Sony Walkman NW-E50 User manual

NW-E50/E70
E Model
Chinese Model
SERVICE MANUAL
PORTABLE IC AUDIO PLAYER
SPECIFICATIONS
Ver 1.3 2004.09
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-877-731-04
2004I16-1
2004.09
ATRAC3plus*
4 hr. 20 min. (64 kbps)
5 hr. 50 min. (48 kbps)
ATRAC3*
2 hr. 00 min. (132 kbps)
2 hr. 30 min. (105 kbps)
4 hr. 10 min. (66 kbps)
MP3
1 hr. 00 min. (256 kbps)
2 hr. 00 min. (128 kbps)
Sampling frequency
ATRAC3, ATRAC3plus, MP3: 44.1 kHz
Audio compression technology
Adaptive Transform Acoustic Coding3 (ATRAC3)
Adaptive Transform Acoustic Coding3plus
(ATRAC3plus)
MPEG1 Audio Layer-3 (MP3): 8 to 320 kbps, variable
bit rate-compliant
Frequency response
20 to 20,000 Hz (single signal measurement)
Maximum recording time (Approx.)
NW-E50
ATRAC3plus*
8 hr. 40 min. (64 kbps)
11 hr. 40 min. (48 kbps)
ATRAC3*
4 hr. 10 min. (132 kbps)
5 hr. 20 min. (105 kbps)
8 hr. 30 min. (66 kbps)
MP3
2 hr. 00 min. (256 kbps)
4 hr. 00 min. (128 kbps)
NW-E70
* The values for ATRAC3, ATRAC3plus apply if the
MP3 file manager software has been erased from the
built-in flash memory.
Output
Headphone: Stereo mini-jack
56 ×
Operating temperature
5˚C to 35˚C (67˚F to 95˚F)
Power source
LR03 (Size AAA) alkaline battery
Battery life (continuous playback)
ATRAC3 format: Approximately 70 hours
ATRAC3plus format: Approximately 60 hours
MP3 format: Approximately 50 hours
Dimension
37.3 ×15 mm
(w/h/d, projecting parts not included)
Mass
Approx. 40 g (battery not included)
Supplied accessories
Headphones (1)
Dedicated USB cable (1)
Carrying pouch (1)
Neck strap (1)
Earbuds (Size S, L) (NW-E70) (1)
Extension headphone cord (1)
CD-ROM (1)
Operating Instructions (1)
SonicStage operating instructions (1)
Design and specifications are subject to change
without notice.
Signal-to-noise ratio (S/N)
80 dB or more (excluding ATRAC3 66 kbps)
Dynamic range
85 dB or more (excluding ATRAC3 66 kbps)
Photo : NW-E70

2
NW-E50/E70
TABLE OF CONTENTS
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270°C during
repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
zUNLEADED SOLDER
Boardsrequiringuseofunleadedsolderareprintedwiththelead-
free mark (LF) indicating the solder contains no lead.
(Caution:Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleadedsolder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
• IC400 (microcomputer) and IC450 (nor flash sram) on MAIN
board cannot be replaced individually.
Replace it with MAIN board assembly for service.
Microsoft, Windows and Windows Media are trademarks or
registered trademarks of Microsoft Corporation in the United States
and/or other countries.
US and foreign patents licensed from Dolby Laboratories.
All other trademarks and registered trademarks are trademarks or
registered trademarks of their respective holders.
1. GENERAL ·········································································· 3
2. TEST MODE······································································ 5
3. DISASSEMBLY
3-1. Case, Chassis (Front) Assy ··········································· 6
3-2. DISPLAY Board Assy ·················································· 7
3-3. MAIN Board Assy ························································ 7
4. DIAGRAMS
4-1. Block Diagram ······························································ 9
4-2. Printed Wiring Board
– DISPLAY Board (SideA) –····································· 10
4-3. Printed Wiring Board
– DISPLAY Board (Side B) –····································· 11
4-4. Schematic Diagram – DISPLAY Board – ·················· 12
4-5. Printed Wiring Board – MAIN Board (Side A) – ······· 13
4-6. Printed Wiring Board – MAIN Board (Side B) – ······· 14
4-7. Schematic Diagram – MAIN Board (1/2) – ··············· 15
4-8. Schematic Diagram – MAIN Board (2/2) – ··············· 16
5. EXPLODEDVIEWS
5-1. Overall Assy Section··················································· 18
5-2. MAIN Board Section ·················································· 19
6. ELECTRICAL PARTS LIST ······································· 20

