SIEB & MEYER SD2 Guide

Drive System SD2
D-00000039.3
2021-03-16
Drive System SD2
Hardware Description
Drive amplifier SD2, power supply unit PS2
SIEB & MEYER

Copyright
Original instructions, Copyright © 2021 SIEB & MEYER AG.
All Rights Reserved.
This manual or extracts thereof may only be copied with the explicit authorization by
SIEB & MEYER AG.
Trademarks
All product, font and company names mentioned in this manual may be trademarks or
registered trademarks of their respective companies.
SIEB & MEYER Worldwide
For questions regarding our products and technical problems please contact us.
SIEB & MEYER AG
Auf dem Schmaarkamp 21
21339 Lueneburg
Germany
Phone: [phone]
Fax: [phone]
[e-mail]
http://www.sieb-meyer.de
SIEB & MEYER Shenzhen Trading Co. Ltd.
Room A208 2/F,
Internet Innovation and Creation services base Building (2),
No.126, Wanxia road, Shekou, Nanshan district,
Shenzhen City, 518067
P.R. China
Phone: [phone]
Fax: [phone]
[email protected]
http://www.sieb-meyer.cn
SIEB & MEYER Asia Co. Ltd.
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Min-Sheng N. Road
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333 Tao-Yuan Hsien
Taiwan
Phone: [phone]
Fax: [phone]
[email protected]
http://www.sieb-meyer.com
Drive System SD2 - Hardware Description

Table of Contents
Table of Contents
1 About this Manual.................................................................8
1.1 Illustration of Warnings.......................................................................................8
1.2 Abbreviations..................................................................................................... 8
2 General Information............................................................10
3 Safety Instructions..............................................................11
3.1 Standards and Regulations..............................................................................11
3.2 Working on the Device.....................................................................................11
3.3 Appropriate Use...............................................................................................12
3.4 Reasonably Foreseeable Misuse.....................................................................13
3.5 Transport and Storage..................................................................................... 13
3.6 Installation........................................................................................................14
3.7 Electrical Connection....................................................................................... 15
3.8 Operation......................................................................................................... 16
3.9 Maintenance.................................................................................................... 17
3.10 Disposal........................................................................................................... 17
3.11 Legal Warranty.................................................................................................18
4 Unit Assembly Complying EMC........................................ 19
4.1 Emission of Line and Field Interferences According to Category C3.............. 19
5 Drive Amplifier SD2............................................................ 21
5.1 Block Diagram..................................................................................................21
5.2 Type Plate........................................................................................................ 22
5.3 Device Designation..........................................................................................23
5.4 Components of the Drive System SD2x.......................................................... 24
6 Single-axis Drive Amplifiers.............................................. 25
6.1 Device Variant 0362111xy (max. 80 A)............................................................ 25
6.1.1 Dimensions...................................................................................................................26
6.1.2 Technical Data.............................................................................................................. 27
6.1.3 Connectors................................................................................................................... 28
6.2 Device Variant 0362111MF/0362111NF (max. 200 A)..................................... 29
6.2.1 Dimensions...................................................................................................................30
6.2.2 Technical Data.............................................................................................................. 31
6.2.3 Connectors................................................................................................................... 32
6.3 Device Variant 0362111OF (max. 160 A) with Integrated Water-cooled Heat
Sink.................................................................................................................. 33
6.3.1 Dimensions...................................................................................................................34
6.3.2 Technical Data.............................................................................................................. 35
6.3.3 Connectors................................................................................................................... 36
6.4 Device Variant 0362111RF (max. 220 A) with Integrated Water-cooled Heat
Sink.................................................................................................................. 37
6.4.1 Dimensions...................................................................................................................38
6.4.2 Technical Data.............................................................................................................. 39
6.4.3 Connectors................................................................................................................... 40
6.5 Device Variant 0362111SF (max. 358 A) with Integrated Water-cooled Heat
Sink.................................................................................................................. 41
6.5.1 Dimensions...................................................................................................................43
6.5.2 Technical Data.............................................................................................................. 44
6.5.3 Connectors................................................................................................................... 45
6.6 Device Variants 0362114xy (max. 80 A) with Integrated Heat Sink.................46
6.6.1 Dimensions...................................................................................................................47
6.6.2 Technical Data.............................................................................................................. 48
6.6.3 Connectors................................................................................................................... 49
6.7 Device Variant 0362114MF/0362114NF (max. 200 A) with Integrated Heat
Sink.................................................................................................................. 50
Drive System SD2 - Hardware Description 3

