Samsung TORINO II NT-Q46 Series User manual

SENS
책자에 수록되지 않은 내용은 K-zone 서비스 매뉴얼을 참조 하십시오.
Q45/Q46 목차
SERVICEManual
Q45/Q46
TORINOⅡ
NT-Q45xxxx/xxx
NT-Q46xxxx/xxx
■주의사항
■제품특징및사양
■분해와조립
■고장진단
■기구전개도및자재리스트
■회로자재리스트
■결선도
■블록도및회로도

-목차-
1. 주의사항
1) 서비스시 일반적인 주의 사항 -------------------------- 1-1
2) 안전 주의 사항 --------------------------------------- 1-2
3) 접지 사항 -------------------------------------------- 1-3
4) 정전기 주의 사항 ------------------------------------- 1-3
2. 제품 특징 및 사양
1) 제품특징 -------------------------------------------- 2-1
2) 제품 사양 ------------------------------------------- 2-2
3) 제품 사양 비교 -------------------------------------- 2-7
4) 경쟁사 사양 비교 ------------------------------------ 2-8
5) 옵션 자재 리스트 ------------------------------------ 2-8
6) 제품기능 -------------------------------------------- 2-11
7) 새로 추가된 기능 ------------------------------------ 2-16
8) Software list --------------------------------------- 2-21
9) 시스템 Setup (BIOS Setup) --------------------------- 2-22
10) 메인보드 부분설명 ---------------------------------- 2-29
3. 분해와 조립
1) Q45 분해와 조립 ------------------------------------- 3-1
4. 고장 진단
1) 일반적인 사항 --------------------------------------- 4-1
2) Debugging Flow Chart -------------------------------- 4-2
3) 시스템 진단 ----------------------------------------- 4-5
4) 진단 프로그램의 사용 -------------------------------- 4-9
5) H/W의 고장 진단 ------------------------------------- 4-14
6) 드라이버 및 어플리케이션 SW 리스트---------------- 4-23
7) CPU Fan 컨트롤 -------------------------------------- 4-25
8) Battery 사용시간 ------------------------------------ 4-26
9) 기타 ------------------------------------------------ 4-30
5. 기구 전개도
1) Q45 기구전개도 ------------------------------------- 5-1
6. 회로물 자재리스트
1) 회로물 자재리스트------------------------------------ 6-1
7. 결선도
1) 결선도 ---------------------------------------------- 7-1
8. 블록도 및 회로도
1) 블록도 ---------------------------------------------- 8-2
2) 회로도 ---------------------------------------------- 8-3
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If there are the Contents not included in this book, please refer to K-zone Service Manual
SAMSUNG Q45 FEATURES
SERVICEManual
Q45
TORINOⅡ
NT-Q45xxxx/xxx
1. Simple & Essential Note PC
-. New Intel SantaRosa technology.
-. Internal 1.3M Camera
-. 12.1'' WXGA 200nit Glare LCD
-. Windows Vista Home/Premium Supportable.
2. High Performance
-. Intel Core™2 Duo processor
-. Powerful connectivity.
-. Convenient Multi-media.

-CONTENTS -
1. Precautions
1) General After-Sales Service Precautions..............................................................................................1-1
2) Safety Precautions..................................................................................................................................1-2
3) Ground.....................................................................................................................................................1-3
4) Static Electricity Precautions..................................................................................................................1-3
2. Introduction and Specification
1) Introduction.............................................................................................................................................2-1
2) Specification...........................................................................................................................................2-2
3) Wireless LAN Specification...................................................................................................................2-8
4) Option list...............................................................................................................................................2-10
3. Function
1) Construction of System........................................................................................................................3-1
2) Keyboard...............................................................................................................................................3-5
3) Multi Card Slot.....................................................................................................................................3-7
4) PC Card Slot........................................................................................................................................3-10
5) Connecting a monitor/TV.....................................................................................................................3-11
6) Microsoft Windows Vista......................................................................................................................3-12
7) Adjusting the Volume...........................................................................................................................3-17
8) Media Center........................................................................................................................................3-18
9) BIOS Setup...........................................................................................................................................3-19
10) Description of Main board...................................................................................................................3-21
4. Disassembly and Reassembling
1) Disassembly and Reassembly of Q45.................................................................................................4-1
5. Troubleshooting
1) General..................................................................................................................................................5-1
2) Debugging Flow Chart..........................................................................................................................5-2
3) System Diagnosis..................................................................................................................................5-4
4) Hardware Troubleshooting....................................................................................................................5-8
5) Device Settings Related Software Diagnosis......................................................................................5-17
6) Battery Use Time..................................................................................................................................5-22
6. Exploded view
1) Exploded view of Q45...........................................................................................................................6-1
2) ODD........................................................................................................................................................6-12
- This Document can not be used without Samsung's authorization -

