SCOTLE ACHI-HR15000 User manual

ACHI-HR15000 Rework Station
NO.: ACHI HR-15000
Instruction Manual
深圳市玉海源科技有限公司
Shenzhen Scotle Technology Co.,Ltd

www.achibgarework.com
ACHI- BGA rework station
深圳市玉海源科技有限公司
Shenzhen Scotle Technology Co.,Ltd
Office Address: 038-068 2F Handmade Culture Street, Phase III
Shuiku Road, Bantian, Longgang, Shenzhen, China
Tel: [phone]
Email: [e-mail]
Factory Address: 801#A, The Zhonghengsheng hi-tech Park,
Xinyu Road No.3, Shajing, Baoan, Shenzhen, China

CONTENTS
1. Instruction Features .................................................................. 4
2. Installation .................................................................................. 4
3. Product specifications and technical parameters ................. 5
4. Introduction of the main structure........................................... 6
5. Program settings and operation .............................................. 8
6. Operation Basic Introduction ................................................. 13
7. The use of external thermocouple wires .............................. 15
8. Reballing process .................................................................... 18
9. Repair and Maintenance ......................................................... 20
10. Safety precautions ................................................................ 21
Normal BGA welding and de-soldering parameters (for
reference) ...................................................................................... 22

1. Instruction Features
1. Adopt liner slide which make X、Y、Z axis all can do micro adjust or rapid
positioning with high precisely.
2. Heating system controlled by touch screen, and optical alignment are easy
operation to ensure positioning precision.
3. Have connected computer device, achievable computer control,
convenience for setting, display, save, and printing curve.
4. The excellent temperature control system ensures the effectiveness of
welding.
1) There are independent heating areas from top to bottom. The first and
second temperature areas can control many groups & sections of
temperature parameters at the same time. The third area preheats the
PCB thoroughly to achieve the best welding effect. Temperature, time,
slope, cooling and alarming all display on the touch screen.
2) Use a V-groove equipped with a flexible fixture for PCB positioning to
protect the PCB.
3) Use a powerful cross-flow fan to cool PCB rapidly to prevent it from
deformation and ensure the welding effect.
4) When the temperature goes out of control, the electric circuit can cut off
automatically, with over-heating protection.
2. Installation
1. Be away from flammable, explosive, corrosive gas or liquid.
2. Avoid damp places, the air humidity is less than 90%.
3. Temperature -10 ~ 40 , avoid direct sunlight, prolonged sun exposure.℃ ℃
4. No dust, fibers and metal particles floating in the operational environment.
5. The place of installation needs to be flat, solid, no vibration.
6. Place heavy objects on the body are strictly prohibited.
7. Avoid the affection of direct airflow, such as air-conditioners, heaters or fans.
8. The back of rework station should be reserved 30CM for heat dissipation.
9. The placing table (900x900mm) be flat, the relative level of a height
750~850mm.
10. Distribute wiring must be handled by a qualified professional technician,

the main line is 1.5 square feet. Equipment must be well grounded.
11. Switch off the power after use, power must be disabled if a long-term no
need.
3. Product specifications and technical parameters
1. Power voltage: 220V±10% VAC 50/60Hz
2. Total power: 5300W Max
3. Heaters: Top hot-air heater 1200W Bottom hot-air heater 1200W Bottom IR
heater 2700W
4. Electrical materials: Intelligent programmable temperature control system,
have connected computer device.
5. Temperature control: K-type thermocouple (Closed Loop): Independent
control top and bottom temperature, temperature accuracy within ±3℃
6. Positioning: V-type groove, with universal fixture
7. PCB size: 410x370mm Max 65x65mm Min
8. Machine size: 640x630x900mm
9. Weight: 68kg
10. Color: Black

