Lenovo ThinkSystem SR635 V3 User manual

ThinkSystem SR635 V3
User Guide
Machine Type: 7D9G, 7D9H

Note
Before using this inform tion nd the product it supports, be sure to re d nd underst nd the s fety
inform tion nd the s fety instructions, which re v il ble t:
https://pubs.lenovo.com/s fety_document tion/
In ddition, be sure th t you re f mili r with the terms nd conditions of the Lenovo w rr nty for your server,
which c n be found t:
http://d t centersupport.lenovo.com/w rr ntylookup
Second Edition (April 2023)
© Copyright Lenovo 2023
LIMITED AND RESTRICTED RIGHTS NOTICE: If d t or softw re is delivered pursu nt to Gener l Services
Administr tion “GSA” contr ct, use, reproduction, or disclosure is subject to restrictions set forth in Contr ct No. GS-
35F-05925.

Contents
Contents i
Safety v
S fety inspection checklist . . . . . . . . . . . vi
Chapter 1 Introduction 1
Fe tures. . . . . . . . . . . . . . . . . . . 1
Tech Tips . . . . . . . . . . . . . . . . . . 2
Security dvisories . . . . . . . . . . . . . . 3
Specific tions . . . . . . . . . . . . . . . . 3
Technic l specific tions. . . . . . . . . . . 3
Mech nic l specific tions . . . . . . . . . . 8
Environment l specific tions . . . . . . . . . 8
M n gement options. . . . . . . . . . . . . 12
Chapter 2 Server components 17
Front view . . . . . . . . . . . . . . . . . 17
Re r view . . . . . . . . . . . . . . . . . 23
Top view . . . . . . . . . . . . . . . . . 28
Front I/O module . . . . . . . . . . . . . . 30
System-bo rd- ssembly l yout . . . . . . . . 31
System-bo rd- ssembly connectors. . . . . 33
System-bo rd- ssembly switches. . . . . . 34
System LEDs nd di gnostics displ y . . . . . . 36
Chapter 3 Parts list 37
Power cords . . . . . . . . . . . . . . . . 40
Chapter 4 Unboxing and setup 41
Server p ck ge contents . . . . . . . . . . . 41
Identify the server nd ccess the Lenovo XCl rity
Controller . . . . . . . . . . . . . . . . . 41
Server setup checklist . . . . . . . . . . . . 43
Chapter 5 Hardware replacement
procedures 45
Inst ll tion Guidelines . . . . . . . . . . . . 45
S fety inspection checklist. . . . . . . . . 46
System reli bility guidelines . . . . . . . . 47
Working inside the server with the power on . . 48
H ndling st tic-sensitive devices . . . . . . 48
Technic l rules . . . . . . . . . . . . . . . 48
Memory module inst ll tion rules nd order . . 49
PCIe slots nd d pters. . . . . . . . . . 50
Technic l rules for drives . . . . . . . . . 53
Therm l rules . . . . . . . . . . . . . . 54
Power on nd power off the server . . . . . . . 59
Power on the server . . . . . . . . . . . 59
Power off the server . . . . . . . . . . . 60
B ckpl ne repl cement. . . . . . . . . . . . 60
Remove the front 2.5-inch drive b ckpl ne . . 60
Inst ll the front 2.5-inch drive b ckpl ne . . . 61
Remove the front 16-EDSFF drive
b ckpl ne . . . . . . . . . . . . . . . 62
Inst ll the front 16-EDSFF drive b ckpl ne . . 63
Remove the re r 2.5-inch drive b ckpl ne. . . 64
Inst ll the re r 2.5-inch drive b ckpl ne . . . 66
Remove the 7mm drive b ckpl nes . . . . . 68
Inst ll the 7mm drive b ckpl nes . . . . . . 70
CMOS b ttery (CR2032) repl cement . . . . . . 71
Remove the CMOS b ttery . . . . . . . . 71
Inst ll the CMOS b ttery . . . . . . . . . 73
EDSFF c ge repl cement . . . . . . . . . . . 75
Remove n EDSFF c ge . . . . . . . . . 75
Inst ll n EDSFF c ge . . . . . . . . . . 76
Front I/O module repl cement . . . . . . . . . 78
Remove the front I/O module . . . . . . . . 78
Inst ll the front I/O module. . . . . . . . . 80
Remove the Integr ted Di gnostics P nel
ssembly . . . . . . . . . . . . . . . 81
Inst ll the Integr ted Di gnostics P nel
ssembly . . . . . . . . . . . . . . . 82
F n bo rd repl cement . . . . . . . . . . . . 84
Remove the f n bo rd . . . . . . . . . . 84
Inst ll the f n bo rd . . . . . . . . . . . 86
GPU repl cement . . . . . . . . . . . . . . 87
Remove GPU d pter . . . . . . . . . . 87
Inst ll GPU d pter . . . . . . . . . . . 89
Server repl cement . . . . . . . . . . . . . 91
Remove the server from r ck . . . . . . . . 91
Inst ll the server to r ck . . . . . . . . . . 94
Hot-sw p drive repl cement . . . . . . . . . . 99
Remove 2.5-inch hot-sw p drive . . . . . 99
Inst ll 2.5-inch hot-sw p drive . . . . . . 100
Remove hot-sw p EDSFF drive . . . . . . 102
Inst ll hot-sw p EDSFF drive . . . . . . . 104
Hot-sw p power supply unit repl cement . . . . 106
Remove hot-sw p power supply unit . . . . 106
Inst ll hot-sw p power supply . . . . . . 108
Intern l CFF HBA/RAID d pter repl cement . . . 110
Remove the intern l CFF HBA/RAID
d pter . . . . . . . . . . . . . . . . 110
Inst ll the intern l CFF HBA/RAID d pter. . . 111
Intrusion switch repl cement . . . . . . . . . 112
Remove n intrusion switch . . . . . . . . 112
© Copyright Lenovo 2023 i