Table of Contents
6.7.1 Dimensions...................................................................................................................51
6.7.2 Technical Data.............................................................................................................. 52
6.7.3 Connectors................................................................................................................... 53
6.8 Device Variant 0362114QF (max. 120 A) with Integrated Heat Sink............... 54
6.8.1 Dimensions...................................................................................................................55
6.8.2 Technical Data.............................................................................................................. 56
6.8.3 Connectors................................................................................................................... 57
7 Double-axis Drive Amplifiers............................................. 59
7.1 Device Variant 0362110xxy (max. 40 A).......................................................... 59
7.1.1 Dimensions...................................................................................................................60
7.1.2 Technical Data.............................................................................................................. 61
7.1.3 Connectors................................................................................................................... 62
7.2 Device Variant 0362112xxy (max. 120 A)........................................................ 63
7.2.1 Dimensions...................................................................................................................64
7.2.2 Technical Data.............................................................................................................. 65
7.2.3 Connectors................................................................................................................... 66
7.3 Device Variant 0362113xxy (max. 40 A) with Integrated Heat Sink.................67
7.3.1 Dimensions...................................................................................................................68
7.3.2 Technical Data.............................................................................................................. 69
7.3.3 Connectors................................................................................................................... 70
7.4 Device Variant 0362115xxy (max. 120 A) with Integrated Heat Sink...............71
7.4.1 Dimensions...................................................................................................................72
7.4.2 Technical Data.............................................................................................................. 73
7.4.3 Connectors................................................................................................................... 74
8 Compact Devices................................................................ 75
8.1 Device Variant 0362130xxy (max. 60 A)..........................................................75
8.1.1 Dimensions...................................................................................................................76
8.1.2 Technical Data.............................................................................................................. 77
8.1.3 Connectors................................................................................................................... 78
8.2 Device Variant 0362131xxy (max. 60 A) with Integrated Heat Sink................ 79
8.2.1 Dimensions...................................................................................................................80
8.2.2 Technical Data.............................................................................................................. 81
8.2.3 Connectors................................................................................................................... 83
9 Power Supply Unit PS2...................................................... 84
9.1 Block Diagram..................................................................................................85
9.2 Device Variant 0362190y................................................................................. 86
9.2.1 Dimensions...................................................................................................................87
9.2.2 Technical Data.............................................................................................................. 88
9.2.3 Connectors................................................................................................................... 89
9.3 Device Variant 0362191y with Integrated Heat Sink........................................90
9.3.1 Dimensions...................................................................................................................91
9.3.2 Technical Data.............................................................................................................. 92
9.3.3 Connectors................................................................................................................... 93
9.4 Device Variant 0362193y with Integrated Heat Sink........................................94
9.4.1 Dimensions...................................................................................................................95
9.4.2 Technical Data.............................................................................................................. 96
9.4.3 Connectors................................................................................................................... 97
10 Mounting Example with External Heat Sink..................... 98
10.1 Rear Panel with Liquid Cooling........................................................................99
10.2 Extruded Heat Sink Made of Aluminum.........................................................100
10.3 High-performance Heat Sink..........................................................................101
10.4 Mounting Holes for 70 mm Devices...............................................................102
10.5 Mounting Holes for 100 mm Devices.............................................................103
10.6 Mounting Holes for 130 mm Devices.............................................................104
11 Water Cooling (0362111OF/RF/SF).................................. 105
4 Drive System SD2 - Hardware Description

