Sony MD Walkman MZ-EP11 User manual

Ver 1.22004.03
9-923-222-14
2004C02-1
© 2004.03
Sony Corporation
Personal Audio Company
Publishedby Sony Engineering Corporation

– 2 –
TABLE OF CONTENTS
Specifications ........................................................................... 1
1. SERVICING NOTE.......................................................... 3
2. GENERAL
Location and Function of Controls .................................... 6
3. DISASSEMBLY ............................................................... 8
4. TEST MODE ...................................................................11
5. ELECTRICAL ADJUSTMENTS ................................. 14
6. DIAGRAMS
6-1. IC Pin Description .................................................... 16
6-2. Block Diagram.......................................................... 18
6-3. Printed Wiring Board................................................ 21
6-4. Schematic Diagram................................................... 25
7. EXPLODEDVIEWS
7-1. Panel Section ............................................................ 32
7-2. Mechanism Deck Section (MT-MZEP10-129) ........ 33
8. ELECTRICAL PARTS LIST ........................................ 34
IN NO EVENT SHALL SELLER BE
LIABLE FOR ANY DIRECT,
INCIDENTAL OR CONSEQUENTIAL
DAMAGES OF ANY NATURE, OR
LOSSES OR EXPENSES RESULTING
FROM ANY DEFECTIVE PRODUCT
OR THE USE OFANY PRODUCT.
“MD WALKMAN” is a trademark of Sony
Corporation.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK !OR DOTTED LINEWITH
MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICALTO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
This Mini Disc player is classi-
fied as a CLASS 1 LASER prod-
uct.
The CLASS 1 LASER
PRODUCT label is located on
the bottom exterior.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE !SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
Ver 1.1 1998.05

– 3 –
SECTION 1
SERVICING NOTE
When repairing this device with the power on, if you remove the main board, this device stops working.
In this case, you work without the device stopping by fastening the hook of the Open/Close detection switch (S801) with tape.
Chassis ass
y
Open/Close switch (S801)
Main board
Tape

– 4 –
OPERATIONS OF MECHANISM (MZ-EP11)
When loading a disc
The disc shutter 1opens when a disc is loaded. (Fig. 1)
≥
When a disc is loaded, the open lever 2moves in arrow direction
a, and the holder assembly 3lock is released. (Fig. 1 to 3)
≥
The slider 4slides in arrow direction b, and the holder assembly
3moves down to the chassis assembly (below). (Fig. 4)
≥
The OPEN/CLOSE SW (S801) is turned ON by the connection
lever linked. (Fig. 1)
≥
The wakeup mode is set and the power circuit starts operating.
(Fig. 1)
(Fig. 4)
(Fig. 3)
OPEN/CLOSE SW (S801) Open lever
2
Disc shutter 1
Insert the Mini Disc
Lock
Open lever 2
Insert the Mini Disc
Slider 4
b
Open lever 2
Relesse
Slider 4
Slider 4
Holder assembly 3
Descends to chassis side (below)
b
ON
(Fig. 2)

– 5 –
When removing the disc
When the open knob 1is slid in arrow direction a, and the open
slider 2lock is released, the disc shutter 3opens. (Fig. 5)
≥
The slider 4slides in arrow direction b, and the holder assembly
5moves up to the upper panel (above). (Fig. 6, Fig. 8)
≥
The OPEN/CLOSE SW (S801) is turned OFF by the connection
lever linked. (Fig. 5)
≥
The optical pick-up block 6moves to the inner circumference c.
(Fig. 5) ≥
The disc 7is pushed by the open lever 8, and ejected out from
the holder assembly 5. (Fig. 7)
≥
The sleep mode is set and the power supply stops.
(Fig. 5)
Slider 4
Slider 4
Slider 4
Holder assembly 5
Moves up to the upper panel (above)
b
b
Open lever 8
Open lever 8
Lock
Relesse
Open lever 8
OPEN/CLOSE SW (S801)
Disc shutter 3
(Fig. 6)
(Fig. 7)
(Fig. 8)
Disc is ejscted 7
Open Slider 2
(Release)
Open knob 1
a
Optical pick-up block 6
Disc is ejscted 7
OFF

– 6 –
SECTION 2
GENERAL
LOCATION AND FUNCTION OF CONTROLS
1AVLS switch
2HOLD switch
3DIGITAL MEGA BASS switch
4Battery compartment
52/ REMOTE jack
6MD operate buttons
((play) button
=, +button
pbutton
7EJECT knob
8VOLUME +, – buttons
9DC IN 1.5V jack
rMain Unit

