Sony CDX-L410 User manual

1
Ver 1.1 2003. 08
Model Name Using Similar Mechanism CDX-L350/L360
CD Drive Mechanism Type MG-393X-121//Q
Optical Pick-up Name KSS-720A
SERVICE MANUAL
AEP Model
UK Model
CDX-L410
FM/MW/LW COMPACT DISC PLAYER
CD player section
Signal-to-noise ratio 90 dB
Frequency response 10 – 20,000 Hz
Wow and flutter Below measurable limit
Tuner section
FM
Tuning range 87.5 – 108.0 MHz
Aerial terminal External aerial connector
Intermediate frequency 10.7 MHz/450 kHz
Usable sensitivity 8 dBf
Selectivity 75 dB at 400 kHz
Signal-to-noise ratio 66 dB (stereo),
72 dB (mono)
Harmonic distortion at 1 kHz
0.6% (stereo),
0.3% (mono)
Separation 35 dB at 1 kHz
Frequency response 30 – 15,000 Hz
MW/LW
Tuning range MW: 531 – 1,602 kHz
LW: 153 – 279 kHz
Aerial terminal External aerial connector
Intermediate frequency 10.7 MHz/450 kHz
Sensitivity MW: 30 µV
LW: 40 µV
Power amplifier section
Outputs Speaker outputs
(sure seal connectors)
Speaker impedance 4 – 8 ohms
Maximum power output 45 W ×4 (at 4 ohms)
SPECIFICATIONS
General
Outputs Power aerial relay control
lead
Inputs TelephoneATT control lead
Tone controls Bass ±9 dB at 100 Hz
Treble ±9 dB at 10 kHz
Power requirements 12 V DC car battery
(negative ground)
Dimensions Approx. 178 ×50 ×177 mm
(w/h/d)
Mounting dimension Approx. 182 ×53 ×162 mm
(w/h/d)
Mass Approx. 1.2 kg
Supplied accessories Parts for installation and
connections (1 set)
Front panel case (1)
Design and specifications are subject to change without
notice.
• The tuner and CD sections have no adjustments.
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
9-873-444-02
2003H04-1
© 2003. 08

2
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SERVICE NOTES
This label is located on the bottom of the chassis.
This label is located on the drive unit’s internal chassis.
When replacing the chassis (T.U) of mechanism deck which have
the “CAUTION LABEL”attached, please be sure to put a new
LABEL (OP CAUTION) (3-223-913-01) to the chassis (T.U).
CDX-L410
CLASS 1
LASER PRODUCT
VIEW DIRECTLY WITH OPTICAL INSTRUMENTS
DO NOT STARE INTO BEAM OR
INVISIBLE LASER RADIATION WHEN OPENCAUTION
TEST DISCS
This set can playback CD-R and CD-ROM discs. The following
test discs should be used to check the capability:
CD-R test disc TCD-R082LMT (Part No. J-2501-063-1)
CD-RW test disc TCD-W082L (Part No. J-2501-063-2)

3
TABLE OF CONTENTS
1. GENERAL
Location of controls ................................................................. 4
Notes on CD-R/CD-RW discs ................................................. 4
Connections ............................................................................. 5
2. DISASSEMBLY
2-1. Sub Panel Assy .................................................................... 6
2-2. CD Mechanism Block ......................................................... 7
2-3. Main Board ......................................................................... 7
2-4. Heat Sink ............................................................................. 8
2-5. Chassis (T.U) Assy .............................................................. 8
2-6. Disc in Board ...................................................................... 9
2-7. Servo Board ......................................................................... 9
2-8. Arm Roller Assy ................................................................ 10
2-9. Chassis (OP) Assy ............................................................. 10
2-10. Optical Pick-up Block ....................................................... 11
3. DIAGRAMS
3-1. IC Pin Description ............................................................. 12
3-2. Circuit Boards Location .................................................... 14
3-3. Block Diagram –CD Section–........................................... 15
3-4. Block Diagram –Tuner Section–....................................... 16
3-5. Block Diagram –Display Section–.................................... 17
3-6. Printed Wiring Boards –CD Mechanism Section–............ 18
3-7. Schematic Diagram –CD Mechanism Section–................ 20
3-8. Printed Wiring Board –Main Section–.............................. 21
3-9. Schematic Diagram –Main Section (1/2)–........................ 22
3-10. Schematic Diagram –Main Section (2/2)–........................ 23
3-11. Printed Wiring Board –Key Section–................................ 24
3-12. Schematic Diagram –Key Section–................................... 25
4. EXPLODED VIEWS
4-1. Chassis Section ................................................................. 28
4-2. Front panel Section ........................................................... 29
4-3. CD Mechanism Section (1) ............................................... 30
4-4. CD Mechanism Section (2) ............................................... 31
4-5. CD Mechanism Section (3) ............................................... 32
5. ELECTRICAL PARTS LIST......................................... 33
MAIN BOARD
CNP301
J-2502-011-1
SERVO BOARD
CN1
EXTENSION CABLE AND SERVICE POSITION
When repairing or servicing this set, connect the jig (extension cable)
as shown below.
•Connect the MAIN board (CNP301) and the SERVO board (CN1)
with the extension cable (Part No. J-2502-011-1).
CDX-L410