4. Introduction of the main structure

Name Function Method
1 Top heater Soldering or
de-soldering BGA
Up and down to the
desired position
2 BGA angle adjust BGA and PCB board
position
Adjust forth and
back
3 Top heater nozzle Ensure hot air
concentration on BGA
surface
Blow to desired
position from BGA
4 Optical alignment box BGA and PCB board
position
90 degree rotate,
pull out when
positioning, push
back after finished
position
5 Light Lighting Adjust light position
6 CCD camera system Pick up the image of
aligning, de-soldering
and soldering
Switch the control
button and place it
properly.
7 PCB support fixture Fixed PCB position from
left to right position
Clockwise,
anticlockwise
rotation
8 PCB board micro
adjust X-axis
BGA and PCB board
when the X-axis
direction of the bit of
fine adjustment
PCB to the left
rotating clockwise,
counter clockwise
9 Emergency stop
button
Abnormal or special
equipment when
emergency stop
Press to stop,
Clockwise rotation
10 Light button Lighting control Press
11 CCD control switch Screen image change Switch over
AV1 shows optical
alignment image
AV2 shows camera
image
12 Start button Starting control Press
13 PCB board micro
adjust Y-axis
BGA and PCB board
when the Y-axis
direction of the bit of
fine adjustment
PCB backward spin
clockwise, counter
clockwise
14 Touch screen Equipment operation
control
Hand touch-screen
15 Joy stick Rise and fall on the
heater up and down the
left and right to zoom
Shaking the handle
up and down
16 Sensors Measure the actual Connect an external

temperature galvanic
17 Top hot air adjust Control of the upper part
of a heating nozzle size
of the wind
Clockwise to
increase air flow,
counter-clockwise
18 Foot Support and adjust
height
Elevated body
clockwise,
counterclockwise
19 Cross-flow cooling fan After cooling the PCB
heating
Choose manual or
automatic
20 Fixture slide PCB board supporting
bar fixed
The PCB into
V-groove, moving
pallets for clamping
21 Monitor BGA and PCB
alignment display
images
Good video,
connector plug,
power cord
5. Program settings and operation
(I) Power to prepare power on:
1. Careful check examination after installed, the switch power on.
2. Check the emergency stop button is pressed or not (Note: If emergency
stop button is pressed, the device will cut off the control power.)
(II) “Operation” Operate
1. After power on, the touch screen will be display (as Figure1) interface,
click “Operation” button, appears operation curve interface. (Figure2).
(Figure1)

(Figure 2)
Operation curve interface introduction:
Top heating temperature: top heating temp. Correspond to the red curve.
Bottom heating temperature: Bottom heating temp. Correspond to the yellow
curve.
Top heater setting: top heater temperature setting.
Bottom heater setting: bottom heater temperature setting.
IR temperature: 3rd IR bottom heater temperature setting. Correspond to
green curve.
IR setting: IR bottom heaters setting.
Real temperature (-1-2-3): shown current sensor temperature.
Run time: recording the time from start to end.
Start: Click start, starting heating.
Stop: when machine is heating, click “Stop” to stop heating.
Manual Cooling: Cooling system, switch control of the cooling system
between manual and automatic.
(Note: During the heating process, don’t allow to open the cooling system.)
Manual Vacuum: vacuum button to control the vacuum.
Analysis: Screen change button, control switch “curve analysis”.
BGA select: Select the data stored in the database.
Save to USB: there is USB connector, can insert USB and saving current
screen (BMP format).

Exit: screen “ ” button to return to the boot screen.
(Note: the heating curve will show from start to end, and save the curve until
the next time start, and re-display the current time temperature curve next
time)
Date: “ ” shown current date and timer.
BGA name: “ ”shown current running group name.
2. Click (Figure 2) “BGA select” button, then enter “group No.” sub-window as
(Figure 3) shown. It show all stored data in database.
(Figure 3)

3. Choose a data and click the “load” button. (Figure 3) appearing the detail
information of chosen data as (Figure4).
(Figure 4)
“+”: reverse the store data.
“-”: forward the store data.
4. Click “use this group data” button. Appearing interface as (Figure5).
(Figure 5)

