Sony Power HADFX HDC-P1 User manual

HD MULTI PURPOSE CAMERA
HDC-P1
MAINTENANCE MANUAL
1st Edition

HDC-P1
!警告
このマニュアルは，サービス専用です。
お客様が，このマニュアルに記載された設置や保守，点検，修理などを行うと感電や火災，
人身事故につながることがあります。
危険をさけるため，サービストレーニングを受けた技術者のみご使用ください。
!WARNING
This manual is intended for qualified service personnel only.
To reduce the risk of electric shock, fire or injury, do not perform any servicing other than that
contained in the operating instructions unless you are qualified to do so. Refer all servicing to
qualified service personnel.
!WARNUNG
Die Anleitung ist nur für qualifiziertes Fachpersonal bestimmt.
Alle Wartungsarbeiten dürfen nur von qualifiziertem Fachpersonal ausgeführt werden. Um die
Gefahr eines elektrischen Schlages, Feuergefahr und Verletzungen zu vermeiden, sind bei
Wartungsarbeiten strikt die Angaben in der Anleitung zu befolgen. Andere als die angegeben
Wartungsarbeiten dürfen nur von Personen ausgeführt werden, die eine spezielle Befähigung
dazu besitzen.
!AVERTISSEMENT
Ce manual est destiné uniquement aux personnes compétentes en charge de l’entretien. Afin
de réduire les risques de décharge électrique, d’incendie ou de blessure n’effectuer que les
réparations indiquées dans le mode d’emploi à moins d’être qualifié pour en effectuer d’autres.
Pour toute réparation faire appel à une personne compétente uniquement.
安全のために，周辺機器を接続する際は，過大電圧を持つ
可能性があるコネクターを以下のポートに接続しないでく
ださい。
:LANコネクター
上記のポートについては本書の指示に従ってくだい。
For safety, do not connect the connector for peripheral
device wiring that might have excessive voltage to the
following port(s).
: LAN connector
Follow the instructions for the above port.

HDC-P1 1 (P)
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type rec-
ommended by the manufacturer.
When you dispose of the battery, you must obey the
law in the relative area or country.
ATTENTION
Il y a danger d’explosion s’il y a remplacement incor-
rect de la batterie. Remplacer uniquement avec
une batterie du même type ou d’un type équivalent
recommandé par le constructeur.
Lorsque vous mettez la batterie au rebut, vous devez
respecter la législation en vigueur dans le pays ou la
région où vous vous trouvez.
VORSICHT
Explosionsgefahr bei Verwendung falscher Batterien.
Batterien nur durch den vom Hersteller empfohlenen
oder einen gleichwertigen Typ ersetzen.
Wenn Sie die Batterie entsorgen, müssen Sie die
Gesetze der jeweiligen Region und des jeweiligen
Landes befolgen.
FÖRSIKTIGHET!
Fara för explosion vid felaktigt placerat batteri.
Byt endast mot samma eller likvärdig typ av batteri,
enligt tillverkarens rekommendationer.
När du kasserar batteriet ska du följa rådande lagar
för regionen eller landet.
PAS PÅ
Fare for eksplosion, hvis batteriet ikke udskiftes
korrekt.
Udskift kun med et batteri af samme eller tilsvarende
type, som er anbefalet af fabrikanten.
Når du bortskaffer batteriet, skal du følge
lovgivningen i det pågældende område eller land.
HUOMIO
Räjähdysvaara, jos akku vaihdetaan virheellisesti.
Vaihda vain samanlaiseen tai vastaavantyyppiseen,
valmistajan suosittelemaan akkuun.
Noudata akun hävittämisessä oman maasi tai
alueesi lakeja.
FORSIKTIG
Eksplosjonsfare hvis feil type batteri settes i.
Bytt ut kun med samme type eller tilsvarende
anbefalt av produsenten.
Kasser batteriet i henhold til gjeldende avfallsregler.
注意
指定以外の電池に交換すると，破裂する危険があります。
必ず指定の電池に交換してください。
使用済みの電池は，国または地域の法令に従って
処理してください。

