Sony ICD-P320 Digital Voice Editor 2 User manual

SERVICE MANUAL
Sony Corporation
Connect Business Division
Published by Sony Techno Create Corporation
US Model
Canadian Model
AEP Model
UK Model
E Model
Chinese Model
IC RECORDER
9-879-994-02
2006B04-1
© 2006. 02
Ver. 1.1 2006. 02
SPECIFICATIONS
ICD-P320
Recording media Built-in flash memory 64 MB,
Monaural recording
Recording time HQ: 7 hours 20 minutes
SP: 19 hours 35 minutes
LP: 32 hours 10 minutes
Frequency range HQ: 260 Hz – 6,800 Hz
SP/LP: 220 Hz – 3,400 Hz
Speaker approx. 2.8 cm (1 1/8 in.) dia.
Power output 250 mW
Input/Output • Earphone jack (minijack) for
8 – 300 ohms ear receiver/headphones
•Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
•USB connector
Power requirements Two LR03 (sizeAAA) alkaline batteries:
3 V DC
Dimensions (w/h/d) (not incl. projecting parts and controls)
34.6 ×109.5 ×18.0 mm (1 3/8 ×4 3/8 ×23/32 in.)
Mass (incl. batteries) 68g (2.4 oz)
Supplied accessories Operating instructions (for the IC recorder (1)/for
the application software (1))
LR03 (size AAA) alkaline batteries (2)
(US, CND model)
Headphone (1) (E, CH, KR model)
Carrying pouch (1) (E, CH, KR model)
USB connecting cable (1)
Application software (CD-ROM) (1)
Design and specifications are subject to change without
notice.
• Abbreviation
CND: Canadian model
CH : Chinese model
KR : Korean model

2
ICD-P320
TABLE OF CONTENTS
1. GENERAL ...................................................................... 3
2. DISASSEMBLY
2-1. Case (Front) Assy ............................................................... 4
2-2. MAIN Board....................................................................... 5
2-3. USB Board ......................................................................... 5
3. TEST MODE .................................................................. 6
4. DIAGRAMS
4-1. Block Diagram ................................................................... 9
4-2. Printed Wiring Board – MAIN Section – ........................ 11
4-3. Schematic Diagram – MAIN Section (1/2) – .................. 12
4-4. Schematic Diagram – MAIN Section (2/2) – .................. 13
4-5. Printed Wiring Board – USB Section –.......................... 14
4-6. Schematic Diagram – USB Section –.............................. 15
5. EXPLODED VIEWS
5-1. Case (Front) Section ......................................................... 19
5-2. Case (Rear) Section .......................................................... 20
6. ELECTRICAL PARTS LIST ................................... 21
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 °C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder. Operating instructiondd

3
ICD-P320
SECTION 1
GENERAL This section is extracted
from instruction manual.
Index to Parts and Controls
Main unit
* There is a tactile dot beside the control to show the
direction to turn up the volume.
** The button has a tactile dot.
MIC (built-in microphone)
(microphone) jack
Display window
DISPLAY/MENU
DIVIDE
x STOP
zX REC (record) /PAUSE
– . (review/fast backward) /
>+
(cue/fast forward) (SELECT)
Speaker
OPR (operation) indicator
ERASE
VOL (volume) control*
HOLD
Nx PLAY/STOP (ENTER)**
i (earphone) jack
Rear
Battery
compartment
Hook for handstrap
(not supplied)
USB connector
Display window
Folder indication
Remaining battery
indicator
Microphone sensitivity
Alarm indicator
Selected message number
REC DATE (recorded date)
indication
REMAIN indicator
Remaining memory
indicator
Recording mode
indication
REC (recording)
indicator
Repeat play indicator
Number of messages in
a folder/Menu
indication/Counter /
Remaining time
indication /Recording
date indication /Current
time indication /
Messages
EASY-S (Easy Search)
indicator

