Sony D-SJ01 - Sports Discman User manual

– 1 –
Model Name Using Similar Mechanism D-E01/EJ01
CD Mechanism Type CDM-3022EBG
Optical Pick-up Name DAX-22EG
SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
D-SJ01
PORTABLE CD PLAYER
MICROFILM
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength: λ= 780 nm
Emission duration: Continuous
Laser output: Less than 44.6 µW (This output
is the value measured at a distance of 200 mm
from the objective lens surface on the optical
pick-up block with 7 mm aperture.)
D-A conversion
1-bit quartz time-axis control
Frequency response
20 - 20,000 Hz +1/–2 dB
(measured by EIAJ CP-307)
Output (at 4.5 V input level)
Headphones (stereo minijack)
Approx. 5 mW + Approx. 5 mW
at 16 ohms
SPECIFICATIONS
–Continued on next page –
Power requirements
For the area code of the model you purchased,
check the upper left side of the bar code on the
package.
• Two Sony NC-WMAA rechargeable
batteries: 2.4 V DC
• Two LR6 (sizeAA) batteries: 3 V DC
• AC power adaptor (DC IN 4.5 V jack):
US, CND model: 120 V, 60 Hz
AEP, E13 model:
220 - 230 V, 50/60 Hz
UK model: 230 - 240V, 50 Hz
AUS model: 240 V, 50 Hz
E33 model: 100 - 240 V, 50/60 Hz
• Sony DCC-E245 car battery cord for use on
car battery: 4.5 V DC
Battery life *(approx. hours)
(When you use the CD player on a flat and stable
surface.)
Playing time varies depending on how the CD
player is used.
When using G-PROTECTION function
off on
Two NC-WMAA 12 11
(charged for
about 2.5 hours**)
NH-WM2AA 25 23
(charged for
about 4 hours**)
Two alkaline 40 37
batteries LR6
* Measured value by the standard of EIAJ
(Electronic Industries Association of Japan).
** Charging time varies depending on how the
rechargeable battery is used.
Ver 1.0 2000. 01

– 2 –
CAUTION
Use of controls or adjustments or performance of proce-
dures other than those specified herein may result in haz-
ardous radiation exposure.
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270°C during
repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
TABLE OF CONTENTS
1. SERVICE NOTE ................................................................ 3
2. GENERAL
Getting Started ......................................................................... 4
Playing a CD ........................................................................... 5
3. DISASSEMBLY
3-1. Hold Board .......................................................................... 6
3-2. Cabinet (M) ......................................................................... 6
3-3. Switch Unit ......................................................................... 7
3-4. CD Mechanism Deck .......................................................... 7
3-5. Main Board ......................................................................... 8
3-6. Control Board...................................................................... 8
3-7. Optical Pick-up ................................................................... 9
4.TEST MODE
4-1. General Information .......................................................... 10
4-2. Test Mode .......................................................................... 10
5. ELECTRICAL ADJUSTMENTS
5-1. Focus Bias Check.............................................................. 11
6. DIAGRAMS
6-1. IC Pin Description............................................................. 12
6-2. Block Diagram –CD Section–........................................... 14
6-3. Block Diagram –Power Supply Section–.......................... 17
6-4. Printed Wiring Boards –Main Section– ............................ 19
6-5. Schematic Diagram –Main Section (1/2)–........................ 23
6-6. Schematic Diagram –Main Section (2/2)–........................ 25
6-7. IC Block Diagrams............................................................ 27
7. EXPLODEDVIEWS
7-1. Cabinet (Upper) Section.................................................... 30
7-2. Cabinet (Rear) Section ...................................................... 31
7-3. CD Mechanism Deck Section (CDM-3022EBG) .............32
8. ELECTRICAL PARTS LIST......................................... 33
Operating temperature
5°C - 35°C (41°F - 95°C)
Dimensions (w/h/d) (excluding projecting parts
and controls)
Approx. 143.2 ×31 ×152.5 mm
(5 3/4 ×1 1/4 ×6 1/8 in.)
Mass (excluding accessories)
Approx. 320 g (11.3 oz.)
Supplied accessories
For the area code of the location in which you
purchased the CD player, check the upper left side
of the bar code on the package.
AC power adaptorAC-E455 (1)
Headphones/earphones with remote control
MDR-W014LP (1) (Except CND model)
MDR-G051LP (1) (CND model only)
Rechargeable batteries NC-WMAA (1)
Battery carrying case (1)
Carrying case (1)
Battery case (1)
AC plug adaptor (1) **
** Supplied with E33 model only
Design and specifications are subject to change without
notice.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE0SUR LES
DIAGRAMMES SCHÉMATIQUES ETLALISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
This Compact Disc player is
classified as a CLASS 1
LASER product.
The CLASS 1 LASER
PRODUCT table is located
on the bottom exterior.
• Abbreviation
CND : Canadian model
E13 : AC 220-230Varea in E model
AUS : Australian model
E33 : AC 100-240Varea in E model

