Toshiba M400 - Portege - Core 2 Duo 1.83 GHz User manual

[CONFIDENTIAL]
1
Toshiba Personal Computer
PORTEGE M400
Maintenance Manual
TOSHIBA CORPORATION
File Number 960-541

ii [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
Copyright
© 2006 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual
cannot be reproduced in any form without the prior written permission of Toshiba. No patent
liability is assumed, with respect to the use of the information contained herein.
Toshiba PORTEGE M400 Maintenance Manual
First edition January 2006
Disclaimer
This manual has been validated and reviewed for accuracy. The instructions and descriptions
it contains are accurate for the Toshiba PORTEGE M400 at the time of this manual's
production. However, succeeding computers and manuals are subject to change without
notice. Toshiba assumes no liability for damages incurred directly or indirectly from errors,
omissions or discrepancies between the computer and the manual.
Trademarks
IBM is a registered trademark and IBM PC is a trademark of International Business
Machines Corporation.
Intel, Intel SpeedStep, Intel Core and Centrino are trademarks or registered trademarks of
Intel Corporation or its subsidiaries in the United States and other countries/regions.
Windows and Microsoft are registered trademarks of Microsoft Corporation.
Photo CD is a trademark of Eastman Kodak.
Sonic RecordNow! is a registered trademark of Sonic Solutions.
Bluetooth is a trademark owned by its proprietor and used by TOSHIBA under license.
i.LINK is trademark and registered trademark of Sony Corporation.
InterVideo and WinDVD are registered trademarks of InterVideo Inc.
WinDVD Creator is trademark of InterVideo Inc.
Other trademarks and registered trademarks not listed above may be used in this manual.

Preface
This maintenance manual describes how to perform hardware service maintenance for the
Toshiba Personal Computer PORTEGE M400, referred to as PORTEGE M400 in this
manual.
The procedures described in this manual are intended to help service technicians isolate
faulty Field Replaceable Units (FRUs) and replace them in the field.
SAFETY PRECAUTIONS
Four types of messages are used in this manual to bring important information to your
attention. Each of these messages will be italicized and identified as shown below.
DANGER: “Danger” indicates the existence of a hazard that could result in death or
serious bodily injury, if the safety instruction is not observed.
WARNING: “Warning” indicates the existence of a hazard that could result in bodily
injury, if the safety instruction is not observed.
CAUTION: “Caution” indicates the existence of a hazard that could result in property
damage, if the safety instruction is not observed.
NOTE: “Note” contains general information that relates to your safe maintenance
service.
Improper repair of the computer may result in safety hazards. Toshiba requires service
technicians and authorized dealers or service providers to ensure the following safety
precautions are adhered to strictly.
Be sure to fasten screws securely with the right screwdriver. Be sure to use the PH
Point size “0” and “1” screwdrivers complying with the ISO/DIS 8764-1:1996. If a
screw is not fully fastened, it could come loose, creating a danger of a short circuit,
which could cause overheating, smoke or fire.
If you replace the battery pack or RTC battery, be sure to use only the same model
battery or an equivalent battery recommended by Toshiba. Installation of the wrong
battery can cause the battery to explode.
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iv [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
The manual is divided into the following parts:
Chapter 1 Hardware Overview describes the Satellite R10 system unit and each
FRU.
Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve
FRU problems.
Chapter 3 Test and Diagnostics describes how to perform test and diagnostic
operations for maintenance service.
Chapter 4 Replacement Procedures describes the removal and replacement of the
FRUs.
Appendices The appendices describe the following:
Handling the LCD module
Board layout
Pin assignment
Keyboard scan/character codes
Key layout
Wiring Diagrams
BIOS Rewrite Procedures
EC/KBC Rewrite Procedures
Reliability
Maintenance of TOSHIBA RAID