– 7 –
1Headphones
2P(pause) button
3(/+, =buttons
4HOLD switch
5p(stop) button
6VOL +, – buttons
7DISPLAY button
8PLAYMODE button
1Character display
2Disc revolve indicator
3Battery condition indicator
4Track number display
rHeadphones with Remote Control
rDisplay windows (Remote Control)
1
1
23
2
4
4
5
5
8
8
7
7
6
6
Except US model
US model
Tourist model
ExceptTourist model
3
123
4
Tourist model Except Tourist model
1Headphones
2P(pause) button
3(/+, =control
4HOLD switch
5p(stop) button
6VOL +, – buttons
7DISPLAY button
8PLAYMODE button
Ver 1.1 1998.05

– 8 –
SECTION 3
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
Set
Mechanism deck
Panel (X) upper, Bottom panel Plate (Control) assy, ornamental Main board
Optical pick-up
rThe equipment can be removed using the following procedure.
3-1. PANEL (X) UPPER, BOTTOM PANEL REMOVAL
3-2. PLATE (CONTROL) ASSY, ORNAMENTAL REMOVAL
7
4
6
1
2 Screws
(M1.4 precision pan)
3 Screws
(M1.4 precision pan)
5 Screws
(M1.4 precision pan
)
5 Screws
(M1.4 precision pan)
Panel (X) upper
Lid, battery case
Stripe (A) assy,
Ornamental
*Caution during assembly
Align the MEGA BASS knob,
AVLS knob and the HOLD knob
position with the switch
on the Main board.
Bottom panel
6
3
Shutter
4 Screw (step)
4 Screw (step)
1 Spring (Shutter),
Tension
Plate (Control) assy,
ornamental
2 Screw
(M1.4 precision pan)
5 Screws
(M1.4 precision pan)
2 Screw
(M1.4 precision pan
)

– 9 –
3-3. MAIN BOARD REMOVAL
3-4. MECHANISM DECK REMOVAL
6
2 Screws
(M1.4 toothed lock)
2 Screws
(M1.4 toothed lock)
1 Screw (1.7 tapping)
3 Remove solder
7 CLV flexible board
(Main board CN551)
5 OP flexible board
(Main board CN501)
4 Switch unit
(Main board CN802)
3 Remove solde
r
Battery flexible
board
Main board
2
5
Case, battery
4 Damper
4 Dampers
3 Screws
(M1.4 precision pan)
1 Screws
(M1.4 precision pan
)
Mechanism deck
Chassis assy
Chassis (B) assy

– 10 –
3-5. OPTICAL PICK-UP REMOVAL
3-6. HOLDER ASSY REMOVAL
1 Screw ( precision)
Optical Pick-up
2
1 Washer (0.8–2.5
)
2 Spring (holder)
Holder assy
Chassis assy
3

– 11 –
SECTION 4
TEST MODE
LCD on remote commander
V2. 00 ROM version display
”key
”key
pkey
pkey
pkey
pkey
VOL
+ key
VOL
– key
(Start ?)
Overall
adjustment
mode (Auto?)
Adjustment
mode
(Manu ?) Servo mode
0 0 0
Audio mode
1 0 0
Servo mode
3 0 0
+, – keys
+, – keys
+, – keys
Display when test mode is set
Displays of the LCD on the remote commander
are shown in parentheses.
Servo mode
0 0 0
Offset adjustment
0 1 0
Laser power
adjustment
0 2 0
011 to 013
*1
021 to 024
*1
23
1
pkey
pkey
pkey
pkey
”key
”key
”key
”key
”key
+, – keys+, – keys
(See page 12.)
*1 Repeatedly press ”key
to change the mode.
(Refer to the following list
for a description of each
mode.)
• ROM version display to all LEDs ON to all LEDs OFF and so
on.
These operations are repeated.
• When the PLAY MODE key is pressed and hold down, the dis-
play at that time is held so that display can be checked.
Configuration ofTest Mode
The test mode has the configuration given below.
Servo Mode
• Set the test mode, press the VOLUME – key and use the (key
to set the servo mode.
• When the servo mode is set, use the +key and the =key
to move the optical pick-up to the outer circumference and to
the inner circumference respectively.
• When entering another mode, refer to the configuration of test
mode.
1. Structure of Servo Mode
Releasing theTest Mode
1. When test mode was entered with key input, turn off the POWER.
2. When test mode was entered by shorting the test point, turn off
the POWER and open the solder bridge of TAP801 (TEST
MODE) on the main board.
Operation of Setting onTest Mode
When the test mode is set, the LCD displays the following :
Outline
• In this set, overall adjustment mode is made available by enter-
ing test mode to perform automatic adjustment of CD and MO.
In the overall adjustment mode, the disc is determined whether
it is CD or MO and adjustments are performed in sequence. If a
fault is found, the location of the fault is displayed.Also, in servo
mode, each adjustment can be automatically made.
Setting theTest Mode
To enter the test mode, two methods are available :
1. Entering method with key input.
Turn on the HOLD switch on the set. While holding down the p
key on the set, press the following remote commander keys in
the following order :
+n+n=n=n+n=n+n
=nPnP
2. Entering method by shorting the test point
Solder bridge the test point TAP801 (TEST) on the main board
(connect IC801 pin #™ to GND), and turn on the POWER.
[MAIN BOARD] (Conductor side)
Test mode
( )
Short :Test mode
Open : Normal mode
Ver 1.1 1998.05