1 (E)
HDC-P1
Table of Contents
Manual Structure
Purpose of this manual............................................................ 3 (E)
Related manuals...................................................................... 3 (E)
Trademarks.............................................................................. 3 (E)
1. Service Overview
1-1. Checking before Installation ..................................... 1-1 (E)
1-1-1. Checking the ROM and Software Version.......1-1 (E)
1-2. Connectors and Cables..............................................1-2 (E)
1-2-1. Connector Input/Output Signals ...................... 1-2 (E)
1-2-2. Wiring Diagrams for Cables ............................ 1-6 (E)
1-2-3. Connection Connectors/Cables........................1-6 (E)
1-3. Location of Printed Circuit Boards ........................... 1-7 (E)
1-4. Circuit Description .................................................... 1-8 (E)
1-5. Removing/Installing the Side Panel Assembly ....... 1-10 (E)
1-6. Description of Onboard LED Indicators ................. 1-11 (E)
1-7. Switch Settings........................................................1-13 (E)
1-8. Notes on Flexible Card Wire...................................1-16 (E)
1-8-1. Disconnecting/
Connecting Flexible Card Wire ..................... 1-16 (E)
1-8-2. Forming Flexible Card Wire .......................... 1-18 (E)
1-9. Notes on Replacement of Circuit Board ................. 1-19 (E)
1-9-1. EEPROM Data............................................... 1-19 (E)
1-9-2. Actions to Be Taken during Board
Replacement and after Board Replacement/
Repair.............................................................1-19 (E)
1-9-3. Adjustment/Setting Items when Replacing
the AT-163APT Board....................................1-20 (E)
1-10. Software Version Upgrade ......................................1-21 (E)
1-10-1. Upgrading Program Version ..........................1-21 (E)
1-10-2. Writing/Rewriting PLD Internal Data ........... 1-22 (E)
1-11. Note on Replacement of Lithium Battery ...............1-23 (E)
1-12. Troubleshooting.......................................................1-24 (E)
1-12-1. Device Check.................................................1-24 (E)
1-13. Periodic Check and Maintenance............................1-25 (E)
1-13-1. Recommended Replacement Parts.................1-25 (E)
1-13-2. Cleaning the Air Vents ...................................1-26 (E)
1-14. Description of CCD Block Number........................1-26 (E)
1-15. Optional Fixtures.....................................................1-26 (E)
1-16. Notes on Repair Parts..............................................1-27 (E)
1-17. Unleaded Solder ...................................................... 1-27 (E)
2. Replacement of Main Parts
2-1. Replacing the CCD Unit ........................................... 2-1 (E)
2-2. Replacing CCD Unit Boards.....................................2-3 (E)
2-2-1. DR-632P Board................................................ 2-3 (E)
2-2-2. NR-80P Board.................................................. 2-3 (E)
2-2-3. PA-353P Board ................................................2-4 (E)
2-2-4. TG-265PT Board .............................................2-5 (E)
2-2-5. Filter Servo Board (FD Unit)...........................2-5 (E)
2-3. Replacement of DC Fan ............................................ 2-6 (E)
2-4. Replacing Operation Parts......................................... 2-7 (E)
2-5. Replacing Connectors ............................................... 2-7 (E)
2-6. Removal and Installation of Rear Panel Assembly ... 2-8 (E)
2-7. Replacement of Boards ............................................. 2-9 (E)
2-7-1. CN-3283 Board................................................2-9 (E)
2-7-2. SW-1485 Board................................................2-9 (E)
2-7-3. DPR-315 Board .............................................2-10 (E)
2-7-4. DPR-316 Board .............................................2-10 (E)
2-7-5. IF-1129 Board................................................ 2-11 (E)
2-7-6. RE-268PT Board............................................ 2-11 (E)
2-7-7. AT-163APT Board .........................................2-12 (E)
2-7-8. MB-1158 Board .............................................2-13 (E)
2-7-9. CN-3282 Board..............................................2-13 (E)
3. Electrical Alignment
3-1. Preparations...............................................................3-1 (E)
3-1-1. Equipment Required ........................................3-1 (E)
3-1-2. Precautions on Adjustments.............................3-1 (E)
3-1-3. File Data at Adjustment ................................... 3-2 (E)
3-1-4. Maintaining the Grayscale Chart ..................... 3-2 (E)
3-1-5. Setup Menu...................................................... 3-4 (E)
3-1-6. Connection of Equipment ................................3-5 (E)
3-1-7. Initial Settings.................................................. 3-6 (E)
3-1-8. Adjustment Items and Setup Menu Items........3-7 (E)
3-2. Automatic Adjustment...............................................3-8 (E)
3-3. Electrical Alignment.................................................. 3-8 (E)
3-3-1. BLACK SET Adjustment ................................ 3-8 (E)
3-3-2. Sensitivity Adjustment.....................................3-9 (E)
3-3-3. V-SUB Adjustment ........................................3-10 (E)
3-3-4. Black Shading Adjustment.............................3-12 (E)
3-3-5. White Shading Adjustment ............................3-13 (E)
3-3-6. RPN Adjustment ............................................3-15 (E)

