Sony Voice File ICD-55 User manual

MICROFILM
SERVICE MANUAL
IC RECORDER
US Model
Canadian Model
AEP Model
E Model
Tourist Model
ICD-55
SPECIFICATIONS
Ver 1.1 1999. 01

– 2 –
TABLE OF CONTENTS
1. SERVICING NOTES............................................... 2
2. GENERAL ................................................................... 3
3. DISASSEMBLY ......................................................... 4
4. DIAGRAMS
4-1. Block Diagram ................................................................ 7
4-2. Printed Wiring Board ...................................................... 9
4-3. Schematic Diagram ......................................................... 11
4-4. IC Pin Function Description ........................................... 17
5. EXPLODED VIEW................................................... 19
6. ELECTRICAL PARTS LIST ............................... 20
CAUTION ON REPLACING FLASH MEMORY
The BAD-BLOCK check* must be executed, when the flash
memory in this set was replaced.
The set will not operation normally, unless this check is finished.
* The BAD-BLOCK check detects an area (bad-block) in the flash
memory where data validity cannot be guaranteed, and saves this
information in the TOC-AREA so that a bad-block is not used.
BAD-BLOCK check Procedure:
1. Apply 1.5V from regulated power supply to the battery termi-
nals.
2. Once the power is supplied, the check starts and then proceeds
for approx. 20 seconds. (Be sure to keep applying the power
during the check)
3. When the check completes, the result is shown as bellows.
OK:Only the LCD back light LED (D503) turns on.
NG:Red LED blinks or turns on or green LED turns on in the
OPR LED (D504).
4. In case of OK, press the [STOP] button.
Note:
• In case of NG, check system control IC (IC701), flash memory IC and
the peripheral circuit. (Particularly, check carefully the soldering of the
flash memory)
• After finishing the BAD-BLOCK check, assemble the set, load the dry
battery, and confirm if the set operates normally.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board. (within 3 times)
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SECTION 1
SERVICING NOTES

– 3 –
SECTION 2
GENERAL This section is extracted from
instruction manual.

– 4 –
LID, BATTERY CASE
CASE (FRONT)/(REAR) SECTION
Note: Follow the disassembly procedure in the numerical order given.
SECTION 3
DISASSEMBLY
3 lid, battery case
2 boss
2 boss
1
2 claw
2 three claws
2 three claws
4 case (front) section
3 Remove the two solders
speaker lead (SP101).
1 screw (1.7 × 4.5)
5 case (rear) section

– 5 –
MAIN BOARD
INSTALLATION “MAIN BOARD”, “MICROPHONE, ELECTRIC CONDENSER”(MIC101)
1 two screws
(M1.7
× 4)
2 bracket
(jack)
3 Remove the MAIN board to
direction of the arrow.
knob (MODE)
knob (HOLD)
S711 S712
microphone, electric condenser
(MIC101)
On installation MAIN board adjust the S711, S712
and knob (HOLD, MODE).
two leads
microphone,
electric condense
r
(MIC101)
Install two leads the electric condenser microphone
(MIC101) in the figure.

