Sony HCD-BX9 User manual

1
HCD-BX9/DX9
SERVICE MANUAL
HCD-BX9/DX9 is the tuner, deck, CD and
amplifier section in MHC-BX9/DX9.
SPECIFICATIONS
COMPACT DISC DECK RECEIVER
— Continued on next page —
Model Name Using Similar Mechanism HCD-BX7/DX7/DX7J
CD Mechanism Type CDM58-K2BD38
Base Unit Type BU-K2BD38
Optical Pick-up Type KSM-213DAP/ZNP
Model Name Using Similar Mechanism HCD-BX7/DX7/DX7J
Tape Transport Mechanism Type TCM-230MWR11
CD
SECTION
TAPE DECK
SECTION
Photo: HCD-DX9
AEP Model
UK Model
HCD-BX9
E Model
Australian Model
HCD-DX9
Amplifier section
European model:
DIN power output (rated)
130 + 130 W
(6 Ωat 1 kHz, DIN)
Continuous RMS power output (reference)
170 + 170 W
(6 Ωat 1 kHz, 10% THD)
Other models:
The following measured atAC 120, 220, 240 V
50/60 Hz
DIN power output (rated)
220 + 220 W
(4 Ωat 1 kHz, DIN)
Continuous RMS power output (reference)
300 + 300 W
(4 Ωat 1 kHz, 10% THD)
Inputs
MD/VIDEO (AUDIO) IN:
(phone jacks)
voltage 450 mV/250 mV,
impedance 47 kΩ
MIC:
(phone jack)
sensitivity 1 mV,
impedance 10 kΩ
Outputs
PHONES:
(stereo mini jack)
accepts headphones of 8 Ωor more
FRONT SPEAKER:
HCD-BX9:
accepts impedance of 6 to 16 Ω
HCD-DX9:
accepts impedance of 4 to 16 Ω
CD player section
System Compact disc and digital audio system
Laser Semiconductor laser (λ=780 nm)
Emission duration: continuous
Laser output
Max. 44.6 µW*
*This output is the value measured at a
distance of 200 mm from the objective
lens surface on the Optical Pick-up Block
with 7 mm aperture.
Frequency response
2 Hz – 20 kHz (±0.5 dB)
Wavelength
780 – 790 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength 660 nm
Output Level –18 dBm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response (DOLBY NR OFF)
40 – 13,000 Hz (±3 dB),
using Sony TYPE I cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
AntennaFM lead antenna
Antenna terminals
75 Ω, unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
BX9, Saudi Arabia models:
531 – 1,602 kHz
(with the interval set at 9 kHz)
Other models:
531 – 1,602 kHz
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)
AntennaAM Loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
9-929-239-14
2002H0200-1
© 2002.08
Ver 1.3 2002.08
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporaton

2
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270˚C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
General
Power requirements
BX9 model:
230 V AC, 50/60 Hz
Australian model:
230 - 240 V AC, 50/60 Hz
Mexican model:
120 V AC, 50/60 Hz
Other models:
120 V, 220 V or 230 - 240 V AC,
50/60 Hz
Adjustable with voltage selector
Power consumption
HCD-BX9: 180 W
HCD-DX9: 300 W
Dimensions (w/h/d)
Approx. 280 ×360 ×425 mm
(11 ×14 3/16 ×16 11/16 in.)
Mas:
HCD-DX9: Approx. 11 kg (24 lbs. 5 oz)
HCD-BX9: Approx. 9.5 kg (21 lbs.)
Supplied accessories
AM loop antenna (1)
Remote commander (1)
Batteries (2)
FM lead antenna (1)
Front speaker pads (8)
Design and specifications are subject to change
without notice.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE WITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