3
NW-E50/E70
SECTION 1
GENERAL This section is extracted from
instruction manual.
Locating controls
Rear sideFront side
7Headphone jack
8Nx button
0VOLUME +/– button
qa HOLD (Locking controls) switch
qs USB jack
qd Battery compartment
G
r
o
u
p
M
o
d
e
1
2
3
4
5
6
7
8
9
0
qz
OPEN
qs
qd
1Strap hole for attaching the strap
2REPEAT/SOUND button
3MENU button
You can switch to the Time display by
pressing the MENU button for a while.
4GROUP button
5Display
6ACCESS lamp
9Shuttle switch

4
NW-E50/E70
4As you did in step 3, adjust the settings
for “month” and “date.”
After rotating the Shuttle switch to adjust the
“date” setting and pressing the Nx button
to confirm, the display switches to the time
setting screen.
0:00
5Rotate the Shuttle switch to adjust the
“hour” setting and press the Nx
button to confirm.
The “minute” digit blinks.
0:00
6As you did in step 5, adjust the settings
for “minute.”
After rotating the Shuttle switch to adjust the
“minute” setting and pressing the Nx
button to confirm, the display switches to the
time setting screen.
DA T E- T IME
7Press the MENU button.
The display returns to the normal screen.
Select [RETURN] in the menu screen or press the MENU
button.
Press the MENU button and hold it.
You can display the current time while pressing the
button.
Notes
• If the unit is not used for a long time, your settings of
the date and time may be reset.
• If the current time is not set, the display for the date and
time will be “-- --.”
• If PC CLK is set to “ON”, the time setting of your
Network Walkman is automatically adjusted to a
computer’s built-in clock when your Network Walkman
is connected to the computer.
•Depending on the shipping area, the time display
format of the unit is set to a 12-hour display or a 24-
hour display.
You cannot switch between a 12-hour display and a 24-
hour display in the unit.
A 24-hour display is shown in this manual.
To cancel the menu mode
To display the current time
Adjusting the
current time
setting (DATE-
TIME)
You can set and display the current time.
1Press the MENU button.
The menu screen is displayed.
REPEAT MODE >
2Rotate the Shuttle switch to select
“DATE-TIME” and press the Nx
button to confirm.
The “year” digit blinks.
2004y 1m 1d
3Rotate the Shuttle switch to adjust the
“year” setting and press the Nx
button to confirm.
The “month” digit blinks.
2004y 1m 1d
G
r
o
u
p
M
o
d
e
o
d
e
Shuttle switch Press
(Confirm)
Nx button
MENU button
to (+/>)
to (./–)

5
NW-E50/E70
SECTION 2
TEST MODE
STANDING PROCEDURE
Procedure 1: Set a dry battery into NW-E50/E70, and keep the
battery lid open.
Procedure 2: In HOLD state, while pushing Nx and [GROUP]
button, turn power on by closing the battery lid of
NW-E50/E70.
Procedure 3: Set HOLD state off.
After starting up test mode, the following contents can be checked.
TEST MODE
• Nx button
The KEY test mode is activated. All key inputs are completed,
then Nx button is pressed, restart. (Be aware that the
initialization is included on all key input.)
• [MENU] button
EL0 (blue) lights on/off.
• [GROUP] button
EL1 (green) lights on/off.
• -/>
All LCD lights and ACCESS LED lights off.
• ./+
All LCD lights and ACCESS LED lights on.
• [VOL +] button
BEEP turns on.
• [VOL --] button
BEEP turns off.
• [ REPEAT SOUND] button
Initialized. (Turns to the factory preset state, time, volume
setting and so on.)
The music data, files and so on in the memory are not changed.
•

6
NW-E50/E70 SECTION 3
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
Note : Disassemble the unit in the order as shown below.
SET
3-1. CASE,CHASSIS (FRONT) ASSY
(Page 6)
3-2. DISPLAY BOARD ASSY
(Page 7)
3-3. MAIN BOARD ASSY
(Page 7)
3-1. CASE, CHASSIS (FRONT) ASSY
MAIN board section
1 case
3 chassis (front)
4 three button (cup)
5 window (led)
2 three claws

