Samsung SENS R560 Series User manual

R560
OSLO2
NT-R560xxx/xxx
NP-R560xxx/xxx
SERVICE
Manual
R560 Contents
1. High Performance Note PC
- Intel Core2 Duo Processor
- DDR III Memory
- New nVIDIA Graphics
- New Intel Montevina Platform
2. Convenient Function
- Internal Camera
- HDMI Port
- 7 in 1 multi card
If there are the contents not included in this book, please refer to K-zone service
SENS

Contents
1. Precautions
1-1. General After-Sales Service Precautions ........................................................................................................1-1
1-2. Safety Precautions ..........................................................................................................................................1-2
1-3. Ground.............................................................................................................................................................1-2
1-4. Static Electricity Precautions ...........................................................................................................................1-2
2. 2. Introduction and Specication
2-1. Instroduction....................................................................................................................................................2-1
2-2. Specication ....................................................................................................................................................2-2
2-3. Comparing product specications ...................................................................................................................2-9
2-4. Comparing product specications jatasa.......................................................................................................2-10
2-5. Option Material List........................................................................................................................................2-11
2-6. Function of Product .......................................................................................................................................2-14
2-7. SW List ..........................................................................................................................................................2-22
2-8. System Setup (BIOS Setup)..........................................................................................................................2-23
2-9. Mainboard Part Description...........................................................................................................................2-29
3. Disassembly and Reassembly
3-1. Disassembly and Reassembly R560...............................................................................................................3-1
4. Troubleshooting
4-1. General............................................................................................................................................................4-1
4-2. Debugging Flow Chart.....................................................................................................................................4-2
4-3. System Diagnosis............................................................................................................................................4-5
4-4. Diagnosis application.....................................................................................................................................4-14
4-5. Hardware Troubleshooting ............................................................................................................................4-17
4-6. CPU Fan Control ...........................................................................................................................................4-24
4-7. Battery Use Time...........................................................................................................................................4-26
4-8. Etc ................................................................................................................................................................4-31
4-9. Adding a Memory Module..............................................................................................................................4-32
5. Exploded View
5-1. System main....................................................................................................................................................5-1
5-2. System Main List .............................................................................................................................................5-2
5-3. LCD Assy.........................................................................................................................................................5-3
5-4. LCD Assy List ..................................................................................................................................................5-4
5-5. LCD Back Assy................................................................................................................................................5-5
5-6. LCD Back Assy List .........................................................................................................................................5-6
5-7. Bottom Assy.....................................................................................................................................................5-7
5-8. Bottom Assy List..............................................................................................................................................5-8
5-9. Top Assy ..........................................................................................................................................................5-9
5-10. Top Assy List................................................................................................................................................5-10
5-11. ODD Assy ....................................................................................................................................................5-11
5-12. ODD Assy List .............................................................................................................................................5-12
6. Material List
7. System Wire Diagram
7-1. View.................................................................................................................................................................7-1
7-2. Bottom .............................................................................................................................................................7-2
7-3. LCD .................................................................................................................................................................7-3
8. Block Diagram and Schematic

Contents

5. Exploded View
5-1
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SYSTEM
T0010
I0006
T0001
T0005
M0001
G0003
I0001
I0002
B0004
M3001
M3004
B0013
D0001
I0009
M4001
G0011
B0150
I0005
B0003
B0100
B0205
B0001
W3007
M4000

5. Exploded View
5-2
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ASSY-LCD
K0201
T0002
K1007
I0003
I0013
K1001
K4001
K4003 K3001
K2003
K1002
K4002
K3002

5. Exploded View
5-3
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UNIT-HOSUNG_TOP
T0101
T9803
T0002
T2001
T2001
T2200
T0301

5. Exploded View
5-4
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UNIT-HOSUNG_BOTTOM
B0501
B0302
B0501
B0303
B0009
B0402
B0010
B0403
B0009