– 12 –
2. Description of Each Mode
010Offset adjustment
Mode Description
011 FE offset
012 TE offset
013 All servo ON
020Laser power adjustment
Mode Description
021 MO power A
022 MO power E
023 CDL power
024 CD power
030MO adjustment
Mode Description
031 MO EF balance
032 MO EF gain
033 MO ABCD gain
034 MO focus gain
035 MO tracking gain
036 MO RF gain
037 MO ADIP gain
038 MO focus bias E
039 CD focus bias A
040Lower reflection CD adjustment
Mode Description
041 Lower reflection CD EF balance
042 Lower reflection CD EF gain
043 Lower reflection CDABCD gain
044 Lower reflection CD focus gain
045 Lower reflection CD tracking gain
046 Lower reflection CD RF offset
047 Lower reflection CD RF gain
048 Lower reflection CD focus bias
050CD adjustment
Mode Description
051 CD EF balance
052 CD EF gain
053 CD ABCD gain
054 CD focus gain
055 CD tracking gain
056 CD RF offset
057 CD RF gain
058 CD focus bias
(See page 11.)
pkey
pkey
pkey
pkey
+, – keys
MO adjustment
0 3 0
031 to 039
*1
”key
pkey
pkey
+, – keys
CD adjustment
0 5 0
051 to 058
*1
”key
pkey
pkey
+, – keys
Sled movement
0 6 0
061 , 062
*1
”key
+, – keys
041 to 048
*1
”key
Low reflection
CD adjustment
0 4 0
pkey
pkey
pkey
pkey
+, – keys
NV relation
0 9 0
091, 092,
093
*1
”key
”key
”key
”key
”key
”key
”key
+, – keys
071, 072,
073, 074
*1
”key
Automatic
adjustment
0 7 0
23
1
Retern the Offset
adjustment (010)
*1 : Repeatedly press ”key
to change the mode.
(Refer to the following list
for a description of each
mode.)
Ver 1.1 1998.05

– 13 –
060Seld movement
Mode Description
061 Seld in
062 Seld out 5
070Automatic adjustment
Mode Description
071 Focus search
072 Access 32
073 ADER check
074 Tracking sensitivity adjust
090NV relation
Mode Description
091 NV clear
092 Power OFF
093 Function code change
Audio Mode
• Enter the test mode and press the VOLUME – key. Then, press
the (key and the VOLUME + key in this turn to enter audio
mode.
• When entering another mode, refer to the configuration of test
mode.
1. Structure of Audio Mode
• The mode No. 111 is for S/N and crosstalk.The mode No. 115 is
for distortion factor and frequency characteristics.
• When the VOLUME +/– keys is pressed in any mode, the vol-
ume of the headphones is changed (increased/decreased) in units
of one step. When the +/ =keys is pressed, the volume of
the headphones is maximized/minimized.
• For the volume value, any changed value remains as it is basi-
cally.
However, when the volume is switched from 114 to 115 or 118
to 119, it returns the default value.
Audio mode
1 0 0
Audio playback test
1 1 0
1kHz 0dB L/R
1 1 1
Infinity Zero
1 1 2
–12dB
–
–12dB
–12dB
–20dB
–20dB
–20dB
–20dB
–40dB
1kHz 0dB L
1 1 3
1kHz 0dB R
1 1 4
1kHz 0dB L/R
1 1 5
20Hz 0dB L/R
1 1 6
20kHz 0dB L/R
1 1 7
100kHz De-Emphasis
1 1 8
100kHz 0dB L/R
1 1 9
headphones
output
pkey
pkey
”key
”key
”key
pkey
”key
pkey
”key
pkey
”key
pkey
”key
pkey
”key
pkey
”key
pkey
”key
pkey
”key