-CONTENTS -
7. Schematic
1) SYSTEM................................................................................................................................................7-2
8. System Block Diagram
1) Block diagram........................................................................................................................................8-1
9. System Wire Diagram
1) Q45 Top.................................................................................................................................................9-1.
2) Q45 Bottom............................................................................................................................................9-1
3) LCD.........................................................................................................................................................9-2
10. Part list
1) SYSTEM................................................................................................................................................10-1
11. References
1) Model Numbering Rule........................................................................................................................11-1.
2) CPU Code table...................................................................................................................................11-4
3) Glossary................................................................................................................................................11-5
4) Hardware Upgrade...............................................................................................................................11-12
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1-1
1. Precautions
1) General After-Sales Service Precautions
(1) Do not let customers repair the product themselves.
☞There is a danger of injury and the product life time may be shortened.
(2) Make sure to disconnect the power cord from the wall outlet before repairing the product.
(especially for after-sales service of electric parts)
☞There is a danger of electric shock.
(3) Do not let customers plug several electric home appliances into a single wall outlet at the same
time.
☞There is a danger of fire due to overheating.
(4) Check if the power plug or wall outlet are damaged in any way.
☞If a defect is found, repair or replace it immediately. (There is a danger of electric shock or fire)
(5) Make sure that it is properly grounded. (Check the ground of the wall outlet)
☞Electricity leakage may cause electric shock.
(6) Do not spray water on to the product to clean it.
☞There is a danger of electric shock or fire and it may shorten the lifetime of the product.
(7) Check the assembly status of the product after the after-sales service.
☞The assembly status of the product must be the same as before the after-sales service.
(8) Unplug the power cord holding the power plug (and not the cord).
☞If the cord is disconnected, it may cause electric shock or fire.
(9) Repair the product using only authorized parts.
(10) Keep the product away from heating devices such as heaters.
☞Exposure to heaters may cause deformation of the product or fire.
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1-2
1. Precautions
2) Safety Precautions
(1) EMI
This device has been registered regarding EMI for residential use. It can be used in all areas.
(2) Circuit Test (Logic Test) Precautions
The LSI and MSI used in this product are semiconductor integrated circuits based on MOS-FET or
CMOS. Since these types of devices are highly susceptible to static electricity or current leakage, an
isolation break may be caused. Therefore read and follow the instructions below.
1. When handling an LSI or MSI, make sure your body is grounded through a few mega-ohms
of resistance. In addition, wear gloves and a jacket made of cotton and not of synthetic fibers
that easily generate static electricity.
2. When repairing the product, place a conductive material (e.g. aluminum foil) grounded to the
earth on the worktable.
3. You must use a soldering iron without a leakage current.
4. Do not touch the pin of an IC and carefully insert the IC into the black plastic package.
5. When inserting an IC into a PCB, be careful with the direction of the IC. When installing an
IC in the wrong direction, it might become damaged.
6. When carrying an IC, package the IC with conducting material such as aluminum foil or
conducting sponge so as to keep the voltage level of each of the terminals the same.
7. Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room
temperature, if possible.
8. When installing or removing a device from a PCB or installing or removing a board, you
must disconnect the power before taking any action.
9. When soldering an IC, solder it in as short a time as possible so that unnecessary heat is
not applied to the device.
10. Avoid leaving excessive amounts of flux within a custom IC or between the pins when soldering
acustomIC.
11.TakecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard.
12. Take care to not break the printed circuit pattern on the PCB when separate an IC.
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1-3
1. Precautions
3) Ground
The product must be grounded to protect it from static electricity and other dangers. When using a
multitap,pleaseuseamultitapwithagroundterminalonly.
If you use a 220V wall outlet with a ground terminal, you do not need to ground it additionally. Avoid
using wall outlets if they are not grounded even if they have a ground terminal.
To ground the product, connect the ground to an exclusive ground terminal or metal water pipe.
Connect the ground cable to the ground terminal at the rear of the main body. To ground the product,
connect the ground terminal of the product to a metal water pipe, wall outlet or exclusive ground terminal
with an electric wire equal to or thicker than #18.
Never ground the product to a PVC water pipe, phone line, TV, radio antenna, aluminum window or
gas pipe, because this does not actually ground the product and may be dangerous.
4) Static Electricity Precautions
Many parts of the system are susceptible to static electricity. Using an electrostatic discharge (ESD)
device is very important for the safety of the user and the user's surroundings. Using an ESD device
increases the probability of a successful repair and lowers the expenses for damaged parts.
To prevent static electricity, follow the instructions below.
(1) Perform the repair in a location without static electricity.
(2) Touch your hands to a metal water pipe or some metal object connected to the ground to
discharge any static electricity from your body before handling the parts.
(3) Touch only the edges of the board, if possible.
(4) Do not touch any parts unless absolutely necessary
(5) Disassemble the parts on the anti-static-electricity pad.
(6) When a board is not installed in the system, packagetheboardwithananti-static-electricity
packaging.
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2 - 1
1) Introduction
(1) High Performance PC
- Intel®Core™ 2 Duo Processor and DDR II Memory
- nVIDIA Geforce 8400 G PCI-Express Graphic
- Intel Santa Rosa Platform
-WirelessLAN(
option), Bluetooth (option)
(2) Convenient feature
- Internal Camera (Option) for easily video and photo capture
- Integrated DMB for mobility TV receiving
(3) Prudent Design for easy use.
- Price competitive power preservation
-Variant Multi-media card support
-Good feeling with free type touchpad, advanced design appearance.
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2. Introduction and Specification

