Samsung NP900X4D User manual

Amor2-14CRVM
NP900X4D
SERVICEMANUAL
NP900X4DContents
1.Precaution
2.Introduction
3.DesassemblyandReassembly
4.Troubleshooting
5.SystemWireDiagram
RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents
Contents
1.Precaution........................................................................................................................................1−1
1.1.GeneralAfter-SalesServicePrecautions.......................................................................................1−1
1.2.SafetyPrecautions...................................................................................................................1−2
1.3.Ground..................................................................................................................................1−3
1.4.StaticElectricityPrecautions......................................................................................................1−4
2.Introduction.....................................................................................................................................2−1
2.1.ProductFeatures......................................................................................................................2−1
2.2.Specication...........................................................................................................................2−2
2.3.Comparingproductspecications...............................................................................................2−7
2.4.FunctionofProduct..................................................................................................................2−8
2.5.NewTechnology/ability..........................................................................................................2−14
2.6.Hardware...............................................................................................................................2−21
2.7.Software................................................................................................................................2−27
2.8.BiosSetup..............................................................................................................................2−29
2.9.HW&OptionMaterials............................................................................................................2−34
3.DesassemblyandReassembly..............................................................................................................3−1
3.1.MainSystem...........................................................................................................................3−1
3.2.TOPA ’ssy..............................................................................................................................3−4
3.3.LCDA’ssy..............................................................................................................................3−6
4.Troubleshooting...............................................................................................................................4−1
4.1.Generalspec...........................................................................................................................4−1
4.2.DebuggingFlowChart..............................................................................................................4−2
4.3.Diagnosisapplication...............................................................................................................4−5
4.4.SystemDiagnosis....................................................................................................................4−7
4.5.HardwareTroubleshooting........................................................................................................4−8
4.5.1.LCD.........................................................................................................................4−8
4.5.2.ProblemsrelatedwithPower.........................................................................................4−9
4.5.3.Others.......................................................................................................................4−11
4.6.CPUFANControl....................................................................................................................4−14
4.7.Other.....................................................................................................................................4−16
4.8.H/WUpgrade..........................................................................................................................4−17
5.SystemWireDiagram........................................................................................................................5−1
5.1.SystemLayout........................................................................................................................5−1
5.2.SystemComponent..................................................................................................................5−3
iCopyright©1995-2012SAMSUNG.Allrightsreserved.

1.Precaution
1.Precaution
1.1.GeneralAfter-SalesServicePrecautions
1)Donotletcustomersrepairtheproductthemselves..
›Thereisadangerofinjuryandtheproductlifetimemaybeshortened.
2)Makesuretodisconnectthepowercordfromthewalloutletbeforerepairingtheproduct(especiallyforafter-sales
serviceofelectricparts).
›Thereisadangerofelectricshock.
3)Donotletcustomersplugseveralelectrichomeappliancesintoasinglewalloutletatthesametime.
›Thereisadangerofreduetooverheating.
4)Checkifthepowerplugorwalloutletaredamagedinanyway.
›Ifadefectisfound,repairorreplaceitimmediately.
(Thereisadangerofelectricshockorre)
5)Makesurethatitisproperlygrounded.
(Checkthegroundofthewalloutlet)
›Electricityleakagemaycauseelectricshock.
DEVICE
UNDER
TES T
(RE ADING S HOULD)
NOT BE ABOVE 0 .5mA
LEAKAGE
CUR RE NT
TES TE R
TES T ALL
EXP OS E D METAL
S URFACE S
2-WIRE C OR D
*ALSO TES T WITH
P LUG RE VER S ED
(US ING AC ADAPTE R
P LUG AS RE QUIRE D) EARTH
GR OUND
Figure1.1LeakageCurrentTestCircuit
6)Donotspraywaterontotheproducttocleanit.
›Thereisadangerofelectricshockorreanditmayshortenthelifetimeoftheproduct..
7)Checktheassemblystatusoftheproductaftertheafter-salesservice..
›Theassemblystatusoftheproductmustbethesameasbeforetheafter-salesservice.
8)Unplugthepowercordholdingthepowerplug(andnotthecord).
›Ifthecordisdisconnected,itmaycauseelectricshockorre.
9)Repairtheproductusingonlyauthorizedparts
10)Keeptheproductawayfromheatingdevicessuchasheaters.
›Exposuretoheatersmaycausedeformationoftheproductorre.
Copyright©1995-2012SAMSUNG.Allrightsreserved.1-1