4
ICD-P320
Note : Follow the disassembly procedure in the numerical order given.
2-1. CASE (FRONT) ASSY
SECTION 2
DISASSEMBLY
Note : Disassemble the unit in the order as shown below.
2-1. CASE (FRONT) ASSY
(Page 4)
2-2. MAIN BOARD
(Page 5)
SET
2-3. USB BOARD
(Page 5)
8
2 screw
9 two screws
0 two brackets (speaker)
qa speaker
qs case (front) assy
3 claw
4 claw
6 claw
7 claw
5 two claws
1 battery case lid

5
ICD-P320
2-2. MAIN BOARD
2-3. USB BOARD
2 USB board
1 two screws
3
4
5 MAIN board
S701
CN2001
1 insulating sheet
2 screw

6
ICD-P320
5-3. BEEP Test
To enter the BEEP Test, press the [ERASE] button.
1. Outline of the TEST MODE
The TEST MODE is designed to help verify the set when servicing
it.
TheTEST MODE is onlymenu driven to selectmodes forservicing.
2. Entering and Canceling the TEST MODE
With the power on, turn on the [HOLD] switch while pressing the
x STOP button and the [DISPLAY/MENU] button at the same time.
3. Canceling the TEST MODE
The TEST MODE can be cancelled by turning off the power
(unplugging the dry battery).
4. Menu Key Designation
The menu has the five modes described below. The following keys
are assigned on the initial screen (version display).
5. Key Assignment
From within TEST MODE, the intended menu can be entered by
using the appropriate one key of the following key.
LCD Test (All OnyAll Off) DISPLAY/MENU
BEEP Test (1.3 kHz) ERASE
HQ-DSP LOOP zX REC/PAUSE
SP-DSP LOOP .–
LP-DSP LOOP >+
USB Test Nx PLAY/STOP(ENTER)
REST MENU Test DIVIDE
Initial Display from each mode xSTOP
5-1. Initial Display in TEST MODE
LCD indications (destination information, memory capacity, CPU
FW information and MIC sens) when TEST MODE is entered:
SECTION 3
TEST MODE
5-2. LCD Test
To enter the LCD Test, press the [DISPLAY/MENU] button. The LCD
Test has two modes: All On and All Off First all the indicators are
on. All the indicators are off when the button is pressed again.
Press the x STOP button to return to the initial display (destination
information, memorycapacity, CPU FW informationand MIC sens).
Press the x STOP button to return to the initial screen (memory and
CPU version).
5-4. DSP LOOP
The DSP LOOP modes can be entered selectively by pressing the
appropriate one of the following three keys.
Within the LOOP test menu, “LOOP” is displayed. The sensitivity
character H or L is displayed depending on the position into which
the [HOLD] switch is placed.
The sensitivity H is displayed when [HOLD] switch is in the ON
position. The sensitivity L is displayed when [HOLD] switch is in
the OFF position.
To change the DSP LOOP test mode, press the x STOP button, then
select the zX REC/PAUSE button, .– button, or >+ button.
In a DSP Test mode, to select another DSP Test mode and to select
the other sensitivity, the x STOP button also has to be pressed.
Memory capacity
(128-128 MB)
(64-64 MB)
(32-32 MB)
(16-16 MB)
MIC sens
Destination
information
CPU FW information
H
ALL ON
DISPLAY/MENU
Switch between
the modes.
ABCD
REQ
FM
LP
EASY-S
REC
REMAIN
LOCAL YH MM MHz DS
DATE
SPHQ
LH
ALL OFF
Beep: Frequency 1.3 kHz only
zX REC/PAUSE
.
>
HQ
H
LP
H
SP
H