7
NW-E50/E70
3-2. DISPLAY BOARD ASSY
3-3. MAIN BOARD ASSY
MAIN board sectio
n
4 DISPLAY board
2 tapping screw (1.7)
3 cover section
1 lid (usb) (sub assy)
4 MAIN board
3 chassis(rear)
ornament assy
2 two claws
1 tapping screw (B1.7x7)

8
NW-E50/E70
Note on Schematic Diagram:
•All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise
specified.
•%: indicates tolerance.
•C: panel designation.
•: B+ Line.
•Power voltageis dc 1.5V and fedwithregulateddc power
supply from battery terminal.
•Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : PLAY
•Voltages are takenwithaVOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
•Circled numbers refer to waveforms.
•Signal path.
F: PLAY
a: DIGITAL OUT
k: DIGITAL IN
zWaveforms
Note on PrintedWiring Board
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•: Pattern from the side which enables seeing.
•: Through hole.
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
SECTION 4
DIAGRAMS
1IC700 8(OSCOUT)
1.1 Vp-p
31.25
µ sec 0.5V/div
10
µ sec/div

NW-E50/E70
99
4-1. BLOCK DIAGRAM
VBUS DET
IC506
NOR FLASH SRAM
IC450
NAND FLASH RAM
IC461
CN400
STAND
CONNECTOR
USB
CONNECTOR
VIN
VOUT
2
1
2
3
4
5
5
126
38 - 53 185 197 - 207, 2 - 9 187 184 183 186 182 23 24 26 28 27 30 29
15 - 22
29 - 37, 41 - 4429 - 36, 38 - 45 111 - 8, 16 - 25, 48 13 14 15 26 28 16 17 18 19 8 7 9
128
129
130
102
104
83
160 173
10
13
1
20
11
1518 16
176 60 57 58 76 74 75 73
7432
8910
87 81 106
41
5
3
3
5
2
3
5
2
1
1
5
2
1
5
3
2
14
4
41
172 59
84
133
134
174
7
8
3
9
2
127
+5VDC
DATA -
DATA +
GND
VBUS
VDIOUS
UDM
UDP
TRON
VBUS
D-
+5V
D+
USB GND
AN4
AN6/INT8
S703
VOLUME -
S702 S701
VOLUME +
S707
PF2/INT4
VDD
LDR
CHV
VDD
VDD
VOUT
VOUT
VOUT
VOUT
CE
VDD
VDD
CE
VIN
VOUT
CE
VIN
VOUT
VOUT
CE
VIN
VOUT
CE
VIN
IN1
2.8V
Q460
OUT1
IN2
STB
OUT2
VOUT VDD
PR4 PI2
OUT2 OUT1 OUTCM
OSCOUT XRST XCS SCL SDA OSCIN VDD
ENA2 ENA1
CE
SI
SO
SCLK
+2.8V
L801
D801
+2.8V
+2.3V
PI5 PC3 SCK0 SO0 PE7 AN3 SO1 SI1 SCK1 AN2 AN1 PG1/INT5 PFO/INT3 RST PI1 PC2
PF3
AOUTR
AOUTL
PI3
VCC
XSTBY
FCE0
FRB0
FCLE
FAD0 - 7A1 - 19D0 - 15
FRE
FWP
FWE
FALE
CSI
WE
RE
CS0
LB
UB
CE R/B CLE
I/O1 - 8A1 - 19DQ0 - 15
RE WP WE ALE BES WE OE BEF LBS UBS
EL ELEMENT
LIQUID
CRYSTAL
DISPLAY
CLOCK
OSC
IC700
IC801
EL DRIVER
SYSTEM CONTROLLER
IC400
D703
X700
32kHz
S706
HOLD
.
S708
GROUP
CORE DET
IC502
+1.2V REG.
IC504
CORE SW
IC501
14
VOUT VDD
I/O DET
IC510
+2.8V REG.
IC508
+VIO
+1.4V
+1.2V
+2.8V
+2.3V
+2.8V
+1.2V
+2.8V
+2.8V
IC500
Q503
+1.2V
Q506, 507
Q501
J301
HP AMP
IC301
+2.3V REG.
IC509
D501
• SIGNAL PATH
: PLAY BACK
: DIGITAL OUT
: DIGITAL IN
L500
L501D504
SWITCHING
Q500
SWITCHING
Q505
SWITCHING
REG.
IC507
SWITCHING
REG.
IC503
I/O DET
IC505
RESET
Q502, 504
LED
DRIVER
Q701
D702
ACCESS
103
105
AN5
AN7/INT9
S705
REPEAT SOUND
S704
MENU
+2.3V
DRY
BATTER Y
SIZE "AAA"
(IEC DESIGNATION LR03)
1PC, 1.5V
Nx
>.
/- /+
MEMORY STICK INTERFACE
MAGIC GATE CORE
NAND FLASH INTERFACE
USB INTERFACE
A/D, D/A CONVERTER
SERIAL INTERFACE
LEVEL BATTERY DETECT