1.Precaution
1.2.SafetyPrecautions
1)EMI
ThisdevicehasbeenregisteredregardingEMIforresidentialuse.Itcanbeusedinallareas.
2)CircuitT est(LogicTest)Precautions
TheLSIandMSIusedinthisproductaresemiconductorintegratedcircuitsbasedonMOS-FETorCMOS.Since
thesetypesofdevicesarehighlysusceptibletostaticelectricityorcurrentleakage,anisolationbreakmaybecaused.
Thereforereadandfollowtheinstructionsbelow.
a)WhenhandlinganLSIorMSI,makesureyourbodyisgroundedthroughafewmega-ohmsofresistance.In
addition,wearglovesandajacketmadeofcottonandnotofsyntheticbersthateasilygeneratestaticelectricity.
b)Whenrepairingtheproduct,placeaconductivematerial(e.g.aluminumfoil)groundedtotheearthontheworktable.
c)Youmustuseasolderingironwithoutaleakagecurrent.
d)DonottouchthepinofanICandcarefullyinserttheICintotheblackplasticpackage.
e)WheninsertinganICintoaPCB,becarefulwiththedirectionoftheIC.WheninstallinganICinthewrong
direction,itmightbecomedamaged.
f)WhencarryinganIC,packagetheICwithconductingmaterialsuchasaluminumfoilorconductingspongesoasto
keepthevoltagelevelofeachoftheterminalsthesame.
g)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.
h)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.
i)WhensolderinganIC,solderitinasshortatimeaspossiblesothatunnecessaryheatisnotappliedtothedevice.
j)AvoidleavingexcessiveamountsofuxwithinacustomICorbetweenthepinswhensolderingacustomIC.
k)TakecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard.
l)TakecaretonotbreaktheprintedcircuitpatternonthePCBwhenseparateanIC.
1-2Copyright©1995-2012SAMSUNG.Allrightsreserved.

1.Precaution
1.3.Ground
Theproductmustbegroundedtoprotectitfromstaticelectricityandotherdangers.Whenusingamultitap,pleaseusea
multitapwithagroundterminalonly.
Ifyouusea220Vwalloutletwithagroundterminal,youdonotneedtogrounditadditionally.Avoidusingwalloutletsif
theyarenotgroundedeveniftheyhaveagroundterminal.
Togroundtheproduct,connectthegroundtoanexclusivegroundterminalormetalwaterpipe.Connectthegroundcableto
thegroundterminalattherearofthemainbody.Togroundtheproduct,connectthegroundterminaloftheproducttoa
metalwaterpipe,walloutletorexclusivegroundterminalwithanelectricwireequaltoorthickerthan#18.
NevergroundtheproducttoaPVCwaterpipe,phoneline,TV ,radioantenna,aluminumwindoworgaspipe,becausethis
doesnotactuallygroundtheproductandmaybedangerous.
Copyright©1995-2012SAMSUNG.Allrightsreserved.1-3

1.Precaution
1.4.StaticElectricityPrecautions
Manypartsofthesystemaresusceptibletostaticelectricity.Usinganelectrostaticdischarge(ESD)deviceisveryimportant
forthesafetyoftheuserandtheuser'ssurroundings.UsinganESDdeviceincreasestheprobabilityofasuccessfulrepair
andlowerstheexpensesfordamagedparts.
Topreventstaticelectricity,followtheinstructionsbelow.
1)Performtherepairinalocationwithoutstaticelectricity.
2)Touchyourhandstoametalwaterpipeorsomemetalobjectconnectedtothegroundtodischargeanystatic
Electricityfromyourbodybeforehandlingtheparts.
3)Touchonlytheedgesoftheboard,ifpossible.
4)Donottouchanypartsunlessabsolutelynecessary
5)Disassemblethepartsontheanti-static-electricitypad.
6)Whenaboardisnotinstalledinthesystem,packagetheboardwithananti-static-electricitypackaging.
1-4Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
2.Introduction
2.1.ProductFeatures
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-1