7
ICD-P320
To change the sensitivity again, press the x STOP button and change
the [HOLD] switch.
In a DSP Test mode, changing the mode and changing the sensitivity
require the x STOP button be pressed.
5-5. USB Test
In this test, the ON/OFF status of VBUS is displayed and the
SUSPEND test is performed.
The Nx PLAY/STOP(ENTER) button is pressed to display the status of
VBUS by “On” or “OFF” indication.
With theVBUS ON, the [HOLD] switch is operated (ON) to perform
the SUSPEND test.
• VBUS Test
with VBUS
Nx PLAY/STOP
(ENTER)
without VBUS
k
Kx STOP
H
with VBUS
Nx PLAY/STOP
(ENTER)
SUSPEND mode
VBUS OFF
k
K
K
j
x STOP
x STOP HOLD
ON
J
H
Sensitivity H
HOLD
ON
OFF
H
Sensitivity L
HOLD
L
5-6. RESET MENU
To enter the RESET MENU test, press the [DIVIDE] button.
When all of the buttons or controls located on the set are operated,
the system shows “Ok” if all of them are normally operated.
An operation of a switch is indicated by the number for verification
in order to make a simple indication.
Note 1: When 10 different operations of the switches are normally
madein anyorder (regardlessofthe order thatpushbuttons
are pressed and the slide switch is set to ON and OFF),
the system shows “Ok”.
Note 2: Clear memory when“ACCESS”is blinking on the display.
(Do this before “Ok” is shown.) To exit from this menu,
the power has to be turned off (battery to be removed).
• SUSPEND Test
With the VBUS ON, turn the [HOLD] switch ON to enter the
SUSPEND mode.
When this mode is cancelled, the VBUS is turned OFF.

8
ICD-P320
• Switches and corresponding LCD indications
Switch Indication
DIVIDE 1
DISPLAY/MENU 2
zX REC/PAUSE 3
Nx PLAY/STOP(ENTER) 4
.–5
xSTOP 6
>+7
ERASE 8
HOLD-OFF 9
HOLD-ON 10
r
rPress DIVIDE button.
Indication after DIVIDE
button is pressed.
Indication after DISPLAY/MENU
button is pressed.
Indication after zX REC/PAUSE
button is pressed.
Indication after HOLD is
set to OFF.
Indication after HOLD is
set to ON.
t If any key is not pressed,
the system waits for the key
to be pressed.
Clear memory when "ACCESS" is
blinking on the display.
The system shows "Ok".
：
：
：
r
r
r
H
1 2
8
10
34
567
DIVIDE
REC/PAUSE
− STOP ＋
PLAY/STOP(ENTER)
DISPLAY/MENU
ERASE
VOL
HOLD
ON
9
OFF