Inst ll n intrusion switch . . . . . . . . . 115
Lenovo Neptune (TM) liquid ssisted cooling
module repl cement (tr ined technici ns only). . . 117
Remove the Lenovo Neptune (TM) liquid
ssisted cooling module . . . . . . . . . 117
Inst ll the Lenovo Neptune (TM) liquid
ssisted cooling module . . . . . . . . . 120
Memory module repl cement . . . . . . . . . 124
Remove memory module . . . . . . . . 125
Inst ll memory module . . . . . . . . . 126
M.2 b ckpl ne nd M.2 drive repl cement . . . . 129
Remove the M.2 b ckpl ne nd M.2 drive. . . 129
Adjust the ret iner on the M.2 b ckpl ne . . . 132
Inst ll the M.2 b ckpl ne nd M.2 drive. . . . 132
MicroSD c rd repl cement . . . . . . . . . . 135
Remove the MicroSD c rd . . . . . . . . . 135
Inst ll the MicroSD c rd . . . . . . . . . . 137
OCP module repl cement . . . . . . . . . . . 138
Remove the OCP module . . . . . . . . . 138
Inst ll the OCP module . . . . . . . . . . 139
PCIe d pter repl cement. . . . . . . . . . . 140
Remove PCIe d pter . . . . . . . . . . 140
Inst ll PCIe d pter . . . . . . . . . . . 142
Power supply unit ir b ffle repl cement . . . . . 143
Remove power supply unit ir b ffle . . . . 143
Inst ll power supply unit ir b ffle b ffle . . . 145
Processor nd he t sink repl cement (Tr ined
technici ns only) . . . . . . . . . . . . . . 147
Remove he t sink . . . . . . . . . . . 148
Remove processor . . . . . . . . . . . 150
Inst ll he t sink . . . . . . . . . . . . 151
Inst ll processor . . . . . . . . . . . . 153
Power inverter bo rd (PIB) repl cement . . . . . 154
Remove the PIB bo rd . . . . . . . . . . 154
Inst ll the PIB bo rd . . . . . . . . . . . 155
R ck l tches repl cement . . . . . . . . . . . 156
Remove the r ck l tches . . . . . . . . . 157
Inst ll the r ck l tches . . . . . . . . . . 158
RAID fl sh power module repl cement . . . . . . 159
Remove the RAID fl sh power module on the
ch ssis . . . . . . . . . . . . . . . . 160
Inst ll the RAID fl sh power module on the
ch ssis . . . . . . . . . . . . . . . . 161
Remove the RAID fl sh power module on the
system bo rd tr y . . . . . . . . . . . . 164
Inst ll the RAID fl sh power module on the
system bo rd tr y . . . . . . . . . . . . 165
Remove the RAID fl sh power module on the
riser . . . . . . . . . . . . . . . . . 167
Inst ll the RAID fl sh power module on the
riser . . . . . . . . . . . . . . . . . 168
Re r drive ssembly repl cement . . . . . . . . 169
Remove the 2.5-inch re r drive ssembly . . . 169
Inst ll the 2.5-inch re r drive ssembly . . . . 171
Remove the 7mm re r drive ssembly . . . . 174
Inst ll the 7mm re r drive ssembly . . . . . 175
Riser c rd repl cement . . . . . . . . . . . . 176
Remove riser c rd . . . . . . . . . . . 178
Inst ll riser c rd . . . . . . . . . . . . 181
Security bezel repl cement . . . . . . . . . . 183
Remove the security bezel . . . . . . . . . 183
Inst ll the security bezel. . . . . . . . . . 184
Seri l port module repl cement . . . . . . . . 187
Remove seri l port module . . . . . . . . 187
Inst ll seri l port module . . . . . . . . . 189
System bo rd ssembly repl cement (Tr ined
technici ns only) . . . . . . . . . . . . . . 191
Remove the firmw re nd RoT security
module . . . . . . . . . . . . . . . . 194
Inst ll the firmw re nd RoT security
module . . . . . . . . . . . . . . . . 195
Remove the system I/O bo rd or processor
bo rd . . . . . . . . . . . . . . . . . 199
Inst ll the system I/O bo rd or processor
bo rd . . . . . . . . . . . . . . . . . 203
System f n repl cement . . . . . . . . . . . 208
Remove system f n. . . . . . . . . . . 209
Inst ll system f n. . . . . . . . . . . . 210
Top cover repl cement . . . . . . . . . . . . 212
Remove the top cover . . . . . . . . . . 212
Inst ll the top cover . . . . . . . . . . . 213
Complete the p rts repl cement . . . . . . . . 215
Chapter 6 Internal cable routing 217
Identifying connectors . . . . . . . . . . . . 217
Drive b ckpl ne connectors . . . . . . . . 217
CFF RAID/HBA d pter. . . . . . . . . . . . 222
Front I/O module c ble routing . . . . . . . . . 224
Intrusion switch . . . . . . . . . . . . . . . 226
RAID fl sh power modules . . . . . . . . . . 227
Re r NVMe/SATA drive b ckpl ne . . . . . . . 232
7mm drive b ckpl ne . . . . . . . . . . . . 235
M.2 drive b ckpl ne c ble routing . . . . . . . 239
Liquid ssisted cooling module c ble routing . . . 242
Power/Sideb nd c ble routing . . . . . . . . . 244
2.5-inch drive b ckpl ne (sign l) . . . . . . . . 247
4 x 2.5'' front drives . . . . . . . . . . . 247
8 x 2.5'' front drives . . . . . . . . . . . 256
10 x 2.5 front drives . . . . . . . . . . . 262
16-EDSFF drive b ckpl ne c ble routing . . . 279
Chapter 7 System configuration 281
Set the network connection for the Lenovo XCl rity
Controller . . . . . . . . . . . . . . . . . 281
ii ThinkSystem SR635 V3 User Guide