2.Introduction
2.2.Specication
ProcessorandMotherboard
CPUIntelIvyBridge_BGAType-Non
UpgradableMaxspec
Intel®Core™i7Processor3517U
(1.9GHz,4MB)
Intel®Core™i5Processor3317U
(1.70Hz,3MBL3Cache)
CacheL3:3~6MB
ChipsetIntelHM75
BIOS64MbitSPIash
ThermalDesignPerformanceAll17W
Memory
Memory/Max.MemoryPC3-1066S(1333MHz),PC3-12800S(1600MHz),2-slotSODIMMMin.4GB~Max.
8GB
Memorytype1333MHz/1600MHzDDR32-SlotSODIMM
MemoryModules2GBSODIMM,4GBSODIMM(1-Slot)
Sockets2-slotSODIMM's
※K4B8G3346B-MCH9(1333MHz)conrmedthecompetibilitytest
DisplayandGraphics
LCD15.0"SuperBright400nitHD+LEDDisplay(1600x900),Anti-Reective
TypeLEDLCDwithAntiGlare(=NonGlare)
PanelTNMode
LCDViewableArea332.4(H)x186.975(V)
LCDResolutionHD+(1600x900)
Win7Support:(1600X900,1366X768,1280X720,
1024X768,800X600)
XPSupport:(1600X900,1366X768,1280X720,
1024X768,800X600)
DotPitch0.20775(H)x0.20775(V)Mm
Viewingangle45/45/15/30(L/R/U/D)
Openingangle135
ReectionRateHaze25
ContrastRatioTyp.500
Brightnesstyp.400(cd/m2)
ResponsetimeAM:Rising+Fallingtyp.16ms
GraphicsControllerIntelHDGraphics4000
VideoMemorySharedmemory(Int)GraphicssetintheBIOSsetting:64MBWindowsboot:1696MB
GPUTDPMax.17W(CPUIntegrated)
2-2Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
Max.ResolutionforLVDSduallinkresolutionof2560x2048perlink/amaximumtheoreticalpixel
rateof224MP/sMAX2560x2048(640x480,800x600,1024x768,1152x864,
1280x800,1280x960,1280x1024,1400x1050,1440x900,1600x1024,1600x1200,
1680x1050,1920x1200,2560x2048)[Ext.monitorresolutionssupportedbyEDID
information]
Max.resolutionforVGAMaxresolutionof2560x1600at85Hzrefreshrate(ext.)Supported
resolutionMAX2560x1600(640x480,800x600,1024x768,1152x864,
1280x800,1280x960,1280x1024,1400x1050,1440x900,1600x1024,1600x1200,
1680x1050,1920x1200,1920x1440,2560x1600)[Ext.monitorresolutionssupported
byEDIDinformation]
Max.resolutionforHDMISupportv1.4acompliant/aresolutionof1920x1200pixelswith32-bitcolorat60Hz
[Ext.monitorresolutionssupportedbyEDIDinformation]
ControlsKeyboardBrightnessControl
AudioandVideo
SoundRealtekHighDenitionAudio
ControllerHDAudioCodec,ALC269Q-VC-GR
ConversionBuilt-inhighperformance24-bitADC&24-bitDAC
InternalInterfacesEmbeddedstereospeakers,InternalArrayMIC
SpeakerPowerRating2Speakersx2.0Wattwithenclosureeach
ExternalInterfacesMicrophone,Headphone,ComboJackSupport(4PoleCombo:MIC/GND/SPK/SPK
=Apple'sapproach),SPDIFNOTSUPPORT
ControlsKeyboardvolumecontrol,SideV olumebutton
SoundeffectSoundAlive
Microphone3poleMic/HPcombo
TypeArrayMic:DIGITALSMDtypedualarraymic(Mainboard/Camera)
Sensitivity-26dBFS[0dB=1V/Pa,at1KHz]
S/NRatio56(min)Db
Camera
ModelnameSC-13HDL11624N(IMX119P+SPCA2088)
Imagesensor1.3MegaCMOScolorimagesensor
StillImageCaptureResolution1280*1024(Max.),1280*720,800*600,640*480,352*288,320*240,176*144,
160*120
VideoCaptureResolution1280*1024(Max.),1280*720,800*600,640*480,352*288,320*240,176*144,
160*120
FrameRateMax30fps@1.3M
OutputVideoFormatYUY2,MJPEG
InterfaceUSB2.0
UVCSupportCompliantwithUSBVideoClass
Storage
TypemSATA(miniPCIetype)
SolideStaeDiskSATA23.0Gbps/SATA36.0Gbps
SupportsuptoA TA/A TAPI-7standard
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-3