ICD-55
– 7 – – 8 –
SECTION 4
DIAGRAMS
4-1. BLOCK DIAGRAM
ADPCM
IC101 (1/2)
MIC
MIC101
ADPCM
IC101 (2/2)
05
•SIGNAL PATH
: PLAY
: REC
J101
SP101
(SPEAKER)
TONE CONTROL
SWITCH
Q150
3.3V
(ADPCM (IC101) B+)
3.5V
(LED B+)
1.5V
(POWER AMP (IC102) B+)
XSPOWER
XHOLD
TP701
(TEST)
S701 – S705 S706 – S710
D504
D503
(LCD BACK LIGHT)
GRN
OPR
(PLAY)
(REC)
RED
IC706
REAL TIME CLOCK
IC703
X701
32.768kHz OSCIN
OSCOUT
32KOUT
DSPIS DSPIR IR VFRO
IS
MIC AMP
IC103 (1/2)
MIC SENSE
SWITCH
Q103
AGC CIRCUIT
D101, 102,
Q104
DIVIDER
IC104
LINE MUTING
Q105
POWER AMP
IC102, Q108, 109
EAR
GATE SWITCH
IC705
BUFFER
IC103 (2/2)
L.P.F. A/D
CONVERTER
DECIMATION
FILTER L.P.F. L.P.F.
D/A
CONVERTER
RV101
VOL
INTER-
POLATOR
B.P.F. COMPRESSOR EXPANDER
ADPCM
ENCODER
ADPCM
DECODER
AIN2
PCMSO
PCMSI
LEDPB
LEDREC
69
XRESET 84
AMPPO 68
4
67
66
8
1
9
X702
5MHz
X2
X1
80
MSKCLK
18
XBCK
74
SYNCOUT
15
SYNCIN
85
SYNCMSK
16
MICSEL
6
79
MCK RSYNC
22 29
XSYNC BCLK
30 31
DIN
EXCK
19 20
DEN 21
14
26 25 872
XPDRST
71
XDSPDEN
65
RTCDO
76
RTCCLK
77
RTCDI
75
RTCCE
70
RTCINT
SI
SCLK
SO
CE
INTR 87
XT1
82
4
2
3
7
6
73
LMUTE 5
LPMODE 89
BEEP 21
28 27
PCMRO
PCMRI
24 23
6
FLASH MEMORY
IC702
FMIO0 – FMIO7
S0 – S29
I/O0 – I/O7
14
2
11
3
10
4
17
42
20
XFMSE
40
19
5
7
43
WE
RE
WP
CE
13
41
R/B
XFMCE
XFMWP
XFMRE
XFMWE
91 – 98
18 – 21, 24 – 27
32 – 61
COM0 – COM3
23 – 26
XFMBSY
LED DRIVE
Q506 (1/2)
LED DRIVE
Q506 (2/2)
WAKE UP CONTROL
SWITCH
Q701 – 703
LIGHT 22
KEY0
1
LED DRIVE
Q505
KEY1
2
WAKEUP
86
TEST
64
ND701
LIQUID CRYSTAL
DISPLAY
OFF
HOLD
S711
CHOLD
SPDSW
3
FAST
NORMAL
SLOW
S712
PLAY SPEED
DRY BATTERY
SIZE “AAA”
(IEC DESIGNATION R03)
1P. 1.5V
VOLTAGE
DETECT
IC504
POWER
SWITCHING
Q508
OSC
Q502
DC/DC
CONVERTER
IC502
+3.3V
REGULATOR
IC503
B+ SWITCH
Q106, 107
BATT BATT B+
BATT B+
100
DC/DC
CONVERTER
IC501
DC/DC CONVERTER
CONTROL
Q507
RESET SIGNAL
GENERATOR
IC505
3.3V
SYSTEM CONTROLLER (IC701), FLASH
MEMORY (IC702), REAL TIME CLOCK (IC703) B+
+
SYSTEM CONTROLLER
IC701
CLE
ALE
SE
XFMCLE
XFMALE
PDN

– 9 – – 10 –
ICD-55
4-2. PRINTED WIRING BOARD
• Semiconductor
Location
Ref. No. Location
D101 B-9
D102 B-8
D501 E-2
D502 E-3
D503 A-8
D504 C-4
D701 E-4
IC101 B-3
IC102 F-3
IC103 C-9
IC104 B-4
IC501 E-2
IC502 E-2
IC503 D-2
IC504 D-3
IC505 F-3
IC701 D-8
IC702 F-8
IC703 E-4
IC705 E-9
IC706 D-9
Q103 B-3
Q104 B-8
Q105 B-4
Q106 F-2
Q107 F-9
Q108 F-3
Q109 G-3
Q150 F-2
Q502 D-2
Q505 B-3
Q506 D-4
Q507 D-3
Q508 E-8
Q701 F-2
Q702 F-2
Q703 F-2
Note on Printed Wiring Board:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•®: Through hole.
•¢: internal component.
•b: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seenfrom
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
•This board is multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in the diagram.