NW-E50/E70
1010
4-2. PRINTEDWIRING BOARD – DISPLAY BOARD (SIDE A) – :Uses unleaded solder.
DISPLAY BOARD
(SIDE A)
1
2
23
24
CN402
(11)
11
LIQUID
CRYSTAL
DISPLAY
A
MAIN
BOARD
CN401
(Page 14)
1-862-329-
120
12
A
B
C
D
E
F
34567 8910

NW-E50/E70
1111
Q701
R807
R706
D702
R713
TP804
TP806
R805
R802
R801
R804
R803
C801
C802 D801
L801
TP410
TP401
R710
TP706
SL700
C700
S705
TP701
R704
S704
TP805
TP850
R701
R700
TP851
C702
S701
S708
TP705
TP803 TP802 TP801
TP853
TP852
ACCESS
MENU
>.
/- /+
REPEAT SOUND
GROUP
DISPLAY BOARD
(SIDE B)
IC 801
EL
ELEMENT
(11)
11
1-862-329-
E
BATTERY
(BACK-UP)
(SECONDARY)
12
A
B
C
D
E
F
34567 891011
4-3. PRINTEDWIRING BOARD – DISPLAY BOARD (SIDE B) – :Uses unleaded solder.

NW-E50/E70
1212
4-4. SCHEMATIC DIAGRAM – DISPLAY BOARD –
IC801
D702
R713
R708
R706
SL700
R710
TP706
D703
C850
C851
C852
C853
CN850
TP806
TP853
TP401
TP850
TP851
TP701
TP705
S701
R700
R701
S704
R704
C702
C802
D801
L801
R801
R805
R802
R803
R804
C801
TP804
TP852
TP410
S708
S705
C522
TP805
Q701
CN402
R850
R851
R852
C700
SM8145AB-G-EL
SML-512DWT86
100
47k
100k
BATTERY
(BACK-UP)
(SECONDARY)
1k
VDD_RTC
RB520S-30TE61
0.47
0.47
0.1
0.1
20P
VDD
LCDDA
EL1
LCDRST
LCDCS
ADK2
GROUP
47k
22k
22k
100p
4700p
1SS376TE-17
100k
150k
33k
47k
33k
0.01
VDD_EL
LCDCK
EL2
1
GND
2SC5658T2L
24P
100k
100k
150k

NW-E50/E70
1313
C419 C301
R300
R303
FB100
C415
R719
C705
C704
*CSP
(Chip Size Package)
*CSP
(Chip Size Package)
MAIN BOARD
(SIDE A)
(11)
11
1-862-328-
12
A
B
C
D
E
F
G
34567 891011
* IC450
* IC400
IC461
IC301
C402
4-5. PRINTEDWIRING BOARD – MAIN (SIDE A) – :Uses unleaded solder. ✩IC400 (microcomputer) and IC450 (nor flash sram) on MAIN
board cannot be replaced individually.
Replace it with MAIN board assembly for service.
•Semiconductor
Location
Ref. No. Location
D300 C-8
IC301 D-9
IC400 C-4
IC450 E-2
IC461 D-7