5. Click “ ” button, return to the operation curve interface. (Figure6)
(Figure 6)
6. Click “Start” button, HR-15000 start to heat according the chosen temp
data.(Figure7)
(Figure 7)
Stated: “Operation” mode and “Set up” mode are basically same, the

difference is below:
“Set up” mode: the user have rights (need input password 8888) to set or
modified each parameter.
“Operation” mode: the user haven’t right (don’t need input password) to
set or modified each parameter. User can operate according stored
parameter only.
(III) Description of parameter settings
1. Preheating section: when you start the program, the top heater will enter
the process, the slope of it is 3 degrees per second, when it reaches to
165 ℃ (the temperature setting of preheating section), keep this
temperature for 30 sections (the time setting of preheating section, till now,
the preheating is finished, then the top heater will enter the next work
process—insulation section.
The bottom heater start to heat from room temperature, the heating slope
is 3 degrees per second, when it reaches to 165℃ (the temperature
setting of preheating section), keep this temperature for 30 seconds (the
time setting of preheating section, till now, the preheating section is
finished, then the top heater will enter the next work process—insulation
section.
IR preheating: Set 180℃, it means that the IR heating plate will be heated
to 180℃, and then keep it.
2. Insulation section: the slope of the top heater is 3degrees per second,
start from 165℃ to 195℃, then keep it for 30seconds.
3. Heating section: the slope of the top heater is 3 degrees per second, start
from 195℃ to 225℃, then keep it for 30 seconds.
The slope of the bottom heater is 3 degrees per second, start from 190℃
to 225℃, then keep it for 30 seconds.
4. Welding 1、welding2 and cooling section are same as above.
The process of actual temperature control of this system can be less than
maximum control section (6 sections). During the heating process, if you
do not use the control section, then you can set 0 to close it.
6. Operation Basic Introduction
(I) De-soldering process
1. Work flow:

Power on→ Place PCB on PCB supporter→adjust position by laser→front
forward Joystick→Fixed the splint→Switch the CCD control bottom to AV2
(for watching the de-soldering process)→ Start
2. Detailed description:
1) Put the BGA pad align bottom heater, fixing the PCB on the PCB
supporter;
2) Fixed PCB board by locked screw of X aisle;
3) Choose the proper nozzle according BGA chip, let laser shine the chip
to position, adjust the joystick to make the top heater fall down to the
distance 3~5mm from PCB board.
4) Switch the CCD control bottom to AV2 for watching the de-soldering
process.
5) Press “start” to run, machine will be automatic heating.
6) After finished heated, press “vacuum”, make the sucker point sucked
up BGA, rising the sucker point to proper position, take out BGA after
cooling.
(II) Soldering process
1. work flow：
Power on→Place PCB on PCB supporter→adjust position by laser→Front
forward Joystick→ Fixed the splint→Switch the CCD control bottom to AV2
(for watching the de-soldering process)→Start
2. Detailed description:
1) Place the PCB on the PCB splint, coating proper flux paste on the BGA
PAD, choose the proper nozzle according BGA size；
2) Let laser shine the soldering place to position, front forward Joystick，
stop when nozzle approaching BGA, then adjust alignment, make the
center of BGA pad aligns nozzle, adjust X axle fixing screw of PCB
splint, to fixed PCB board；
3) Put the balled BGA chips on the PCB pad；
4) Choose the proper nozzle according BGA chip, adjust the joystick to
make the top heater fall down to the distance 3～5mm from PCB
board;
5) Switch the CCD control bottom to AV2 for watching the de-soldering
process.