2 (E) HDC-P1
3-4. Video System Level Adjustment ............................. 3-16 (E)
3-4-1. H/V Ratio Adjustment ................................... 3-16 (E)
3-4-2. Detail Level Adjustment ................................3-17 (E)
3-4-3. Crispening Adjustment ..................................3-18 (E)
3-4-4. Level Dependent Adjustment.........................3-19 (E)
3-4-5. Detail Clip Adjustment .................................. 3-20 (E)
3-4-6. Auto-iris Adjustment .....................................3-21 (E)
3-4-7. Pedestal Level Adjustment.............................3-22 (E)
3-4-8. Flare Adjustment............................................3-23 (E)
3-4-9. Gamma Correction Adjustment .....................3-24 (E)
3-4-10. Knee Point/Knee Slope Adjustment .............. 3-25 (E)
3-4-11. White Clip Level Adjustment ........................3-26 (E)
3-4-12. File Store........................................................3-26 (E)
3-5. ND Offset Adjustment............................................. 3-27 (E)
3-6. RPN Compensation................................................. 3-28 (E)
3-6-1. Automatic Compensation (APR)................... 3-28 (E)
3-6-2. Manual RPN Compensation Adjustment.......3-28 (E)
3-6-3. Procedures to Be Taken When the RPN
Compensation Fails .......................................3-30 (E)
3-6-4. Performing Efficient Auto-Detection of
RPNs ..............................................................3-31 (E)
3-6-5. RPN Compensation Flowchart ...................... 3-32 (E)
3-7. Vertical Line Compensation ....................................3-33 (E)
3-8. VBS Output Level Adjustment ............................... 3-35 (E)
3-9. TEST SAW Level Adjustment ................................3-36 (E)
4. File System
4-1. File Structure............................................................. 4-1 (E)
4-2. Operator File ............................................................. 4-2 (E)
4-3. Preset Operator File................................................... 4-3 (E)
4-4. Scene File ..................................................................4-4 (E)
4-5. Reference File ........................................................... 4-6 (E)
4-6. Lens File....................................................................4-8 (E)
4-7. OHB File .................................................................4-10 (E)
4-8. File Items.................................................................4-12 (E)
5. Setup Menu
5-1. Entering the SERVICE Menu ...................................5-1 (E)
5-2. Settable Special Functions ........................................ 5-2 (E)
5-3. Description on SERVICE Menu ...............................5-2 (E)
6. Spare Parts
6-1. Notes on Repair Parts...................................................... 6-1
6-2. Exploded Views............................................................... 6-2
6-3. Electrical Parts List ......................................................... 6-7
6-4. Supplied Accessories..................................................... 6-53
7. Block Diagram
Overall........................................................................................ 7-1
8. Schematic Diagrams
AT-163APT ................................................................................ 8-3
CN-3282................................................................................... 8-11
CN-3283................................................................................... 8-11
DPR-315 .................................................................................. 8-12
DPR-316 .................................................................................. 8-22
DR-632P................................................................................... 8-34
IF-1129..................................................................................... 8-37
MB-1158 .................................................................................. 8-44
NR-80P..................................................................................... 8-46
PA-353P ................................................................................... 8-48
RE-268PT................................................................................. 8-49
SW-1485 .................................................................................. 8-51
TG-265PT ................................................................................ 8-52
Frame Wiring ........................................................................... 8-56
9. Board Layouts
AT-163APT ................................................................................ 9-2
CN-3282..................................................................................... 9-3
CN-3283..................................................................................... 9-3
DPR-315 .................................................................................... 9-4
DPR-316 .................................................................................... 9-5
DR-632P..................................................................................... 9-6
IF-1129....................................................................................... 9-7
MB-1158 .................................................................................... 9-8
NR-80P....................................................................................... 9-9
PA-353P ..................................................................................... 9-9
RE-268PT................................................................................. 9-10
SW-1485 .................................................................................. 9-11
TG-265PT ................................................................................ 9-12

