
Contents
1.Precaution
2.ProductSpecication
3.DisassemblyandReassembly
4.Troubleshooting
5.PCBDiagram
6.SchematicDiagram
RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents
Contents
1.Precaution........................................................................................................................................1−1
1.1.SafetyPrecautions...................................................................................................................1−1
1.2.ServicingPrecautions...............................................................................................................1−3
1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)..............................................................1−4
2.ProductSpecication.........................................................................................................................2−1
2.1.ProductFeature.......................................................................................................................2−1
2.2.Specications..........................................................................................................................2−2
2.3.SpecicationsAnalysis.............................................................................................................2−4
2.4.Accessories............................................................................................................................2−5
2.4.1.SuppliedAccessories...................................................................................................2−5
3.DisassemblyandReassembly..............................................................................................................3−1
3.1.OverallDisassemblyandReassembly..........................................................................................3−1
4.Troubleshooting................................................................................................................................4−1
4.1.CheckpointsbyErrorMode.......................................................................................................4−1
4.1.1.NoPower...................................................................................................................4−2
4.1.2.NoAudio...................................................................................................................4−3
4.1.3.DiscLoadingError......................................................................................................4−4
4.1.4.Remotedoesn’twork...................................................................................................4−5
4.1.5.Noimageonscreen.....................................................................................................4−7
4.1.6.Discskipsorfreezing...................................................................................................4−10
4.1.7.NoDiscReadingError.................................................................................................4−11
4.1.8.NetworkError.............................................................................................................4−12
4.2.Initialization&UpgradeMethods...............................................................................................4−13
4.2.1.HowtocheckF/Wversion............................................................................................4−13
4.2.2.Howtoupdatermware................................................................................................4−14
4.2.3.ColdStartMethod(InitializeSetup)................................................................................4−16
4.3.Buyer-RegionCodeSettingMethod............................................................................................4−17
4.3.1.InsertingtheRegionCodeafterreplacingtheMainPCB.....................................................4−17
5.PCBDiagram...................................................................................................................................5−1
5.1.WiringDiagram.......................................................................................................................5−1
5.2.FRONTPCBTop....................................................................................................................5−2
5.2.1.PinConnection...........................................................................................................5−3
5.2.2.TestPointWaveForm..................................................................................................5−4
5.3.FRONTPCBBottom...............................................................................................................5−5
5.4.MAINPCBTop......................................................................................................................5−6
5.4.1.PinConnection...........................................................................................................5−7
5.4.2.TestPointWaveForm..................................................................................................5−8
5.5.MAINPCBBottom..................................................................................................................5−9
iCopyright©1995-2012SAMSUNG.Allrightsreserved.

Contents
5.6.SMPSPCBTop.......................................................................................................................5−10
5.6.1.PinConnection...........................................................................................................5−11
5.7.SMPSPCBBottom..................................................................................................................5−12
6.SchematicDiagram...........................................................................................................................6−1
6.1.OverallBlockDiagram.............................................................................................................6−1
6.2.FRONT.................................................................................................................................6−2
6.2.1.TestPointWaveForm..................................................................................................6−3
6.3.DC-DCPOWER......................................................................................................................6−4
6.4.DIR/ADC/VIDEO...................................................................................................................6−5
6.5.HDMI/ARC............................................................................................................................6−6
6.5.1.TestPointWaveForm..................................................................................................6−7
6.6.NAND/ETHERNET/USB.........................................................................................................6−8
6.7.DDR3BANK#0......................................................................................................................6−9
6.8.DDR3BANK#1......................................................................................................................6−10
6.9.MISC/UART/STRAP...............................................................................................................6−11
6.10.F/E-1.....................................................................................................................................6−12
6.11.F/E-2.....................................................................................................................................6−13
6.12.FRONTMICOM.....................................................................................................................6−14
6.13.PWM....................................................................................................................................6−15
6.14.AMP.....................................................................................................................................6−16
6.15.SMPS-1.................................................................................................................................6−17
6.16.SMPS-2.................................................................................................................................6−18
Copyright©1995-2012SAMSUNG.Allrightsreserved.ii