ICD-55
– 11 – – 12 – – 13 –
4-3. SCHEMATIC DIAGRAM • See page 14 forWaveforms. •See page 15 for IC Block Diagrams.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
• % : indicates tolerance.
•¢: internal component.
•C: panel designation.
•U: B+ Line.
• Powervoltageisdc 1.5V and fed with regulated dc power
supply from battery terminal.
no mark : PLAY
( ) : REC
< > : STOP
∗: Impossible to measure
• Voltagesare takenwithaVOM(Inputimpedance10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: PLAY
L: REC

– 14 – – 15 – – 16 –
• Waveforms
– MAIN Board –
1IC101 @™ MCK, IC104 4CLK OUT
(REC/PB mode) 1 V/DIV, 50 ns/DIV
• IC Block Diagrams
IC101 MSM7590L-01TS-K
2IC101 @ª RSYNC, #º XSYNC
(REC/PB mode) 1 V/DIV, 50 µs/DIV
3IC705 1
1 V/DIV, 50 µs/DIV
4IC705 2
1 V/DIV, 50 µs/DIV
5IC705 5
1 V/DIV, 50 µs/DIV
6IC701 &ª X2 (REC/PB mode)
1 V/DIV, 50 ns/DIV
7IC701 *™ XT1 (REC/PB mode)
1 V/DIV, 10 µs/DIV
8IC703 132KOUT (REC/PB mode)
1 V/DIV, 10 µs/DIV
9IC703 6INTR (REC/PB mode)
1 V/DIV, 100 ms/DIV
0IC703 8OSCOUT (REC/PB mode)
200 mV/DIV, 10 µs/DIV
!¡ IC502 4LX (REC/PB mode)
1 V/DIV, 5 µs/DIV
!™ Q502 Base (REC/PB mode)
200 mV/DIV, 5 µs/DIV
!£ Q502 Collector (REC/PB mode)
1 V/DIV, 5 µs/DIV
!¢ IC501 4LX (REC/PB mode)
1 V/DIV, 5 µs/DIV
3.5 Vp-p
95 ns
3.4 Vp-p
123.5
µ s
3.3 Vp-p
123.5
µ s
3.4 Vp-p
123.5
µ s
3.4 Vp-p
123.5
µ s
3.4 Vp-p
200 ns
2.4 Vp-p
30.6 us
2.5 Vp-p
30.6
µ s
4.3 Vp-p
500 ms
1.1 Vp-p
30.5
µ s
3.4 Vp-p
10.4
µ s
712 mVp-p
10.4
µ s
4.1 Vp-p
10.4
µ s
3.9 Vp-p
10.4
µ s
IR
PCMRO
PCMRI
ATT
ATT
PCM
ENCODER
ADPCM
ENCODER
REFERENCE
POWER SUPPLY
ADPCM
DECODER
CLOCK,
TIMING
GENERATOR
P/S
or
S/P
PCM
DECODER
BACK-GROUND
NOISE
GENERATOR
DTMF/
OTHERS TONE
GENERATOR
VOICE
DETECT
AIN1+
AIN1–
GSX1
AIN2
25
24
23
22
21
MCK
CPU
INTERFACE
DEN
20 EXCK
19 DIN
18 DOUT
17 VOXO
PCMSO
PCMSI
IS
28
27
26
BCLK
XSYNC
RSYNC
31
DG
32
30
29
3
SG 2
AG 1
4
5
GSX2 7
VFRO 8
PWI 9
AOUT– 10
AOUT+ 11
6
+
–
+
–
+
–
–1
SAO+ 12 +1
SAO– 13
VOXI 15
VDD 16
PDN/RESET 14
–1
IC102 NJM2076M (TE2)
INVA IN
NON INVB IN
BASE B
BASE A
A OUT
VSS
B OUT
2
VDD 3
1
4
7
6
5
8
POWER
AMP
POWER
AMP
IC104 XC25A08510MR
CLKINVSS VDD
CLKOUT
PHASE
DETECTOR
1/N
COUNTER
L.P.F.
VCO
1/2
BUFFER
21 3
4
CE
5
IC501 XC6372C331PR
IC502 XC6372D351PR
NC
VOUT
CE
VSS
LX
2
1
3
4
5
VLX
LIMITER
PWM/PFM
CONTROL
OSC 100kHz
BUFFER
PHASE
COMPARATOR
REFERENCE
VOLTAGE
CHIP
ENABLE
SLOW
START
+
–
VDD
IC703 RS5C348A-E2
VDD
VDD
OSCIN
OSCOUT
CE
/INTR
32KOUT
SCLK
SO
SI
VSS
32 kHz
OUTPUT
CONTROL COMPARATOR
W
COMPARATOR
D
ADDRESS
REGISTER
I/O
CONTROL
ADDRESS
DECODER
SHIFT
REGISTER
INTERRUPT
CONTROL
OSC
DETECT
VOLTAGE
DETECT
ALARM W REGISTER
(WEEK, MIN, HOUR)
ALARM D REGISTER
(MIN, HOUR)
DIV OSC
DIVIDER
CORRECTION
9
10
8
7
6
2
3
4
5
1
TIMER COUNTER
SEC, MIN, HOUR, WEEK,
DAY, MONTH, YEAR