Table of Contents
11.1 Connection of the cooling unit........................................................................105
12 Connector Pin Assignment..............................................107
12.1 ID Switch SD2 (Address Selection Switch)....................................................107
12.2 ID SwitchPS2................................................................................................. 107
12.3 X1, X2 – 24 V.................................................................................................107
12.4 X3 – Bus Inputs (RS485,CAN).......................................................................108
12.5 X4 – Bus Outputs (RS485, CAN)...................................................................108
12.6 X5 – DIO........................................................................................................ 109
12.6.1 Digital Inputs / Outputs – SERVO / VECTOR (SVC)..................................................109
12.6.2 Digital Inputs / Outputs – HSPAM / VF....................................................................... 111
12.7 X6 – Encoder 0.............................................................................................. 112
12.8 X7 – Encoder 1 / Encoder Emulation.............................................................112
12.9 X8 – Resolver................................................................................................ 113
12.10 X9 – Motor Feedback.....................................................................................114
12.11 X10 – Safety (STO)........................................................................................115
12.12 X11ϑ – Temperature Sensor of the Motor...................................................... 116
12.13 X12 – DIO PS2.............................................................................................. 116
12.14 X13– Analog Interface................................................................................... 117
12.15 X14 – USB (Parameterization).......................................................................118
12.16 X20, X21 – DC Link Connectors....................................................................118
12.17 X22, X24, X47 – Motor Connection............................................................... 119
12.18 X23 – Mains Supply PS2............................................................................... 121
12.19 X25 – External Ballast Resistor..................................................................... 121
12.20 X26/ X27 – SERVOLINK 4.............................................................................122
12.20.1 Preparation of Optical Fiber Cables with Connector.................................................. 122
12.21 X28 – Mains Supply of Compact Devices......................................................124
12.22 X68 – DC Link Connectors............................................................................ 125
12.23 X69 (1, 2) – External Ballast Resistor............................................................126
12.24 X70 (1, 2, 3) – External Precharge Resistor.................................................. 126
12.25 X71 – Mains Supply PS2............................................................................... 126
12.26 Motor/DC Link Connection 0362111RF......................................................... 127
12.27 Motor/DC Link Connection 0362111SF..........................................................130
13 Connection Examples...................................................... 132
13.1 X1, X2 – 24V..................................................................................................132
13.2 X3, X4 – Bus Connection...............................................................................132
13.2.1 RS485 Bus................................................................................................................. 133
13.2.2 CAN Bus.....................................................................................................................133
13.3 X5 DIO – Digital Inputs/Outputs.....................................................................134
13.3.1 Digital Inputs...............................................................................................................134
13.3.2 Digital Outputs............................................................................................................134
13.4 X6, X7 – Incremental Encoders with TTL Signals......................................... 135
13.5 X7 – Encoder Emulation................................................................................ 136
13.6 X8 – Resolver................................................................................................ 137
13.7 X9 – Motor Feedback.....................................................................................138
13.7.1 Incremental Encoder with Sine Signals (1 Vpp)......................................................... 138
13.7.2 Linear Hall Encoder (1 Vpp)....................................................................................... 139
13.7.3 EnDat 2.1 with Sine Signals (1 Vpp).......................................................................... 140
13.7.4 Hiperface with Sine Signals........................................................................................141
13.7.5 SSI Encoder............................................................................................................... 142
13.7.6 Hall Sensor 12 V.........................................................................................................142
13.7.7 Hall Sensor 5.3 V........................................................................................................143
13.7.8 Field Plate...................................................................................................................144
13.7.9 Incremental Encoder with TTL Signals (5.3 V)...........................................................145
13.7.10 Incremental Encoder 12 V..........................................................................................146
13.8 X10 – Safety Circuit (STO)............................................................................ 147
13.8.1 Wiring with OSSD.......................................................................................................147
Drive System SD2 - Hardware Description 5