–3 –
(OPEN)
S801 TAP802
– main board (side A) –
SECTION 1
SERVICE NOTE
•NOTES ON HANDLINGTHE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static breakdown because of the potential difference generated by
thecharged electrostatic load,etc. onclothing and thehuman body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
•NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
•To Check the Laser Diode and Focus Search Operation
Open the upper panel. Turn on the power without a disc while
the main board S801 (OPEN) is ON (or TAP802 is shorted). Then,
observe the objective lens and check that the following opera-
tions are performed.
1.Scatterd light of laser beams is seen.
2. Check for vertical movements (five) of the objective lens (with
movement of the PU on the inner circumference).
•Moisture ResistantTreatment
Be sure to perform the following work when the cabinet and ring
have been replaced in servicing :
Apply SONY grease SGL-505 (7-662-010-04) to the ring at the
points specified in the figure with an applicator or other means.
•Before Replacing the Optical Pick-Up Block
Please be sure to check throughly the parameters as par the “Opti-
cal Pick-Up Block Checking Procedures”(Part No.: 9-960-027-
11) issued separately before replacing the optical pick-up block.
Note and specifications required to check are given below.
•FOK output : IC601 eg pin
When checking FOK, remove the lead wire to disc motor.
When checking FOK value, remove the lead wire to disc
motor.
•RF signal P-to-P value : 0.35 - 0.65 Vp-p
•The repairing grating holder is impossible.
grease applying
points (ring)
lever (HOLD)
lever (SW)

–4 –
SECTION 2
GENERAL This section is extracted
from instruction manual.

–5 –

–6 –
Note : Follow the disassembly procedure in the numerical order given.
3-2. CABINET (M)
SECTION 3
DISASSEMBLY
Set Hold Board Cabinet (M) Switch Unit
CD Mechanism Deck Optical Pick-Up
Main Board
Control Board
•This equipment can be removed using the following procedure.
Note : When installing, fit the lever (SW) and switch (S951)
1M 1.7x4
3M 1.7x4
4HOLD board
S951 lever (SW)
5CN951
2arm assy, click
1screws (B2)
2screws (B2)
4cabinet (M)
3
3-1. HOLD BOARD

–7 –
3-3. SWITCH UNIT
3-4. CD MECHANISM DECK
2M 1.7x4
3cover, lid
4switch unit
1CN801
1CN503
2CN502
3CN501
4cd mechanism deck

–8 –
3-5. MAIN BOARD
3-6. CONTROL BOARD
1CN802
3knob (AVLS) 4MAIN board
2
1screw (B2)
4screw (B1.4)
6screw (B1.4)
5button, control
7CONTROL board
3cover, button
2

–9 –
3-7. OPTICAL PICK-UP
6optical pick-up
2rack
1M1.4x1.8
5shaft, standard
4bracket assy, sled
3M1.4x4

–10 –
(TEST)
TAP801
SECTION 4
TEST MODE
4-1. GENERAL INFORMATION
In this set, the functions and audio capabilities can be checked by
entering the TEST MODE.
4-2.TEST MODE
4-2-1. Setting the Test Mode
1. Switch positions
OPEN switch : OPEN
HOLD switch : OFF
AVLS switch : OFF
2. With external power supply disconnected. (power is not applied
to the set)
3. Solder across the TEST terminals (TAP801). (pin qf, IC801
(SEL) is grounded)
4. Connect an external power supply.
Thus, the set is switched to the test mode.
4-2-2. Releasing the Test Mode
1. Be sure to disconnect the external power supply and remove
the solder bridge at the TEST terminals connected before in
setting.
2. The set thus becomes available for normal operation.
4-2-3. Contents of Test Mode
1When a specific key is operated:
KEY Contents of the operation. ((LCD DISPLAY))
NXSpindle on. Tracking servo off.
((UP 00 03))
xCHG All servo off. Mute on.
((10 different displays are repeatedly presented.))
>Moves the pick-up to the outside (with the open switch open). Tracking servo off. Mute on.
((Among 10 different displays, the display when the key is pressed is held.))
.Moves the pick-up to the inside (with the open switch open). Tracking servo off. Mute on.
((Among 10 different displays, the display when the key is pressed is held.))
2In play mode
•Press the play key:
KEY Contents of the operation. ((LCD DISPLAY))
PLAY MODE Tracking servo on. Mute off.
Each time this key is pressed, the display changes as follows:
x1 speed tx2 speed tx3 speed tx4 speed tx1 speed
(( 01 00 01)) ((02 00 02)) ((03 00 03)) ((04 00 04))
RPT/ENT Each time this key is pressed, the display changes as follows:
Tracking gain up. Emphasis on. LCD back light onhTracking gain down. Emphasis off. LCD back light off
VOL+ Headphone ATT 0dB
VOL–Headphone ATT –35dB

