User's Manual l MBLX2160A UM 0100 l © 2021, TQ-Systems Gm H Page I
TABLE OF CONTENTS
1. ABOUT THIS MANUAL.................................................................................................................................................................................. 1
1.1 Copyright and license expenses............................................................................................................................................................... 1
1.2 Registered trademarks................................................................................................................................................................................. 1
1.3 Disclaimer........................................................................................................................................................................................................ 1
1.4 Imprint.............................................................................................................................................................................................................. 1
1.5 Tips on safety.................................................................................................................................................................................................. 2
1.6 Sym ols and typographic conventions................................................................................................................................................. 2
1.7 Handling and ESD tips................................................................................................................................................................................. 2
1.8 Naming of signals.......................................................................................................................................................................................... 3
1.9 Further applica le documents / presumed knowledge................................................................................................................... 3
2. BRIEF DESCRIPTION...................................................................................................................................................................................... 4
3. ELECTRONICS.................................................................................................................................................................................................. 5
3.1 TQMLX2160A.................................................................................................................................................................................................. 5
3.1.1 TQMLX2160A mating connectors............................................................................................................................................................ 6
3.1.2 TQMLX2160A pinout.................................................................................................................................................................................... 6
3.1.3 Boot source................................................................................................................................................................................................... 12
3.1.4 eMMC cong................................................................................................................................................................................................ 13
3.1.5 NOR Flash swap........................................................................................................................................................................................... 14
3.2 Power supply and PMC............................................................................................................................................................................. 15
3.2.1 Protective circuitry..................................................................................................................................................................................... 16
3.2.2 MBLX2160A power-up sequencing...................................................................................................................................................... 16
3.2.3 Battery............................................................................................................................................................................................................ 16
3.3 Clock generation......................................................................................................................................................................................... 17
3.4 I2C devices.................................................................................................................................................................................................... 19
3.5 SerDes............................................................................................................................................................................................................. 20
3.5.1 SerDes Multiplexing options................................................................................................................................................................... 20
3.5.2 SerDes #1....................................................................................................................................................................................................... 21
3.5.3 SerDes #2....................................................................................................................................................................................................... 22
3.5.4 SerDes #3....................................................................................................................................................................................................... 23
3.6 QSFP28 100 G it Ethernet....................................................................................................................................................................... 24
3.7 SFP+ 10 G it Ethernet............................................................................................................................................................................... 25
3.8 RGMII / SGMII Ethernet.............................................................................................................................................................................. 25
3.9 Communication interfaces...................................................................................................................................................................... 27
3.9.1 PCIe.................................................................................................................................................................................................................. 27
3.9.2 Mini PCIe........................................................................................................................................................................................................ 28
3.9.3 SD card........................................................................................................................................................................................................... 28
3.9.4 SATA................................................................................................................................................................................................................ 29
3.9.5 USB 3.0............................................................................................................................................................................................................ 30
3.9.6 CAN.................................................................................................................................................................................................................. 31
3.9.7 UART................................................................................................................................................................................................................ 32
3.9.8 GPIO port expanders................................................................................................................................................................................. 32
3.9.9 Pin headers................................................................................................................................................................................................... 34
3.10 User interfaces............................................................................................................................................................................................. 36
3.10.1 OLED display................................................................................................................................................................................................ 36
3.10.2 GP LEDs and GP uttons........................................................................................................................................................................... 38
3.10.3 Status LEDs.................................................................................................................................................................................................... 38
3.10.4 DIP switches.................................................................................................................................................................................................. 39
3.10.5 JTAG®.............................................................................................................................................................................................................. 40
3.11 Fan................................................................................................................................................................................................................... 40
4. SOFTWARE.................................................................................................................................................................................................... 40
5. MECHANICS.................................................................................................................................................................................................. 41
5.1 MBLX2160A dimensions........................................................................................................................................................................... 41
5.2 Notes of treatment..................................................................................................................................................................................... 41
5.3 Thermal management............................................................................................................................................................................... 41
5.4 Assem ly....................................................................................................................................................................................................... 42
6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS...........................................................................................................43
6.1 EMC.................................................................................................................................................................................................................. 43
6.2 ESD................................................................................................................................................................................................................... 43
6.3 Operational safety and personal security........................................................................................................................................... 43
7. CLIMATE AND OPERATIONAL CONDITIONS....................................................................................................................................... 44
7.1 Protection against external eects....................................................................................................................................................... 44