Table of Contents
13.8.2 Wiring without OSSD..................................................................................................147
13.9 X11 – Temperature Sensor of the Motor........................................................ 148
13.10 X13 – Analog Inputs/Outputs.........................................................................149
13.10.1 Analog Inputs..............................................................................................................149
13.10.2 Analog outputs............................................................................................................150
13.11 X22/X24/X47 – Motor Phases........................................................................150
13.12 X26/X27 – SERVOLINK.................................................................................151
13.13 Housing Ground.............................................................................................151
13.14 Mounting of the Shield Connection Clamps...................................................151
13.14.1 Clamp Mounting at Plate Edge...................................................................................152
13.14.2 Clamp Mounting at Slot Holes....................................................................................152
14 System Connection.......................................................... 154
15 Status Display and Error Messages of SD2................... 156
15.1 List of the Operating States........................................................................... 156
15.2 List of Drive Error Messages..........................................................................157
15.3 List of the Warning Messages........................................................................162
15.4 Messages of the Quick Stop Functions......................................................... 162
16 Status Display and Error Messages of PS2....................164
16.1 List of the Operating States........................................................................... 164
16.2 List of the Power Supply Error Messages......................................................165
16.3 Hardware Status Signals ERR0/ERR1.......................................................... 166
17 General Information Regarding the Wiring.................... 167
17.1 Mains Connection.......................................................................................... 167
17.1.1 Power Chokes............................................................................................................ 167
17.2 Cable Requirements...................................................................................... 167
17.2.1 Motor Cable................................................................................................................170
17.2.2 Communication Cables.............................................................................................. 171
17.2.3 Cables for the Rotor Position Detection..................................................................... 171
17.2.4 Cables for the External Ballast Resistor.....................................................................171
18 Electric Performance Dimensioning............................... 172
18.1 Components...................................................................................................172
18.1.1 Output Stage.............................................................................................................. 172
18.1.2 Power Supply............................................................................................................. 172
18.1.3 Motor.......................................................................................................................... 173
18.2 Power Consumption of a Drive...................................................................... 175
19 Safety circuit / restart lock (STO).................................... 176
19.1 Functional Description of the Restart Lock.................................................... 177
19.2 Wiring Example..............................................................................................178
19.3 Requirements and Standards........................................................................ 179
20 Appendix............................................................................181
A Specification of Drive Functions.....................................................................181
B Specification of Device Firmware...................................................................185
C Connection Diagram...................................................................................... 186
C.1 Wiring of PS2 (0362190F/0362191F) and SD2..........................................................187
C.2 Wiring PS2 (0362193F) and SD2...............................................................................188
C.3 Wiring SD2 Compact (036213x).................................................................................189
D Manufacturers................................................................................................190
D.1 SIEB & MEYER Accessories......................................................................................190
D.1.1 Connectors of the Series SD2....................................................................................190
D.1.2 Line Filters for Frequency Converter/Power Electronics............................................ 191
Line Filters by TDK & EPCOS Group.........................................................................191
D.1.3 Power Chokes............................................................................................................ 191
6 Drive System SD2 - Hardware Description

Table of Contents
D.1.4 USB>RS232/485 Converter 050201.......................................................................... 192
D.2 Phoenix Contact......................................................................................................... 193
D.2.1 Surge Arrestor FLASHTRAB......................................................................................193
D.2.2 Shield Connection Clamps......................................................................................... 193
D.3 TOSHIBA - Fiber Optic Connectors............................................................................194
D.4 WAGO Innovative Connections..................................................................................194
D.4.1 Shield Connection Clamps......................................................................................... 194
21 Index...................................................................................195
Drive System SD2 - Hardware Description 7

About this Manual
1 About this Manual
This chapter describes symbols, signal words and abbreviations used in this manual.
Note
You can download more documentation from the SIEB & MEYER website under http://
www.sieb-meyer.de/downloads.html.
1.1 Illustration of Warnings
In this manual, the warnings listed below are used. Depending on their degree of risk,
the risk levels listed below exist:
DANGER
Imminent risk of injury
Indicates an imminently hazardous situation which, if not avoided, will re-
sult in death or serious injury.
→ Follow the instructions in this manual to avoid danger.
WARNING
Risk of injury
Indicates an imminently hazardous situation which, if not avoided, will re-
sult in death or serious injury.
→ Follow the instructions in this manual to avoid danger.
CAUTION
Slight risk of injury
Indicates a potentially hazardous situation which, if not avoided, may result
in minor or moderate injury or property damage.
→ Follow the instructions in this manual to avoid danger.
NOTICE
Notice
Indicates a hazardous situation which, if not avoided, may result in property damage.
→ Follow the instructions in this manual to avoid danger.
1.2 Abbreviations
HSPAM high-speed pulse amplitude modulation
n.c. not connected
OSSD output signal switching device
PAM pulse amplitude modulation
PWM pulse width modulation
8 Drive System SD2 - Hardware Description

SERVO servo control
STO safety function: Safe Torque Off
SVC sensorless vector control
VF V/f Characteristic Curve
VCC voltage at the common collector
VECTOR vector control
9Drive System SD2 - Hardware Description
About this Manual

General Information
2 General Information
This manual describes the drive systems of the series SD2. These devices allow oper-
ation of high-dynamic servo motors as well as synchronous and asynchronous high-fre-
quency spindles.
The devices are equipped with interfaces for different sensor systems allowing to drive
motors with resolvers as well as SinCos, EnDat, Hall, linear Hall, incremental and field
plate sensors. Motor systems without any sensors are also supported, whereas different
customized control methods are available. In addition, the devices can drive rotary and
linear motors. Thus, the number of device variants is reduced for the machine manufac-
turer.
This manual provides information on:
▸Safety instructions and application advice
▸Notes about the electromagnetic compatibility
▸Description of the device (block diagram, type plate, module designation)
▸Technical data, dimensions
▸Connector pin assignment
▸Wiring examples
▸Status and error messages
▸General information regarding the wiring (cables and line cross-sections)
▸External protection, ballast circuit
This manual has the following demands on the trained staff of machine manufacturers:
Transport: only by skilled employees familiar with handling electrostatically sensitive compo-
nents
Installation: only by experts with electrotechnical training
Initial operation: only by experts with experience in the fields of electrical engineering / drive technol-
ogy
Note
Information concerning the initial operation and parameterization of the digital drive am-
plifier can be found in the manual of the software drivemaster2.
Note
More documentation can be downloaded from the SIEB & MEYER website under http://
www.sieb-meyer.de/downloads.html.
10 Drive System SD2 - Hardware Description