– 11 – – 12 – – 13 –
RF level :
0.5 ±0.15 Vp-p
VOLT/DIV : 100 mV (10 : 1 probe in use)
TIME/DIV : 500 nS
SECTION 5
ELECTRICAL ADJUSTMENTS
CD section adjustments are done automatically in this set.
In case of operation check, confirm that focus bias.
5-1. FOCUS BIAS CHECK
1. Connect the oscilloscope between TP614 (RF) or TP601 (RF)
and GND on main board.
2. Insert the disc (YEDS-18). (Part No. : 3-702-101-01)
3. Press the ubutton.
4. Confirm that the oscilloscope waveform is as shown in the
figure below. (eye pattern)
A good eye pattern means that the diamond shape ( ) in the
center of the waveform can be clearly distinguished.
• RF signal reference waveform (eye pattern)
Test Points:
When observing the eye pattern, set the oscilloscope for AC range
and raise vertical sensitivity.
TP601
– main board (side A) – –main board (side B) –
TP61
4
Pin No. Pin Name I/O Pin Description
53 – 56 SEG11 – 8 O LCD drive segment output (Open)
57 – 64 SEG7 – 0 O LCD drive segment output (Open)
65 – 68 COM3 – 0 O LCD drive common output (Open)
69 – 71 V3 – 1 O LCD drive bias output (Open)
72, 73 C1, 0 O Capacitor connected terminal of LCD driver for voltage-up.
74 STOP O Stop signal output to VCD control IC. (Connect to ground.)
75 TEST I Test terminal for IC. Fixed at L.
76 XHPSW (NC) O HeadphoneAMP ON/OFF control signal output. Not used
77 XLIGHT O LCD back light control signal output to LCD.
78 RESET I System reset signal input from power control IC (IC401). (L: Reset)
79 XIN I Oscillation input
80 XOUT O Oscillation output (Open)
6-1. IC PIN DESCRIPTION
• IC801 TMP88CM22F (SYSTEM CONTROLLER)
Pin No. Pin Name I/O Pin Description
1 VSS I Ground
2 IRRMC I Fixed at L.
3 FOKI I Focus OK signal input from digital servo processor (IC601).
4 AGCCON O AGC control pulse output
5 XLEDDISP O CHG/HOLD LED control signal output
6 VCC SWITCHING O Control signal output for Switching power supply circuit.
7 AMUTE O Analog audio muting ON/OFF signal control signal output (H: Mute ON)
8 VCC2 ON O VCC2 voltage control output
9 XRST O Reset signal output to CXD3027R (IC601). (L: Reset)
10 SCK O Serial data transfer clock signal output to CXD3027R (IC601).
11 SDTI I Serial data input from CXD3027R (IC601).
12 SDTO O Serial data output to CXD3027R (IC601).
13 SLPOUT O WAKE-UP control signal output (for system standby reset)
14 SEL I Plug-in detection signal input of LINE OUT/OPTICAL OUT jack.
15 CHGMNT1 I Battery charge voltage detection input from power control IC (IC401).
16 VCDKEY I Fixed at H.
17 BATMNT I Battery voltage detection input
18 KEY I Key input from switch unit (A/D input)
19 RMKEY (NC) I Key input from headphones with remote controller (A/D input). Fixed at L.
20 DCINMNT I DC input voltage detection input (A/D input) DC input jack use/no-use detect input
21 OPEN I CD door open/close detection input
22 VREFL I Reference voltage (0 V) input for A/D converter.
23 VREFH I Reference voltage (+2 V) input forA/D converter.
24 VDD — Power supply pin (+2 V)
25 SCOR I Sub code sync detection input from CXD3027R (IC601).
26 GRSCOR I GRSCOR signal input
27 FG I FG pulse input
28 BEEP O Beep sound output to headphone AMP (IC351).
29 NC — Not used. (Open)
30 RMSCK (NC) O Communication clock. Not used.
31 RMDATI (NC) I Communication data bus of headphones with remote controller. Not used.
32 RMDATO (NC) O Communication data bus of headphones with remote controller. Not used.
33 RMRW (NC) O Read/write control signal output to headphones with remote.
(L: Read, H: Write) Not used.
34 RMLAT (NC) O Serial data latch pulse output to headphones with remote. Not used.
35 WFCKI I WFCK input
36 COMPON I I Key input from G-protection switch (S805).
37 XNTSC I I Not used. Fixed at H.
38 AVLS I AVLS (AutomaticVolume Limiter System) switch input (L: Normal, H: Limit)
39 HOLD I HOLD switch input (L: HOLD on, H: HOLD off)
40 EX BATT (NC) I EXT BATT plug-in detection input Not used
41 DRVRST O Spindle motor driver control signal output
42 XOE O Optical pick-up VCC control signal output (L: on)
43 XLAT O Serial data latch pulse output to D-RAM controller (IC601). (for ESP)
44 XSOE O Output enable signal output (for ESP)
45 DRVLT O Spindle motor driver latch output
46 XPOWLT O Latch output to VCD control IC.
47 XDOUTON (NC) O DIGITAL OUT LED control signal output Not used
48 XAPC OFF O APC mute signal output (L: mute)
49 XVRST (NC) — Not used. (Open)
50 – 52 SEG14 – 12 O LCD drive segment output (Open)
SECTION 6
DIAGRAMS