3 (E)
HDC-P1
Manual Structure
Purpose of this manual
This manual is the maintenance manual for HD MULTI PURPOSE CAMERA
HDC-P1.
This manual describes the information items that premise the service based on the
components parts such as replacement of main parts, electrical alignment, schematic
diagrams, board layouts and detailed parts list assuming use of system and service
engineers.
Related manuals
Besides this maintenance manual the following manual is available for this unit.
.HDC-P1 Operation Manual (Supplied with HDC-P1)
This manual is necessary for application and operation of HDC-P1.
Part number: 4-170-164-0X (Japanese)
Part number: 4-170-168-0X (English)
.“Semiconductor Pin Assignments” CD-ROM (Available on request)
This “Semiconductor Pin Assignments” CD-ROM allows you to search for semi-
conductors used in Broadcast and Professional equipment.
This manual contains a complete list of semiconductors and their ID Nos., and thus
should be used together with the CD-ROM.
Part number: 9-968-546-06
Trademarks
Trademarks and registered trademarks used in this manual are follows.
.FRAM is a registered trademark of Ramtron International Corporation.

1-1 (E)
HDC-P1
Section 1
Service Overview
1-1. Checking before Installation
1-1-1. Checking the ROM and Software Version
When connecting peripheral devices shown in the following table to this unit, check the versions of the
ROMs and software programs installed in the devices.
If the versions are not those shown in the following table, relevant ROMs must be replaced and relevant
software programs must be upgraded.
When you need ROM replacement and/or software version upgrade, contact your local Sony Sales Office/
Service Center.
ROM
Peripheral equipment Board name Ref No Rom version
MSU-700A/750 CPU-293/CPU-286 IC5, IC6/IC5, IC6 Ver. 1.30 or higher
CNU-700 AT-89 or AT-89A IC4, IC5 Ver. 3.40 or higher
CNU-500 AT-100 IC4, IC5 Ver. 3.00 or higher
RCP-720/721 MPU-79 IC10 Ver. 3.00 or higher
RCP-730/731 MPU-79 IC10 Ver. 3.00 or higher
RCP-740/741 MPU-79 IC10 Ver. 3.00 or higher
RCP-700/701 MPU-92 IC6 Ver. 2.73 or higher
RM-B150 CPU-266 IC4 Ver. 1.21 or higher
Software
Peripheral equipment Board name Software version
RCP-750/751 MPU-123 Ver. 1.40 or higher
RCP-920/921 MPU-143 Ver. 1.11 or higher
RM-B750 MPU-124 Ver. 1.20 or higher
MSU-900/950 CPU-396 Ver. 1.21 or higher

1-2 (E) HDC-P1
1-2. Connectors and Cables
1-2-1. Connector Input/Output Signals
1
7
3
2
8
5
4
6
Input Signals (BNC)
1GENLOCK
HD or SD
HD: SMPTE 274 M, tri-level sync, 0.6 V p-p, 75 Z
SD: Black burst signal
NTSC: 0.286 V p-p, 75 Z
PAL: 0.3 V p-p, 75 Z
Output Signals (BNC)
2VBS
Analog composite signals: 75 Z, 1.0 V p-p Output
Signals
3SDI 1/2 (BNC)
HD SDI/SD SDI selectable
HD SDI: SMPTE 292 M, 0.8 V p-p, 75 Ω,
1.485/1.4835 Gbps
BTA-S004A compliant
SD SDI: SMPTE 259M, 270 Mbps
Component serial signal