3
MODEL IDENTIFICATION
— BACK PANEL —
TABLE OF CONTENTS
1. SERVICE NOTE ······························································· 4
2. GENERAL ·········································································· 5
3. DISASSEMBLY ································································ 7
4. TEST MODE ···································································· 12
5. MECHANICAL ADJUSTMENTS ····························· 16
6. ELECTRICAL ADJUSTMENTS ······························· 16
7. DIAGRAMS
7-1. Circuit Board Location ····················································· 21
7-2. Block Diagrams ································································ 22
7-3. Printed Wiring Board – BD Section – ······························ 24
7-4. Schematic Diagram – BD Section – ································· 25
7-5. Printed Wiring Board – Main Section – ··························· 26
7-6. Schematic Diagram – Main (1/3) Section – ····················· 27
7-7. Schematic Diagram – Main (2/3) Section – ····················· 28
7-8. Schematic Diagram – Main (3/3) Section – ····················· 29
7-9. Printed Wiring Board – Power AMP Section –
(BX9 model) ····································································· 30
7-10. Schematic Diagram – Power AMP Section –
(BX9 model) ····································································· 31
7-11. Printed Wiring Board – Power AMP Section –
(DX9 model)····································································· 32
7-12. Schematic Diagram – Power AMP Section –
(DX9 model)····································································· 33
7-13. Printed Wiring Board – Panel Section – ··························· 34
7-14. Schematic Diagram – Panel Section – ····························· 35
7-15. Printed Wiring Board – Leaf SW Section – ···················· 36
7-16. Schematic Diagram – Leaf SW Section – ························ 37
7-17. Printed Wiring Board – Driver Section – ························· 38
7-18. Schematic Diagram – Driver Section – ···························· 39
7-19. Printed Wiring Board – Trans Section –
(BX9 model) ····································································· 40
7-20. Schematic Diagram – Trans Section –
(BX9 model) ····································································· 41
7-21. Printed Wiring Board – Trans Section –
(DX9 model)····································································· 42
7-22. Schematic Diagram – Trans Section –
(DX9 model)····································································· 43
7-23. IC Pin Function Description ············································· 44
7-24. IC Block Diagrams ··························································· 46
8. EXPLODED VIEWS
8-1. Main Section ····································································· 49
8-2. Panel Section ···································································· 50
8-3. Main Board Section ·························································· 51
8-4. Tape Mechanism Deck Section-1 ····································· 52
8-5. Tape Mechanism Deck Section-2 ····································· 53
8-6. CD Mechanism Deck Section (CDM58-K2BD38) ·········· 54
8-7. Base Unit Section (BU-K2BD38) ···································· 55
9. ELECTRICAL PARTS LIST ······································· 56
PARTS No.
• Abbreviation
AUS : Australian model
EA : Saudi Arabia model
MY : Malaysia model
SP : Singapore model
MX : Mexican model
AR : Argentina model
MODEL
BX9, DX9: MX models
DX9: E, AR, SP, MY, EA, AUS models
PARTS No.
4-225-041-4s
4-225-041-5s
Ver 1.2 2001.08

4
SECTION 1
SERVICE NOTE
Screw hole
Attach the panel board with
six screws (
+BVTP 2.6 × 8 )
after the board is removed once.
Do not tighten the screws excessively.
1 Cut the eleven melted-connection points with a cutting plier.
Note for installing the panel board
2 Panel board
Hot melt

5
SECTION 2
GENERAL
1DISC SKIP EX-CHANGE button
2DISC 1 button and indicator
3DISC 2 button and indicator
4DISC 3 button and indicator
5ZOPEN/CLOSE button
6EDIT, TUNER MOMERY button
7PLAY MODE, STEREO/MONO button
8REPEAT, DOLBY NR button
9DIRECTION knob (DX9 model)
DIRECTION, PTY knob (BX9 model)
q; SURROUND button
qa VOLUME knob
qs PHONES jack
qd ENTER button
qf REC PAUSE/START button and indicator
qg CD SYNC HI-DUB button
qh LOOP button (BX9 model)
KARAOKE PON button (DX9 model)
qj MIC jack (DX9 model)
qk MIC LEVEL knob (DX9 model)
ql V-GROOVE button and indicator
w; CURSOL button and indicator
wa GROOVE button
ws EQ EDIT button
wd SPECTRUM button
wf DISPLAY button
wg ?/1 button and indicator
wh TUNER/BAND button
wj MD (VIDEO) button
wk Ybutton
wl >+ button
e; Xbutton
ea – .button
es xbutton
ed TAPE A/B button
ef CD button
eg Function indicator
eh m/M knob
Photo: HCD-BX9
1234 5
6
7
8
qa
qs
qdqfqgqh
w;
ws
ed
ef wh
wj
eh
wk
wl
e;
ea
9
q;
wa
ql
wd
wf
wg
es
qk
qj
eg