3 Safety Instructions
Note
These safety instructions include important information regarding your safety and must
be observed during installation and operation of SIEB & MEYER devices. Read them
carefully and keep them for later use.
Also adhere to safety instructions in the product documentation and on the device.
3.1 Standards and Regulations
SIEB & MEYER devices comply with the regulations of the following standards and di-
rectives:
▸Low-Voltage Directive 2014/35/EU:
EU declaration of conformity, DIN EN 61800-5-1
▸EMC Directive 2014/30/EU:
EU manufacturer's certificate, DIN EN 61800-3
▸Machinery Directive 2006/42/EC:
EU manufacturer's certificate, DIN EN 61800-5-2 (safety functions)
Note
SIEB & MEYER products are no products according to the EU Machinery Directive. The
appropriate use of SIEB & MEYER devices in machines and installations is prohibited
until the manufacturer of the machine or installation confirms the CE conformity of the
complete machine or installation.
Note
If the mechanics or the electronics of the device are modified, the conformity with the
EC/EEC directives and thus the label will expire.
3.2 Working on the Device
WARNING
trained staff
→ To avoid risks of serious injuries and material damage any works re-
garding installation, initial operation and maintenance must be carried
out by trained staff only! Furthermore, electricians who connect feed-
in systems must be approved by the local DSO (distribution system
operator).
→ Trained staff, according to this fundamental safety instruction, are
persons familiar with the installation, mounting, initial and permanent
operation of the product and they are qualified appropriately for the
work. The standards DIN VDE 0100 and DIN VDE 0110 as well as the
national accident prevention regulations shall be considered!
→ When installing feed-in systems adhere to all applicable regulations,
special safety instructions and technical connection conditions of the
local DSO.
11Drive System SD2 - Hardware Description
Safety Instructions

Safety Instructions
DANGER
Risk of serious damage to property and personal injury may occur:
- when covers are removed illegally
- due to improper use
- when either the installation or the operation is incorrect
→ Observe the corresponding notes and information in the product doc-
umentation of your device.
WARNING
Risk of injuries and material damage due to illegal modifications
→ Only change the settings of the device after having contacted
SIEB & MEYER vor.
All Information and advice attached to the device, such as safety instructions or danger
warnings and technical data (type plate) are:
▸not to be removed
▸not to be damaged
▸to be kept readably (no covers, no paint over or the like)
3.3 Appropriate Use
Use the device according to its appropriate use only. Consider the corresponding infor-
mation regarding the application fields of the device in the product documentation.
The device is intended for use within an enclosed cabinet by the OEM or end user to
comply with pollution degree 2 or equivalent environmental conditions. That means: En-
sure to avoid conductive impurities and humidity during the operation.
SIEB & MEYER products are not suitable for use in areas exposed to explosion hazards
(ATEX zones) without approriate housing.
Terms according to DIN EN 61800
Before initial operation, make sure that the machine will not expose danger (e.g. run-
away moves). The conformity with the safety standards DIN EN 60204-1 and DIN
EN 61800-5-1 must be ensured.
The manufacturer of the system or the machine has to meet the requirements of the
legal values regarding the Electromagnetic Compatibility (EMC). SIEB & MEYER units
can be operated in industrial areas, provided that the attached EMC information has
been taken into consideration.
SIEB & MEYER tests all products in its own EMC laboratory to ensure that the products
meet the respective standards, when they are installed properly.
Installation of the device differing from the product documentation and the manual "EMC
Guidelines" means that the machine manufacturer has to carry out new measurements
to comply with the regulations.
SIEB & MEYER devices meet the requirements of the Low-Voltage Directive 2014/35/
EU. The harmonized standards of DIN EN 50178 and DIN EN 60204-1 in combination
with the standards DIN EN 60947 and DIN EN 61800-5-1 are applied consequently.
12 Drive System SD2 - Hardware Description