NW-E50/E70
1414
R516
R528 R829 R525
R530
C512
C518
R519 C511
R527
DRY
BATTERY
SIZE "AAA"
(IEC DESIGNATION LR03)
1PC, 1.5V
MAIN BOARD
(SIDE B)
L
R
COM
J301
CN401
1
224
23
A
DISPLAY
BOARD
CN402
(Page 10)
CN400
HOLD.
VOLUME
-
VOLUME
+
Nx
IC508
IC503
IC505
IC509
IC502
IC507
IC700
IC506
IC504
IC501
IC500
5
1
1
34
5
1
1
1
3
3
3
2
4
4
4
5
5
1
1
1
3
3
3
4
4
4
5
5
5
SE
E
E
E
S
E
S
OFF ON
1
3
2
4
IC510
1
3
2
4
1
1
3
3
2
2
4
4
R534
12
A
B
C
D
E
F
G
34567 891011
4-6. PRINTEDWIRING BOARD – MAIN (SIDE B) – :Uses unleaded solder.
•Semiconductor Location
Ref. No. Location
D501 B-8
D502 C-10
D503 D-10
D504 C-8
IC500 E-10
IC501 B-5
IC502 B-5
IC503 C-8
IC504 B-6
IC505 D-5
IC506 C-11
IC507 E-9
IC508 D-6
Ref. No. Location
IC509 B-4
IC510 D-3
IC700 E-7
Q460 D-4
Q500 C-8
Q501 D-9
Q502 C-5
Q503 D-10
Q504 B-5
Q505 E-8
Q506 D-5
Q507 C-5

NW-E50/E70
1515
4-7. SCHEMATIC DIAGRAM – MAIN BOARD (1/2) – ✩IC400 (microcomputer) on MAIN board cannot be replaced
individually.
Replace it with MAIN board assembly for service.
C404
C405
C400
R720
R422
TP407
C418
TP402
TP403
TP404
TP405
VDR401
TP408
TP411 R420
TP416
TP417
TP415
TP418
VDR402
C421
C419
TP409
C414
C415
C417
R412
X401
R411
R409
C411
C408
R408
R407
R406
R405
R403
C406
C407
R402
C403
C402
VDR404
VDR403
R719 C709
R705
Q460
R724
VDR701
R718
R717
R711
R703
S702
R702
TP700
R721 TP704 VDR700
R725
R723
R709 TP702
C701TP412
R416
C704
C705
C706
R400
VDR400
C401
TP406
R401
R722
TP701
C707
X700
IC700
R461
C462
VDR405
R716
R715
R463
R726
R727
R729
S706
C703
R410
R453
C464
R462
S707
S703
R714
C416
R404
R728
CN401
X400
R421
C409
C410
0.1
0.1
0.1
0
10k
PD4
0.1
TXD0
TXD0
TXD0
TXD0
MSINS
MSDIS 10k
MSSCLK
MSBS
MSPWR
XMS
0.1
0.1
XBOOT
0.1
10p
0.1
220
16MHz
1M
22
1
1
1.5k
22
22
0
2.2M
1000p
0.1
10k
4.7
10V
4.7
10V
10k 0.1
470k
NDS356AP
10k
22k
10k
10k
1k
10k
ADK1
10k XHOLD
470k
470k
10k XPLAY
0.01
DEBUG
100k
0.01
0.01
0.01
1M
1000p
RST
10k
470k
VDDRTC
0.1
32.768KHz
RS5C348A-E2-FB
100k
0.1
10k
10k
100k
0
0
0
1000p
100
470k
1
1k
22k
10p
470k
0
24P
22MHz
100k
0.1
4.7
6.3V