– 14 –
Power Mode
• Enter the test mode and press the VOLUME – key. Then, press
the (key and the VOLUME – key in this turn to enter power
mode.
• When entering another mode, refer to the configuration of test
mode.
1. Structure of Power Mode
SECTION 5
ELECTRICAL ADJUSTMENTS
Notes for Adjustment
• In this set, automatic adjustment of CD and MO can be per-
formed by entering the test mode.
• Adjustments are performed in the overall adjustment mode. If
an item is determined as NG, the item is readjusted in servo
mode.
Adjustment Method in Overall Adjustment Mode
1. Enter the test mode and press the VOLUME + key to enter over-
all adjustment mode.
2. Insert the CD test disc (TGYS-1) or SONY MO disc (recorded)
commercially availble.
3. Press the (key twice. The disc is determined whether it is CD
or MO and each adjustment mode is set.Automatic adjustments
are performed in the order of the items listed below.
• In CDAutomatic adjustment Mode
No. Mode Description
1061 Sled in
2071 Focus search
3062 Sled out 5
4051 CD EF balance
5052 CD EF gain
6051 CD EF balance
7053 CD ABCD gain
8054 CD foucus gain
9055 CD tracking gain
10 056 CD RF offset
11 057 CD RF gain
12 056 CD RF offset
13 058 CD Focus bias
Overall Adjustment Mode
• Enter the test mode and press the VOLUME + key to enter over-
all adjustment mode.
• When entering another mode, refer to the configuration of test
mode.
• When the overall adjustment mode is entered, the LCD on the
remote commander display the following :
Power mode
3 0 0
UNREG check
31 0
Power OFF
3 1 1
pkey
pkey
”key
”key
”key
1. Structure of Overall Adjustment Mode
Auto ?
000
Start ?
CD automatic
adjustment
MO automatic
adjustment
OK
NG
OK
NG
Overall
adjustment
mode
Auto?
Adjustment
mode
Manu ?
pkey
pkey
pkey
pkey
”key (to discriminate between CD and MO)
”key

– 15 –
• In MO Automatic adjustment Mode
No. Mode Description
1061 Sled in
2071 Focus search
3062 Sled out
4031 MO EF balance
5032 MO EF gain
6031 MO EF balance
7033 MO ABCD gain
8034 MO focus gain
9035 MO tracking gain
10 036 MO RF gain
11 037 MO ADIP gain
12 038 MO focus bias E
13 039 MO focus bias A
14 073 ADER check
15 061 Sled in
16 071 Focus search
17 041 Low reflection CD EF balance
18 042 Low reflection CD EF gain
19 041 Low reflection CD EF balance
20 043 Low reflection CDABCD gain
21 044 Low reflection CD focus gain
22 045 Low reflection CD tracking gain
23 046 Low reflection CD RF offset
24 047 Low reflection CD RF gain
* Remote commander display during automatic adjustment
Adjustment in Servo Mode Method
1. When each adjustment mode is set according to the structure of
servo mode, the lower two digits of the mode No. and the adjust-
ment value written in EEPROM are displayed and lit on the LCD
on the remote commander.
4. If result of automatic adjustment is OK, the following display
appears.
12
057
Adjustment value (flashing)
Mode No. under adjustment
5. If result of automatic adjustment is NG, the following display
appears.
End-OK
058
* If NG, enter servo mode to perform automatic adjustment of the
item determined as NG.
NG 04
NG mode No.
051
2. When the Pkey is pressed, the following display appears and
the automatic adjustment is performed.
13
052
Adjustment value (lit)
Mode No.
Note) Although theVOLUME +/– keys can be used to change the
adjustmentvalue toany value,they should not be used when-
ever possible.
3. When the automatic adjustment is completed, the flashing ad-
justment value is lit.
13
052
Adjustment value (flashing)
13
052
Adjustment value (lit)