6) Press “start” to run, machine will be automatic heating;
7) After finished heated, top heater will automatic rising up to original
position and stop there;
8) cooling fan start cooling;
9) Welding is finished.
(III) Mounting process
1. Work flow:
Power on→Place PCB on PCB supporter→Place BGA→Adjust position→
Fixed the splint →Front forward Joystick →Sucking BGA →Go Back
Joystick→Optical Alignment adjust image
2. Detail description
1) Fixed X axis screw, locked PCB splint.
2) Put the balled BGA chips on the PCB pad.
3) Operate joystick to front forward, make the sucking point touched BGA,
press “Vacuum” to sucking BGA;
4) Go back the joystick, let the sucker point with BGA to rising up proper
position;
5) Drag out optical alignment to proper position (BGA center);
6) Adjust image, operating joystick from left to right as zoom in and zoom
out, micro control X, Y axis and R angle to got clearer image.
7) Push back optical alignment to original position, and there is magnetic
positioning.
8) Front joystick, top heater fall down to put BGA on correspond welding
pad, then start heating;
9) After finished heated, top heater will automatic rising up to original
position; BGA has welded on PCB;
10) So far, the mounting process is finished.
7. The use of external thermocouple wires
(I) Function
1. More accurate to measure the actual temperature of the part to be
heated during the welding process.
2. It is easy to move, so that it can be convenient to measure the
temperature of the different parts of the welded components during the

process.
3. After installing thermocouple wires correctly, it will display the galvanic
current measurement temperature in the touch-screen outside the
measured temperature curve screen “measured” column.
(II) Installation
1. Check the thermocouple wires, whether there are disconnected
phenomenon or not.
2. Insert the galvanic Plug into the “outer galvanic Socket” on the control
according to the positive and negative mark.
3. After GALVANIC installed correctly, the real temperature of the outer
temperature curve screen of the touch screen will show the
temperature of the GALVANIC.
(III) Measurement
1. PCB board will be installed on the rework station, with the galvanic
fixed on the PCB board
2. Adjust the height of the probe with the probe galvanic head located in
the top 1-2mm of the test site.
3. Adjust the related mechanical adjustment knob, so that the heating
part just below the hot-air tube.
4. Adjust the up and down adjustment knob of the hot-air head to make
the distance between the edge of PCB board side and hot-air head is
3-5mm.
5. Implementation of the welding / disordering process, that is to start the
process of upper and lower heater.
6. Then it will show three curves of the green, red and yellow on the
computer monitor screen.
(IV) Using the external thermocouple to adjust the temperature curve
Statement: In this operation, it may be due to improper operation to cause
the temperature deviation of the device or even lose control, please
caution!
Take the upper hot-air tube as an example to make detailed description of
adjustment method.

1. Set the temperature, the time, the slope and so on parameters of the
upper heater;
2. Adjustment process proposed to do on a waste circuit board in order to
prevent damage to the circuit board and on-board electronic
components.
3. Implementation of the above process (3), installed the external
thermocouple, in which the top of the PCB board just below the hot-air
tube.
4. Close the lower part of the heating process, click on "Start" button to
start the heating process, which will on the computer monitor screen
will be displayed on the upper curve of the measured temperature
(green) and external galvanic measuring temperature (red) the two
curves;
5. Green curves represent the actual measurement of the galvanic
temperature curve of the upper heating wire interior, the red curve
represents the actual measurement of the galvanic temperature
outside. the smaller the gap between the green curve and red curve,
the closer between the actual temperature and set temperature of the
heating parts, more standard of the upper heating process; On the
contrary, the greater the gap between the two curves, the greater the
actual temperature deviate from the set temperature, the more
non-standard of the upper part during the heating process.
6. If the deviation between the two curves is too much, you should make
the appropriate adjustments.
7. The specific adjustment method is as follows, because of the impact of
the system processes and the environmental, deviations in the
objective is inevitable. If the temperature deviation does not affect the
normal welding and de-soldering, non-professionals should avoid the
following corrective actions!
A. If the outer galvanic curve (red) lower than the upper one (green), adjust
the internal hairdryer galvanic probe upward;
B. If the outer galvanic curve (red) higher than the upper one (green),
adjust the internal hairdryer galvanic probe downward;
C. Adjustment must be small, try to control the amplitude of
accommodation in 1mm or less;