Set front USB port for Lenovo XCl rity Controller
connection. . . . . . . . . . . . . . . . . 282
Upd te the firmw re . . . . . . . . . . . . . 283
Configure the firmw re . . . . . . . . . . . . 286
Memory module configur tion . . . . . . . . . 287
RAID configur tion . . . . . . . . . . . . . 288
Deploy the oper ting system. . . . . . . . . . 288
B ck up the server configur tion . . . . . . . . 289
Chapter 8 Problem
determination 291
Event logs . . . . . . . . . . . . . . . . . 291
Troubleshooting by system LEDs nd di gnostics
displ y . . . . . . . . . . . . . . . . . . 292
Drive LEDs . . . . . . . . . . . . . . . 293
Front oper tor p nel LEDs . . . . . . . . . 294
Power supply LEDs . . . . . . . . . . . 296
System-bo rd- ssembly LEDs . . . . . . . 297
XCC system m n gement port LEDs. . . . . 300
Extern l Di gnostics H ndset . . . . . . . 300
Integr ted di gnostics p nel . . . . . . . . 306
LEDs on the firmw re nd RoT security
module . . . . . . . . . . . . . . . . 311
Liquid detection sensor LED . . . . . . . . 313
Gener l problem determin tion procedures . . . . 314
Resolving suspected power problems . . . . 314
Resolving suspected Ethernet controller
problems . . . . . . . . . . . . . . . 315
Troubleshooting by symptom . . . . . . . . . 316
Cool nt le k problems . . . . . . . . . . 316
F n bo rd problems . . . . . . . . . . . 317
H rd disk drive problems . . . . . . . . . 317
Intermittent problems. . . . . . . . . . . 320
Keybo rd, mouse, KVM switch or USB-device
problems . . . . . . . . . . . . . . . 321
Memory problems . . . . . . . . . . . . 322
Monitor nd video problems . . . . . . . . 323
Observ ble problems. . . . . . . . . . . 325
Option l-device problems . . . . . . . . . 328
Perform nce problems . . . . . . . . . . 329
Power on nd power off problems . . . . . . 330
Power supply nd PIB problems . . . . . . 331
Softw re problems. . . . . . . . . . . . 332
Appendix A Hardware
disassembling for recycle 333
Dis ssemble the system bo rd ssembly for
recycle . . . . . . . . . . . . . . . . . . 333
Appendix B Getting help and
technical assistance 335
Before you c ll . . . . . . . . . . . . . . . 335
Collecting service d t . . . . . . . . . . . . 336
Cont cting Support . . . . . . . . . . . . . 337
Appendix C Documents and
supports 339
Documents downlo d . . . . . . . . . . . . 339
Support websites . . . . . . . . . . . . . . 339
Appendix D Notices 341
Tr dem rks . . . . . . . . . . . . . . . . 342
Import nt notes . . . . . . . . . . . . . . . 342
Electronic emission notices . . . . . . . . . . 342
T iw n Region BSMI RoHS decl r tion . . . . . 343
T iw n Region import nd export cont ct
inform tion . . . . . . . . . . . . . . . . 343
© Copyright Lenovo 2023 iii