– 16 –
Pin No. Pin Name I/O Pin Description
1 CHG MON – Not used (Fixed at “L” ).
2 UREG MON I Unreg voltage monitor input.
3 VTEMP I Temperature sensor input.
4 VREF I Reference voltage monitor input.
5 PLAY KEY I Set PLAY key input.
6 OPEN/CLS SW I OPEN/CLOSE switch input.
7 RMC KEY I Remote commander key input.
8 SET KEY I Set key input.
9 XRESET I Systen reset input (At reset : “L” ).
10 AVDD – A/D converter power supply.
11 AVSS – A/D converter GND.
12 TYPE 0 I (Fixed at “L” ).
13 TYPE 1 I (Fixed at “L” ).
14 HOLD SW I Set HOLD switch input.
15 MODEL I (Fixed at “L” ).
16 TYPE 2 I (Fixed at “L” ).
17 VREG CON O 2.5V voltage on/off switch.
18 XWK CLR O Power IC wakeup factor latch clear outpu and motor driver IC control signal outpt.
19 SLEEP O System sleep ouput.
20 MCK I Master clock input.
21 NC – Not used (Open).
22 VDD – Digital power supply.
23 VSS – Digital Ground.
24 NC – Not used (Open).
25 VSS – Digital Ground.
26 UREG CHK CON O Not used (Open).
27 DSP SINT I Interrupt input from DSP.
28 DBB OFF I DBB switch.
29 AVLS SW I Set AVLS switch input.
30 OPR LED O LED drive.
31 NC – Not used (Open).
32 ADJUST I “Normally, Test mode select input (“L” : Test mode)
33 NC – Not used (Open).
34 SBUS CLK O SBB serial clock output.
35 SBUSDATA O SBB serial data output.
36 FR CAP I Free-run counter capture input (Not used).
37 SLD 1 MON I Sled servo timing signal input.
38 SLD 2 MON I Sled servo timing signal input.
39 CLV VCON O Spindle servo drive voltage control output.
40 V28-CON O Power voltage correction control output.
41 APC REF O Laser power control output.
42 CLV U MON I Spindle servo timing signal input.
43 CLV V MON I Spindle servo timing signal input.
44 CLV W MON I Spindle servo timing signal input.
45 CLV U CON O Spindle servo drive signal output.
SECTION 6
DIAGRAMS
IC801 RU6715MF-0004 (SYSTEM CONTROL)
6-1. IC PIN DESCRIPTION

– 17 – – 18 – – 20 –– 19 –
Pin No. Pin Name I/O Pin Description
46 CLV V CON O Spindle servo drive signal output.
47 CLV W CON O Spindle servo drive signal output.
48 NC – Not used (Open).
49 FR TRG – Free-run counter capture output (Not used).
50 VDD – Digital power supply.
51 VPP – Power for on board light.
52 VSS – Digital ground.
53 SLD 1R CON O Gate array control signal output.
54 SLD 1F CON O Gate array control signal output.
55 SLD 2R CON O Gate array control signal output.
56 SLD 2F CON O Gate array control signal output.
57 SLD DLY4 O Gate array control signal output.
58 SLD DLY5 O Gate array control signal output.
59 SLD DLY6 O Gate array control signal output.
60 SLD MODE O Gate array control signal output.
61 SPCK – Not used (Open).
62 RMC DTCLK I/O TSB serial data input/output.
63 – 65 NC – Not used (Open).
66 SLD DIR O Gate array control output.
67 SLD VCON O Sled servo outer voltage control output.
68 SLD PWR-UP O Baypass transistor control output for sled drive power supply.
69 HP MUTE O Headphone amplifier mute output.
70 HP STBY O Headphone amplifier standby output.
71 RMC SEL O Not used (Open).
72 NV D0 O Serial data signal output for NVRAM.
73 NV D1 I Serial data signal input from NVRAM.
74 NV CLK O Serial clock signal output for NVRAM.
75 NV CS1 O Chip select signal output for NVRAM.
76 VDD – Digital power supply.
77 – 79 LCD VL2 – 0 I LCD drive level power supply (Ground).
80 VSS – Digital ground.
81 – 87 NC – Not used (Open).
88 – 96 LCD SEG0 – 8 – Not used (Open).
97 – 100 LCD COM0 – 3 – Not used (Open).
MZ-EP11
• Signal path.
J: PLAY
6-2. BLOCK DIAGRAM