– 14 – – 15 – – 16 –
D-SJ01
6-2. BLOCK DIAGRAM — CD SECTION —
04
RF AMP,
DIGITAL SIGNAL PROCESSOR,
DIGITAL SERVO PROCESSOR,
D-RAM CONTROLLER
IC601
85
116, 115, 118, 117
109 - 106, 7 - 5, 3 -1, 111
113
114
119
120
13
97
104
94
93
78
83
2826 30 35 242523
3
26
3511 44 43101225
21
DIGITAL
OUT
LPF
CONTROLLER,
PREDRIVER
MODE
CONTROL
ROTATION
DETECTOR
BEMF
SEPARATOR
PREDRIVER CPU
INTERFACE
FEEDBACK
PATTERN
GENERATOR
OR
PHASE/PWM
DECODER
SIGNAL
PROCESSOR
BLOCK MEMORY
CONTROLLER,
BUS BOOST
BLOCK
SERVO
BLOCK
• SIGNAL PATH
: CD PLAY (ANALOG OUT)
: CD PLAY (OPTICAL OUT)
MDS
44 MDS
MDP
43 MDP
SENS
SCOR
17
SCOR
42
3
1
4
4
1
3
2
23
24
25
14
16
18
20
45
27
41
22
C176
SDTO
XTAI
XTAO
RFAC
XSOE
R4M
XLAT
CLOK
DOUT
XRAS
XWE
XCAS
XOE
LOUT1
LOUT2
AMUTE
FOK
FOK R4M
78
RESET
79
XIN
42
XHGON
39
HOLD
21
OPEN
XSOE WDCK WFCK SDTD SENS CLOK XLAT
XSOE
GRSCOR
FOKI
WFCKI
SDTD
SCOR
SDTI
SCK
XLAT
46
47
SFDR
XRST
RFDC
B
A
D0-D3
A0-A10
4 4
11 11
2
WDCK
WFCK
XTAO
XTAI
E
F
SRDR
TRDR
FRDR
FFDR
TFDR
SFDR
SRDR
59 F
62
61
A
B
58
71
RFDC
RFAC
E
50
51
FFDR
FRDR
48
49
39
40
37
38
16
17
31
29
35
33
27
25
TFDR
TRDR
LASER DIODE
OPTICAL PICK-UP
BLOCK (DAX-22EG)
A
A
B
RF
E
F
B
RF
E
F
PD
PD
LD
LD
DETECTOR
VCC OP VCC
M901
SLED MOTOR
FOCUS
COIL
TRACKING
COIL
FI2
RI2
FI1
RI1
FI3
FI3
FO2
RO2
FO1
RO1
FO3
RO3
FOCUS/TRACKING COIL DRIVER
SLED MOTOR DRIVER
IC401 (2/2)
M
F+
F-
S+
S-
T+
T-
+
+
BUFFER
IC403
SYNC
SYNC
8
9
12
7
6
RST
RST
DATA
LTCH
CLK
OEB
PWM
POL
FG
+
+
U1
V1
W1
COM
U
V
W
VGVG
SPINDLE MOTOR DRIVER
IC402
V
COM
U
W
V
UW
M902
SPINDLE
MOTOR
FG
DRVLT
XSPDOE
OP VCC
SDTO SCK
D415
RSTB
X601
16.9MHz
FG
A
B
D
E
C
H
ON
OFF
S951
HOLD
VCPU +2V
S801
(OPEN) TAP802 (OPEN)
OPTICAL
PICK-UP
POWER ON
SWITCH
Q411
VCC +2V
60
SYSTEM CONTROLLER
IC801 (2/3)
HOLD BOARD
2, 3, 24, 25
9 - 12, 15 - 19, 21, 8
5
4
23
22
14 7 9 28 38 18
SEL
AMUTE
XRST
BEEP
AVLS
16
VCD KEY
77
XLIGHT SEG14 I SEG0 COM3 I COM0
KEY
SYSTEM CONTROLLER
IC801(3/3)
D601
D-RAM
IC602
DQ1-DQ4A0-A10
XRAS
XWE
XCAS
XOE
J302
i
SWITCH BOARD
S901-S904
SWITCH UNIT
OFF
ON
S803
AVLS
VCPU +2V
36
COMPON-I
OFF
ON
S805
G-PROTECTION
IN_L
IN_R
HEADPHONE AMP
IC351
14
15
OUT_L
OUT_R
8
6
PW_SW
MT_SW
19
BEEP
17
PW SW
BEEP
MT SW
20
TAP801
(TEST)
50 - 64 65 - 68
LIQUID CRYSTAL DISPLAY LCD
BACK
LIGHT
LCD BACK LIGHT
DRIVE
Q80L
(Page 17)
(Page 17)
(Page 17)
(Page 17)
(Page 17)
(Page 17)
(Page 17)
(Page 18)