iv ThinkSystem SR635 V3 User Guide

Safety
Before inst lling this product, re d the S fety Inform tion.
Antes de inst l r este produto, lei s Inform ções de Segur nç .
在安装本产品之前，请仔细阅读 S fety Inform tion （安全信息）。
Læs sikkerhedsforskrifterne, før du inst llerer dette produkt.
Lees voord t u dit product inst lleert eerst de veiligheidsvoorschriften.
Ennen kuin senn t tämän tuotteen, lue turv ohjeet kohd st S fety Inform tion.
Av nt d'inst ller ce produit, lisez les consignes de sécurité.
Vor der Inst ll tion dieses Produkts die Sicherheitshinweise lesen.
Prim di inst ll re questo prodotto, leggere le Inform zioni sull Sicurezz .
Les sikkerhetsinform sjonen (S fety Inform tion) før du inst llerer dette produktet.
Antes de inst l r este produto, lei s Inform ções sobre Segur nç .
© Copyright Lenovo 2023 v

Antes de inst l r este producto, le l inform ción de segurid d.
Läs säkerhetsinform tionen inn n du inst ller r den här produkten.
Safety inspection checklist
Use the inform tion in this section to identify potenti lly uns fe conditions with your server. As e ch m chine
w s designed nd built, required s fety items were inst lled to protect users nd service technici ns from
injury.
Note: The product is not suit ble for use t visu l displ y workpl ces ccording to §2 of the Workpl ce
Regul tions.
Note: The set-up of the server is m de in the server room only.
CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology Lenovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location
Important: Electric l grounding of the server is required for oper tor s fety nd correct system function.
Proper grounding of the electric l outlet c n be verified by certified electrici n.
Use the following checklist to verify th t there re no potenti lly uns fe conditions:
1. M ke sure th t the power is off nd the power cord is disconnected.
2. Check the power cord.
• M ke sure th t the third-wire ground connector is in good condition. Use meter to me sure third-
wire ground continuity for 0.1 ohm or less between the extern l ground pin nd the fr me ground.
• M ke sure th t the power cord is the correct type.
To view the power cords th t re v il ble for the server:
. Go to:
vi ThinkSystem SR635 V3 User Guide

http://dcsc.lenovo.com/#/
b. Click Preconfigured Model or Configure to order.
c. Enter the m chine type nd model for your server to displ y the configur tor p ge.
d. Click Power ➙ Power Cables to see ll line cords.
• M ke sure th t the insul tion is not fr yed or worn.
3. Check for ny obvious non-Lenovo lter tions. Use good judgment s to the s fety of ny non-Lenovo
lter tions.
4. Check inside the server for ny obvious uns fe conditions, such s met l filings, cont min tion, w ter or
other liquid, or signs of fire or smoke d m ge.
5. Check for worn, fr yed, or pinched c bles.
6. M ke sure th t the power-supply cover f steners (screws or rivets) h ve not been removed or t mpered
with.
© Copyright Lenovo 2023 vii

viii ThinkSystem SR635 V3 User Guide

Chapter 1 Introduction
The ThinkSystem SR635 V3 Server (Types 7D9G nd 7D9H) is 1-socket 1U r ck server th t fe tures the 4th
gener tion EPYC processor f mily of AMD. It is designed to be highly flexible to support m ny kinds of
Inform tion Technology (IT) worklo ds. This high-perform nce, multi-core server is ide lly suited for IT
environments th t require superior processor perform nce, input/output (I/O) flexibility, nd flexible
m n ge bility.
Figure 1. ThinkSystem SR635 V3
Features
Perform nce, e se of use, reli bility, nd exp nsion c p bilities were key consider tions in the design of
your server. These design fe tures m ke it possible for you to customize the system h rdw re to meet your
needs tod y nd provide flexible exp nsion c p bilities for the future.
Your server implements the following fe tures nd technologies:
• Features on Demand
If Fe tures on Dem nd fe ture is integr ted in the server or in n option l device th t is inst lled in the
server, you c n purch se n ctiv tion key to ctiv te the fe ture. For inform tion bout Fe tures on
Dem nd, see:
https://fod.lenovo.com/lkms
• Lenovo XClarity Controller (XCC)
The Lenovo XCl rity Controller is the common m n gement controller for Lenovo ThinkSystem server
h rdw re. The Lenovo XCl rity Controller consolid tes multiple m n gement functions in single chip on
the server system bo rd (system bo rd ssembly). Some of the fe tures th t re unique to the Lenovo
XCl rity Controller re enh nced perform nce, higher-resolution remote video, nd exp nded security
options.
The server supports Lenovo XCl rity Controller 2 (XCC2). For ddition l inform tion bout Lenovo XCl rity
Controller 2 (XCC2), refer to https://sysmgt.lenovofiles.com/help/topic/lxcc_frontend/lxcc_overview.html.
• UEFI-compliant server firmware
Lenovo ThinkSystem firmw re is Unified Extensible Firmw re Interf ce (UEFI) compli nt. UEFI repl ces
BIOS nd defines st nd rd interf ce between the oper ting system, pl tform firmw re, nd extern l
devices.
Lenovo ThinkSystem servers re c p ble of booting UEFI-compli nt oper ting systems, BIOS-b sed
oper ting systems, nd BIOS-b sed d pters s well s UEFI-compli nt d pters.
Note: The server does not support DOS (Disk Oper ting System).
• Large system-memory capacity
© Copyright Lenovo 2023 1