1-3 (E)
HDC-P1
4REMOTE (8P FEMALE)
17
6
5
4
3
2
8
(External view)
No. Signal I/O Specifications
for RCP for TRUNK (RS-422A)
1 TX (X) TX1 (+) OUT SERIAL DATA OUT/TRUNK DATA OUT
2 TX (Y) TX1 (_) OUT
3 RX (X) RX1 (+) IN SERIAL DATA IN/TRUNK DATA IN
4 RX (Y) RX1 (_)IN
5 TX-GND _GND for TX
6 UNREG-OUT OUT +10.5 to +17 V dc, 200 mA (max)
7 UNREG-GND _GND for UNREG-OUT
8 RCP-PIX OUT 75 Z, 1.0 V p-p (SD Video)
CHASSIS GND _CHASSIS GND
5LAN (8P, RJ-45, 10Base-T/100Base-TX)
18
(External view)
No. Signal Specifications
1 TX (+) Transmitted Data (+)
2 TX (-) Transmitted Data (-)
3 RX (+) Received Data (+)
4 NC No connection
5 NC No connection
6 RX (-) Received Data (-)
7 NC No connection
8 NC No connection

1-4 (E) HDC-P1
6DC IN (4P MALE)
(External view)
No. Signal I/O Specifications
1 EXT_DC (C) _GND for DC (+)
2 NC No connection
3 NC No connection
4 EXT_DC (H) IN +10.5 to 17 V dc
7LENS (12P FEMALE)
(External view)
No. Signal I/O Specifications
1 RET VIDEO ENABLE IN ENABLE : 0 V, DISABLE : +5 V or OPEN
2 VTR START/STOP IN ENABLE : 0 V, DISABLE : +5 V or OPEN
3 GND _GND for UNREG
4 SERVO MA/AT OUT AUTO : +5 V, MANU : 0 V or OPEN
5 IRIS POSITION OUT +3.4 V (F16) to +6.2 V (F2.8)
6 UNREG OUT +10.5 to +17 V
7 IRIS POSITION IN +3.4 V (F16) to +6.2 V (F2.8)
8 IRIS AT/MA OUT AUTO IRIS : 0 V, MANUAL IRIS : +5 V
9 EXTENDER ON/OFF IN EX 2 ON : GND
EX 0.8 ON : 30 kZto GND
OFF : OPEN
EX 2 ON
30 k7
EX 0.8 ON
10 ZOOM POSITION IN WIDE : 2 V, TELE : 7 V
11 FOCUS POSI (/LENS RX) IN %: 7 V, min. : 2 V
12 (LENS TX) OUT

1-5 (E)
HDC-P1
8EXT I/O (15P FEMALE)
(External view)
1
915
8
No. Signal I/O Specifications
1 UNREG OUT OUT +10.5 to 17 Vdc
2 UNREG GND _GND for UNREG OUT (0.5 A or less)
3 POWER CONT (X) IN Short-circuit of POWER CONT (X) and POWER CONT (Y)
will turn off the power.
4 POWER CONT (Y) IN
5 GND _
6 R TALLY (X) IN IN Contact: Short-circuit of R TALLY (X) IN and R TALLY (Y) IN
TTL: Set the R TALLY (X) IN pin to a TTL level voltage to
the R TALLY (Y) IN pin
Setting by S4 on the SW-1485 board.
7 R TALLY (Y) IN IN
8 R TALLY (X) OUT OUT Open collector: 10 mA (max)
9 VBS (X) OUT OUT 1 Vp-p, 75 Ztermination
10 VBS (G) _
11 SPARE (1)
12 SPARE (2)
13 G TALLY (X) IN IN Contact: Short-circuit of G TALLY (X) IN and G TALLY (Y) IN
TTL: Set the G TALLY (X) IN pin to a TTL level voltage
to the G TALLY (Y) IN pin
Setting by S3 on the SW-1485 board.
14 G TALLY (Y) IN IN
15 G TALLY OUT OUT Open collector: 10 mA (max)