5. Exploded View
5-5
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D3000
D1002
D2000
D0001
Unit-ODD

1-1
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1. Precautions
1-1. General After-Sales Service Precautions
1. Do not let customers repair the product themselves.
There is a danger of injury and the product life time may be shortened.
2. Make sure to disconnect the power cord from the wall outlet before repairing the product (especially for after-sales service of
electric parts).
There is a danger of electric shock.
3. Do not let customers plug several electric home appliances into a single wall outlet at the same time
There is a danger of re due to overheating.
4. Check if the power plug or wall outlet are damaged in any way.
If a defect is found, repair or replace it immediately. (There is a
danger of electric shock or re)
5. Make sure that it is properly grounded. (Check the ground of the
wall outlet)
Electricity leakage may cause electric shock.
6. Do not spray water on to the product to clean it.
There is a danger of electric shock or re and it may shorten the
lifetime of the product.
7. Check the assembly status of the product after the after-sales
service.
The assembly status of the product must be the same as before
the after-sales service.
8. Unplug the power cord holding the power plug (and not the cord).
If the cord is disconnected, it may cause electric shock or re.
9. Repair the product using only authorized parts.
10. Keep the product away from heating devices such as heaters.
Exposure to heaters may cause deformation of the product or re.
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1-2
1. Precautions
- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -
- This Document can not be used without Samsung's authorization -
1-2. Safety Precautions
(1) EMI
This device has been registered regarding EMI for residential use. It can be used in all areas.
(2) Circuit Test (Logic Test) Precautions
The LSI and MSI used in this product are semiconductor integrated circuits based on MOS-FET or CMOS. Since these types of
devices are highly susceptible to static electricity or current leakage, an isolation break may be caused. Therefore read and follow the
instructions below.
1) When handling an LSI or MSI, make sure your body is grounded through a few mega-ohms of resistance. In addition, wear gloves
and a jacket made of cotton and not of synthetic bers that easily generate static electricity.
2) When repairing the product, place a conductive material (e.g. aluminum foil) grounded to the earth on the worktable.
3) You must use a soldering iron without a leakage current.
4) Do not touch the pin of an IC and carefully insert the IC into the black plastic package.
5) When inserting an IC into a PCB, be careful with the direction of the IC. When installing an IC in the wrong direction, it might
become damaged.
6) When carrying an IC, package the IC with conducting material such as aluminum foil or conducting sponge so as to keep the
voltage level of each of the terminals the same.
7) Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room temperature, if possible.
8) Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room temperature, if possible.
9) When soldering an IC, solder it in as short a time as possible so that unnecessary heat is not applied to the device.
10) Avoid leaving excessive amounts of ux within a custom IC or between the pins when soldering a custom IC.
11) Take care to not damage the board when installing or separating an Option Board.
12) Take care to not break the printed circuit pattern on the PCB when separate an IC.
1-3. Ground
The product must be grounded to protect it from static electricity and other dangers. When using a multitap, please use a multitap with a
ground terminal only.
If you use a 220V wall outlet with a ground terminal, you do not need to ground it additionally. Avoid using wall outlets if they are not
grounded even if they have a ground terminal.
To ground the product, connect the ground to an exclusive ground terminal or metal water pipe. Connect the ground cable to the ground
terminal at the rear of the main body. To ground the product, connect the ground terminal of the product to a metal water pipe, wall outlet
or exclusive ground terminal with an electric wire equal to or thicker than #18.
Never ground the product to a PVC water pipe, phone line, TV, radio antenna, aluminum window or gas pipe, because this does not
actually ground the product and may be dangerous.
1-4. Static Electricity Precautions
Many parts of the system are susceptible to static electricity. Using an electrostatic discharge (ESD) device is very important for the
safety of the user and the user's surroundings. Using an ESD device increases the probability of a successful repair and lowers the
expenses for damaged parts.
To prevent static electricity, follow the instructions below.
1) Perform the repair in a location without static electricity.
2) Touch your hands to a metal water pipe or some metal object connected to the ground to discharge any static electricity
from your body before handling the parts.
3) Touch only the edges of the board, if possible.
4) Do not touch any parts unless absolutely necessary
5) Disassemble the parts on the anti-static-electricity pad.
6) When a board is not installed in the system, package the board with an anti-static-electricity packaging.