Ver 1.2

– 25 – – 26 – – 28 –– 27 –
6-4. SCHEMATIC DIAGRAM
MZ-EP11
rRefer to page 29 for IC Block Diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
Note: Note:
The components identi- Les composants identifiés
fied by mark !or dotted par une marque !sont cri-
line with mark !are cri- tiques pour la sécurité.
tical for safety. Ne les remplacer que par
Replace only with part une piéce portant le
number specified. numéro spécifié.
•U: B+ Line.
• Powervoltage is dc1.5V and fedwith regulated dc power
supply from external power voltage jack. (J901)
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark :PLAY
• Voltagesare taken witha VOM(Input impedance 10MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J:PLAY
1
IC501 #¶ RF OUT
2
3
TIME/DIV : 0.5µsec
VOLT/DIV : 0.5V
1.0 Vp-
p
TIME/DIV : 20 nsec
VOLT/DIV : 0.1VAC
IC301 5 XT1
0.4 Vp-
p
16.0 MHz
TIME/DIV : 50 nsec
VOLT/DIV : 0.5V AC
IC601 $• X1
0.9 Vp-
p
59.8 msec
rWAVEFORMS
PLAY MODE
Ver 1.1 1998.05

– 31 – – 32 –– 29 – – 30 –
IC602 MSM51V4400-70TS-K
ROW
ADDRESS
BUFFERS
ROW
DECODERS
INTERNAL
ADDRESS
COUNTER
TIMING
GENERATOR
4
RAS
REFRESH
CONTROL CLOCK
23
CAS
9
A0
5
A9
1D0
10
A1
11
A2
12
A3
14
A4
15
A5
16
A6
17
A7
18
A8
13
VDD
ON CHIP V DD
26
GND
TIMING
GENERATOR
WORD
DRIVERS
MEMORY
CELLS
OUTPUT
BUFFERS
COLUM
ADDRESS
BUFFERS
COLUM
DECODERS
SENSE
AMPS
INPUT
BUFFERS
WRITE
CLOCK
GENERATOR
I/O
SELECTOR
2D1
3WE
22 OE
24 D2
25 D3
SECTION 7
EXPLODED VIEWS
NOTE :
• -XX, -X mean standardized parts, so they
may have some difference from the original
one.
• Items marked “ * ”are not stocked since they
are seldom required for routine service. Some
delay should be anticipated when ordering
these items.
• The mechanical parts with no reference
number in the exploded views are not
supplied.
• Hardware (# mark) list and accessories and
packing materials are given in the last of this
parts list.
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
7-1. PANEL SECTION
1 4-963-883-21 SCREW (M1.4), PRECISION PAN
2 4-993-374-11 PANEL, BOTTOM
3 4-982-398-21 KNOB (BASS BOOST)
4 4-982-397-21 KNOB (AVLS)
5 4-986-207-21 KNOB (TUN)
6 X-4948-817-1 PLATE (CONTROL)ASSY,ORNAMENTAL
7 4-993-386-01 SPRING (SHUTTER), TENSION
8 4-993-384-01 SHUTTER
9 4-993-387-01 STRIP (B), ORNAMENTAL
10 4-993-413-01 PANEL (X), UPPER
11 4-993-392-02 LID, BATTERY CASE
12 X-4948-821-1 TERMINAL BOARD ASSY, MINUS
13 4-993-415-01 CASE, BATTERY
14 X-4948-820-1 TERMINAL BOARD ASSY, PLUS
15 4-993-389-01 SPRING (BATTERY), COMPRESSION
16 1-666-783-11 FLEXIBLE BOARD
17 X-4948-818-1 STRIP (A) ASSY, ORNAMENTAL
18 A-3293-628-A MAIN BOARD, COMPLETE (JE)
18 A-3293-828-A MAIN BOARD, COMPLETE (EXCEPT JE)
19 7-627-455-07 SCREW +K1.4X1.4, PRECISION
20 4-963-883-41 SCREW (M1.4), PRECISION PAN
21 3-335-797-91 SCREW (M1.4), TOOTHED LOCK
22 4-984-017-11 SCREW (1.7), TAPPING
23 4-993-385-01 SCREW, STEP
24 3-338-625-11 SCREW (M1.4X1.6), WASHER HEAD
25 3-350-775-01 SPACER
1
19
1
1
1
1
1
1
1
1
2
3
4
5
6
7
89
10
11
12
13
14
15
16
17
18
20
21
22
23
23
not supplied
not supplied
not
supplied
25
1
24
• Abbreviation
JE : Tourist
Les composants identifiés par une
marque !sont critiques pour la sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
The components identified by mark !
or dotted line with mark !are critical
for safety.
Replaceonly with part number specified.
Ver 1.2