1-6 (E) HDC-P1
1-2-2. Wiring Diagrams for Cables
CCA-5 Cable (For REMOTE Connector)
BrownBrown
Brown
Red
Red
White
White
White
Orange
Black
— 8P CONNECTOR (MALE) —
(WIRING SIDE)
1-2-3. Connection Connectors/Cables
Use the following connectors/cables when connecting cables to connectors on the connector panel at the
time of installation and service.
Connector Name Connector/Cable
VBS
GENLOCK
SDI 1/2
(BNC)
1-569-370-12 Plug, BNC
DC IN (4P MALE) 1-508-362-00 XLR, 4P Female or ITT Cannon XLR-4-11C equivalent
DC cable CCDD-X2 (2 m)
REMOTE (8P FEMALE) .1-766-848-11 Plug, 8P Male or CCA-5 cable assembly
(CCA-5-10 (10 m)/CCA-5-3 (3 m)) (optional)*2 *3
.REMOTE cable 1-783-372-11 (supplied with RM-B150, 10 m) *1 *2 *3
EXT I/O
(D-SUB 15P FEMALE)
1-506-582-11 D-SUB 15P MALE or JAE DA-15PF-N equivalent
Available shell: JAE DA-C1-J10-R equivalent
LAN (8P RJ-45) LAN cable (shield type, category 5 or higher, commercially available)
*1: Use of REMOTE cable enables to monitor video signals. (The pin 8 is available for the video signal line.)
The down-converted SD signal is output.
*2: If you want to use a cable of length different from a standard product, contact your local Sony Sales Office/Service Center.
n
*3: The pin 8 of CCA-5 cable is GND (ground).
The pin 8 of REMOTE cable is not GND (ground).

1-7 (E)
HDC-P1
1-3. Location of Printed Circuit Boards
DPR-316
IF-1129
AT-163APT
SW-1485
RE-268PT
CN-3283
DPR-315
MB-1158
CN-3282
TG-265PT
DR-632P
PA-353P
NR-80P
Filter disk servo board

1-8 (E) HDC-P1
1-4. Circuit Description
PA-353P Board
The PA-353P board, consisting of an H driver (IC1) for CCD drive and a sample hold IC (IC5), performs
correlative double-sampling for the signal from the CCD and differential output. This board also adjusts
sensitivity by the sample hold IC.
DR-632P Board
The DR-632P board consists of a buffer for the CCD and sample hold IC drive pulse and a V driver circuit
of the CCD.
TG-265PT Board
The TG-265PT board consists of the following circuits.
.A PLD (IC218) that generates CCD/sample hold IC drive pulse and a video amplifier (IC1, IC8, IC18)
.A circuit to synchronize (PLL lock) the INT PLL H signal generated by the PLD with the PLL H X and
PLL H Y signals sent from the DPR-315 board
The master gain is switched by the step gain in the video amplifier.
NR-80P Board
The NR-80P board corrects CCD defects and performs black shading.
DPR-315 Board
The DPR-315 board converts the analog RGB signals from the CCD block to digital data and processes
camera signals.
The analog RGB signals from the TG-265PT board in the CCD block are A/D-converted by the 14-bit
A/D converter (IC207 to IC209), and the converted digital data is input to the preprocess PLD (IC301).
The digital data is processed by the IC301 for the 720p format, is input to the camera signal processor
(IC401) for camera signal processing, and is then returned to the IC301.
Two SDRAM chips (IC501, IC502) are mounted as frame memory near the IC301. The IC301 performs
image inversion (H/V mirror processing) and P-PsF conversion processing in the PsF format, and then
transfers the digital data to the baseband signal processing block (DPR-316 board).
Furthermore, the IC301 generates and transfers the reference timing signal to the CCD block.
DPR-316 Board
The DPR-316 board processes various baseband signals.
This board is provided with the following four video input/output BNC connectors.
.REF IN connector CN301 (input)
.SDI 1 connector CN801 (output)
.SDI 2 connector CN802 (output)
.VBS connector CN901 (output)
The HD digital video signal to which camera signal processing was applied on the DPR-315 board is
transferred to the baseband processing IC (IC107) where baseband signal processing is performed, and is
then converted to a serial signal by the SDI P/S converter (IC801, IC802). The serial signal is output as
SDI signal from CN801 and CN802.
IC107 is provided with a down-converter function and IC801 and IC802 can select and output HD SDI or
SD SDI signal. The down-converted SD signal is VBS-encoded and D/A-converted by the encoder
(IC901), and the converted VBS signal is output from CN901.
The DPR-316 board mounts SDRAM (IC501, IC502) and OSD IC (IC622, IC623) around IC107 as frame
memory. IC107 also performs 2-3 pull-down processing and character signal mixing processing for 24PsF.
Furthermore, this board is provided with a GEN LOCK function that extracts sync signal from the refer-
ence input signal in CN301, generates a reference clock by the 74 MHz/27 MHz PLL circuit, and distrib-
utes the clock and the reference timing signal to each video signal processing block.