2-1
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2. 2. Introduction and Specication
2-1. Instroduction
High Performance Note PC
High Performance with Intel Core 2 Duo Processor and DDR II Memory
New nVIDIA 9200 PCI-Express Graphics(External model), intel GMA X4500 (Internal model)
New Intel Montevina Platform
Improve the system performance using Intel turbo memory(Option)
Convenient Function
Easy use of picture and moving image through Internal Camera (Option)
Convenient connection with TV with HDMI port
Prudent Design for easy use.
Use of Various memory card through Multi card slot
Good feeling and design through the Flat type touchpad.
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•
•
•
•
•
•

2-2
2. Introduction and Specication
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2-2. Specication
Processor and Motherboard Description
Processor Intel® Core™2 Duo Processor T9600 (2.8 GHz, 1066 MHz, 6 MB, 35 W)
Intel® Core™2 Duo Processor T9400 (2.53 GHz, 1066 MHz, 6 MB, 35 W)
Intel® Core™2 Duo Processor P9500 (2.53 GHz, 1066 MHz, 6 MB, 25 W)
Intel® Core™2 Duo Processor P8600 (2.4 GHz, 1066 MHz, 3 MB, 25 W)
Intel® Core™2 Duo Processor P8400 (2.26 GHz, 1066 MHz, 3 MB, 25 W)
Intel® Core™2 Duo Processor P7350 (2.00 GHz, 1066 MHz, 3 MB, 25 W, Tj)
Chipset (MCH + ICH) Intel PM45 + ICH9M
Memory
Memory capacity Min. 1 GB ~ Max. 4 GB
Memory type PC3-6400 (800 MHz), PC3-8500 (1067MHz) DDR3 SODIMM
Memory modules 1 GB SODIMM
2 GB SODIMM
Sockets 2-slot SODIMMs
Display
LCD 1 15.4" WXGA Gloss
Vendor Samsung LCD
Resolution 1,280 x 800 pixel
Colors 262,144 colors
Viewing angle Left 45° / Right 45° / Up 15° / Down 30°
Dot pitch 0.25875 x 0.25875 mm (Horizontal x Vertical)
Contrast ratio Typical 300 CR
Brightness Typical 200 cd/m2
Response time Typical 16 ms / max. 25 ms
Polarizer Gloss
Weight Max. 550 g
LCD 2 15.4” WSXGA+ Gloss
Vendor Samsung LCD
Resolution 1,680 x 1050 pixel
Colors 262,144 colors
Viewing angle Left 65° / Right 65° / Up 50° / Down 50°
Dot pitch 0.1972 x 0.1972mm (Horizontal x Vertical)
Contrast ratio Typical 300 CR
Brightness Typical 200 cd/m2
Response time Typical 16 ms / max.25 ms
Polarizer Gloss
Weight Max. 590 g
LCD 3 15.4” WXGA Gloss
Vendor Samsung LCD
Resolution 1,280 x 800 pixel
Colors 262,144 colors
Viewing angle Left 40° / Right 40° / Up 15° / Down 30°
Dot pitch 0.25875 x 0.25875 mm (Horizontal x Vertical)
Contrast ratio Typical 500 CR
Brightness Typical 220 cd/m2
Response time Typical 16 ms / max.25 ms

2-3
2. Introduction and Specication
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Processor and Motherboard Description
Polarizer Gloss
Weight Max. 570 g
LCD 4 15.4” WXGA Gloss
Vendor CPT
Resolution 1,280 x 800 pixel
Colors 262,144 colors
Viewing angle Left 40° / Right 40° / Up 10° / Down 30°
Dot pitch 0.25875 x 0.25875 mm (Horizontal x Vertical)
Contrast ratio Typical 500 CR
Brightness Typical 220 cd/m2
Response time Typical 8 ms / max.16 ms
Polarizer Gloss
Weight Max. 565 g
Graphics
NVIDIA External GFx NVIDIA GeForce 9600M GS / 9600M GT
Video Memory NVIDIA GeForce 9600M GS Dedicated GDDR3 256MB
Vista OS
1. Turbo Cache (Total Available Graphics Memory) 511MB
(Dedicate 256MB with1GB System Memory)
2. Turbo Cache (Total Available Graphics Memory) 1023MB
(Dedicate 256MB with 2GB System Memory)
3. Turbo Cache (Total Available Graphics Memory) 2047MB
(Dedicate 256MB with 4GB System Memory)
NVIDIA GeForce 9600M GT Dedicated GDDR3 512MB
Vista OS
1. Turbo Cache (Total Available Graphics Memory) 767MB
(Dedicate 512MB with 1GB System Memory)
2. Turbo Cache (Total Available Graphics Memory) 1279MB
(Dedicate 512MB with 2GB System Memory)
3. Turbo Cache (Total Available Graphics Memory) 2303MB
(Dedicate 512MB with 4GB System Memory)
Max.Resolution for LFP LVDS 1680 x 1050 x 18Bits color (WSXGA+)
Max.Resolution for External Monitor 2048 x 1536 @ 32bps (CRT)
1080p HDMI
Controls Keyboard Brightness control
GPU TDP GeForce 9600M GS 21W, GeForce 9600M GT 24W
Audio
Sound
Codec Intel® HD (High Denition) audio codec
Chipset REALTEK ALC262-VC2-GR
Conversion Built-in high performance 20 bit ADC & 24 bit DAC
Sound effect EDS (Enhanced Digital Sound)
Internal interfaces Embedded stereo speakers & integrated mono microphone
Speaker power rating 2 speakers x 1.5 W with enclosure
External interfaces Headphone-out, microphone-in
Controls Keyboard volume control
Microphone
Type 1 integrated mono microphone
Sensitivity -40±3 dB