2.Introduction
CapacityMAX.256GB,128GB
Size30*51*3.8mm,W*L*H
NANDMLC
OpticalDriverModules(Share)
OpticalDiskDriver(Option)Ext.ODD:AA-ES3P95M
SpecTS-U633J/SCEFZ,8X,170MS,USB,1.5MB,7.5W,5V ,Blueblack
TypeHalf-FinishedType5902,
Speed5xDVD-RAM,8xDVD±R,6xDVD±RDL,8xDVD+RW,6xDVD-RW,24x
CD-R/RW,8xDVD,24xCD
Weight130gorless
NetworkT ools(Share)
LAN10/100/1000GigabitEthernetLAN
RTL8111E,RJ45output
CombomoduleIntelCentrino@Advanced-N6235
JacksonPeak2(BA59-03294A)
Spec6235AN.HMWG,-,2x2,HalfMiniCardSTD,IEEE802.11a/g/n,26.8*30.0
Type2X2WLAN/BTcombomodule,802.11abg/Bluetooth4.0(WIDIsupport)
Max.LinkSpeed300Mbps(LinkSpeedisonlystandardvalue,Actuallyvaluewilldecidedbyeach
environmant)
ChipsetJacksonPeak2
Antenna2AntennaSupport:WLAN(2TX,2RX),BT(1TX/RX)
I/OInterface(Share)
MultiCardSlot4-in-1(SD,SDHC,SDXC,MMC)
vendorJingshi
Max.supportcapacity64GB(comrmofthecompetibilitytest)
I/OPorts
USBPort1xUSB2.0port(Chargeable,supportiphone),2xUSB3.0ports
VGAPort1xVGAdongleport
[VGAdongleisoptionsale.]
AudioJacks1x3.5mmCombo(HeadPhone-out,MIC-in)
LAN1xLANdongleport
TV1xCombo(4pole,HeadPhone-out,MIC-in)
[MicroHDMItoVGAdongleisnotsupported.]
DockNone
SecurityNone
Power1xDC-injack(3Pie)forACadapter
2-4Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
InputDevices
Keyboard1.35mmstroke3.4mmheight/BackightKBD(ELsheet)
TouchpadW98*H67.3*T0.3,PETtypeClickpad,Multingergesture
SecuritySolution
TPMTrustedPlatformModule1.2
InterfaceLPC
ChipSLB9635TT1.2(inneon)
SecuritysoftwareTPMHostSW
PowerandPowerManagement
PowerandPowerManagement
Systempowermanagement
PowermanagementfeaturesACPIV2.0compliant,Standby(S3),Hibernate(S4)
Standardbattery
ModelcodeAA-PBXN8AR
TypeLi-Polymer
Detailsofcell8cells
Batterycapacity8400mAh
V oltage7.4V
Batteryrating60Wh
ColorBlack
Dimension309x139.4x5.6mm(WXDXH)
Weightappox.360g
Rechargetimeappox.3.3hours
ACAdapterAD-4019P
OutputPower40W
Dimension94X67X17mm(WxHxD)
Weight(ACAdapter)250g(Max)
WorldwideCompatibilityAuto-sensing100-240V AC
LineFrequency50/60Hz
AdapterRating-Input90V-264V ,1.0A
AdapterRating-Output19.0VDC/2.10A
SystemDimensions
Dimensions(WXDXH)356.9x237.0x14.9mm
Weight1.6Kg
-TermFullSystemwith8cellBattery
PackingSize(WXDXH)WithOption:491*317*112
WithoutOption:491*317*112
Design
LCDBackMg+TeonCoating
LCDFrontAl,Sanding+Anodizing
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-5

2.Introduction
SystemTopMg+TeonCoating
SystemBottomAl,Sanding+Anodizing
ProtectionlmOnPalmrest,LCDback
XPDriverXPDriverready,Thereisnoplantosell
XPTRIMDonotsupport
※TRIM,whichpurgesdatafromtheSSD'scellsupondeletionandcanpreventtheslowdownthatmanysolidstate
drivesexperienceafterprolongeduse,isgenerallyconsideredtobethebestthingtohavehappenedtothedevices
forquitesometime.
Locationlabeling
2-6Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
2.3.Comparingproductspecications
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-7

2.Introduction
2.4.FunctionofProduct
2-8Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-9

2.Introduction
2-10Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
Touchpad
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-11

2.Introduction
Keyboard
※ ※
※Keyboardarrangementandsizecandiffertobyeachcountry.
2-12Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-13

2.Introduction
2.5.NewTechnology/ability
Innerbattery
KBDFunction
2-14Copyright©1995-2012SAMSUNG.Allrightsreserved.