1.Precaution
1.Precaution
FollowthesesafetyinstructionswhileservicingtheESDtopreventdamageandtoprotectagainstpotentialhazards
suchaselectricalshockandX-rays.
1.1.SafetyPrecautions
1)Whenreinstallingthechassisanditsassemblies,besuretorestorealloftheprotectivedevices,includingthecontrol
knobsandthecompartmentcovers.
2)Makesurethattherearenocabinetopeningsthroughwhichpeople(particularlychildren)canmakecontactwith
dangerousinternalcomponents.
3)DesignAlterationWarning:Neveralteroraddtothemechanicalorelectricaldesignoftheunit.
Example:Donotaddauxiliaryaudioorvideoconnectors.Suchalterationsmightcreateasafetyhazard.Also,any
designchangesoradditionswillvoidthemanufacturer’swarranty.
4)LeakageCurrentHotCheckFigure1.1ACLeakageTest:
WARNING
Donotuseanisolationtransformerduringthistest.Usealeakage-currenttesterorameteringsystemthatcomplies
withAmericanNationalStandardsInstitute(ANSIC101.1,LeakageCurrentforAppliances),andUnderwriters
Laboratories(ULPublicationUL1410,59.7).
Withtheunitcompletelyreassembled,plugtheACcorddirectlyintoa120VACoutlet.Withtheunit’spowerswitched
fromtheONtotheOFFposition,measurethecurrentbetweenaknowngroundandallexposedmetalparts.
KnownGrounds-Earth
KnownMetalparts-Screwheads,MetalCabinets,etc.
DEVICE
UNDER
TES T
LEAKAGE
CURRENT
TES TE R
TES T ALL
EXPO SED METAL
SU RFACES
2-WIRE C ORD
ALSO TES T WITH
PLUG R EVER SE D
(US ING AC
ADAPTER PLUG
AS R EQ UIRED)
EARTH
GROUND
(READING
SH OULD NOT BE
ABOVE 0.5m A)
Figure1.1ACLeakageTest
1-1Copyright©1995-2012SAMSUNG.Allrightsreserved.

1.Precaution
5)InsulationResistanceColdCheck:
(1)Withtheunit’sACplugdisconnectedfromtheACsource,connectanelectricaljumperacrossthetwoACprongs.
(2)SetthepowerswitchtoON.
(3)MeasuretheresistancebetweentheshortedACplugandanyexposedmetallicparts.
Example:Screwheads,MetalCabinets,AntennaPort,etc.Ifanyoftheexposedmetallicpartshasareturnpathto
thechassis,themeasuredresistanceshouldbebetween1and5.2megohms.Ifthereisnoreturnpath,themeasured
resistanceshouldbe“innite”.Iftheresistanceisoutsidetheselimits,ashockhazardmightexist.
SeeFigure1.2InsulationResistanceTest
Ante nn a
Term ina l
ohm
Expo se d
Meta l Pa rt
Ohmme te r
Figure1.2InsulationResistanceTest
6)Components,partsandwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith
partsthatmeettheoriginalspecications.Alwaysdeterminethecauseofdamageoroverheating,andcorrectany
potentialhazards.
7)Observetheoriginalleaddress,especiallynearthefollowingareas:
Antennawiring,sharpedges,andespeciallytheACandhighvoltagepowersupplies.Alwaysinspectforpinched,
out-of-place,orfrayedwiring.Donotchangethespacingbetweencomponentsandtheprintedcircuitboard.Checkthe
ACpowercordfordamage.Makesurethatnowiresorcomponentstouchthermallyhotparts.
8)ProductSafetyNotice:
Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichmightnotbeobviousfromvisual
inspection.Thesesafetyfeaturesandtheprotectiontheygivemightbelostifthereplacementcomponentdiffersfrom
theoriginal–evenifthereplacementisratedforhighervoltage,wattage,etc.
9)Componentsthatarecriticalforsafetyareindicatedinthecircuitdiagrambyshading,or.
Usereplacementcomponentsthathavethesameratings,especiallyforameresistanceanddielectricstrength
specications.Areplacementpartthatdoesnothavethesamesafetycharacteristicsastheoriginalmightcreate
shock,reorotherhazards.
Copyright©1995-2012SAMSUNG.Allrightsreserved.1-2