– 17 – – 18 –
D-SJ01
6-3. BLOCK DIAGRAM — POWER SUPPLY SECTION —
04
LINEAR
CONSTANT CURRENT,
CONSTANT VOLTAGE
CHARGING BATTERY
CHARGE CIRCUIT
CHARGING BATTERY
VOLTAGE DETECTOR
CIRCUIT
SAWTOOTH
WAVEFORM
OCCURRENCE
CIRCUIT
UP SIDE
PRE-DRIVER
SWITCHING
POWER
CIRCUIT 2
WAKE UP
SWITCH
Q409
LASER VOLTAGE
LIMITER
Q412
D-RAM
POWER SWITCH
Q602,603
RISING TIME
ADJUSTMENT
Q406
CHARGE
SWITCH
Q402, 407
DC IN
REGULATOR
Q403, 404
+3V POWER
SWITCH
Q401, 405
SWITCH
Q414
SWITCHING
POWER
CIRCUIT 1
LENEAR
REGULATOR
SYSTEM
CONTROL,
INPUT/OUTPUT VG
POWER
CIRCUIT
LOW
VOLTAGE
DETETOR
CLOCK
57
51
52
43
44
42
45
63
41
CHG SW
RF4
INM4
RF21
RF21
RF2
RF2
VC
VC
VCC1
VCC1
INM2
INM2
APCREF
APCREF
PAPC
PA PC
MODE2
MODE2
MODE1
MODE1
WAKEUP
LATCHC
DATA
CLOCK
DATA
CLOCK
VLG2O
SYNC
14
13
67
8
7
3
12
48
47
58
15
2
55
59
50
46
49
4
56
11
SDTO
SCK 2
3
PD
13
LD
D
F
G
B
A
H
SYNC
DTC2D
DTC2D
DTC1D
DTC1D
INP1
INP1
RS
DC IN
V IN
RF4
INM4
RS
CHGSW
V IN
DC IN
LATCHC
WAKEUP
VLG1O
BATM1
BATM1
BATM2
CHGMNT
CHGMNT
VLG2O
VLG1O
VG
L4
9
6
VG
L4
RSTB
SLPOUT
8
VCC2_ON
46
XPOWLT
15
CHGMNT1
20
DCINMNT
17
BATMNT
6
VCC_SWITCHING 48
XAPC_OFF
4
AGCCON
SYSTEM CONTROLLER
IC801 (1/3)
RSTB
RST
VCC +2V
D-RAM
(IC602) +2V
VCPU +2V
D411
D404
D402
D406
D401
RECHARGEABLE
BATTERY
(NICKEL-METAL)
NC-WMAA
1.2V x 2
700mAh
+3V,
SPINDLE MOTOR
DRIVER (IC402) +3V,
HEADPHONE
AMP (IC351) +3V
DC IN 4.5V
–+
VG
VCC +3V
CHARGE
LOW BATTERY
DETECTOR
IC404
E
C
POWER CONTROL
IC401 (1/2)
J401
(Page 15)
(Page 15)
(Page 15)
(Page 14)
(Page 15) (Page 14)
(Page 15)
(Page 14)

– 19 – – 20 –
D-SJ01
6-4. PRINTEDWIRING BOARDS — MAIN SECTION —
04
M
V
U
WBLK
BLK
WHT
WHT
ORG
RED
M901
SLED
MOTOR
S901 S903
S902
S904
M902
SPINDLE
MOTOR
SWITCH
UNIT
J401
DC IN 4.5V
!
J302
i
RECHARGEABLE BATTERY
NC-WMAA
1.2V 700mAh
RECHARGEABLE BATTERY
NC-WMAA
1.2V 700mAh
1
A
B
C
D
E
F
G
H
I
J
234567891011
(TEST)
(OPEN)
(IC801) I-7
(Q401) F-9
(Q402) B-10
(Q403) D-10
Q404 C-10
(Q405) E-9
(Q406) B-9
(Q407) E-10
(Q409) C-8
Q411 H-3
Q412 B-8
(Q414) C-10
Q602 I-5
Q603 I-6
Q801 J-6
(VDR102) G-9
(VDR202) H-9
(VDR303) H-9
(VDR601) J-4
(D401) D-10
(D402) C-8
(D403) C-8
(D404) E-9
(D405) E-10
D406 B-10
D409 C-7
(D411) C-10
(D412) B-8
D413 B-7
(D414) D-10
(D415) H-6
(D601) J-5
IC351 I-9
(IC401) C-9
(IC402) B-7
IC403 B-7
IC404 D-10
(IC601) I-4
IC602 I-5
•Semiconductor Location
Ref.No. Location Ref.No. Location
( ) : SIDE B