The server supports up to 12 TruDDR5 du l inline memory modules (DIMMs) with error correcting code
(ECC). For more inform tion bout the specific types nd m ximum mount of memory, see “Technic l
specific tions” on p ge 3.
• Large data-storage capacity and hot-swap capability
With the hot-sw p fe ture, you c n dd, remove, or repl ce h rd disk drives without turning off the server.
Stor ge c p city is different depending on server model. See “Technic l specific tions” on p ge 3 for
more inform tion.
• Lightpath Diagnostics
Lightp th Di gnostics provides LEDs to help you di gnose problems. For more inform tion bout the
Lightp th Di gnostics, see “System LEDs nd di gnostics displ y” on p ge 36.
• Mobile access to Lenovo Service Information website
The server provides QR code on the system service l bel, which is on the cover of the server, th t you
c n sc n using QR code re der nd sc nner with mobile device to get quick ccess to the Lenovo
Service Inform tion website. The Lenovo Service Inform tion website provides ddition l inform tion for
p rts inst ll tion, repl cement videos, nd error codes for server support.
• Active Energy Manager
Lenovo XCl rity Energy M n ger is power nd temper ture m n gement solution for d t centers. You
c n monitor nd m n ge the power consumption nd temper ture of Converged, NeXtSc le, System x,
nd ThinkServer servers, nd improve energy efficiency using Lenovo XCl rity Energy M n ger.
• Redundant networking connection
The Lenovo XCl rity Controller provides f ilover c p bility to redund nt Ethernet connection with the
pplic ble pplic tion inst lled. If problem occurs with the prim ry Ethernet connection, ll Ethernet
tr ffic th t is ssoci ted with the prim ry connection is utom tic lly switched to the option l redund nt
Ethernet connection. If the pplic ble device drivers re inst lled, this switching occurs without d t loss
nd without user intervention.
• Redundant cooling
The redund nt cooling by the f ns in the server en bles continued oper tion if one rotor of f n f ils.
• ThinkSystem RAID support
The ThinkSystem RAID d pter provides h rdw re redund nt rr y of independent disks (RAID) support
to cre te configur tions, supporting RAID levels 0, 1, 5, 6, 10, 50, nd 60.
Tech Tips
Lenovo continu lly upd tes the support website with the l test tips nd techniques th t you c n use to solve
issues th t your server might encounter. These Tech Tips ( lso c lled ret in tips or service bulletins) provide
procedures to work round issues or solve problems rel ted to the oper tion of your server.
To find the Tech Tips v il ble for your server:
1. Go to http://d t centersupport.lenovo.com nd n vig te to the support p ge for your server.
2. Click on the document tion icon from the n vig tion p ne.
3. Click Documentation Type ➙ Solution from the drop-down menu.
Follow the on-screen instructions to choose the c tegory for the problem th t you re h ving.
2ThinkSystem SR635 V3 User Guide

Security advisories
Lenovo is committed to developing products nd services th t dhere to the highest security st nd rds in
order to protect our customers nd their d t . When potenti l vulner bilities re reported, it is the
responsibility of the Lenovo Product Security Incident Response Te m (PSIRT) to investig te nd provide
inform tion to our customers so they m y put mitig tion pl ns in pl ce s we work tow rd providing
solutions.
The list of current dvisories is v il ble t the following site:
https://d t centersupport.lenovo.com/product_security/home
Specifications
Summ ry of the fe tures nd specific tions of the server. Depending on the model, some fe tures might not
be v il ble, or some specific tions might not pply.
Refer to the below t ble for specific tion c tegories nd the content of e ch c tegory.
Specification
category
Technic l specific tions Mech nic l specific tions Environment l specific tions
Content • Processor
• Memory
• M.2 Drive
• Stor ge exp nsion
• Exp nsion slots
• Integr ted functions nd I/O
connectors
• Network
• RAID d pter
• Host bus d pter
• System f n
• Electric l input
• Minim l configur tion for
debugging
• Oper ting systems
• Dimension
• Weight
• Acoustic l noise emissions
• Ambient temper ture
m n gement
• Environment l
Technical specifications
Summ ry of the technic l specific tions of the server. Depending on the model, some fe tures might not be
v il ble, or some specific tions might not pply. The l test specific tions inform tion is lw ys v il ble t
https://lenovopress.lenovo.com/.
Processor
Supports fourth-gener tion AMD® EPYCTM processors, with 5nm process technology.
• One processor with the new LGA 6096 (SP5) socket
• Up to 96 Zen4 cores (192 thre ds)
• Up to 4 xGMI3 links t up to 32 GT/s
• M ximum Configur ble Therm l Design Power (cTDP): up to 400 w tts
For list of supported processors, see https://serverproven.lenovo.com.
Ch pter 1.Introduction 3