6
This section is extracted from instruction manual.
6
Step 1: Hooking up the system
(continued)
To attach the front speaker pads
Attach the supplied front speaker pads to the
bottom of the speakers to stabilize the
speakers and prevent them from slipping.
Positioning the speakers
Before you connect them, determine the best
location for your speakers.
1Place the front speakers at an angle
of 45 degrees from your listening
position.
2Place the surround speakers facing
each other at about 60 to 90 cm
above your listening position.
E
e
eE
Front
speaker
(L)
Front
speaker
(R)
Surround
speaker
(L)
Surround
speaker
(R)
45º
Surround
speaker
60 to 90 cm
Inserting two size AA (R6)
batteries into the remote
Tip
With normal use, the batteries should last for about
six months. When the remote no longer operates
the system, replace both batteries with new ones.
Note
If you do not use the remote for a long period of
time, remove the batteries to avoid possible damage
from battery leakage.
When carrying this system
Do the following to protect the CD
mechanism.
1Make sure that all discs are removed from
the unit.
2Hold down CD and then press ?/1 so that
“LOCK”appears in the display.
3Unplug the AC power cord.
7
1Press CLOCK/TIMER SET.
The hour indication flashes.
2Press .or >repeatedly to set
the hour.
3Press ENTER.
The minute indication flashes.
4Press .or >repeatedly to set
the minute.
5Press ENTER.
The clock starts working.
Tip
If you’ve made a mistake, start over from step 1.
To change the time
The previous explanation shows you how to set the
time while the power is off. To change the time
while the power is on, do the following:
1Press CLOCK/TIMER SET.
2Press .or >repeatedly to select
SET CLOCK.
3Press ENTER.
4Perform steps 2 through 5 above.
Note
The clock settings are canceled when you disconnect
the power cord or if a power failure occurs.
Step 2: Setting the
time
You must set the time before using the timer
functions.
The clock is on a 24-hour system for the
European model and a 12-hour system for
other models.
The 24-hour system model is used for
illustration purposes.
mM
.>
YX x
x
NX
1
3,5
2,4

7
SECTION 3
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
Side panel R
Claw
4
q;
8
Upper case (Top)
Side panel L
5 Two screws (Case)
7 Two screws
(+BVTP 3
× 10)
1 Two screws (Case)
9 Two screws (+BVTP 3 × 10)
3 Two screws
(+BVTP 3
× 10)
6 Screw (Case)
2 Screw (Case)
2 Pull-out the disc tray.
1 Turn the pulley to the direction of arrow.
pulley
Loading panel assy
Front panel side
CD mechanism deck (CDM58)
3
3-1. UPPER CASE (TOP)
3-2. LOADING PANEL ASSY

8
7
0
CD mechanism deck (CDM58)
Front panel section
3 Connector (CN2)
8 Connector (CN201)
9 Connector (CN202)
2 Connector (CN1)
Connector
(CN601)
1 Flat type wire (CN304)
6 Three screws (+BVTT 3 × 6)
5 Screw (+BVTP 3 × 10)
4 Screw (+BVTP 3 × 10)
6 Tape mechanism deck
5 Five screws (+BVTP 2.6 × 8)
1 Screw (+BVTP 2.6 × 8
)
2 Bracket (Heart cam R)
4 Bracket (Heart cam L)
3 Screw (+BVTP 2.6 × 8)
3-3. FRONT PANEL SECTION
3-4. TAPE MECHANISM DECK

9
qs Two screws
(+BVTT 4
× 8)
3 Two screws
(+BVTP 3
× 8)
6 Six screws
(+BVTP 3
× 10
)
5 Two screws
(+BVTP 3
× 10)
8 Panel, back
qa Two screws (+BVTT 4 × 8)
qf Trans board
4 Sub-trans
board
qd Trans
1 Connector (CN975)
9 Connector (CN975)
0 Connector (CN977)
7 Connector (CN891)
2 Connector (CN974)
3-5. PANEL BOARD
3-6. SUB-TRANS BOARD AND TRANS BOARD
qs Cut the eleven melted-connection points with a cutting plier.
Note: When attching the panel board,
refer to "Service Note" on page 4.
qf Panel board
qa CD Switch boar
d
1 Knob (Volume)
8
5
FR knob
4 Bracket (FR)
qd Five claws
0 Three claws
9 Two screws
(+BVTP 2.6
× 8)
3 Two bosses & four pins
6 Spring
2 Two screws
(+BVTP 2.6
× 8)
7 Knob(MIC)

10
4 Three screws (+BVTP 3 × 8)
6 Two screws (+BVTP 3 × 8)
7 Heat sink
3 Two screws (+BVTP 3 × 16)
1 Two screws (+BVTP 3 × 8)
2 Main board
Connector(CN502)
Connector
(CN503)
5Power AMP board
6 Screw (+PS 2.6 × 5)
3 Screw (+PS 2.6 × 5)
2Leaf SW board
1 Five claws
4 Head (A) board
5 Head (B) board
6 Remove the four solderings.
3-7. MAIN BOARD AND AMP BOARD
3-8. LEAF SW BOARD, HEAD (A) BOARD AND HEAD (B) BOARD