1.Precaution
1.2.ServicingPrecautions
1)Servicingprecautionsareprintedonthecabinet.Followthem.
2)Alwaysunplugtheunit’sACpowercordfromtheACpowersourcebeforeattemptingto:
(a)Removeorreinstallanycomponentorassembly,(b)Disconnectanelectricalplugorconnector,(c)Connecta
testcomponentinparallelwithanelectrolyticcapacitor.
3)Somecomponentsareraisedabovetheprintedcircuitboardforsafety.Aninsulationtubeortapeissometimesused.
Theinternalwiringmaybeclampedtopreventcontactwiththermallyhotcomponents.Reinstallallsuchelements
totheiroriginalposition.
4)Afterservicing,alwayscheckthatthescrews,componentsandwiringhavebeencorrectlyreinstalled.Makesurethat
theportionaroundtheservicedparthasnotbeendamaged.
5)ChecktheinsulationbetweenthebladesoftheACplugandaccessibleconductiveparts(examples:metalpanels,
inputterminalsandearphonejacks).
6)InsulationCheckingProcedure:
DisconnectthepowercordfromtheACsource.Connectaninsulationresistancemeter(500V)tothebladesofthe
ACplug.TheinsulationresistancebetweeneachbladeoftheACplugandaccessibleconductiveparts(seeabove)
shouldbegreaterthan1megohm.
7)NeverdefeatanyoftheB+voltageinterlocks.DonotapplyACpowertotheunit(oranyofitsassemblies)unlessall
solid-stateheatsinksarecorrectlyinstalled.
8)Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthepositivelead;
alwaysremovetheinstrument’sgroundleadlast.
CAUTION
Firstreadthe“SafetyPrecautions”sectionofthismanual.Ifsomeunforeseencircumstancecreatesaconictbetweenthe
servicingandsafetyprecautions,alwaysfollowthesafetyprecautions.
1-3Copyright©1995-2012SAMSUNG.Allrightsreserved.

1.Precaution
1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)
Somesemiconductor(“solidstate”)devicesareeasilydamagedbystaticelectricity.
SuchcomponentsarecalledElectrostaticallySensitiveDevices(ESDs).
Examplesincludeintegratedcircuitsandsomeeld-effecttransistors.
Thefollowingtechniqueswillreducetheoccurrenceofcomponentdamagecausedbystaticelectricity:
1)Immediatelybeforehandlinganysemiconductorcomponentsorassemblies,draintheelectrostaticchargefromyour
bodybytouchingaknownearthground.Alternatively,wearadischargingwrist-strapdevice.(Besuretoremoveit
priortoapplyingpower–thisisanelectricshockprecaution.)
2)AfterremovinganESD-equippedassembly,placeitonaconductivesurfacesuchasaluminumfoiltoprevent
accumulationofelectrostaticcharge.
3)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargesthatdamageESDs.
4)Useonlyagrounded-tipsolderingironwhensolderingorunsolderingESDs.
5)Useonlyananti-staticsolderremovaldevice.Manysolderremovaldevicesarenotratedas“anti-static”(thesecan
accumulatesufcientelectricalchargetodamageESDs).
6)DonotremoveareplacementESDfromitsprotectivepackageuntilyouarereadytoinstallit.
MostreplacementESDsarepackagedwithleadsthatareelectricallyshortedtogetherbyconductivefoam,aluminum
foilorotherconductivematerials.
7)ImmediatelybeforeremovingtheprotectivematerialfromtheleadsofareplacementESD,touchtheprotectivematerial
tothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.
8)MinimizebodymotionswhenhandlingunpackagedreplacementESDs.Motionssuchasbrushingclothestogether,or
liftingafootfromacarpetedoorcangenerateenoughstaticelectricitytodamageanESD.
Copyright©1995-2012SAMSUNG.Allrightsreserved.1-4