Technical data and the connection specification can be found in the respective product
documents.
Line filters
If adequate interference suppression measures are applied and the appropriate use in
industrial applications of the device is ensured SIEB & MEYER devices comply with
the Directive EMC Directive 2014/30/EU in terms of the EMC Product Standard (PDS)
DIN EN 61800-3.
The use of line filters helps reaching the following:
▸Resistance to interference. The electronic system is protected against high-fre-
quency disturbances, possibly infiltrated via the mains cable.
▸Protection against radiation. High-frequency disturbances are reduced to legally
authorized measure. This prevents effects of the transients to adjacent components
or devices.
▸Products, not equipped with an integrated AC supply line filter must be operated
with an upstream line filter.
▸Using SIEB & MEYER devices in residential or business areas as well in small busi-
nesses requires additional interference suppression.
For detailed information refer to the manual "EMC Guidelines", chapter "EMC Prod-
uct Standard DIN EN 61800-3 for PDS".
Note
Refer to the product documentation of your device to find out whether or not your device
is equipped with a line filter. For detailed information on line filters refer to the manual
"EMC Guidelines".
3.4 Reasonably Foreseeable Misuse
The Machinery Directive defines a "reasonably foreseeable misuse" as "use of machin-
ery in a way not intended in the instructions but which may result from predictable hu-
man behavior".
SIEB & MEYER products are no products according to the EU Machinery Directive.
During design and construction of the machine as well as in the operation manual the
machine manufacturer is obliged to give consideration to the intended (appropriate) use
of the machine and risks arising from reasonably foreseeable misuse of the machine.
To avoid injuries and material damage any use, installation and setup of
SIEB & MEYER products by non-experts which exceed the technical data
specified in the product documentation (high voltages, temperatures etc.)
is considered to be not intended use and forbidden.
Adhere to the safety instructions on the device and in the product docu-
mentation.
3.5 Transport and Storage
Avoid improper mechanical load of the device. The following points must especially be
taken into consideration:
13Drive System SD2 - Hardware Description
Safety Instructions

Safety Instructions
▸Protect the device against mechanical damage! Ensure that single shock loads do
not exceed 40 m/s2.
▸Protect the device against dirt and humidity.
Make sure that dust plugs are plugged on optical fiber connectors equipped
with them during transport of the device. Otherwise, recommissioning is poten-
tially not possible.
▸Never touch electronic components.
The following climatic conditions apply to the storage. If required, appropriate measures
must be taken to ensure these climatic conditions (installation of heating/air conditioning
systems etc.):
▸The storage area must be clean (dust-free, if possible), dry and well-ventilated.
▸No storage in the open.
▸The storage temperature must be in the range of −25 °C to +55 °C (−13 °F to
+131 °F). Shortly it may be +70 °C (+158 °F).
▸The relative humidity on the storage premises must be in the range of 5 % to 75 %
(no bedewing).
▸Sudden changes of the temperature or the humidity should be prevented.
▸Avoid stacking of the devices during transport and storage.
The maximum storage period is 2 years. Electrolytic capacitors produce high leakage
currents when a voltage is applied after a long storage period without applied voltage
and must be reformed. For this, the operating voltage is applied via a 1 kΩ series resistor
for one hour. Please contact the SIEB & MEYER service department for details.
3.6 Installation
NOTICE
Damage of electrostatically sensitive components due to improper handling
→ Never touch electronic components..
Note
Consider specific mounting instructions for your device.
Mechanical installation conditions for the system according to DIN EN 61800-2:
„Vibrations must remain within the limit values of the IEC 60721-3-3,
class 3M1,standard for fixed equipment.“
Tab. 1: Vibration limits of the system Frequency [Hz] Amplitude [mm] Acceleration [m/s²]
2 ≤ f < 9 0.3 Not applicable
9 ≤ f < 200 Not applicable 1
Tab. 1: Vibration limits of the system
"Vibrations which exceed these limits, or the use on mobile equipment, are considered
as abnormal mechanical conditions."
Operating conditions:
The following requirements are to be considered for the installation and the operation of
the device. Noncompliance with theses requirements is regarded as abnormal operat-
ing condition:
14 Drive System SD2 - Hardware Description