4
CDX-L410
SECTION 1
GENERAL This section is extracted
from instruction manual.

5
CDX-L410
Connections

6
CDX-L410
SECTION 2
DISASSEMBLY
Note : This set can be disassemble according to the following sequence.
Note : Follow the disassembly procedure in the numerical order given.
2-1. SUB PANEL ASSY
2-1. SUB PANEL ASSY
(Page 6)
2-2. CD MECHANISM BLOCK
(Page 7)
2-5. CHASSIS (T.U) ASSY
(Page 8)
2-6. DISC IN BOARD
(Page 9)
2-8. ARM ROLLER ASSY
(Page 10)
2-9. CHASSIS (OP) ASSY
(Page 10)
2-10. OPTICAL PICK-UP BLOCK
(Page 11)
SET
2-7. SERVO BOARD
(Page 9)
2-3. MAIN BOARD
(Page 7)
2-4. HEAT SINK
(Page 8)
1 PTT 2.6x6
2 PTT 2.6x6
3 claw
5 sub panel assy
4 claws

7
CDX-L410
2-2. CD MECHANISM BLOCK
2-3. MAIN BOARD
1PTT 2.6x6
6PTT 2.6x
6
7bracket (CD)
2PTT 2.6x6
5CD mechanism block
4CNP301
3
4ground point screw
(PTT 2.6x6)
5ground point screws
(PTT 2.6x6)
1PTT 2.6x6
6MAIN board
3PTT 2.6x
6
2PTT 2.6x6

8
CDX-L410
2-4. HEAT SINK
2-5. CHASSIS (T.U) ASSY
1PTT 2.6x10
3PTT 2.6x1
0
4heat sink
2PTT 2.6x16
4chassis (T.U) assy
3P 2x3
2P 2x3
1Unsolder the
lead wires.
black
red
white

9
CDX-L410
2-6. DISC IN BOARD
2-7. SERVO BOARD
4 claws
2 DISC IN board
3 tension spring (LR)
5 guide (disc)
1 PS 2x4
8PS 2x4
1CN3
3Removal the solders.
4Removal the solders.
5P 2x3
6loading motor assy
(M903)
9SERVO board
2CN2
7PS 2x4

10
CDX-L410
2-9. CHASSIS (OP) ASSY
2-8. ARM ROLLER ASSY
• When installing, take note of the positions
arm (roller) and washers. (Fig. 1)
Fig. 1
3 PS 2x3
4 LOAD board
1 tension spring (RA3)
2 arm roller assy
retaining ring (roller)
arm arm
washer (RA) washer (RA) bearing (roller
)
bearing (roller)
1tension spring (KF1)
8compression spring (FL)
7chassis (OP) assy
9compression spring (FL)
2tension spring (KR1)
5Fit lever (D) in the
direction of the arrow.
3damper (T)
4damper (T)
6Turn loading ring in the
direction of the arrow.

11
CDX-L410
2-10. OPTICAL PICK-UP BLOCK
1 P 2x3
5 P 2x3
6 plate spring (feed)
7 shaft (feed) assy
2 sled motor assy
3 optical pick-up block
4 pick-up flexible board