2.ProductSpecication
2.ProductSpecication
2.1.ProductFeature
■Featuresfor2013modelBDHTS
•BD-LIVEfromthebeginningoftheMassProduction.
•DTS-HDMasterAudiodecodingfromthebeginningoftheMassProduction.
•MP3,MKV ,MP4,WMA,WMV
•Support11CP(Netix,Pandora,CinemaNow,Vudu.,etc)
•1USBport(Front)
•Support3DDisc
•HDMI1.4withARC
•DLNA
2-1Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.ProductSpecication
2.2.Specications
■BasicSpecication
PowerRequirementsAC110-220V ,50/60Hz
PowerConsumption67.5W
Weight5.5Ibs
Dimensions16.9(W)x2.0(H)x9.8(D)inches
OperatingTemperatureRange+41°Fto+95°F
General
OperatingHumidityRange10%to75%
Signal/noiseratio55dB
Usablesensitivity12dB FMT uner
Totalharmonicdistortion0.5%
BD(Blu-rayDisc)ReadingSpeed:9.834m/sec
ReadingSpeed:6.98~7.68m/sec.
DVD(DigitalVersatileDisc)
Approx.PlayTime(SingleSided,SingleLayerDisc):135min.
ReadingSpeed:4.8~5.6m/sec.
CD:5inches
(COMPACTDISC)MaximumPlayTime:74min.
ReadingSpeed:4.8~5.6m/sec.
Disc
CD:31/2inches
(COMPACTDISC)MaximumPlayTime:20min.
Video1080p,1080i,720p,480p
HDMI
AudioPCMmultichannelaudio,Bitstreamaudio,PCMaudio
Frontspeakeroutput80Wx2(3Ω)
Centerspeakeroutput80W(3Ω)
Surroundspeakeroutput165Wx2(3Ω)
Subwooferspeakeroutput100W(3Ω)
Analoginput20Hz~20kHz(±3dB)
Frequencyresponse
Digitalinput20Hz~40kHz(±4dB)
S/NRatio70dB
Channelseparation60dB
Amplier
Inputsensitivity(AUX)500mV
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-2

2.ProductSpecication
■SpeakerSpecications
5.1chspeakersystem
Speakersystem
FrontSurroundCenterSubwoofer
Impedance3Ω3Ω3Ω3Ω
Frequencyrange140Hz~20kHz140Hz~20kHz140Hz~20kHz40Hz~160Hz
Outputsoundpressure
level87dB/W/M87dB/W/M87dB/W/M88dB/W/M
Ratedinput80W80W80W100W
Maximuminput160W160W160W200W
Dimensions
(WxHxD)(inches)3.03x4.25x2.753.03x4.25x2.758.97x3.03x2.756.10x11.81x
11.22
Speaker
Weights(Ibs)0.780.841.086.36
2-3Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.ProductSpecication
2.3.SpecicationsAnalysis
ModelNameHT-FM45/HT-F4500HT-E4500
Photo
ProleBlu-ray5.0fromthebeginningBlu-ray2.0fromthebeginning
DVD,CDOO
MP3,JPGO
(MP4,MKV ,WMA,WMV)
O
(MP4,MKV ,WMA,WMV)
USBHOSTOO
iPod/iPhoneXO
(OnlyDigitalUSBAUDIOsupport)
WirelessLANXX
WirelessRearSpeakerXX
MemorySlotInternalStorageSupportInternalStorageSupport
DLNA,Widgetsupport11CPSupport5CP
Energy-StarUnder0.5WUnder0.5W
V ACCUMTUBEXX
2D/3D2D/3D2D
SMPS2trans
Stand-ByPowerConsumption0.2W
1trans
Stand-ByPowerConsumption0.7W
DualFreeV oltage
DECKDrawtypeDrawtypePlasticCover
PickUp7GPickup6GVEPickup
FrontMicomRENESASSANYO
MAINChipMTKBROADCOM
Wi-FiLANDongleXX
HDMIINXX
Main↔LoaderBACKENDMTK
(Loader:includedMTK)
BACKENDBROADCOM
(Loader:includedBROADCOM)
TIP
O:FeatureIncluded
X:NotIncluded
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-4

2.ProductSpecication
2.4.Accessories
2.4.1.SuppliedAccessories
AccessoriesItemItemcode
RemoteControlAH59-02530A
Batteries(AAAsize)4301-000116
PowerCable3903-000525
FMAntennaAH42-00021A
User’sManualAH68-02574M
AH68-02574N
2-5Copyright©1995-2012SAMSUNG.Allrightsreserved.