Conventions
This manual uses the following formats to describe, identify, and highlight terms and
operating procedures.
Acronyms
On the first appearance and whenever necessary for clarification acronyms are enclosed in
parentheses following their definition. For example:
Read Only Memory (ROM)
Keys
Keys are used in the text to describe many operations. The key top symbol as it appears on
the keyboard is printed in boldface type.
Key operation
Some operations require you to simultaneously use two or more keys. We identify such
operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause
(Break) means you must hold down Ctrl and at the same time press Pause (Break). If
three keys are used, hold down the first two and at the same time press the third.
User input
Text that you are instructed to type in is shown in the boldface type below:
DISKCOPY A: B:
The display
Text generated by the Satellite R10 that appears on its display is presented in the type face
below:
Format complete
System transferred
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Table of Contents
Chapter 1 Hardware Overview
1.1 Features......................................................................................................................1-1
1.2 2.5-inch Hard Disk Drive.........................................................................................1-11
1.3 Optical Drive............................................................................................................1-14
1.4 Keyboard..................................................................................................................1-20
1.5 TFT Color Display...................................................................................................1-21
1.6 Power Supply...........................................................................................................1-23
1.7 Batteries ...................................................................................................................1-25
1.8 AC Adapter..............................................................................................................1-28
Chapter 2 Troubleshooting Procedures
2.1 Troubleshooting.........................................................................................................2-1
2.2 Troubleshooting Flowchart........................................................................................2-2
2.3 Power Supply Troubleshooting..................................................................................2-6
2.4 System Board Troubleshooting................................................................................2-16
2.5 USB 3.5” FDD Troubleshooting..............................................................................2-32
2.6 2.5” HDD Troubleshooting......................................................................................2-35
2.7 Keyboard Troubleshooting ......................................................................................2-40
2.8 Display Troubleshooting..........................................................................................2-41
2.9 Touch Pad Troubleshooting.....................................................................................2-43
2.10 Selectable bay(optical drive) Troubleshooting........................................................2-44
2.11 Modem Troubleshooting..........................................................................................2-45
2.12 Bluetooth Troubleshooting ......................................................................................2-46
2.13 LAN Troubleshooting..............................................................................................2-49
2.14 Sound Troubleshooting............................................................................................2-50
2.15 Bridge media Slot Troubleshooting.........................................................................2-51
2.16 Tablet Pen Troubleshooting.....................................................................................2-52

2.17 Wireless LAN Troubleshooting...............................................................................2-54
2.18 Fingerprint sensor Troubleshooting.........................................................................2-56
Chapter 3 Tests and Diagnostics
3.1 The Diagnostic Test..................................................................................................3-1
3.2 Executing the Diagnostic Test..................................................................................3-4
3.3 Check of the RAID configuration.............................................................................3-8
3.4 Setting of the hardware configuration.....................................................................3-16
3.5 Heatrun Test............................................................................................................3-19
3.6 Subtest Names.........................................................................................................3-20
3.7 System Test.............................................................................................................3-22
3.8 Memory Test...........................................................................................................3-24
3.9 Keyboard Test.........................................................................................................3-25
3.10 Display Test............................................................................................................3-26
3.11 Floppy Disk Test.....................................................................................................3-29
3.12 Printer Test..............................................................................................................3-31
3.13 Async Test ..............................................................................................................3-33
3.14 Hard Disk Test........................................................................................................3-34
3.15 Real Timer Test.......................................................................................................3-37
3.16 NDP Test.................................................................................................................3-39
3.17 Expansion Test........................................................................................................3-40
3.18 CD-ROM/DVD-ROM Test ....................................................................................3-42
3.19 Error Code and Error Status Names........................................................................3-43
3.20 Hard Disk Test Detail Status...................................................................................3-46
3.21 Only One Test.........................................................................................................3-48
3.22 Head Cleaning.........................................................................................................3-56
3.23 Log Utilities............................................................................................................3-57
3.24 Running Test...........................................................................................................3-59
3.25 Floppy Disk Drive Utilities.....................................................................................3-60
3.26 System Configuration .............................................................................................3-65
3.27 Wireless LAN Test Program (Intel-made b/g)........................................................3-67
3.28 Wireless LAN Test Program (Intel-made a/b/g).....................................................3-71
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program .................................................3-76
3.30 Sound Test Program................................................................................................3-90
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3.31 SETUP ....................................................................................................................3-96
Chapter 4 Replacement Procedures
4.1 Overview...................................................................................................................4-1
4.2 Battery pack..............................................................................................................4-8
4.3 PC card/Bridge media.............................................................................................4-10
4.4 Touch pen case........................................................................................................4-12
4.5 HDD........................................................................................................................4-13
4.6 Slim select bay module...........................................................................................4-17
4.7 Keyboard.................................................................................................................4-20
4.8 Memory module......................................................................................................4-24
4.9 Bluetooth module....................................................................................................4-27
4.10 Wireless LAN card .................................................................................................4-29
4.11 Touch pad................................................................................................................4-31
4.12 Top cover assembly ................................................................................................4-36
4.13 System board/RTC battery......................................................................................4-42
4.14 Cover latch..............................................................................................................4-45
4.15 Battery lock assembly/Pen holder assembly...........................................................4-46
4.16 Microphone/Front panel..........................................................................................4-47
4.17 Fan...........................................................................................................................4-49
4.18 Heat sink/CPU ........................................................................................................4-51
4.19 MDC .......................................................................................................................4-54
4.20 GPU heat sink.........................................................................................................4-56
4.21 HDD cable ..............................................................................................................4-57
4.22 Sensor board............................................................................................................4-58
4.23 Speaker....................................................................................................................4-59
4.24 Hinge spacer............................................................................................................4-62
4.25 LCD unit/FL inverter..............................................................................................4-63
4.26 Digitizer ..................................................................................................................4-68
4.27 Finger print sensor board (NF board) .....................................................................4-75
4.28 Switch board (NW board).......................................................................................4-76
4.29 LCD latch assembly................................................................................................4-77