NW-E50/E70
1616
4-8. SCHEMATIC DIAGRAM – MAIN BOARD (2/2) –
IC301
C104
R103
R102
R203
C204
C103
C305 C303 R101 C102
C100
R200
C200
C202
R201
R302
C301
R300
C203
TP208
TP108
R533
TP509
C520
TP414
TP314
TP503
R531
R532
D504
TP506
C518
R530
R528
R526
R523
Q506
C511
R527
R529
TP505
C516
C512
R519
R510
Q502
R502 C503
R507
R522
R501
R505
R514
TP508
Q501
IC500
D503
D502
C513
C515
R513
R508
R500
D501
R518
R516
R511
R506
R509
R504
TP502
C506
C505
R512
R521R515
R520
C508
C501
TP501
TP500
TP507
J301
C304
C101
C201
C300
D300
C302
IC509
C521
VDR502
IC508
IC504
L501
IC507
Q505
C517
Q507
C519
Q504
C509
C502
0.1
VDR504
IC503
Q503
C504
L500
VDR501
VDR503
C500
VDR500
R450
C450
R451
R452
R202
TP504
R303
IC506
R524
IC501
Q500
IC505
R517
IC502
FB200
FB100
FB300
R100
FB302
R503
R525
C510
CN400
NJM2776RB2 (TE2)
0.22
47k
33k
47k
0.22
100p
0.1 0.33 10 0.22
0.022
4.7k
0.022
0.22
10
47k
0.1
0
100p
HP-R
HP-L
0
2.3V
0.1
D-
D+
1.2V
0
0
R534
100
RSX101M-30TR
33p
470k
100k
100k
470k
2SC5658T2L
0.047
470k
1M
REGCE
0.1
0.01
1M
470k
2SC5658T2L
1M 0.022
470k
47K
100k
2.2M
470k
VCORE
3LN01S-K-TL-E
S-80809CNBB-B9N-TF
1SS400TE-61
1SS400TE-61
0.1
10
47k
220k
470k
RSX101M-30TR
1M
470k
220k
330k
2.2M
2.2M
NM
1
0.1
100k
470k220k
22k
0.1
1
BATT+
BATT-
2.8V
10
10V
220
2.5V
220
2.5V
10
10V
MAZS120008SO
22
4V
XC62HR2301MR
4.7
6.3V
XC62HR2802MR
R1160N121B-TR-FA
XC9105D091MR
XP151A13A0MR
47
10V
2SA2029T2L
100
6.3V
2SA2029T2L
10
6.3V
XC9105D091MR
XP4601
47
10V
47
10V
0
0.1
100k
100k
33k
VBUS
0
XC62HR3302MR
1M
S-80810CNBB-B9O-TF
XP151A12A2MR
S-80824CNBB-B8J-TF
IC510
S-80824CNBB-B8J-TF
100k
S-80810CNBB-B9O-TF
4.7k
1M
1M
47p
5P
✩IC450 (nor flash sram) on MAIN board cannot be replaced
individually.
Replace it with MAIN board assembly for service.

17
NW-E50/E70
• IC BLOCK DIAGRAMS
IC301 NJM2776RB2 (TE2) (MAIN board)
1
2
3
4
5
10
9
6
7
V+2O
OUT1
IN1
STANDBY
V+1VREF
OUT2
GND
STANDBY
8IN2
BIAS
REG
IC700 RS5C348A-E2-FB (MAIN board)
VDD
VDD
OSCIN
OSCOUT
CE
INTR
32KOUT
SCLK
SO
SI
VSS
32 kHz
OUTPUT
CONTROL COMPARATOR
W
COMPARATOR
D
ADDRESS
REGISTER
I/O
CONTROL
ADDRESS
DECODER
SHIFT
REGISTER
INTERRUPT
CONTROL
OSC
DETECT
VOLTAGE
DETECT
ALARM W REGISTER
(WEEK, MIN, HOUR)
ALARM D REGISTER
(MIN, HOUR)
DIV OSC
DIVIDER
CORRECTION
9
10
8
7
6
2
3
4
5
1
TIMER COUNTER
SEC, MIN, HOUR, WEEK,
DAY, MONTH, YEAR
LDR
NC
NC
OCL1 OCL2
NC
OCL3
OCE
ENA2 ENA1
NC VDD NC OUT2 OUT1 NC NC CHV OUTCOM
VSS
20 19 18 17 16 15 14 13 12 11
12345678910
OSCILLATOR OSCILLATOR
DIVIDER
DIVIDER
CONTROL
LOGIC
HIGH VOLTAGE SWITCHING
CIRCUIT
IC801 SM8145AB-G-EL (DISPLAY board)