2-4
2. Introduction and Specication
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Processor and Motherboard Description
Output impedance Max. 2,200 Ohm
Noise supression Noise supression
Storage
Hard disk drive 1
Vendor HGST, Fujitsu, Samsung Storage, Toshiba , WD
Type 9.5 mm Height 2.5” S-ATA
Speed 5,400 rpm
Average seek time Read max. 14 ms, write max. 15 ms
Supports SATA II 3.0Gbit , SataI 1.5Gbit/s
Capacity 80 GB
120 GB
160 GB
200 GB
250 GB
320 GB
Hard disk drive 2
Vendor HGST, Fujitsu
Type 9.5 mm Height 2.5” S-ATA
Speed 7,200 rpm
Average seek time Read max. 16 ms, write max. 17 ms
Supports SATA II 3.0Gbit , SataI 1.5Gbit/s
Security 80 GB
120 GB
160 GB
200 GB
Type NAND ash
Memory capacity 1 GB
2 GB
Feature ReadyDrive/ReadyBoost Support, AHCI Mode, Intel® Turbo Memory driver
Interface Mini card (PCI-Express)
Optical disk drive
Combo drive 1
Vendor TSST
Type 12.7 mm, S-ATA, Fixed type
Speed 24 x CD-R/RW, 8x DVD, 24x CD
Average access time DVD 150 ms typ, CD 150 ms typ.
Weight Max. 165 g
Software supplied CyberLink DVD Suite
Security RPC-II regional encoding
Combo drive 2
Vendor TEAC
Type 12.7 mm, S-ATA, Fixed type
Speed 24 x CD-R/RW, 8x DVD, 24x CD
Average access time DVD 110 ms Typ., CD 90 ms Typ.
Weight Max. 178g
Software supplied CyberLink DVD Suite
Security RPC-II regional encoding

2-5
2. Introduction and Specication
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Processor and Motherboard Description
Super multi dual layer 1
Vendor TSST
Type 12.7 mm, S-ATA, Fixed type
Speed 5 x DVD-RAM, 8 x DVD±R, 6 x DVD±R DL, 8 x DVD+RW, 6 x DVD-RW, 24 x CD-R/RW,
8 x DVD, 24 x CD
Average access time DVD 130 ms Typ., CD 130 ms Typ.
Weight Max. 165 g
Software supplied CyberLink DVD Suite
Security RPC-II regional encoding
Super multi dual layer 2
Vendor TEAC
Type Fixed 12.7mm
Speed 5 x DVD-RAM, 8 x DVD±R, 6 x DVD±R DL, 8 x DVD+RW, 6 x DVD-RW, 24 x CD-R/RW,
8 x DVD, 24 x CD
Average access time DVD 150 ms Typ., CD 140 ms Typ.
Weight Max. 180 g
Software supplied CyberLink DVD Suite
Security RPC-II regional encoding
Super multi light scribe 1
Vendor TSST
Type 12.7 mm, S-ATA, Fixed type
Speed 5 x DVD-RAM, 8 x DVD±R, 6 x DVD±R DL, 8 x DVD+RW, 6 x DVD-RW, 24 x CD-R/RW,
8 x DVD, 24 x CD
Average access time DVD 130 ms Typ., CD 130 ms Typ.
Weight Max. 165 g
Software supplied CyberLink DVD Suite
Security RPC-II regional encoding
Network communication
Fax / Modem
Type 56 Kbps / V.92 Modem
Chipset SV92A3
Interface RJ11 output
LAN
Type 10/100/1000 Ethernet
Chipset Marvell 88E8055
Interface RJ45 output
Feature
Wireless LAN 1
Type Atheros® 802.11b/g
Interface Mini card type
Chipset Atheros XB63
Antenna 2 integrated
Feature
Wireless LAN 2
Type Intel® 802.11a/b/g/n