12
CDX-L410
SECTION 3
DIAGRAMS
3-1. IC PIN DESCRIPTION
• IC501 MN101C49KTD2 (SYSTEM CONTROL)
Pin No. Pin Name I/O Pin Description
1 VREF– — Rated voltage – for A/D converter.
2 VSM I S-meter voltage detection input
3 NC — Not used. (Connect to ground in this set)
4 KEYIN1 I Key input 1
5 KEYIN0 I Key input 0
6 RCIN0 I Rotary commander input 0
7 QUALITY I Noise detection input
8 MPTH I Tuner multi-path detection input
9 NC — Not used. (Connect to ground in this set)
10 VREF+ — Rated voltage + for A/D converter. (+5 V)
11 VDD — Power supply pin (+5 V)
12 OSCOUT O Oscillator output (18.432 MHz)
13 OSCIN I Oscillator input (18.432 MHz)
14 VSS — Ground
15 XIN I Oscillator input (32.768 kHz)
16 XOUT O Oscillator output (32.768 kHz)
17 MMOD — Mode selector (Connect to ground in this set)
18 LCDSO O LCD serial data output
19 LCDCE O LCD chip enable output
20 LCDCKO O LCD serial clock output
21 CD_TSO O CD text serial data output
22 CD_TSI I CD text serial data input
23 CD_TCKO O CD text serial clock output
24 NC — Not used. (Open)
25 NC — Not used. (Open)
26 KEY ACK I Key acknowledge detection input
27 DAVN I RDS data block synchro detection input
28 BUIN I Back-up power detection input
29 NC I Not used. (Connect to ground in this set)
30 CD_SELFSW I CD self switch input
31 CD_PACK I CD pack synchro signal input
32 NC (VCC) — Not used. (Connect to VDD in this set)
33 RESET I Reset input
34 NC — Not used. (Fixed at H in this set)
35 BEEP O Beep output
36 NC — Not used. (Open)
37 TESTIN I Test mode detection input
38 ACCIN I Accessory power detection input
39 NC (VCC) — Not used. (Open)
40 TELATT I Telephone attenuate detection input
41 NC (VCC) — Not used. (Connect to VDD in this set)
42 UNISO O SONY BUS data output
43 UNISI I SONY BUS data input
44 UNICKO O SONY BUS clock output
45 I2C_SIO I/O I2C BUS serial data input/output
46 NC — Not used. (Open)
47 I2C_CKO O I2C BUS serial clock output
48 NC — Not used. (Open)
49 TUNON O Tuner power control output
50 PW_ON O System power control output
51 TSTB O CD text strobe output

13
CDX-L410
Pin No. Pin Name I/O Pin Description
52 RFOK I CD RFOK signal input
53 CD_RST O CD reset signal output
54 A0 O CD command/parameter signal output
55 STB O CD strobe signal output
56 X_EN O CD crystal oscillator control output
57 LIMIT I CD limit switch input
58 PH1 I Not used. (Fixed at H in this set)
59 D_SW I CD down switch input
60 INSW I CD disc in switch input
61 NC (PH3) —Not used. (Fixed at H in this set)
62 CD_LM_LO O Loading motor control output (Loading direction)
63 CD_LM_EJ O Loading motor control output (Eject direction)
64 NC —Not used. (Open)
65 NC —Not used. (Open)
66 AMPATT O Power amplifier attenuator control output
67 AMPON O Power amplifier standby control output
68 CDMD_ON O CD mechanism power control output
69 ATT O System attenuate control output
70 VOLATT O Electronic volume attenuate control output
71 NC —Not used. (Open)
72 NC —Not used. (Open)
73 NC —Not used. (Open)
74 NC —Not used. (Open)
75 NC —Not used. (Open)
76 NC —Not used. (Connect to ground in this set)
77 NC —Not used. (Connect to ground in this set)
78 DIMSEL —Not used. (Open)
79 XCD_ON O CD power control output
80 TU-ATT —Not used. (Open)
81 NC —Not used. (Open)
82 NC —Not used. (Open)
83 NC —Not used. (Open)
84 NC —Not used. (Open)
85 NC —Not used. (Open)
86 E2P_SIO I/O EEPROM serial data input/output
87 E2P_CKO O EEPROM serial clock output
88 NC —Not used. (Open)
89 FLASH_W I Flash write input
90 NS_MASK O Noise detection output
91 AD_ON O Key power control output
92 NC —Not used. (Open)
93 ILLON O Illumination power control output
94 DOORSW I Not used. (Connect to ground in this set)
95 DAVSS —Ground for D/A converter.
96 NC —Not used. (Open)
97 NC —Not used. (Open)
98 RCIN1 I Rotary commander input 1
99 RAMBU —Not used. (Connect to ground in this set)
100 DAVDD —D/A converter power supply pin (+5 V)

14
CDX-L410
3-2. CIRCUIT BOARDS LOCATION
MAIN board
SUB board
LIMIT board
DISC IN board
LOAD board
KEY board SERVO board
tuner uni
t
(TU10)
32.768kHz
IC501 qh (XOUT)
—Main Board —
1
2
3
18.432MHz
IC501 qs (OSCOUT)
5.2Vp-p
4.332MHz
IC51 4(OSCO)
5.2Vp-p
3.6Vp-p
IC1 uj (RFO)
•Waveforms
—Servo Board —
(MODE: CD PLAY)
1
2
3
IC1 ts (PACK)
0V
1.8Vp-p
16.9344MHz
IC1 wd (XTAL)
0V
4
Approx. 620mVp-p
IC1 oa (FEO)
5
Approx. 200mVp-p
IC1 od (TEO)
2.4Vp-p
4.8Vp-p
3.4msec