SECTION 5
EXPLODEDVIEWS
NOTE:
•-XX, -X mean standardized parts, so they may have
some differences from the original one.
•Items marked “*” are not stocked since they are
seldom required for routine service. Some delay
should be anticipated when ordering these items.
•The mechanical parts with no reference number in
the exploded views are not supplied.
•Color Indication of Appearance Parts
Example:
KNOB, BALANCE (WHITE) . . . (RED)
↑↑
Parts Color Cabinet's Color
18
NW-E50/E70
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
5-1. OVERALL ASSY SECTION
1
2
4
6
7
10 11
9
8
3
not supplied
MAIN board section
5
13-266-585-01 CASE
23-266-593-01 CHASSIS (FRONT)(SILVER, WHITE)(E50)
23-266-593-11 CHASSIS (FRONT)(BLUE)(E50)
23-266-593-21 CHASSIS (FRONT)(RED)(E50)
23-266-593-31 CHASSIS (FRONT)(HAIR LINE, SILVER)(E70)
23-266-593-41 CHASSIS (FRONT)(BLUE)(E70)
23-266-593-51 CHASSIS (FRONT)(WHITE)(E70)
33-266-591-01 BUTTON (CAP)
43-266-592-01 WINDOW (LED)
53-267-336-01 SHEET (BUTTON), ADHESIVE
6X-2021-525-1 LID (USB)(SUB ASSY)
74-984-017-11 SCREW (1.7), TAPPING
83-266-597-01 COVER (USB)
9X-3385-162-1 TERMINAL (+) SUB ASSY, BATTERY
10 3-266-599-01 LID, BATTERY CASE
11 3-247-180-01 SCREW (1.4X3)
Ver 1.3

19
NW-E50/E70
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
5-2. MAIN BOARD SECTION
51
54 55
53
56
57
58
62
63 64 67
65 66
68
52
69
60
61
59
51 3-318-203-81 SCREW (B1.7X7), TAPPING
52 3-266-604-01 ORNAMENT
53 3-266-584-01 BUTTON (PLAY)
54 3-266-608-01 SHEET (COVER), ADHESIVE
55 3-266-586-01 COVER (PLAY)
56 3-266-581-01 KNOB (HOLD)
57 2-023-871-01 SHEET (VOL), ADHESIVE
58 3-266-582-01 BUTTON (VOL)
59 3-266-595-01 SHEET (VOL)
60 2-048-634-01 SHEET (FRONT), ADHESIVE
61 3-266-594-01 CHASSIS (REAR)(SILVER:E50, WHITE)
61 3-266-594-11 CHASSIS (REAR)(BLUE)
61 3-266-594-21 CHASSIS (REAR)(RED)
61 3-266-594-31 CHASSIS (REAR)(SILVER:E70, HAIR LINE)
62 X-2021-522-1 MAIN BOARD, COMPLETE (E50)
62 X-2021-523-1 MAIN BOARD, COMPLETE (E70)
63 3-266-606-01 SHAFT (PLAY)
64 3-266-610-01 KNOB (SHUTTLE)
65 3-266-588-01 INNER (SHUTTLE)
66 3-266-583-01 ARM (SHUTTLE)
67 3-266-605-01 SPRING (SHUTTLE)
68 A-4547-617-A DISPLAY BOARD, COMPLETE
69 2-048-635-01 SHEET (REAR), ADHESIVE
Ver 1.3