2-6
2. Introduction and Specication
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Processor and Motherboard Description
Interface Mini card type
Chipset Intel® WiFi Link 5300
Antenna 3 integrated (Main, AUX, MIMO)
Feature
Wireless LAN 3
Type Intel® 802.11a/b/g/n (11a/b/g for Russia, Ukraine, Pakistan)
Interface Mini card type
Chipset Intel® WiFi Link 5100
Antenna 2 integrated (Main, AUX)
Feature
Bluetooth
Type Bluetooth V2.0 + EDR (Enhanced Data Rate)
Interface USB daughter card type with integrated PIFA (Plane Inverted F Antenna)
Chipset Broadcom BCM2045
Ports and interfaces ( Input / output )
PC card slot 1
Type ExpressCard/34/54
Chipset PM45
Support PCI Express 1.1
PC card slot 2 No
Type PCMCIA
Chipset
Support
Memory card slot YES
Type 7-in-1 Multi Memory Card Slot
Support MS / MS Pro / SD / SDHC / xD / MMC / MMC Plus
Dock port No
Type X-Dock port
[X-Dock Option Product ]
Model Code AA-RD3NX25
Feature PIO, SIO, PS/2, VGA, DVI, SVHS, 4 x USB 2.0, RJ45, Microphone-in, Headphone-out ,
Kensington Lock, DC-In
Input / output ports
VGA Yes (15 pin)
S-Video (TV-out) No
HDMI Yes
Headphone-out Yes
Microphone-in Yes
USB 3 x USB 2.0
SIO No
IEEE1394 No
RJ11 (Modem) Yes
RJ45 (LAN) Yes
TV antenna No
DC-In (power port) Yes (5 pie)

2-7
2. Introduction and Specication
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Processor and Motherboard Description
Input devices
Keyboard Yes
- Amount of keys 88 (KOR, RUS, UKR, US)
89 (UK, FR, GM, SP)
- Feature Travel length 2.6 mm, key pitch 19.05 mm
- Silver Nano Technology Yes
- Fast function keys (EZ BLU) F7 (Magic Doctor), F8 (SpeedUp Manager)
Touchpad Synaptics touchpad (plat type with scroll area)
Button Power On
LED indicator Power, AC-in / battery, HDD, num-lock, caps-lock, scroll-lock, wireless antenna
Multimedia
Integrated digital camera
Type 1.3M Web-Cam
Chipset GD-5931A/B (D-MAX)
Image sensor Color CMOS SXGA (1.3 Mpixel)
SCAN mode Progressive
Still image capture resolution SXGA (1,280 x 1,024), VGA (640 x 480), CIF (352 x 288)
Video capture resolution VGA (640 x 480)
Digital video capture speed Max. 30 frame
Focus Min. 50 cm ~ innity
UVC support USB video class 1.0 standard compliant
Power and power management
System power management
Power management features ACPI 1.0b support, standby (S3), hibernate (S4)
Standard battery
Model code BA43-00150A Sanyo (1’st)
BA43-00149A SDI (2’nd)
Details of cell 6 cells
Battery capacity 5,200 mAh
Voltage 11.1 V
Battery rating 57.72 Wh
Color Black
Dimension 204 x 48.05 x 21.4 mm (W x H x D)
Weight Max. 350 g
Recharge time Approx. 2 hours
Battery life (DVD play mode) Typ. 2.6 hours
- Test program PowerDVD(Max Batttery Mode)
- Test condition Multimedia MOde, LCD Brightness-Level 4, WLAN R/F Off, discharged by 3%
T9400(2.53GHz), DDR3 1GB, 15.4” WXGA(200nits), NB9P-GS(512MB), 80GB,
DVD-Multi, Vista Home Premium
Battery life (Bench mark mode) Max. 3.7 hours
- Test program BatteryMark v.4.0.1
- Test condition Samsung Optimized mode, LCD Brightness-Minimum, WLAN R/F Off, discharged by 3%
T9400(2.53GHz), DDR3 1GB, 15.4” WXGA(200nits), NB9P-GS(512MB), 80GB,
DVD-Multi, Vista Home Premium
Long-life battery

