Stollmann BlueMod+C11/G2 Series Application guide

BlueMod+C11/G2
Hardware Reference
Release r05

BlueMod+C11/G2
Hardware Reference
Release r05 www.stollmann.de Page 2 of 44
Note
This device was developed for the purpose of communication in an office environ-
ment. It is intended solely for our industrial clients for physical integration into their
own technical products after careful examination by experienced technical personnel
for its suitability for the intended purpose. The device was not developed for or in-
tended for use in any specific customer application. The firmware of the device may
have to be adapted to the specific intended modalities of use or even replaced by
other firmware in order to ensure flawless function in the respective areas of applica-
tion. Performance data (range, power requirements, etc.) may depend on the oper-
ating environment, the area of application, the configuration, and method of control,
as well as on other conditions of use; these may deviate from the technical specifi-
cations, the Design Guide specifications, or other product documentation. The ac-
tual performance characteristics can be determined only by measurements subse-
quent to integration. Variations in the performance data of mass-produced devices
may occur due to individual differences between such devices. Device samples
were tested in a reference environment for compliance with the legal requirements
applicable to the reference environment. No representation is made regarding the
compliance with legal, regulatory, or other requirements in other environments. No
representation can be made and no warranty can be assumed regarding the suit-
ability of the device for a specific purpose as defined by our customers. Stollmann
reserves the right to make changes to the hardware or firmware or to the specifica-
tions without prior notice or to replace the device with a successor model. Of course,
any changes to the hardware or firmware of any devices for which we have entered
into a supply agreement with our customers will be made only if, and only to the
extent that, such changes can reasonably be expected to be acceptable to our cus-
tomers. No general commitment will be made regarding periods of availability; these
must be subject to individual agreement. All agreements are subject to our Terms
and Conditions for Deliveries and Payments, a copy of which is available from
Stollmann.
Copyright © 2005-2009 Stollmann E+V GmbH
Trademarks
The Bluetooth
®
word mark and logos are owned by the Bluetooth SIG, Inc. and any
use of such marks by Stollmann E+V GmbH is under license. Other trademarks and
trade names are those of their respective owners.

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Table of contents
1 Introduction........................................................................................................6
1.1 Feature Summary.........................................................................................6
1.2 Applications ..................................................................................................7
2 Block Diagram ...................................................................................................8
3 Application Interface..........................................................................................9
3.1 Power Supply................................................................................................9
3.2 Power-up slew-rate.....................................................................................10
3.3 Power-On-Reset.........................................................................................10
3.4 Serial Interface............................................................................................11
3.4.1 RS-485 Support..................................................................................11
3.5 GPIO Interface............................................................................................13
3.6 Alternate GPIO/IO Functions ......................................................................13
3.6.1 Master/Slave SPI Interface..................................................................13
3.6.2 Synchronous Serial Interface..............................................................14
3.6.3 Multi Channel PWM Controller............................................................14
3.6.4 PCM interface.....................................................................................15
3.6.5 Analog to Digital Converter .................................................................15
3.7 Bluetooth radio Interface.............................................................................16
3.8 Etc..............................................................................................................16
4 Pin Description.................................................................................................17
4.1 Pin Numbering............................................................................................17
4.2 Pin Description............................................................................................18
4.2.1 General Pin Description......................................................................18
4.2.2 Application Specific Pin Description....................................................19
4.2.3 SPP Configuration ..............................................................................19
5 Electrical Characteristics..................................................................................20
5.1 Absolute Maximum Ratings ........................................................................20
5.2 Environmental Requirements......................................................................20
5.3 Operating Conditions..................................................................................21
5.3.1 RF and Supply Connections................................................................21

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5.3.2 GPIO, JTAG; Serial IF and Test Pins..................................................22
5.3.3 USB Pins ............................................................................................22
5.4 Power consumption and power down modes..............................................22
5.4.1 SPP configuration...............................................................................23
5.4.1.1 Deep Sleep state..........................................................................23
5.4.1.2 Power down state.........................................................................23
5.4.1.3 Idle state.......................................................................................23
5.4.1.4 Power Consumption.....................................................................23
5.5 RF performance..........................................................................................25
5.5.1 Antenna-Gain and Radiation-Pattern ..................................................27
5.6 Power-up Time ...........................................................................................30
5.7 Wake-up Time ............................................................................................30
6 Mechanical Characteristics..............................................................................31
6.1 Dimensions.................................................................................................31
6.2 Connectors .................................................................................................31
6.3 Recommended Land Pattern......................................................................32
6.4 Soldering Temperature-Time Profile (for lead-free re-flow soldering)..........33
6.5 Housing Guidelines.....................................................................................34
6.6 Antenna Issues...........................................................................................35
6.7 Safety Guidelines........................................................................................37
7 Approvals/Certifications...................................................................................38
7.1 Declaration of conformity ............................................................................38
7.2 FCC Compliance and FCC Statement........................................................39
7.2.1 Caution ...............................................................................................39
7.2.2 FCC Warning......................................................................................39
7.2.3 RF-exposure Statement......................................................................39
7.2.4 Labelling and re-test requirements for the End Product.......................40
7.3 Bluetooth Qualification................................................................................40
7.4 RoHS Declaration.......................................................................................41
8 Related Documents .........................................................................................42
9 Ordering Information........................................................................................42