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
20
SECTION 6
ELECTRICAL PARTS LIST
NW-E50/E70
NOTE:
•Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.
•-XX, -X mean standardized parts, so they
may have some difference from the original
one.
•RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
•Items marked “*” are not stocked since they
are seldom required for routine service. Some
delay should be anticipated when ordering these
items.
•SEMICONDUCTORS
In each case, u: µ, for example:
uA...: µA... , uPA... , µPA... ,
uPB... , µPB... , uPC... , µPC... ,
uPD..., µPD...
•CAPACITORS:
uF: µF
•COILS
uH: µH
•Abbreviation
HK : Hong Kong model
KR : Korea model
TW : Taiwan model
CH : Chinese model
When indicating parts by reference number,
please include the board name.
A-4547-617-A DISPLAY BOARD, COMPLETE
************************
1-805-081-12 ELEMENT, EL
1-805-082-11 DISPLAY PANEL, LIQUID CRYSTAL
2-024-570-01 SPACER (JACK)
2-024-571-01 SPACER (BUTTON)
3-247-203-02 HOLDER, LCD
3-252-983-01 CUSHION (EL)
< CAPACITOR >
C522 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C700 1-756-305-11 BATTERY, PAS SECONDARY
C702 1-164-874-11 CERAMIC CHIP 100PF 5% 50V
C801 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16V
C802 1-100-437-91 CERAMIC CHIP 4700PF 5% 100V
C850 1-125-891-11 CERAMIC CHIP 0.47uF 10% 10V
C851 1-125-891-11 CERAMIC CHIP 0.47uF 10% 10V
C852 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C853 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
< CONNECTOR >
CN402 1-818-409-21 CONNECTOR, BOARD TO BOARD 24P
CN850 1-818-411-21 CONNECTOR, FFC/FPC LIF 20P
< DIODE >
D702 6-500-653-01 DIODE SML-512DWT86 (ACCESS)
D703 8-719-069-29 DIODE RB520S-30TE61
D801 8-719-052-12 DIODE 1SS376TE-17
< IC >
IC801 6-703-296-01 IC SM8145AB-G-EL
< COIL >
L801 1-414-406-41 INDUCTOR 220uH
< TRANSISTOR >
Q701 8-729-056-42 TRANSISTOR 2SC5658T2L
< RESISTOR >
R460 1-218-977-11 RES-CHIP 100K 5% 1/16W
R700 1-218-973-11 RES-CHIP 47K 5% 1/16W
R701 1-218-969-11 RES-CHIP 22K 5% 1/16W
R704 1-218-969-11 RES-CHIP 22K 5% 1/16W
R706 1-218-977-11 RES-CHIP 100K 5% 1/16W
R708 1-218-973-11 RES-CHIP 47K 5% 1/16W
R710 1-218-953-11 RES-CHIP 1K 5% 1/16W
R713 1-218-941-81 RES-CHIP 100 5% 1/16W
R801 1-218-977-11 RES-CHIP 100K 5% 1/16W
R802 1-218-971-11 RES-CHIP 33K 5% 1/16W
R803 1-218-973-11 RES-CHIP 47K 5% 1/16W
R804 1-218-971-11 RES-CHIP 33K 5% 1/16W
R805 1-218-979-11 RES-CHIP 150K 5% 1/16W
R850 1-218-977-11 RES-CHIP 100K 5% 1/16W
R851 1-218-977-11 RES-CHIP 100K 5% 1/16W
R852 1-218-979-11 RES-CHIP 150K 5% 1/16W
< SWITCH >
S701 1-786-740-21 SWITCH, PUSH (1 KEY) (./- +/>)
S704 1-786-453-21 SWITCH, TACTILE (MENU)
S705 1-786-453-21 SWITCH, TACTILE (• REPEAT SOUND)
S708 1-786-453-21 SWITCH, TACTILE (GROUP)
************************************************************
X-2021-522-1 MAIN BOARD, COMPLETE (E50)
X-2021-523-1 MAIN BOARD, COMPLETE (E70)
*********************
2-024-569-01 SPACER (USB)
3-266-603-01 SPRING (BATTERY TERMINAL)
3-266-685-01 TERMINAL (-), BATTERY
< CAPACITOR >
C100 1-107-819-11 CERAMIC CHIP 0.022uF 10% 16V
C101 1-135-868-91 TANTAL. CHIP 220uF 20% 2.5V
C102 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C103 1-164-874-11 CERAMIC CHIP 100PF 5% 50V
C104 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C200 1-107-819-11 CERAMIC CHIP 0.022uF 10% 16V
C201 1-135-868-91 TANTAL. CHIP 220uF 20% 2.5V
C202 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C203 1-164-874-11 CERAMIC CHIP 100PF 5% 50V
C204 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C300 1-104-851-11 TANTAL. CHIP 10uF 20% 10V
C301 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C302 1-127-895-91 TANTAL. CHIP 22uF 20% 4V
C303 1-128-934-91 CERAMIC CHIP 0.33uF 20% 10V
C304 1-104-851-11 TANTAL. CHIP 10uF 20% 10V
C305 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C400 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C401 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C402 1-131-860-91 TANTAL. CHIP 4.7uF 20% 10V
C403 1-131-860-91 TANTAL. CHIP 4.7uF 20% 10V
DISPLAY MAIN
Ver 1.2