15 15
CDX-L410
3-3. BLOCK DIAGRAM — CD SECTION —
(Page 16)
82
83
84
85
16
12
D/A
CONV
TRACKING
ERROR
FORCUS
ERROR
9
1
OSC
EFM
DEMOD
SERVO
CTL
RF
EQ
52
56
DSUB CODE
PROCESS
8
7
6
5
4
3
2
56
60
30
57
59
68
79
31
51
21
22
23
55
54
53
52
I/F
87
86
97
98
LD
DRIVE
Q1
FOCUS
COIL
DRIVE
TRACKING
COIL
DRIVE
SLED
MOTOR
DRIVE
SPINDLE
MOTOR
DRIVE
LOADING
MOTOR
DRIVE
6
5
23
2
15
16
17
18
13
14
11
12
9
10
26
62 63 64 65
63
62
33
POWER
CONTROL
Q332
POWER
CONTROL
Q333
REG
Q331
REG
Q341
M902
(SLED)
M901
(SPINDLE)
M903
(LOADING)
SW3
(LIMIT)
SW2
(SELF)
SW4
(DOWN)
SW1
(DISC IN)
X1
16.9344MHz
OPTICAL PICK-UP
(KSS-720A)
I-V
CONV.
CDL
CD PACK
TSTB
STB
AO
CD TSO
CD TSI
CD TCKO
CD RST
RFOK
XEN
IN SW
LIMIT
CD SELF SW
D SW
CD LM LO
CD LM EJ
CDMD ON
XCD ON
R-CH
TUNER
SECTION
A
23 24
M
M
M
IC602
BU 5V
BATT
LOUT
ROUT
PACK
TSTB
SI
RFOK
SO
SCK
STB
AO
XTALEN
RST
RESET
A
C
B
D
E
F
PD
LD
A
C
B
D
E
F
PD
LD
LD AMP
FOCUS
COIL
TRACKING
COIL
FD
FSC+
FSC-
TRK+
TRK-
SL-
SL+
SP-
SP+
LD-
LD+
TD
SD
MD
LOAD
EJECT
SYSTEM CONTROL
IC501 (1/3)
RF AMP,DIGITAL SERVO,
DIGITAL SIGNAL PROCESSOR
IC1
FOCUS/TRACKING COIL DRIVE,
SLED/SPINDLE/LOADING MOTOR DRIVE
IC2
FD TD SD MD
Signal path
: CD
R-ch is omitted due to same as L-ch.
A5V
AU5V
D5V
DR6V
+-
+-
+-
1
S702
RESET
RESET 3

1616
CDX-L410
3-4. BLOCK DIAGRAM —TUNER SECTION —
(Page 15)
J10
(ANTENNA) 210
1
ANTFM MPX
CDL
8
AM DET
14
S-METER
12
I2C SDA
13
I2C SCL
9
RDS DET
17
E2PROM SDA
18
E2PROM SCL
ANTAM
TUNER UNIT
TU10
FM BUFFER
Q21
NOISE
SUPPRESSOR
6 1
IC20
Q22
NOISE
SUPPRESSOR
ON
7
90
2
45
47
70
14
15
20
21
18
11
13
1
30
SYSTEM CONTROL
IC501 (2/3)
ELECTRONIC VOLUME
IC401
OUT FL
29
OUT RL
35
BEEP
ATT
67
69
AMP ON
66
AMP ATT
40
TEL ATT
38
ACC IN
SE L
MPX
AM
LEVEL
MPIN
SDA
SCL
SM
VOL ATT
QUALITY
NS MASK
VSM
I2C SIO
I2C CKO
MPTH
DAVN
E2P SIO
E2P CKO
CD
SECTION
A
MUTE
CONT
Q478,479
Q451
MUTE
Q431
MUTE
22 MUTE
4STBY
16 AUX
11
12 5
3
9
7
POWER AMP
IC404
1
9
2
10
CNP601
FL+
FL
-
RL+
RL
-
4
12
FR+
FR
-
3
11
RR+
RR
-
16 BATT
13 ATT
6ANT REM
R-CH
BATT
F901
TEL
ATT
Q651
7ACC
15 TEST (NC)
49
50
TUN ON
37
TEST IN
ACC
CHECK
Q631
POWER SUPPLY
IC601
3
PW ON
28
BU IN
4
2
7
BATT
BATT
BATT
VCC
8
ANT+B
9
COM 8V
10
TU 5.6V
11
TU 8.7V
COM 8V
5
BU+B BU 5V
TU 5.6V
TU 8.7V
8.7V ON
5.6V ON
STB
9
20 2
10
MULTI
PATH
DET
LV IN
16
4 5
8
RDS/RDBS
DEM/DEC
8
27
MPX
OSCO OSCI
SDA SCL
X51
4.332MHz
87
86
RDS DECODER
IC51
Signal path
: FM
R-ch is omitted due to same as L-ch.
: MW
: CD
BATT DET
Q551,557
BATT DET
Q556