3.DisassemblyandReassembly
3.DisassemblyandReassembly
3.1.OverallDisassemblyandReassembly
CAUTION
•Becarefultofollowthedisassemblysequencedescribedinthemanual.Otherwise,theproductmaybedamaged.
•BesuretocarefullyreadandunderstandthesafetyinstructionsbeforeperforminganyworkastheICchipson
thePCBarevulnerabletostaticelectricity.
•Inordertoassemblereversetheorderofdisassembly.
DescriptionDescriptionPhoto
1.Unfasten3screwsonthebackand2onthesides.
Back:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A
Side:BH,+,B,M3,L8,ZPC(BLK),SWRCH18A
CAUTION
Becarefulnottomakeanyscratchesasyouremovethem.
2.Liftthetopcover.
3.Disconnect2FFCcablesfromdeckandSMPSwireandfanwire
andFFCcablefromfrontassy.
Unfasten3screwsontheMainPCB.
:BH,+,B,M3,L6,ZPC(WHT),SWRCH18A
4.3screwsonthebackside.
:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A
Copyright©1995-2012SAMSUNG.Allrightsreserved.3-1

3.DisassemblyandReassembly
DescriptionDescriptionPhoto
5.DisassembleandliftMainPCB.
6.Liftuponthe3hooksconnectingtheCOVER-FRONTtothe
COVER-BOTTOM.
7.Liftthe2hooksonthesideoftheCOVER-FRONT
ToremovetheFRONT-COVERallhooksmustbedisconnect
atthesametimeandyoushouldliftfromthebottomandpull
Upandawayfromthedevice.
8.The4hooksonthetopwillbeloosenedasyouliftthe
FRONT-COVERfromthebottom.
9.Unfasten3screwsontheFrontPCB.
:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A
3-2Copyright©1995-2012SAMSUNG.Allrightsreserved.

3.DisassemblyandReassembly
DescriptionDescriptionPhoto
10.UnfastentheAssy-Deckbypushingthelockingpointsontheside.
<Locking Point>
11.Unfasten5screwsontheSMPS.
Copyright©1995-2012SAMSUNG.Allrightsreserved.3-3

3.DisassemblyandReassembly
DescriptionDescriptionPhoto
12.Unfasten3screwsonthebackside.
:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A)
RemovetheSMPSandFan.
3-4Copyright©1995-2012SAMSUNG.Allrightsreserved.

4.Troubleshooting
4.Troubleshooting
4.1.CheckpointsbyErrorMode
OscilloscopeSettingValuesNormalVoltage24MHz32.768KHz
V oltage/DIV1V/div200mV/div500mV/div
TIME/DIV100ms/div100ns/div100us/div
Copyright©1995-2012SAMSUNG.Allrightsreserved.4-1

4.Troubleshooting
4.1.1.NoPower
Re -Conne ct P owe r Ca ble .
No
Cha nge S MP S.
Cha nge S MP S.
No
Ye s
Ye s
Power ca ble
is connected correctly?
CN21 #11, #12 pin
3.4V is OK?
No
Ye s
Doe s CN21
#6, #7, #8 pin have 12V?
No Powe r
Cha nge MAIN P CB.
4-2Copyright©1995-2012SAMSUNG.Allrightsreserved.

4.Troubleshooting
4.1.2.NoAudio
Re -conne ct or cha nge
spe a ke r ca ble .
No
No No
Ye s
Ye s
Spe a ke r J ack,
ca ble plug is ok?
S pe a ke r ca ble s
are ok?
The re is no a udio
s ound from s pe a ke r.
Change MAIN PCB.
Ye s
Re-soldering problem's
components.
Ye s
No s ound a t a ll cha nne ls ?
Do Components
on I2S line s a nd output
block have problems?
(soldering etc...)
Cha nge s pe a ke r ja ck
or ca ble .
Change M AIN P CB.
Che ck I2S Line s a nd
output block re fe r to
ne xt pa ge s .
No
Copyright©1995-2012SAMSUNG.Allrightsreserved.4-3

4.Troubleshooting
4.1.3.DiscLoadingError
Upda te Firmwa re .
No
No
Re -conne ct Ca ble s .
Ye s
Two Ca ble s be twe e n
MAIN and DECK a re connectoe d
corre ctly?
Ca n't it play a ll of dis c?
Cha nge MAIN P CB.
No
No
Cha nge MAIN P CB.
Ye s
Ye s
Front End P owe rs
(12V, 5V, 3.3V) are OK?
Is SP IN Motor working?
Dis c Loa ding Error
Ye s
Cha nge De ck.
4-4Copyright©1995-2012SAMSUNG.Allrightsreserved.