Memory
See “Memory module inst ll tion rules nd order” on p ge 49 for det iled inform tion bout memory configur tion nd
setup.
• Slots: 12 memory module (DIMM) slots
• Memory module type:
– TruDDR5 4800MHz RDIMM: 16 GB (1Rx8), 32 GB (2Rx8)
– TruDDR5 4800MHz 10x4 RDIMM: 32 GB (1Rx4), 64 GB (2Rx4)
– TruDDR5 4800MHz 9x4 RDIMM: 32 GB (1Rx4), 64 GB (2Rx4)
– TruDDR5 4800MHz 3DS RDIMM: 128 GB (4Rx4)
• C p city:
– Minimum: 16 GB (1 x 16 GB RDIMM)
– M ximum: 1.5 TB (12 x 128 GB 3DS RDIMMs)
• Speed:
– The oper ting speed v ries with specific processor models nd UEFI settings.
– M ximum speed: 4800 MT/s
For list of supported memory modules, see https://serverproven.lenovo.com.
Internal drives
• Front:
– Up to four 2.5-inch hot-sw p SAS/SATA drives
– Up to four 2.5-inch hot-sw p NVMe drives
– Up to four 2.5-inch hot-sw p AnyB y drives
– Up to eight 2.5-inch hot-sw p SAS/SATA drives
– Up to six 2.5-inch hot-sw p SAS/SATA nd four 2.5-inch hot-sw p AnyB y (SAS/SATA/NVMe) drives
– Up to six 2.5-inch hot-sw p SAS/SATA nd two 2.5-inch hot-sw p AnyB y (SAS/SATA/NVMe) nd two 2.5-inch
hot-sw p NVMe drives
– Up to ten 2.5-inch hot-sw p NVMe drives
– Up to ten 2.5-inch hot-sw p SAS/SATA drives
– Up to ten 2.5-inch hot-sw p AnyB y (SAS/SATA/NVMe) drives
– Up to 16 hot-sw p EDSFF drives
• Internal:
Up to two intern l SATA or NVMe M.2 drives
• Rear:
– Up to two 2.5-inch hot-sw p SAS/SATA drives
– Up to two 2.5-inch hot-sw p NVMe drives
– Up to two 7mm hot-sw p SATA or NVMe drives
Expansion slots
Depending on the model, your server supports up to three PCIe slots in the re r.
• PCIe x16, low-profile
• PCIe x16/x16, low-profile + low-profile
• PCIe x16/x16, low profile + full-height
• PCIe x16, full-height
PCIe slot v il bility is b sed on riser selection. See “Re r view” on p ge 23 nd “PCIe slots nd d pters” on p ge
50.
4ThinkSystem SR635 V3 User Guide

Storage controller
• SAS/SATA HBA d pters
– ThinkSystem 440-8i SAS/SATA PCIe Gen4 12Gb HBA
– ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb HBA
– ThinkSystem 4350-8i SAS/SATA 12Gb HBA
– ThinkSystem 4350-16i SAS/SATA 12Gb HBA
– ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb Intern l HBA
– ThinkSystem 440-8e SAS/SATA PCIe Gen4 12Gb HBA
– ThinkSystem 440-16e SAS/SATA PCIe Gen4 12Gb HBA
• SAS/SATA RAID d pters
– ThinkSystem RAID 540-8i PCIe Gen4 12Gb Ad pter
– ThinkSystem RAID 540-16i PCIe Gen4 12Gb Ad pter
– ThinkSystem RAID 940-8i 4GB Fl sh PCIe Gen4 12Gb Ad pter
– ThinkSystem RAID 940-16i 4GB Fl sh PCIe Gen4 12Gb Ad pter
– ThinkSystem RAID 940-16i 8GB Fl sh PCIe Gen4 12Gb Ad pter
– ThinkSystem RAID 940-16i 8GB Fl sh PCIe Gen4 12Gb Intern l Ad pter
– ThinkSystem RAID 940-8e 4GB Fl sh PCIe Gen4 12Gb Ad pter
– ThinkSystem RAID 5350-8i PCIe 12Gb Ad pter
– ThinkSystem RAID 5350-8i PCIe 12Gb Intern l Ad pter
– ThinkSystem RAID 9350-8i 2GB Fl sh PCIe 12Gb Ad pter
– ThinkSystem RAID 9350-8i 2GB Fl sh PCIe 12Gb Intern l Ad pter
– ThinkSystem RAID 9350-16i 4GB Fl sh PCIe 12Gb Ad pter
– ThinkSystem RAID 9350-16i 4GB Fl sh PCIe 12Gb Intern l Ad pter
Notes:
C tegoriz tion of Gen 3 nd Gen 4 RAID/HBA d pters:
• Gen 4: 440, 540 nd 940 series
• Gen 3: 4350, 5350 nd 9350 series
Note:
For more inform tion bout the RAID/HBA d pters, see Lenovo ThinkSystem RAID Ad pter nd HBA Reference.
Graphics processing unit (GPU)
The server supports the following GPU:
• Low-profile, h lf-length, single-wide:
– NVIDIA® A2
Ch pter 1.Introduction 5