2 - 2
2) Specification
Processor and Motherboard Description
CPU Intel® Core 2 Duo T7000 (1.86GHz) ~ T7700 (2.4G) and All CPU
at Q4'07.35W (64bit)
Speed
T7100 : 1.8GHz
T7300 : 2.0GHz
T7500 : 2.2GHz
T7700 : 2.4GHz
Cache 4MB/2MB L2 Cache in Merom
Chipset Intel PM/GM965+ ICH8M
BIOS 8 Mbit, Flash upgradable, SPI type
Thermal Design Performance MAX. 35W
Memory
Memory/Max.Memory 512MB ~ 4GB
Memory type PC2-4200(533MHz) / PC2-5300(667MHz) DDR2 SODIMM
Memory Modules 512MB, 1GB, 2GB SODIMM
Sockets 2-slot SODIMM's
Display and Graphics
LCD 12.1" WXGA (200nits 이상, Glare only)
LCD Vendor Samsung AMLCD WXGA (LTN121W1-L03-G)
AUO WXGA (B121EW01V3)
12.1" WXGA
LCD Viewable Area 261.12 x 163.2mm (H x V)
LCD Resolution 1280 x 800 x 262,144 color ( 18 bit )
Dot Pitch 0.204 x 0.204mm (H x V)
Viewing angle Hor. +40/-40, Ver. +20/-40
Contrast Ratio typ.400 (CR)
Brightness min.180, typ.200 (cd/m2)
Response time Rising typ.10ms / max.15ms, Falling typ.15ms / max.20ms
Graphics Controller
Factory option
Mobile Intel GMA X3000
NVIDIA GeForce 8400M G (Physical 128MB + TurboCache)
Intel Internal GFX Mobile Intel GMA X3000
Video Memory 128MB / 256M / 512M with DVMT
Max.Resolution for LFP LVDS 1920 x 1200 x 32Bits color (WUXGA)
Max.Resolution for External
Monitor 2048 x 1536 @60HZ (CRT)
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2. Introduction and Specification