D. Repeated several adjustments;
E. During adjustment process, the heated of galvanic probe is strictly
prohibited from contacting with any objects, so as not to affect the
accuracy of measuring temperature;
F. After temperature adjustment, you should fix the probe, to avoid the
probe vibration measurement of the temperature of the equipment
G. The method of the adjustment applies only to the two parallel curves in
a smooth uniform deviation, and it is invalid to the temperature which is
from top to bottom jitters free-laws regulating!
H. The upper part of the internal galvanic Duct location: Remove the upper
heater nozzle, at a distance of 2-3cm at the edge wind-cone.
8. There is no booster thermocouple temperature curve on the bottom of
the computer screen, so you have to adjust the process of the lower
part of the heaters by visual.
9. Fixed the galvanic line with foil stickers on the bottom of PCB board (as
opposed to the upper heater set back on the PCB board), so that the
probe of the booster thermocouple is located just 2mm above the
mouth of the bottom hot-air nozzle, and adjust the mechanical parts,
make the upper hot-air nozzle deviate from the heated parts to avoid
cold air affect the temperature of the heated parts.
10. The caution is same as the top heater.
11. The methods of adjustment:
A If the outer temperature is lower than the bottom, you should adjust the
lower internal galvanic probe downward.
B If the outer temperature is higher than the bottom; you should adjust the
lower internal galvanic probe upward.
8. Reballing process
1. Fix the BGA chip on the base of universal reballing station; adjust the
four slipper blocks to fix the chip to make it on the center of the
reballing kit.

2. Select the appropriate steel mesh according to chip type. Fix the steel
mesh to the ceiling cover and tighten it with 4 M3 screws, covered with
lid. Adjust 4 Jimmy on the base to meet the suitable height required.
3. Observe the hole on steel mesh which should be completely coincide
with the solder holes on BGA. If not coincide, we must remove the cap
to reposition to ensure steel mesh holes aligned with the chip, and then
lock the four screws.
4. Locking two no spring fixed slide, remove the BGA chip and coated
with a thin layer of solder flux, card the chip into the base again,
covered with lid (make sure the right direction).
5. Put into solder ball, clench hands and gently swaying reballing station
to ensure the solder ball completely filled in the holes and pour out
extra solder balls.
6. Place the reballing station on the flat location; remove the lid, carefully
scored BGA chips. Observe the chip, if individual solder balls are not in
the rightly, please correct it with forceps.
7. It is convenient to use our different types of repair stations or welding
machine to fix solder ball. Heat solder balls on the BGA to soldering it
on BGA, thus reballing finished.

9. Repair and Maintenance
(I) Upper heater:
1. Turn off the power supply, wait until the machine is cool down；
2. Replace the fan: take off the cover of top heater, then change the fan；
3. Then replace the cover, fan, fan splint, plastic connector, heating tube,
take off the heater and replace heater.
Noted: It must be use high-temperature insulation paper to wrapped
heating wire when replace it.
(II) Replacement of Bottom heating wire:
1. Dismantle the locking fan bolts, careful overturn body of machine, then
the components are shown.
2. Remove fan and fan fixture, plastic connector, heating wire fixture, then
take off the heating wire to replace.
Noted: It must be use high-temperature insulation tape to wrap heating
wire when replace it.
(III) Bottom (3rd heating area) heater replacement:
1. Remove the heating box cover, demolition of locking screw, remove
the heating plate and the assembly of the fixed plate, placed on the
table which is covered with a sponge (with heating plate surface facing
down).
2. Removed the fixed heating plate card, you can break down the fixed
plate and heating plate assembly, remove the heating plate then it can
be replaced
(IV)Machine maintain
1. Always keep slider clean;
2. Optical system do not remove at random, use the fabric with alcohol to
clean;
3. Frequently cleaning heating plate, PCB split. Use cloth with alcohol
wrap surface of machine after heaters gully cool.