Integrated functions and I/O connectors
• Lenovo XCl rity Controller (XCC), which provides service processor control nd monitoring functions, video
controller, nd remote keybo rd, video, mouse, nd remote drive c p bilities.
– The server supports Lenovo XCl rity Controller 2 (XCC2). For ddition l inform tion bout Lenovo XCl rity
Controller 2 (XCC2), refer to https://sysmgt.lenovofiles.com/help/topic/lxcc_frontend/lxcc_overview.html.
• Front connectors:
– (Option l) One VGA connector
– (Option l) One USB 3.1 Gen 1 (5 Gbps) connector
– (Option l) One USB 2.0 connector
– (Option l) One extern l di gnostics connector
Note: These connectors re v il ble only when the front I/O module is inst lled in the server.
• Re r connectors:
– One VGA connector
– Three USB 3.1 Gen 1 (5 Gbps) connectors
– One XCC system m n gement port to connect to systems-m n gement network. This RJ-45 connector is
dedic ted to the Lenovo XCl rity Controller functions nd runs t 1 Gb speed.
– Two or four Ethernet connectors on the OCP module (option l)
– (Option l) One seri l port connector
Note: This connector is v il ble when the seri l port c ble is inst lled in the server.
Network
• OCP module
Notes:
• The OCP module is n option l p rt. It is def ult to be inst lled on the re r nd option l in the front of the server.
• If ThinkSystem Redund nt System M n gement Port Ad pter is inst lled on the server, it will not be displ yed on
the PCIe c rd list of system m n gement softw re, such s XCC, LXPM, nd so on.
Rear button
Rear button
• NMI button
System fan
• Supports up to 7 du l-rotor hot-sw p f ns (including one redund nt f n rotor)
• Supports the following two f n types:
– St nd rd f n 4056 (speed: 21000 RPM)
– Perform nce f n 4056 (speed: 28000 RPM)
Note: If there is n OCP module inst lled, when the system is powered off but still plugged in to AC power, system f n
1 nd f n 2 will continue to spin t much lower speed. This is the system design to provide proper cooling for the
OCP module.
6ThinkSystem SR635 V3 User Guide

The server supports up to two power supplies for redund ncy.
Table 1. Electrical input for po er supply units
Power supply 100-127 V ac 200-240 V ac 240 V dc -48 V dc
750-w tt 80 PLUS
Pl tinum √ √ √
750-w tt 80 PLUS
Tit nium √ √
1100-w tt 80 PLUS
Tit nium
√ √ √
1100-w tt 80 PLUS
Pl tinum
√ √
1800-w tt 80 PLUS
Pl tinum
√ √
1800-w tt 80 PLUS
Tit nium
√ √
1100W -48V DC √
CAUTION:
• 240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland ONLY
• Power supply with 240 V dc input cannot support hot plugging power cord function Before removing the
power supply with dc input, turn off server or disconnect dc power sources at the breaker panel or by
turning off the power source Then, remove the power cord
Minimal configuration for debugging
• One processor
• One memory module in slot 7
• One power supply
• One HDD/SSD drive or one M.2 drive (if OS is needed for debugging)
• Five system f ns
Operating systems
Supported nd certified oper ting systems:
• Microsoft Windows Server
• VMw re ESXi
• Microsoft Windows
• Red H t Enterprise Linux
• SUSE Linux Enterprise Server
• C nonic l Ubuntu
References:
• Complete list of v il ble oper ting systems: https://lenovopress.lenovo.com/osig.
• OS deployment instructions, see “Deploy the oper ting system” on p ge 288.
Ch pter 1.Introduction 7

Mechanical specifications
Summ ry of the mech nic l specific tions of the server. Depending on the model, some fe tures might not
be v il ble, or some specific tions might not pply.
Dimension
1U server
• Height: 43 mm (1.69 inches)
• Width (with EIA fl nge): 482 mm (18.97 inches)
• Depth (with EIA fl nge nd PSU h ndle): 787.6 mm (31 inches)
Weight
Up to 20.2 kg (44.56 lb)
Environmental specifications
Summ ry of the environment l specific tions of the server. Depending on the model, some fe tures might
not be v il ble, or some specific tions might not pply.
8ThinkSystem SR635 V3 User Guide