– 17 –
4-4. IC PIN FUNCTION DESCRIPTION
•MAIN BOARD IC701 µPD78P0308GC (SYSTEM CONTROLLER)
Pin No. Pin Name I/O Function
1 KEY0 I Key input terminal (A/D input) S701 to S705 (STOP, REC START/STOP, PLAY/STOP
(EXECUTE), – =(SELECT), ++ (SELECT) ) keys input
2 KEY1 I Key input terminal (A/D input)
S706 to S710 (FILE, MENU, PRIORITY, ERASE, INDEX) keys input
3 SPDSW I PLAY SPEED select switch (S712) input terminal (A/D input)
“L”: SLOW, “M”: NORMAL, “H”: FAST
4 XHOLD I HOLD switch (S711) input terminal “L”: HOLD ON, “H”: HOLD OFF
5 LMUTE O Line muting control signal output terminal “H”: line muting on
6 MICSEL O Microphone sensitivity select signal output terminal
“L”: mic sensitivity high, “H”: mic sensitivity low
7 XFMCE O Chip enable signal output to the flash memory (IC702) “L” active
8 VDD — Power supply terminal (+3.3V)
9 AVREF I Reference voltage input terminal (for A/D converter)
10 XFMWE O Write enable signal output to the flash memory (IC702) “L” active
11 XFMALE O Address latch enable signal output to the flash memory (IC702) “L” active
12 VSS1 — Ground terminal
13 XFMBSY I Ready/busy detection signal input from the flash memory (IC702) “L” active
14 XFMCLE O Command latch enable signal output to the flash memory (IC702) “L” active
15 SYNCOUT O FS sync signal output to the MSM7590L (IC101)
16 SYNCMSK O X (R) sync control signal output to the MSM7590L (IC101)
17 XFMRE O Read enable signal output to the flash memory (IC702) “L” active
18 MSKCLK I Clock signal input for the X (R) sync output control
19 XFMWP O Write protect signal output to the flash memory (IC702) “L” active
20 XFMSE O Spare space enable signal output to the flash memory (IC702) “L” active
21 BEEP O Beep sound drive signal output terminal (2.4 kHz)
22 LIGHT O LED drive signal output of the LCD back light LED (D503) “H”: LED on (back light on)
23 to 26 COM0 to COM3 O Common drive signal output to the liquid crystal display (ND701)
27 BIAS O Power supply output terminal for the liquid crystal display
28 to 30 VLC0 to VLC2 I Power supply input terminal for the liquid crystal display
31 VSS0 — Ground terminal
32 to 61 S0 to S29 O Segment drive signal output to the liquid crystal display (ND701)
62 — O Not used (open)
63 XSERV I Setting terminal for the service mode Not used (open)
64 TEST I Setting terminal for the test mode “L”: test mode (Normally: fixed at “H”)
65 XDSPDEN O DSP control interface enable signal output to the MSM7590L (IC101)
66 LEDREC O LED drive signal output of the REC indicator (D504 red) “H”: LED on (rec mode)
67 LEDPLY O LED drive signal output of the PLAY indicator (D504 green) “H”: LED on (play mode)
68 AMPPO O Power on/off control signal output to the power amplifier (IC102)
“H”: power on (play mode)
69 XSPOWER O Power on/off control signal output for the MSM7590L (IC101) and LED power supply
“L”: power on
70 RTCCE O Chip enable signal output to the RS5C348A (IC703) “H” active
71 XPDRST O Reset signal and power down detection signal output to the MSM7590L (IC101)
“L”: reset or power down
72 DSPIS I Recording serial data input from the MSM7590L (IC101)
73 DSPIR O Playback serial data output to the MSM7590L (IC101)