2-8
2. Introduction and Specication
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Processor and Motherboard Description
Model code AA-PL2NC9B
Details of cell 9 cells
Battery capacity 7,800 mAh
Voltage 11.1 V
Battery rating 86.58 Wh
Color Black
Dimension 204 x 67 x 21.4 mm (W x H x D)
Weight Max. 470 g
Recharge time Approx. 3.2 hours
Battery life (DVD play mode) Typ. 4.0 hours
- Test program PowerDVD (Max Batttery Mode)
- Test condition Mutimedia Mode, LCD Brightness-Level 4, WLAN R/F Off, discharged by 3%
T9400(2.53GHz), DDR3 1GB, 15.4” WXGA(200nits), NB9P-GS(512MB), 80GB,
DVD-Multi, Vista Home Premium
Battery life (Bench mark mode) Max. 5.7 hours
- Test program BatteryMark v.4.0.1
- Test condition Samsung Optimized mode, LCD Brightness-Minimum, WLAN R/F Off, discharged by 3%
T9400(2.53GHz), DDR3 1GB, 15.4” WXGA(200nits), NB9P-GS(512MB), 80GB,
DVD-Multi, Vista Home Premium
AC Adapter
Model Code AA-PA1N90W
Output Power 90 W
Dimension 126 x 50 x 30 mm (W x H x D)
Weight (AC Adapter) 430g (Max.)
Worldwide Compatibility Auto-sensing 100 - 240 VAC
Line Frequency 50 Hz / 60Hz
Adapter Rating - Input 100 VAC ~ 240 VAC, 1.5A
Adapter Rating - Output 19.0 VDC, 4.74 A
System dimensions
Dimensions (W x D x H) 358 x 264 x28.6 (min) ~ 36.5 (max.) mm
(14.1" x 10.4" x 1.12" (min) ~ 1.44" (max.) inch)
Weight 2.70Kg (5.95lbs)
- Condition (with battery)
Package dimensions (W x D x H) 425 x 110 x 405 mm
Package weight 4.34 Kg
- Condition Status : Combo , 6cell battery, 2.5” 80GB 2 platter HDD with Bundle items
Materials & Design
- LCD Back PC/ABS
- LCD Front PC/ABS
- System Top PC/ABS
- System Bottom PC/ABS
Installed software
Operating system Genuine Windows Vista® Home Premium SP1
Software Samsung Recovery Solution III (optional), Samsung Magic Doctor, Samsung Update Plus
Easy Display Manger, Easy Battery Manager, Easy Network Manager, Easy SpeedUp
Manager McAfee SecurityCenter, Adobe Acrobat Reader, Microsoft® Ofce Professional
2007 (free 60-day trial)

2-9
2. Introduction and Specication
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2-3. Comparing product specications
R70 R560
CPU 667/800MHz Intel Core 2 Duo Processor
(Merom)
800MHz/1066MHz Intel Core 2 Duo Processor
(Penryn)
Chipset PM965 (Crestline) PM 45 (Cantiga)
Memory DDR2 533 / 667MHz DDR3 800 / 1067MHz
Graphic nVIDIA Geforce 8600M GS
nVIDIA Geforce 8400M GS
nVIDIA Geforce 9600M GS
nVIDIA Geforce 9600M GT
LCD 15.4” WXGA, WSXGA+ Glare 15.4” WXGA, WSXGA+ Glare
HDD SATA SATA
ODD PATA 12.7mm SATA 12.7mm
Port 3USB, CRT, Headphone/MIC, RJ45, RJ11 (Option),
HDMI, PC-Card, 6-in-1
3USB, CRT, Headphone/MIC, RJ45, RJ11 (Option),
HDMI, Express-Card, 7-in-1
Battery 6cell / 9cell (Option) 6cell / 9cell (Option)
Design 2nd Proto type Chrome Bar, Heat Transfer mechanical disign