– 21 – – 22 –
D-SJ01
OPTICAL
PICK-UP
BLOCK
(DAX-22EG)
04
1
A
B
C
D
E
F
G
H
I
J
234567891011
Note on PrintedWiring Boards:
•Y: parts extracted from the conductor side.
•a:Through hole.
•b: Pattern from the side which enables seeing.
Caution:
Pattern face side: Partson thepattern faceside seenfrom the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
Common Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
•C: panel designation.
•U: B+ Line.
• Powervoltage isdc 4.5Vand fedwith regulateddcpower
supply from external power voltage jack.
• Voltages and waveforms are dc with respect to ground in
playback mode.
no mark : CD PLAY
∗: Impossible to measure
• Voltages aretakenwith aVOM(Input impedance10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J: CD

– 23 – – 24 –
6-5. SCHEMATIC DIAGRAM —MAIN SECTION (1/2) —•Refer to page 25 forWaveforms.
•Refer to page 27 for IC Block Diagrams.
D-SJ01
(Page 26)

– 25 – – 26 –
D-SJ01
6-6. SCHEMATIC DIAGRAM —MAIN SECTION (2/2) —•Refer to page 28 for IC Block Diagrams.
(Page 23)
TP425 (SCK)
TP639 (SCK)
0.5µsec/div
TP614 (RF)
•Waveforms (Play mode)
12
0.5±0.15Vp-p
20µsec/div
TP607 (FOK)
2V
0V
3
IC601 rd (MDP)
2Vp-p
2µsec/div
4
2Vp-p
0.5µsec/div
5
5µsec/div
TP634 (LRCK)
2Vp-p
6
IC601 of (XTAO)
1.9Vp-p
0.05µsec/div16.9MHz