2 - 3
NVIDIA External GFX NVIDIA GeForce 8400M G
Video Memory NVIDIA GeForce 8400M G (Physical 128MB + TurboCache)
Max.Resolution for LFP LVDS 1680 x 1050 x 18Bits color (WSXGA+)
Max.Resolution for External
Monitor 2048 x 1536 @85HZ (CRT)
Audio
Sound High Definition Audio
Controller HD Audio Codec, ALC262
Conversion Built-in high performance 20-bit ADC & 24-bit DAC
Internal Interfaces Embedded 2 stereo speakers, Internal microphone
Speaker Power Rating 2 Speakers x 2 Watt with enclosure each
External Interfaces Microphone, Headphone, S/PDIF
Controls Keyboard volume control
Microphone Mono Microphone
Microphone Mono
Sensitivity -44dB
Output Impedance 2.2KΩ
Storage
Hard Disk Drive 9.5mmH 2.5" HDD, Removable
Supports SMART Ultra DMA 33/66/100, DMA Mode 2/4 ; SATA
Average Access Time 13m sec.
Speed 5400 / 7200 RPM , Hybrid HDD, TMR/PMR Type
Capacity
80GB / 100GB / 120GB / 160GB / 2000GB / 250GB : HGST,
Hitachi, Samsung
- 80 ~ 250 GB SATA 5400rpm
- 80 ~ 200 GB SATA 7200rpm
- 80 ~ 160GB SATA 5400rpm, Hybride + 256MB
- 120 ~ 250GB SATA 5400rpm, Hybride + 5126MB
Optical Disk Drive DVD / Combo / Super Multi DL & w/LightScribe (12.7mm/PATA)
Blueray / HD-DVD
Type Fixed type (Factory Option)
S/W supplied Cyberlink DVD Solution
Security RPC-II Regional Encoding
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2. Introduction and Specification

2 - 4
Optical Driver Modules
Combo Drive 1 Factory Option
Module type Fixed 12.7mm Slim
Speed 8x DVD-ROM, 24x RW, 24x CD-R : TSST, TS-L332A
Average Access Time DVD 130ms Typ, CD 130ms Typ
Weight 176g or less
S/W Supplied Cyberlink DVD Solution
Security RPC-II Regional Encoding
Combo Drive 2 Factory Option
Module type Fixed 12.7mm Slim
Speed 8x DVD-ROM, 24x RW, 24x CD-R, 24x CD : TSST, TS-L462D
Average Access Time DVD 130ms Typ, CD 130ms Typ,.
Weight 176g or less
S/W supplied Cyberlink DVD Solution
Security RPC-II Regional Encoding
SuperMultiDualLayer1 Factory Option
Module type Fixed 12.7mm Slim
Speed 5x DVD-RAM, 8x DVD±R 2.4x DVD+R DL, 4x DVD±RW, 24x CD-R,
16x CD-RW, 8x DVD, 24x CD : Panasonic UJ-850
Average Access Time DVD 130ms Typ., CD 130ms Typ.
Weight 190g or less
S/W supplied Cyberlink DVD Solution
Security RPC-II Regional Encoding
SuperMultiDualLayer2 Factory Option
Module type Fixed 12.7mm Slim
Speed 5x DVD-RAM, 8x DVD±R, 6x DVD±R DL, 8x DVD+RW, 6x DVD-
RW, 24x CD-R/RW, 8x DVD, 24x CD : TSSTTS-L632D
Average Access Time DVD 130ms Typ., CD 130ms Typ.
Weight 180g or less
S/W supplied Cyberlink DVD Solution
Security RPC-II Regional Encoding
Super MultiDual Layer 3 Factory Option
Module type Fixed 12.7mm Slim
Speed 5x DVD-RAM, 8x DVD±R, 6x DVD±R DL, 8x DVD+RW, 6x DVD-
RW, 24x CD-R/RW, 8x DVD, 24x CD : TeacDV-W28EC
Average Access Time DVD 130ms Typ., CD 130ms Typ.
Weight 180g or less
S/W supplied Cyberlink DVD Solution
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2. Introduction and Specification

2 - 5
Security RPC-II Regional Encoding
Super MultiDual Layer
Lightscribe Factory Option
Module type Fixed 12.7mm Slim
Speed 5x DVD-RAM, 8x DVD±R, 6x DVD±R DL, 8x DVD+RW, 6x DVD-
RW, 24x CD-R/RW, 8x DVD, 24x CD : TSST TS-L632M
Average Access Time DVD 130ms Typ., CD 130ms Typ.
Weight 180g or less
S/W supplied Cyberlink DVD Solution
Security RPC-II Regional Encoding
Network Tools
Fax/Modem 56Kbps / V.92 Azalia Modem, DELPHI (D40) (Factory Option)
Chipset CSP1040 AGR A3 & A3 5V1
Features RJ11 Output
LAN 10/100 Ethernet
Chipset Marvell 88E8039
Features RJ45 Output
802.11g Wireless LAN Intel PRO/Wireless 3945BG:Intel 802.11b/g
Type Mini card (Factory Option)
Chipset Golan
Antenna Integrated 2 Antenna
802.11a/g Wireless LAN Intel PRO/Wireless 3945ABG:Intel 802.11a/b/g
Type Mini card (Factory Option)
Chipset Golan
Antenna Integrated 2 Antenna
802.11a/g/n Wireless LAN Intel PRO/Wireless 4965ABGN:Intel 802.11a/b/g/n
Type Mini card (Factory Option)
Chipset Kedron
Antenna Integrated 3 Antenna
Bluetooth BCM92045NMD : Factory Option
Type USB daughter card with integrated PIFA antenna
Chipset Broadcom BCM2045
Standard version 2.0
I/O Interface
PC CardBus Slots 1 PCMCIA Type II slot
Controller RICOH R5C847
Support 32bit CardBus cards
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2. Introduction and Specification

