Supermicro SSG-5049P-E1CR45L Owner's manual

Information for Lot 9 of ErP (Ecodesign)
This addendum addresses European Union (EU) Ecodesign requirements for servers and storage
products. All data and ratings within this addendum are in reference only to the Supermicro product(s) in
the manual. The below information conforms to requirements laid down in Annex II of the Commission
Regulation 2019/424.
3(1)(a): See Section 1.1 of the system manual for the product type.
3(1)(b): See the title page and preface of the system manual for the trademark and
manufacturer’s address.
3(1)(c): See the title page of the system manual for product model number(s).
3(1)(d): See the serial number on the physical system to determine the year of manufacture.
3(1)(e-j): PSU Efficiency and Power Factor Value (Table) (From 80 Plus report)
PSU Model #:
PWS-1K66P-1R
Watts: 1600
PSU Efficiency
Power Factor
% of Rated Load 10 % 20 % 50 % 100 % 50 %
Single Output (AC-DC)
91.60 %
93.84 %
94.30
%
91.23%
0.99
System (EUT) Efficiency in Idle State Power (Table)
Representative
Configurations
Measured Idle State
Power (W)
Calculated Idle Power
Allowance (W)
High-End Performance
Configuration
453.9
504.07
Typical Configuration
N/A
N/A
Low-End Performance
Configuration
105.4
168.63
System (EUT) Efficiency in Active State Power (Table)
Representative
Configurations
Active State
Efficiency Score
(Effserver)
Minimum Active State
Efficiency
High-End Performance
Configuration
11.8
Typical Configuration
N/A
9
Low-End Performance
Configuration
12.6

3(1)(k): The operating condition class is A2.
Dry bulb temp °C Humidity range, non-condensing
Operati
ng
conditi
Allowab
le
range
Reco
m
mend
Allowable range Recommended
range
Max
dew
point (°
C)
Maximu
m rate
of
change
A1 15- 32 18-27
– 12 °C Dew Point (DP)
and
8 % relative
humidity (RH) to
17 °C DP and 80 % RH
– 9 °C DP to
15 °C DP
and
60 %
17 5/20
A2 10-35 18-27
– 12 °C DP and 8 % RH
to 21 °C DP and 80 %
Same as A1 21 5/20
A3 5-40 18-27
– 12 °C DP and 8 % RH
to 24 °C DP and 85 %
Same as A1 24 5/20
A4 5-45 18-27
– 12 °C DP and 8 % RH
to 24 °C DP and 90 %
Same as A1 24 5/20
3(1)(l): The idle state power at the higher boundary temperature of the operating conditions
class is 535.60 W.
3(1)(m): The active state efficiency and performance is a minimum of 11.8.
3(1)(n): There are two methods by which a user can securely delete data from this system. The
user performing secure data deletion should be an IT professional.
The first is with a Unified Extensible Firmware Interface (UEFI) shell utility. This utility
works on X10/X11/H11/H12/M11 motherboard series with onboard SATA/NVMe devices.
Any user may access and download this utility through following link:
https://www.supermicro.com/about/policies/disclaimer.cfm?url=/wftp/utility/Lot9_Secure
_Data_Deletion_Utility/
Download the shell utility package and extract it to a USB flash drive, then plug the drive
into the server for which secure data deletion is necessary. Then turn the system on.
Navigate to the BIOS setup menu, then place the server system into the UEFI shell
environment. Follow the instructions in the README file to invoke the utility and
complete the deletion.
The second method is through the secure data deletion tool provided by the original
manufacturer of the hard drive. This should be used in a scenario where the shell utility
is not applicable. Each manufacturer should have the tool available on their website. If
needed, please look on the hard drive label for the name of the manufacturer and model
information.
3(1)(o): List of recommended combinations of blade servers with chassis: N/A.
3(1)(p): List of all current SKUs within this product family: SSG-6049P-E1CR45H, SSG-
6049PE1CR45L, SSG-6049P-E1CR45L+.
3(3)(a): There is no use of cobalt in batteries in this product.

The indicative weight range of neodymium in the HDD is 0.0 if manufactured by Western
Digital, and is between 5-25 grams if manufactured by Seagate.
3(3)(b): Please see the disassembly instructions on the next page.

Illustrated System Disassembly Instructions
Please note: All the illustrations in the below disassembly instructions are for demonstration only.
Components shown here may not match exactly with the components in your system.
CAUTION: Always power off the system and unplug the power cord(s) first
before disassembling the system!
1. Data Storage Devices
Type and number of fastenings: One (1) latch and four (4) Phillips screws.
Tools required: Screwdriver with PH2 bit.
Procedure: (Rear trays) Push the release button on the carrier. Swing the handle fully. Grasp the
handle and pull the drive carrier out of its bay. (Top trays) Slide the release button on the drive
carrier to open the handle. Then use the handle to pull the drive carrier up and out of the
chassis.

2. Memory
Type and number of fastenings: Two (2) latches per memory module.
Tools required: None.
Procedure: Press both release tabs on the ends of the memory module to unlock it. Once the
module is loosened, remove it from the memory slot.

3. Processor
Type and number of fastenings: Four (4) T30 Torx screws.
Tools required: Screwdriver with T30 Torx bit.
Procedure: Remove the screws in the sequence of 4, then 3, then 2, then 1, as marked in the
illustration below. After removing the screws, lift the processor heatsink module off the processor
socket. Unsnap corners A and B, then C and D of the latch. Push the latch out from the bottom.

4. Motherboard
Type and number of fastenings: Three (3) thumb screws, 10 Phillips screws, and three (3) fan
housings and airshroud to expose the motherboard. Nine (9) Phillips screws to remove the
motherboard.
Tools required: Screwdriver with PH2 bit.
Procedure: Unscrew the two thumb screws and four Phillips screws (Fig. 1) . Remove the dual
fan housing (Fig. 2) . Remove the three lower fans and the housing. Remove the top cover
airshroud by unscrewing the side thumb screw. Remove the top metal frame plate by unscrewing
the six side screws
(Fig. 3) . The motherboard is now exposed. To remove it, remove the nine
Phillips screws. Lift the motherboard from its base
(Fig. 4) .
Fig. 1
Fig. 2

Fig. 3
Fig. 4

5. Expansion Card
Type and number of fastenings: One (1) Phillips screw and two (2) latches.
Tools required: Screwdriver with PH2 bit.
Procedure: Remove the Phillips screw. Then pull the card out while applying pressure on the
latches as shown by the two arrows below.

6. Power Supply Module
Type and number of fastenings: One (1) latch per module.
Tools required: None.
Procedure: Unplug the power cord from the power supply. Push the release tab on the back of
the power supply module to the side and pull the module straight out.

7. Chassis Cover
Type and number of fastenings: Two (2) thumb screws.
Tools required: None.
Procedure: Unscrew the two thumb screws, then lift away the top cover.

8. Batteries
Type and number of fastenings: One (1) latch.
Tools required: None.
Procedure: Push aside the small clamp that covers the edge of the battery. When the battery is
released, lift it out of the holder.
9. Fans
Type and number of fastenings: Two (2) latches per fan.
Tools required: None.
Procedure: Simultaneously press down on the upper release tab while pushing up the lower
release tab. Pull the fan out of the rear of the chassis using the handle provided.