– 27 – – 28 –
IC402 MPC17H71MTAEL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
18
19
20
21
22
23
24
25
26
29
30
27
28
17
16
MODE CONTROL ROTATION
DETECTOR
MODE CLOCK REGULATOR
HOLD PWM REGULATOR
MODE TIME REGULATOR
CLOCK DIVIDER
STATE MACHINE
STARTUP PATTERN
GENERATOR
PATTERN REGULATOR
SEQUENCER
CPU INTERFACE
SERIAL PORT
PARALLEL
INTERFACE
OPERATION MODE
OPERATION MODE
REGULATOR
TEST MODE REGULATOR
PREDRIVER
FEEDBACK PATTERN
GENERATOR BEMF
SEPARATOR
OVERFLOW REGULATOR
PHASE DELAY
REGULATOR
FEEDBACK RESISTOR
PHASE
DECODER PWM DECODER
FG
SYNC
PWM
POL
TEST
RST
DATA
LTCH
CLK
VC
AGND
OEB
VDU
U
PGDUV V
VDVW
W
PGDW
VG
DGND
W1
OE
WP
VP
UP
BEMF
DETECT
V1
U1
COM
TST0
TST1
TST2
TST3
NC
IC602 MSM51X17400D-10TFSR1
ON CHIP
VBB GENERATOR
TIMING
GENERATOR TIMING
GENERATOR
REFRESH
CONTROL CLOCK
INTERNAL
ADDRESS
COUNTER
COLUMN
ADDRESS
BUFFER
11 COLUMN
DECODER
ROW
ADDRESS
BUFFER
ROW
DECODER WORD DRIVER
WRITE
CLOCK
GENERATOR
1
2
3
4
5
6
7
9
8
10
11
12
13
25
26
24
23
22
11
4 4
4
115
11 11
18
19
17
16
15
14
20
21
MEMORY
CELLS
SENS
AMPLIFIER I/O SELECTOR
OUTPUT
BUFFER
4 4
46
INPUT
BUFFER
VCC
DQ1
DQ2
XWE
XRAS
NC
A10
A0
A1
A2
A3
VCC
DQ4
VSS
DQ3
XCAS
XOE
A9
A8
A7
A6
A5
A4
VSS
2
2
6-7. IC Block Diagrams IC601 CXD3027R
ERROR
CORRECTOR
32K
RAM
EFM
DEMODULATOR
SUB CODE
PROCESSOR
SERVO
AUTO
SEQUENCER
D/A
INTERFACE
VIBRATION
MEMORY
CONTROLLER
+
COMPRESSION
EXPANDER
DAC
SELECTOR
DIGITAL
OUT
ASYMMETRY
CORRECTOR
DIGITAL
PLL
DIGITAL
CLV
CPU
INTERFACE
OP AMP
ANALOG SWITCH
SERVO BLOCK
SIGNAL
PROCESSOR
BLOCK
MEMORY CONTROLLER,
BUS BOOST BLOCK
A/D
CONVERTER
SERVO
INTERFACE
SERVO DSP
FOCUS SERVO
SLED SERVO
TRACKING
SERVO
CLOCK
GENERATOR
LPF
LPF
MIRR
DFCT
FOK
PWM GENERATOR
FOCUS PWM
GENERATOR
SLED PWM
GENERATOR
TRACKING PWM
GENERATOR
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60
XOE
A0 –A11
SYSM
AMUTE
HPL
HPM
HPR
PCMDI
LRCKI
BCKI
AOUT1
AIN1
LOUT1
LOUT2
AIN2
AOUT2
A9
A8
A7
DVSS
RFAC
XTAO
XTAI
XTSL VCTL
VPCO
WFCK
GFS
XUGF
MDS
C2PO
WDCK
BIAS
ASYI
ASYO
FILO
FILI
PCO
PWMI
LOCK
MDP
SDTI
SCSY
SCOR
SBSO
EXCK
SDTO
XLAT
CLOK
SENS
XSOE
R4M
IGEN
VDD0 COUT
MIRR
DFCT
FOK
PWMI
LOCK
HPR
HPM
HPL
VDD1
C176
MDP MDS
SSTP
SFDR
SRDR
TFDR
TRDR
FFDR
FRDR
FRDR
FFDR
TRDR
TFDR
SRDR
SFDR
SCLK
ATSK
SSTP
COUT
FOK
DFCT
MIRR
VSS1
TEST TES1
AVDD0
IGEN
AVSS0
RFDC
E
F
120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91
XOE XCAS D2 D3 D0 D1 XWE XRAS A11 A10 DVDD A0 A1 A2 A3 AVDD2 LOUT2 AIN2 AOUT2 AVSS2 AVSS1 AOUT1 AIN1 LOUT1 AVDD1 XVSS XTAO XTAI XVDD BCKI
XOE
XCAS
D2 D3 D0 D1
XWE
XRAS
A11 A10
DVDD
A0 A1 A2 A3
AVDD2
LOUT2
AIN2
AOUT2
AVSS2 AVSS1
AOUT1
AIN1
LOUT1
AVDD1
XVSS
XTAO
XTAI
XVDD
BCKI
VDD0 COUT
MIRR
DFCT
FOK
PWMI
LOCK
HPR
HPM
HPL
VDD1
MDP MDS
SSTP
SFDR
SRDR
TFDR
TRDR
FFDR
FRDR
VSS1
A VDD A GND
D VDD
AVDD0
IGEN
AVSS0
RFDC
E
F
RFDC
E
F
B
A
VC
CLTV
XPCK
A6
A5
A4
XWRE
XRDE
XEMP
XWIH
XQOK
AMUTE
SDTI
XQCK
SCSY
SCOR
VSS0
SBSO
EXCK
XRST
SYSM
SDTO
XLAT
CLOK
SENS
SCLK
XSOE
ATSK
R4M
A9
A8
A7
DVSS
A6
A5
A4
XWRE
XRDE
XEMP
XWIH
XQOK
AMUTE
SDTI
SCSY
SCOR
VSS0 D GND
SBSO
EXCK
SYSM
SDTO
XLAT
CLOK
SENS
SCLK
XSOE
ATSK
R4M
BCK
PCMDI
PCMD
LRCKI
LRCK
DOUT
VDD2
WFCK
C2PO
GFS
XPCK
XUGF
WDCK
VSS2
XTSL
AVDD3
ASYO
ASYI
BIAS
RFAC
AVSS3
CLTV
PCO
FILI
FILO
VCTL
VPCO
VC
A
B
BCK
PCMDI
PCMD
LRCKI
LRCK
DOUT
VDD2
WFCK
C2PO
GFS
XPCK
XUGF
WDCK
VSS2
XTSL
AVDD3
ASYO
ASYI
BIAS
RFAC
AVSS3
CLTV
PCO
FILI
FILO
VCTL
VPCO
VC
A
B
XCAS
D0 –D4
XWE
BCK
PCMD
LRCK
DOUT
XWRE
XRAS
XRDE
XQOK
XWIH
XEMP