2 - 6
I/O Ports
USB Port 2(USB2.0)
Video (CRT) Port 1
Audio Jacks Headphone + S/PDIF, MIC-in
Modem / LAN RJ11, RJ45
Power 1(5pie)
TV Antenna Jack External DMB Antenna socket (Factory Option)
Security Kensington Lock
Input Devices
Camera 1.3M Pixels Digital Camera (Factory Option)
Key board 88KEY(KR/US), 89KEY(UK/FR/GM/SP)
Travel length 2.6mm/ Key Pitch 19.05mm
Touchpad Synaptics Touchpad (Plat type with Scroll area)
Easy Button Vista : Hot start, XP : AVS
Multi Memory Card Slot
Controller R5C843
Type Memory stick / Memory stick pro / SD / xD / MMC (High speed MMC)
Power and Power
Management
Battery SSB-Q30LS6 (6cells, Smart Li-Ion Battery)
Dimension 204 x 52.2 x 21mm
Weight 320g (max)
Recharge Time 2 hours to 100% with Windows on & off
Battery Life over 4hours ( Battery mark 4.01)
Details of Cell 6cells (2Parallel 3Serial)
Voltage 11.1Vdc
Battery Capacity 2400mAh/cell
Battery Rating 11.1V / 4800mAh (53.28Wh)
AC Adapter AD-6019S
Output Power 60Watts
Dimension 160 X 70 X 29mm
Weight (AC Adapter) 300g ± 50g
Worldwide Compatibility Auto-sensing 100 - 240VAC
Line Frequency 50 / 60Hz
Adapter Rating - Input 100V - 240V, 1.8A
Adapter Rating - Output 19.0VDC / 3.16A
Power Management Features ACPI 3.0 support, Standby(S3), Hibernate(S4)
System Dimensions
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2. Introduction and Specification

2 - 7
Dimensions (W X D X H) 299 x 217 x 26.9~36.1mm
Weight (Full system w/ 6cell
Battery) 1.86kg
Status : No options, 6cell battery, 12.1" LCD
Materials LCD back / Front : PC/ABS
Bottom / Top : PC/ABS
3) Key Feature
Q35 Q45
CPU Intel Core Solo T1300, T1400
Intel Core Duo T2300~2700.
667/800MHz Intel Core 2 Duo Processor
(Merom)
Chipset 945GM/PM (Calistoga) 965GM/PM(Crestline)
Memory DDR2 533 / 667MHz DDR2 533 / 667MHz
Graphic Intel 950 GMA Solution Intel GMA X3000 Solution /
nVIDIA Geforce 8400M G
LCD 12.1" WXGA Glare 12.1” WXGA Glare
HDD PATA / SATA SATA
ODD 12.7mm 12.7mm
Port 2USB, VGA, Headphone, MIC, S/PDIF
1394(4pin), RJ45, RJ11, PC-Card, 6-in-1,
AC-IN, DMB Antenna, Kensington Lock
2USB, VGA, Headphone, MIC, S/PDIF
1394(4pin), RJ45, RJ11, PC-Card, 6-in-1,
AC-IN, DMB Antenna, Kensington Lock
Battery 6cell 6cell
Design Proto type 2nd Proto type
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2. Introduction and Specification