▸The device is conceived according to DIN EN 61800-1/ DIN EN 50178for the dirt
level 2. That means: Ensure to avoid conductive impurities during the operation.
▸Devices with air cooling only can be loaded to their maximum up to a height of
1000 m above MSL (3281 ft above MSL). For an operation in areas higher than
1000 m (3281 ft) above MSL the capacity must be reduced by 1.5 % per 100 m
(328 ft).
The maximum site altitude is 2000 m (6562 ft) above MSL for IT mains and 3000 m
(9843 ft) above MSL for symmetrically grounded TN and TT mains..
▸The device must be protected against harmful gas, oil vapor and salty air at the
place of installation.
▸The ambient air must not contain aggressive, grinding, electrically conductive or
flammable substances as well as any amount of dust.
▸The maximum relative humidity during operation is 85 % (no condensation).
▸The allowed ambient temperature for the operation is +5 °C to +40 °C (+41 °F to
+104 °F). Extreme and sudden changes of the temperature should be prevented.
– Ensure power derating for devices used in ambient temperatures over +40 °C
(+104 °F) (see technical data). The following applies: -1.5 % per 1 °C. Note:
F=C×9/5+32; C=(F-32)×5/9
– Devices with polyester films: The polyester films must not be exposed to direct
sunlight for extended periods of time. In conditions of high humidity (>80 %) the
ambient temperature must not exceed +40 °C (+104 °F). The polyester films
must not come in contact with benzyl alcohol or methylene chloride.
▸Make sure that the aeration elements are free and open, so that the air circulation
is not restricted.
3.7 Electrical Connection
DANGER
Risk of serious injuries due to touch voltages
After electric devices have been switched off touch voltages may occur de-
pending on the device up to 4 minutes. Longer construction-related dis-
charge times are possible. Refer to the product documentation of your de-
vice.
→ All work at and within the units must only be carried out, when the
units are turned off, the mains supply is cut and the DC bus is com-
pletely discharged.
→ Never touch energized parts after a device has been switched. off.
→ Consider the VDE regulations and the applicable accident prevention
regulations (e.g. VBG 1 and VBG 4).
DANGER
Risk of serious injuries due to improper connection to earth
Incorrect or insufficient connection of the system to earth may cause dan-
gerous currents.
→ Connection to earth must be realized according to the instructions in
the product documentation of your device.
The electrical installation must be carried out according to the relevant electrical codes
(e.g. appropriate wire gauges, fuse protection and connections of ground conductors
must be considered).
15Drive System SD2 - Hardware Description
Safety Instructions

Safety Instructions
Note
SIEB & MEYERdevices are conceived for connection to symmetrically grounded TN
networks. For detailed information regading the connection to TN networks or other net-
works refer to the manual "EMC Guidelines", chapter "Connection to Different Supply
System Types".
Recommendations for the installation complying EMC (e.g. shields, connection to earth
and line installations) can be found in the technical manuals of your device (only for ma-
chine manufacturers). The manufacturer of the system or machine has to meet the re-
quirements of the legislation regarding the EMC.
1. Consider that the mains supply must be protected via an overload release with re-
stricted guidance for each mains phase. The mains line should not be switched on,
before the work is completed.
2. Before turning on the unit the first time, make sure that the connected machine will
not have runaway axes.
3. Never connect capacitive loads to the output phases of the servo amplifiers and fre-
quency converters.
4. Prevent cable loops. Therefore, the units must only be connected to earth at the
provided PE connection for the mains supply line and the racks only at the provided
earth screw.
DANGER
Connection of the power supply unit
This product may cause touch current in the protective earthing conductor.
The current in the protective earthing conductor can exceed 3.5 mA AC or
10 mA DC.
→ Pay attention to the local safety regulations for electric equipment with
high leakage currents, in particular the minimum cross-section of the
protective earthing conductor.
Operation with residual current device (RCD)
Note
For detailed information regarding the operation with residual current device (RCD) re-
fer to the manual "EMC Guidelines", chapter "Safety-relevant Aspects, Residual Current
Device (RCD)".
3.8 Operation
WARNING
Risk of serious personal injury due to moving machine parts
During the operation of an installation with open doors or removed covers,
persons may seriously be injured by moving machine parts.
→ Keep the doors closed during the operation and do not remove cov-
ers.
16 Drive System SD2 - Hardware Description