1-9 (E)
HDC-P1
AT-163APT Board
The AT-163APT board consists of a microcomputer AT CPU (IC109) for system control and a peripheral
circuit. The EEPROM (IC403) on this board retains the main program, and the FRAM (IC133) retains the
camera control data. Furthermore, this board also mounts a lens interface circuit and an auto-iris control
circuit.
IF-1129 Board
The IF-1129 board is provided with a microcomputer IF CPU (IC205) that has a function equivalent to
the CCU to make system settings. The IF FPGA (IC400) switches system connection. This board also
performs command communication with the RCP and MSU. In addition, the LAN controller in the IF
CPU allows LAN connection.
MB-1158 Board
The MB-1158 board is used for connection between boards.
CN-3282 Board
The CN-3282 board is provided with a lens connection connector and a front tally lamp.
CN-3283 Board
The CN-3283 board is provided with a DC IN connector.
SW-1485 Board
The SW-1485 board is an external interface board.
RE-268PT Board
The RE-268PT board converts the input power from the DC IN connector to various output voltages.
The activation/shutdown voltages of the DC power from the DC IN connector are always monitored by
the input protection IC (IC101). The DC power voltages are converted by the power ICs (IC301, IC351,
IC381, IC401, IC451, IC501, IC601), and are then output from CN101 as power voltages.
IC101 performs output protection processing to shut down output of all systems if there is an output short
circuit of any system or there is no output for some reason.
IC202 and IC203 convert the fan output control signal, and IC201 allows variable voltage output to the
fan.
When the power OFF switch signal is input to the D-sub connector connected to the SW-1485 board, the
RE-268PT board outputs are forcibly shut down.

1-10 (E) HDC-P1
1-5. Removing/Installing the Side
Panel Assembly
1. Remove the six screws to detach the side
panel (L) assembly.
2. Remove the six screws to detach the side
panel (R) assembly.
3. Install the side panel assembly by reversing
the step above.
Side panel (R) assembly
Side panel (L) assembly
Screws (M2)
Screws (M2)
Side panel (R) assembly
Side panel (L) assembly
Screws (M2)
Screws (M2)

1-11 (E)
HDC-P1
1-6. Description of Onboard LED Indicators
DPR-315 Board
D103
A
1
2
3
BC
D401
DPR-315 BOARD (SIDE B)
Ref No. Name Color Description Normal state
D103 POWER Green Lights while the power of the board is normal. Lit
D401 CTL Green Lights some time after power is turned on, and
goes out after the initial processing from the
CPU.
Off
DPR-316 Board
D103
A
4
3
2
1
BC
DPR-316 BOARD (SIDE A)
Ref No. Name Color Description Normal state
D103 POWER Green Lights while the power of the board is normal. Lit

1-12 (E) HDC-P1
IF-1129 Board
A
1
2
3
4
BC
D10
IF-1129 BOARD (SIDE A)
Ref No. Name Color Description Normal state
D10 POWER Green Lights while the power of the board is normal. Lit