17 17
CDX-L410
3-5. BLOCK DIAGRAM —DISPLAY SECTION —
KEY MATRIX
LSW900-922
KEY
ACTIVE
Q664
X502
32.768kHz
15
16
12
13
518
20
194
26
91
98
6
SYSTEM CONTROL
IC501 (3/3)
LCD DRIVE
IC901
KEY IN0 LCD SO
LCD CKO
LCD CE
POWER
CONT
Q661,662
KEY IN1
KEY ACK
AD ON
RC IN1
RC IN0
J561
(REMOTE IN)
ILL +B
XIN
XOUT
OSC OUT
93
ILL ON
BATT
OSC IN
X501
18.432MHz
64
63
62
LCD901
DI
CL
CE
LED921,922
PL901,902

1818
CDX-L410
1
A
B
C
D
E
F
G
H
I
J
234567891011121314
3-6. PRINTED WIRING BOARDS —CD MECHANISM SECTION —•Refer to page 14 for Circuit Boards Location.
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
for schematic diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
• % : indicates tolerance.
•f: internal component.
•C: panel designation.
•A: B+ Line.
• Power voltage is dc 14.4V and fed with regulated dc power
supply from ACC and BATT cords.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: FM
f: MW
J: CD
for printed wiring boards:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•a: Through hole.
•: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Note: The components identified by mark 0or dotted line
with mark 0are critical for safety.
Replace only with part number specified.
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.

19 19
CDX-L410
(Page 21)
BE
C
+
-
+- +-
( )
1
A
B
C
D
E
F
G
H
I
J
234567891011121314
Ref. No. Location
IC1 E-7
IC2 H-7
Q1 C-5
•Semiconductor
Location

2020
CDX-L410
IC B/D
IC B/D
TP77
TP78
R29
R30
C1 C5 C43
TP79
TP80
TP81
TP82
TP83
TP84
CN2
CN3
TP85
CN1
SW3
M902
M901
SW4 TP1
SW2
SW1
TP2
TP3
M903
TP87
TP86
Q1 TP9 TP8
R3 R26
C4 C6C3
TP10
C13
R5
C11
C15
C10
C8
C16
C7
TP7
TP92
R6
TP15
TP14
TP17
TP20
TP16
TP19
C21
C22
R25
TP21
TP18
BP4
BP3
R24
R7
TP6
C17
FB1
TP11
TP12 C9
C14
TP89
C19
C20 C23
R9
R8
C24
TP22
TP23
TP24
TP25
C28
TP88
FB4
C41
C26
C27
C29
C31
C34
C25
TP31
BP1
BP2
TP33
TP32
R14
R15
TP30
R12
R10
C30 TP91 C37
TP90
TP29
TP28
TP26
TP27
R21
R22
C39
C36
TP34
TP35
TP36
TP46
TP37
TP38
TP39
TP40
TP41
TP42
TP43
TP44
TP45
C35
FB2
CN1
R18
R19
R20
R17
TP66
FB7
FB6
TP62
TP47
TP63
TP48
TP49
TP64
TP50
TP51
TP52
TP68
TP53
TP69
TP54
TP70
TP55
TP71
TP56
TP72
TP57
TP73
TP58
TP74
TP59
TP75
TP60
TP76
TP61
C38
IC1
FB5
X1
C18
R31C44
C40
TP4
TP5
IC2
•Refer to page 14 for Waveforms and page 18 for Common Note on Schematic Diagram.
3-7. SCHEMATIC DIAGRAM —CD MECHANISM SECTION —•Refer to page 26 for IC Block Diagrams.
Note:
•Voltage is dc with respect to
ground under no-signal conditions.
no mark : CD PLAY
(Page 22)