4.30 Hinge assembly.......................................................................................................4-78
4.31 Fluorescent Lamp....................................................................................................4-80
Appendices
Appendix A Handling the LCD Module .......................................................................A-1
Appendix B Board Layout ............................................................................................ B-1
Appendix C Pin Assignment......................................................................................... C-1
Appendix D Keyboard Scan/Character Codes ..............................................................D-1
Appendix E Key Layout.................................................................................................E-1
Appendix F Wiring Diagrams........................................................................................F-1
Appendix G BIOS Rewrite Procedures.........................................................................G-1
Appendix H EC/KBC Rewrite Procedures....................................................................H-1
Appendix I Reliability....................................................................................................I-1
Appendix J Maintenance of TOSHIBA RAID ............................................................. J-1
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Appendix A Handling the LCD Module Appendices
Appendix A
Appendix A Handling the LCD Module
Precautions for handling the LCD module
The LCD module can be easily damaged during assembly or disassembly. Observe the
following precautions when handling the LCD module:
1. When installing the LCD module in the LCD cover, be sure to seat it so that it is
properly aligned and maximum visibility of the display is maintained.
2. Be careful to align the holes at the four corners of the LCD module with the
corresponding holes in the LCD cover before securing the module with screws.
Do not force the module into place, because stress can affect its performance.
Also, the panel’s polarized surface is easily scarred, so be careful when handling it.
PORTEGE M400 Maintenance Manual (960-541) [CONFIDENTIAL] A-1

Appendices Appendix A Handling the LCD Module
3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty,
try breathing on the surface to create a light condensate and wipe it again.
If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to
a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel.
4. If water or other liquid is left on the panel’s surface for a long period, it can change
the screen’s tint or stain it. Be sure to quickly wipe off any liquid.
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Appendix A Handling the LCD Module Appendices
5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object,
which could cause breakage or cracks.
6. CMOS-LSI circuits are used in the module, so guard against damage from
electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the
module.
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Appendices Appendix A Handling the LCD Module
7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods.
8. Do not store the module at temperatures below specifications. Cold can cause the
liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
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Appendix A Handling the LCD Module Appendices
10. If you transport the module, do not use packing material that contains epoxy resin
(amine) or silicon glue (alcohol or oxime). These materials can release gas that can
damage the panel’s polarization.
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Appendices Appendix A Handling the LCD Module
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Appendix B Board Layout Appendices
Appendix B
Appendix B Board Layout
B.1 System Board Front View
Figure B-1 System board layout (front)
PORTEGE M400 Maintenance Manual (960-541) [CONFIDENTIAL] B-1

Appendices Appendix B Board Layout
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Table B-1 System board ICs and connectors (front)
Number Part’s name
IS2101 Bridge media connector
CN1400 Memory connector (A)
CN1410 Memory connector (B)
CN2600 Wireless LAN I/F connector
CN9500 NP board I/F connector
CN4400 Bluetooth module I/F connector
CN6170 Speaker connector
CN9540 Digitizer I/F connector
CN5500 LCD I/F connector
CN3230 Keyboard connector
CN3240 Touch pad connector
IC2000 Card controller
CN2110 PC card I/F connector
IC3200 EC/KBC
IC1600 ICH7-M
CN6060 Internal Microphone I/F connector (Left)
CN6061 Internal Microphone I/F connector (Right)

Appendix B Board Layout Appendices
B.2 System board Back View
Figure B-2 System board layout (back)
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Appendices Appendix B Board Layout
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Table B-2 System board ICs and connectors (back)
Number Name
CN8800 DC-IN jack
CN4612 USB port 0
CN5080 RGB connector
CN1810 ODD connector
CN8810 Battery connector
IC1200 AlvisioPM
CN2300 Port replicator I/F connector
CN3010 MDC connector
VR6240 Sound volume
J6310 Headphone jack
J6070 External microphone jack
CN4100 Modem relay connector
CN4200 1394 connector
CN4611 USB port 4
CN4610 USB port 6
CN1850 HDD I/F connector
CN8781 Fan connector
J4100 Network jack
IS1050 CPU