WARNING
Risk of injuries and material damage due to flying parts
Persons may be injured or material be damaged, if screws of the front pan-
els and housing parts are not fastened.
→ Before the initial operation of the installation ensure that all screws are
tightened.
WARNING
Risk of burn due to hot surfaces
During operation the units can have hot surfaces according to their protec-
tion system. In particular this applies to ventilation inlets and outlets.
Never touch device parts during operation apart from operating units.
When using ferrite rings temperatures may exceed 80 °C in some cases.
→ Only use cables that are provided for temperatures over 90 °C. This
corresponds to the flammability rating UL 94V-0, RTI 105 °C. Dies
entspricht der Entflammbarkeitsklasse UL 94V-0, RTI 105 °C.
→ Consider the relevant notes in the manual.
Systems, into which servo amplifiers and frequency converters are mounted, possibly
must be equipped with additional protective devices according to the valid safety instruc-
tions (e.g. law about technical material, rules for prevention of accidents, etc.)
3.9 Maintenance
The unit must be checked regularly for cleanness and functionality depending on the
ambient pollution. This applies in particular for installed fans.
3.10 Disposal
Note
Make sure to consider country-specific waste and disposal laws and statutes for the dis-
posal of packing material, used batteries and irreparable devices.
SIEB & MEYERproducts meet the requirements of the following directive:
▸2011/65/EU (EU-directive RoHS 2 on the restriction of the use of hazardous sub-
stances in electrical and electronic equipment)
SIEB & MEYERproducts do not exceed the limits of the directive 2011/65/EU for haz-
ardous substances.
SIEB & MEYERproducts labeled with the adjacent symbol also meet
the regulations of the following directive:
▸SJ/T 11364-2014 (China RoHS 2 on the restriction of the use of
hazardous substances in electrical and electronic equipment)
SIEB & MEYERproducts labeled with the symbol above do not exceed the limits of the
directive SJ/T 11364-2014 for hazardous substances.
17Drive System SD2 - Hardware Description
Safety Instructions

Safety Instructions
3.11 Legal Warranty
SIEB & MEYER products are liable to a legal warranty of at least one year. Any claims
for the products beyond this warranty shall be declared in an additional contractual
agreement between SIEB & MEYER and the customer.
Claims for damages are excluded:
▸due to improper use of the device
▸when the device has been installed nonstandard or improperly, especially by elec-
tricians without license
▸when the device has been employed although the protection equipment was defec-
tive
▸when the maximum permissible input voltage has been exceeded
▸due to improper operation
▸when the device or its equipment have been modified
▸when the device was affected by foreign material or force majeure
NOTICE
Due diligence of the machine manufacturer
→ A first programming carried out by SIEB & MEYER does not release the machine
manufacturer from his duty to check the programmed values for correctness.
18 Drive System SD2 - Hardware Description

4 Unit Assembly Complying EMC
Note
The EU guidelines for electromagnetic compatibility (EMC) must be considered for the
initial operation of all SIEB & MEYER devices.
The manual "EMC Guidelines" is available in German and English and includes:
▸EMC rules
▸information regarding the professional grounding and wiring
▸safety-relevant aspects
▸extracts from the EMC product standard
▸possibilities for the connection to different supply system types
Availability:
▸PDF file under www.sieb-meyer.de/downloads.html
4.1 Emission of Line and Field Interferences
According to Category C3
According to the EMC product standard DIN EN 61800-3, chapter 6 (emission of line in-
terferences), this device meets the interference limit values of the category C3 if the con-
ditions listed below are met.
Requirements
▸The device is equipped with basic interference elimination functions via an integrat-
ed line filter.
If motor cables longer than 5 m are used, an external line filter may be required.
For detailed information on mounting and connecting line filters refer to the manual
"Unit Assembly complying EMC".
▸If no internal line filter is provided, an external line filter must be used to reach the
category C3.
NOTICE
Connection of line filters
→ Consider the connection instructions of the line filter manufacturer to ensure suffi-
cient filter effect.
→ Appropriate line filters are provided on demand by SIEB & MEYER (see chapter
“Line Filters by TDK & EPCOS Group”, page 191).
Note
For detailed information on the used device refer to the section "Technical Data".
19Drive System SD2 - Hardware Description
Unit Assembly Complying EMC

Unit Assembly Complying EMC
NOTICE
High-frequency interference when used in a public low-voltage distribution net-
work
If the device is used in a high-frequency distribution network, which supplies residen-
tial areas, high-frequency interferences may occur. These interferences may disturb the
functioning of other devices.
→ Do not use the device in a public low-voltage distribution network or ensure appro-
priate interference suppression measures.
20 Drive System SD2 - Hardware Description