Acoustical noise emissions
The server h s the following coustic noise emissions decl r tion.
The decl red sound levels re b sed on the following configur tions, which m y ch nge depending on configur tions
or conditions.
Typical GPU rich Storage rich
Sound power levels (LWAd)
Idling 6.7 Bel 6.7 Bel 7.4 Bel
Oper ting 8.4 Bel 8.3 Bel 7.9 Bel
Sound pressure level (LpAm)
Idling 52.3 dBA 52.3 dBA 59.9 dBA
Oper ting 68.7 dBA 67.7 dBA 64.1 dBA
Notes:
• These sound levels were me sured in controlled coustic l environments ccording to procedures specified by
ISO7779 nd re reported in ccord nce with ISO 9296.
• The decl red coustic sound levels re b sed on the following configur tions, which m y ch nge depending on
configur tion/conditions:
Components Typical configuration GPU rich
configuration
Storage rich
configuration
Processor One 300 W processor One 300 W processor One 240 W processor
Memory Twelve 64 GB
RDIMMs
Twelve 64 GB
RDIMMs
Twelve 64 GB
RDIMMs
Drive Ten SAS hard disk
drives
Ten SAS hard disk
drives
Twelve SAS hard disk
drives
RAID adapter One 440-16i CFF RAID
adapter
One 440-16i CFF RAID
adapter
One 440-16i CFF RAID
adapter
OCP adapter One Broadcom 5719
1GbE RJ45 4-port
OCP Ethernet adapter
One Broadcom 5719
1GbE RJ45 4-port
OCP Ethernet adapter
One Broadcom 5719
1GbE RJ45 4-port
OCP Ethernet adapter
GPU adapter None One A2 GPU adapter None
Power supply unit Two 1100 W power
supply units
Two 1100 W power
supply units
Two 750 W power
supply units
• Government regul tions (such s those prescribed by OSHA or Europe n Community Directives) m y govern noise
level exposure in the workpl ce nd m y pply to you nd your server inst ll tion. The ctu l sound pressure levels
in your inst ll tion depend upon v riety of f ctors, including the number of r cks in the inst ll tion; the size,
m teri ls, nd configur tion of the room; the noise levels from other equipment; the room mbient temper ture, nd
employee's loc tion in rel tion to the equipment. Further, compli nce with such government regul tions depends
on v riety of ddition l f ctors, including the dur tion of employees' exposure nd whether employees we r
he ring protection. Lenovo recommends th t you consult with qu lified experts in this field to determine whether
you re in compli nce with the pplic ble regul tions.
Ch pter 1.Introduction 9

Ambient temperature management
The server is supported in the following environment:
• Air temper ture:
– Oper ting:
– ASHRAE cl ss H1: 5–25°C (41–77°F); when the ltitude exceeds 900 m (2953 ft), the m ximum mbient
temper ture v lue decre ses by 1°C (1.8°F) with every 500 m (1640 ft) of ltitude incre se.
– ASHRAE cl ss A2: 10–35°C (50–95°F); when the ltitude exceeds 900 m (2953 ft), the m ximum mbient
temper ture v lue decre ses by 1°C (1.8°F) with every 300 m (984 ft) of ltitude incre se.
– ASHRAE cl ss A3: 5–40°C (41–104°F); when the ltitude exceeds 900 m (2953 ft), the m ximum mbient
temper ture v lue decre ses by 1°C (1.8°F) with every 175 m (574 ft) of ltitude incre se.
– ASHRAE cl ss A4: 5–45°C (41–113°F); when the ltitude exceeds 900 m (2953 ft), the m ximum mbient
temper ture v lue decre ses by 1°C (1.8°F) with every 125 m (410 ft) of ltitude incre se.
– Server off: 5–45°C (41–113°F)
– Shipping or stor ge: -40–60°C (-40–140°F)
• M ximum ltitude: 3050 m (10 000 ft)
• Rel tive humidity (non-condensing):
– Oper ting:
– ASHRAE Cl ss H1: 8%–80%, m ximum dew point: 17°C (62.6°F)
– ASHRAE Cl ss A2: 8%–80%, m ximum dew point: 21°C (70°F)
– ASHRAE Cl ss A3: 8%–85%, m ximum dew point: 24°C (75°F)
– ASHRAE Cl ss A4: 8%–90%, m ximum dew point: 24°C (75°F)
– Shipment or stor ge: 8%–90%
• P rticul te cont min tion
Attention: Airborne p rticul tes nd re ctive g ses cting lone or in combin tion with other environment l f ctors
such s humidity or temper ture might pose risk to the server. For inform tion bout the limits for p rticul tes nd
g ses, see “P rticul te cont min tion” on p ge 11.
10 ThinkSystem SR635 V3 User Guide