2 - 8
4) Option Partlist
HDD
BA59-01999A HTS541660J9SA00 5400rpm, 60G, SATA, 8M
BA59-01946A MHV2060BH-PL 5400rpm, 60G, SATA, 8M
BA59-02084A MHW2060BH 5400rpm, 60G, SATA, 8M
BA59-02038A HM060HI 5400rpm, 60G, SATA, 8M
BA59-02001A HTS541680J9SA00 5400rpm, 80G, SATA, 8M
BA59-01947A MHV2080BH-PL 5400rpm, 80G, SATA, 8M
BA59-02085A MHW2080BH 5400rpm, 80G, SATA, 8M
BA59-02009A ST980815AS 5400rpm, 80G, SATA, 8M
BA59-01742A HTS541010G9SA00 5400rpm, 100G, SATA, 8M
BA59-01948A MHV2100BH-PL 5400rpm, 100G, SATA, 8M
BA59-02086A MHW2100BH 5400rpm, 100G, SATA, 8M
BA59-02014A HM101JI 5400rpm, 100G, SATA, FFS
BA59-02010A ST9100828AS 5400rpm, 100G, SATA, 8M
BA59-02002A HTS541612J9SA00 5400rpm, 120G, SATA, 8M
BA59-01957A MHV2120BH-PL 5400rpm, 120G, SATA, 8M
BA59-02087A MHW2120BH 5400rpm, 120G, SATA, 8M
BA59-02013A HM121JI 5400rpm, 120G, SATA, FFS
BA59-02039A HM120JI 5400rpm, 120G, SATA, 8M
BA59-02011A ST9120822AS 5400rpm, 120G, SATA, 8M
BA59-02003A HTS541616J9SA00 5400rpm, 160G, SATA, 8M
BA59-02012A ST9160821AS 5400rpm, 160G, SATA, 8M
BA59-02110A MHW2160BH-PL 5400rpm, 160G, SATA, 8M
LCD
BA59-01889A AMLCD LTN121W1-L03-G
BA59-01893A AUO B121EW01V3
MEMORY
1105-001683 DDR2 667Mhz 512MB M470T6554CZ3-CE6
1105-001684 DDR2 667Mhz 1GB M470T2953CZ3-CE6
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2. Introduction and Specification

2 - 9
CPU
0902-002196 T_T7100(Merom Dual Core ) 1.8Ghz(FSB800) 2MB
0902-002197 T_T7300(Merom Dual Core ) 2.0Ghz(FSB800) 4MB
0902-002198 T_T7500(Merom Dual Core ) 2.2Ghz(FSB800) 4MB
0902-002199 T_T7700(Merom Dual Core ) 2.4Ghz(FSB800) 4MB
BLUETOOTH
BA59-01691A BT MODULE(FOX) Bluetooth V2.0, T60H928.01, Bluetooth Module
BA59-01916A BT MODULE(SEM) Bluetooth V2.0, BTO2P0B2SA, Bluetooth Module,
ODD
BA96-03223A S_MULTI(DV228EC) TEAC
BA96-03241A S_MULTI(UJ-850) MATSUHITA
BA96-03242A S_MULTI(TS-L632D) TSST
BA96-03243A S_MULT ScriveI(TS-L632M) TSST
BA96-03222A COMBO(DW-224E-R) TEAC
BA96-03239A COMBO(TS-L462D) TSST
BA96-03245A DVD(TS-L332A) TS-L332A
WLAN_GOLAN
BA59-01723A 802.11a/b/g WM3B3945AGKOR
BA59-01722A 802.11a/b/g WM3B3945AGROW
BA59-01721A 802.11a/b/g WM3B3945AGMOW1
BA59-01724A 802.11a/b/g WM3B3945AGMOW2
WLAN_MIMO
BA59-02065A 802.11a/b/g/n 4965AGN KOR
BA59-02064A 802.11a/b/g/n 4965AGN ROW
BA59-02062A 802.11a/b/g/n 4965AGN MOW1
BA59-02063A 802.11a/b/g/n 4965AGN MOW2
- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -
- This Document can not be used without Samsung's authorization -
2. Introduction and Specification

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5) New Function
5)-1. Camera (Option)
Internal Camera (Option) for easily video and photo capture
5)-2. HD-DVD, Blue-Ray
- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -
- This Document can not be used without Samsung's authorization -
2. Introduction and Specification

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- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -
- This Document can not be used without Samsung's authorization -
2. 제품 특징 및 사양

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5)-3. New Keyboard
- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -
- This Document can not be used without Samsung's authorization -
2. Introduction and Specification