–29 –
IC401 MPC17A52FTA
21 22 232019
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
71 70 69 6872
PREDRIVER
H BRIDGE ON H BRIDGE ON
H BRIDGE ON
SYSTEM
CONTROL,
INPUT/OUTPUT
CONTROLLER
VG
VC VC
VC
VC
VC
VC
VC
VC
VC
VG
VG
VG
VG
VG
VGDCINVC
VC
VIN
VC VG
VC VG
VIN VIN
VC
DCIN
VG
VG
D1 (DRV MUTE)
25 26 27 2824 29 30 31 32 33 34 35 36
37
38
39
40
PREDRIVER
CLOCK
CONTROLLER
41
42
43
44
50
51
52
53
54
46
45
47
48
49
SWITCHING
POWER
CIRCUIT 2
SWITCHING
POWER
CIRCUIT 3
BAND GAP
REFERENCE
SUB
REFERENCE
PRE-
DRIVER
DOWN SIDE
PRE-DRIVER
DOWN SIDE
PRE-DRIVER
UP SIDE
PRE-DRIVER
UP SIDE
PRE-DRIVER
SAW TOOTH
WAVEFORM
OCCURRENCE
CIRCUIT
LINEAR, CONSTANT
CURRENT, CONSTANT
VOLTAGE CHARGING
BATTERY CHARGE CIRCUIT
SWITCHING POWER
CIRCUIT 1
CHARGING BATTERY
VOLTAGE DETECTOR
CIRCUIT
LINEAR REGULATOR
VG
POWER CIRCUIT
VC
67 66 65 64 63 62 61 60 59 58 57 56 55
LOW VOLTAGE DETECTOR
HPI2
HPOUT2 HPOUT1
VHP
VD3
VD23
RO2
MGND2
FO2
VD12
RO1
MGND1
FO1
VD1
RO3
FO3
MGND3
HPGND
VLG3
RF21
PAPC
APCREF
VREF
L4
RF2
INM2
VG
GND
SYNC
WAKEUP
CLOCK
DATA
LATCHC
FI3
RI3
HPI1
FI1
RI1
FI2
RI2
CHGSW
RS
INM4
RF4
DCIN
DCIN
VC
VCP
RSTB
MODE1
MODE2
DTC2D
DTC1D
INM1
RF1
INP1 CHGMNT BATM2 BATM1 VLG1O L1L PGND1 L1H VIN L2H PGND2 L2L VLG2O PGND3 L3 DTC3 RF3 INM3
D2 (H BRIDGE/HEADPHONE)
D3 (HPON)
IC351 TA2120FN
+ –
+ –
+ –
23 18 17 16 15 14 13
2345678911 12
1
24
BIAS BEEP
PW
SW MT SW
ALC
DET
ATT
SW
PWC
SW
OUT B OUT A
BEEP
IN
BST
PW
BPW
C
BST
NF ADD OUT RF IN PWC SW OUT B OUT C OUT A PWR GND MIX OUT ALC IN ALC DET
ATT
SW
IN AIN BGND
MT
TC
MT
SW
PW
SW
BIAS
BIAS
IN
BST
SW
BST
OUT
VCC
ADDA
ADDB
21
22
PW
A
ALC ALC
20 19
10

–30 –
SECTION 7
EXPLODEDVIEWS
Ref. No. Part No. Description Remark
7-1. CABINET (UPPER) SECTION
Ref. No. Part No. Description Remark
NOTE:
•The mechanical parts with no reference
number in the exploded views are not supplied.
•Items marked “*”are not stocked since
they are seldom required for routine service.
Some delay should be anticipated
when ordering these items.
•Accessories and packing materials are
given in the last of this parts list.
•Abbreviation
AUS : Australian model
CND : Canadian model
E33 :AC 100-240V area in E model
E13 :AC 220-230V area in E model
The components identified by
mark 0or dotted line with mark.
0are critical for safety.
Replace only with part number
specified.
Les composants identifiés par une
marque 0sont critiques pour
la sécurité.
Ne les remplacer que par une piéce
portant le numéro spécifié.
1 X-3379-025-1 LID ASSY, UPPER
2 3-713-791-01 SCREW (M1.7X4), TAPPING, P2
3 3-326-536-11 SCREW, TAPPING
4 4-225-308-01 PACKING (UPPER LID)
5 1-418-630-11 SWITCH UNIT
6 4-225-318-01 COVER, LID
7 4-225-295-01 LEVER (HOLD)
8 3-326-560-02 RING (DIA. 2.5XDIA. 4.5), O
9 4-225-296-01 LEVER (SW)
10 3-043-748-01 SCREW (B1.4)
*11 1-676-556-11 HOLD BOARD
1
4
5
6
7
8
9
10
11
2
2
2
3
3
A
A