99
ICD-P320
ICD-P320
4-1. BLOCK DIAGRAM
SECTION 4
DIAGRAMS
47 MIP HSSPOOT
XOUT
XIN
RV101
VOL
33
51
52
MIC101
MICROPHONE
J101
(PLUG IN POWER)
Q106
A/D,D/A CONVERTER,DSP
IC101
SYSTEM CONTROL,
USB/LED/LCD DRIVER
IC703
FLASH MEMORY
IC701
48
3
2
–IN
1SHUTDOWN
+IN
BIAS
VO2
5
VO1
SP101
SPEAKER
DSP+3V 34
DSP+3V REG
IC501
VOUT VIN
1
CE
5
EXT
1
FB
MUTE
Q101
SPEAKER AMP
IC102
HEADPHONE AMP
IC2002
DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION LR03)
2PCS, 3V
23 EGPIO11
SI1
XDSPIFRW
SCK1
SO1
XDSPIFACK
XDSPRST
XDSPIFREQ
SCK1
XDSPIFRW
SO1
SI1
XDSPIFACK
XDSPRST
XDSPIFREQ
SCKI
DSPIFRW
SO1
SI1
XDSPIFACK
XDSPRST
DSPIFREQ
EGPIO12
EGPIO13
EGPIO14
EGPIO15
RSTN
BGPIO2
24
25
26
27
54
58
• Signal path
: PB
: REC
100
I
69
61
I
68
15
54
55
56
57
58
59
60
29
I
32
•
41
I
44
7
19
9
16
17
18
8
FLMRB
13
XHPMUTE 12
SP AMPPWR
14
HP AMPPWR
47
BEEP
45
LMUTE
XFLMRE
XFLMCSO
FLMCLE
FLMALE
XFLMWE
XFLMWP
UCOM+3V
UCOM+3V
OPR
(PB) (REC)
R/B
WP
CE
CLE
ALE
WE
RE
XREDLED
XGRNLED
DC+3V
OSC1
OSC2
DSPPWR
29
HOLDHPDET
9
FLMPWR
51
XVBUSDET
46
TRON/CLKOUT
33
D+
34
D–
31
XBATTEN
26
BATT
SEG0
I
SEG31
I/O1
I
I/O4
I/O5
I
I/O8
LIQUID
CRYSTAL
DISPLAY
PANEL
LCD701
BATTERY
DETECT
Q702
D702
OPR
D701
X701
8MHz
1
I
4
COM0
I
COM3
40
41
42
RESET
IC702
39
43
44
52
27 KEYIN0
28 KEYIN1
48 WAKEUP
HOLD
OFF
ON
S701
23
17
18
XI
XO
X702
32.768kHz
20
21
X2001
4.096MHz
XRESET
10
11
WAKE UP
SWITCH
Q703
KEY
MATRIX
S702-709
DSP+3V 34
VOUT VIN
1
CE
DECT
D505
DC/DC
CONVERTER
IC506
UCOM+3V 34
VOUT VIN
1
CE
DC+3V
3
CE
VOLTAGE
DETECT
IC504
SWITCHING
Q506
VOLTAGE
DETECT
Q507,508
SWITCH
Q509
BUFFER
Q704
VBUS
DETECT
Q2002
m
J102
i
4
5
3
2
–IN
1SHUTDOWN
+IN
BIAS VO1
HP MUTE
Q2001
UCOM+3V REG
IC503
FLM+3V 43
VOUT VIN
1
CE
FLM+3V REG
IC2001
DSP+3V REG
IC502
SCKI
SO1
SI1
XDSPRST
DSPIFREQ
DSPIFRW
XDSPIFACK
FLMIO0
I
FLMIO7
DC+3.3V
DC+3.3V
DC+3.3V
CN1001
VBUS
DATA+
DATA–
(USB)
+
–

1010
ICD-P320
ICD-P320
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
Common Note on Schematic Diagrams:
•All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise
specified.
•f: internal component.
•C: panel designation.
•A: B+ Line.
•Power voltage is dc 3V and fed with regulated dc power
supply from battery terminal.
•Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : PB
():REC
•Voltagesaretaken witha VOM(Input impedance10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
•Circled numbers refer to waveforms.
•Signal path.
E: PB
a: REC
Common Note on Printed Wiring Boards:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•f: internal component.
•: Pattern from the side which enables seeing.
Caution:
Pattern face side: Partson thepatternface sideseen from
(SIDE B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
•Waverforms
– MAIN board –
2 IC703 qk (OSC2)
0.5 V/DIV, 0.1 µ sec/DIV
3 IC703 wa (XO)
0.5 V/DIV, 20 µ sec/DIV
0.5 V/DIV, 0.1 µ sec/DIV
1 IC101 ta (XOUT)
1.2 Vp-p
4.096 MHz
8 MHz
2.8 Vp-p
32.768 kHz
3.5 Vp-p
Ref. No. Location
(D505) H-6
D701 E-12
D702 E-12
D2001 E-12
D2002 C-6
D2004 C-5
(D2007) I-6
D2008 A-12
IC101 C-9
IC102 D-10
(IC501) J-6
(IC502) G-6
(IC503) I-6
(IC504) H-3
(IC506) I-6
(IC701) I-8
(IC702) G-10
(IC703) I-10
IC2001 D-8
IC2002 D-11
(Q101) G-11
Q106 B-10
(Q506) H-5
(Q507) I-4
(Q508) I-4
Q509 C-4
(Q702) G-10
Q703 C-8
Q704 C-5
(Q2001) H-12
Q2002 C-5
• Semiconductor
Location (MAIN
Section)
( ): SIDE B