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10 History.............................................................................................................43

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1 Introduction
This Hardware Reference Guide documents how BlueMod+C11/G2 can be inte-
grated into customer systems.
It addresses developers of hardware environments for BlueMod+C11/G2.
For detailed information about software interfaces refer to the software reference
manual.
The BlueMod+C11/G2 is available with EDR functionality disabled and enabled. For
the product with EDR disabled all information given in the following chapters regard-
ing EDR performance and functionality is not valid. Information regarding EDR per-
formance and functionality applies only to the BlueMod+C11/G2 with EDR function-
ality enabled.
For the latest version of this document please check the following URL:
http://www.stollmann.de/en/modules/bluetooth-products/bluemod-c11g2/
1.1 Feature Summary
• Bluetooth specification V2.0+EDR
• EDR compliant with V2.0.E.2 of specification for 2Mbps and 3Mbps modulation
modes
• Full Speed Bluetooth Operation with Full Piconet Support
• Scatternet Support
• Complete Co-location and Co-existence with 802.11 (AWMA, AFH and SFH)
• Fast Connection Setup
• RF output power class 1 with power control
• Supply Voltage 3.0V to 3.6V
• Internal crystal oscillator (26 MHz BC04 and 14,7456MHz for ARM7)
• Full Bluetooth data rate up to 2178 kbps asymmetric
• Support for very low-power modes (sleep and deep sleep)
• Full 8- to 128-bit encryption
• High sensitivity design ( -87 dBm typ.)
• Extra ARM7TDMI CPU for embedded profiles and/or application software
• Up to 17 GPIO lines
• USB 2.0 Full Speed Device Interface
• Master/Slave SPI
• Synchronous Serial Controller

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• PWM Controller
• PCM Interface
• 10 bit A/D Converter
• Power control
• 5V tolerant I/Os
• -40°C to +85°C industrial operating temperature ran ge
• RoHS Compliant
1.2 Applications
BlueMod+C11/G2 can be used in different applications.
Available applications are
• Bluetooth SPP
• BlueMux Point to Multipoint SPP
• BlueCluster Adhoc Networking
Please refer the software reference and interface specifications for further informa-
tion.

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2 Block Diagram
ARM7
CPU
AT91SAM7S
256k
FLASH
64k
SRAM
Bluetooth
BC04-ROM
+3V3
EXT-RES#
RS-232(TTL)
BlueMod+C11/G2
Class1
PA
HCI
SingleChip
+3V3-PA
GPIO
USB2.0 FS
JTAG
TEST
Fig. 1 Block Diagram

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3 Application Interface
3.1 Power Supply
The BlueMod+C11/G2 has two power supply rails, which always should be kept on
the same voltage level. Although we recommend using two different power rails, it is
as well possible to feed both rail from a single supply.
Pin # Signal Usage
C-13 3V3 Supply for digital and low power RF circuitry,
C-16 3V3-PA Supply for RF Amplifier
C-14 GND Reference Supply
C-15 GND Reference Supply
The pin order is made such that on the customer hardware directly at the pins of
each supply pair pins (C-13/C14) and pins (C-16/C-15) a 10uF X5R ceramic capaci-
tor with for example a 1206 footprint can be placed for decoupling. It is recom-
mended to add further smaller value ceramic capacitors. These values depend on
noise frequencies on the supply rail. The following picture shows a sample layout
with two linear regulators in SOT23-5 housings and various capacitors in SMT
shapes 0402, 0805 and 1206.
Fig. 2 Sample Layout Power Supply

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Each supply rail should be fed with 3,3V, Range 3,0V to 3,6V incl. Noise, low noise
from a linear regulator with fast transient response. Stollmann suggest using two
pcs.
TOREX: XC6204B332MR
regulators, so that the fast current transients of the class1 RF power amplifier do not
interfere with sensitive PLL circuitry of the low power RF circuitry.
For layout guidelines please see sample implementation Stollmann reference design
BlueMod+Eval/C11/G2.
Excessive noise or too slow current transient response on the supply rails may have
an impact on the RF performance.
3.2 Power-up slew-rate
The Power up slew-rate for the BlueMod+C11/G2 must be more then 6V/ms for
proper startup of the AT91SAM7S Controller used on the BlueMod+C11/G2.
Figure 3 shows an example circuit for a power supply. The Output Voltage of the
Regulator is enabled by the Threshold Voltage of a RESET-Circuit, when VCC
Startup ramp reaches a valid Voltage.
Vin
RESET
Enable
Vout
TOREX: XC6204B332MR
VCC 3V3
Vth ~ 2.8 - 3.3V
Figure 3 power supply example circuit
3.3 Power-On-Reset
The BlueMod+C11/G2 is equipped with circuitry for generating Power-On Reset and
to provide under-voltage supervision. An integrated circuit type Maxim DS1818R
provides this functionality.
A reset is generated if the 3.3V supply rail including noise falls below 2,8V to 2,97V.
Via Pin A-1 an external reset can be generated by holding EXT-RES# at ≤0.3V for
≥10ms. A 74LVC14 Schmitt Trigger gate with a 1kR5/10nF low-pass filter at the
input is implemented to avoid false reset pulse recognition due to EMC effects.