Udoo Bolt User manual

UDOO BOLT

Next-gen Open hardware SBC with the

AMD Ryzen Embedded V1000 Processors

BOLT

This manual is released under Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0) license

Every effort has been made to ensure the accuracy of this manual. However, SECO S.p.A. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.p.A. reserves the right to change precise specifications without prior notice to supply the best product possible.

To get the required assistance for any and possible issues, please contact us using the dedicated web form available at http://www.udoo.org/customer-

care/open.php.

Our team is ready to assist.

Revision

Date

Note

Ref

1.0

19 April 2019

First Official Release.

REVISION HISTORY

 
 BOLT 
UDOO BOLT User Manual - Rev. First Edition: 1.0 - Last Edition: 1.0 - Author: S.B. - Reviewed by L.V. Copyright © 2019 SECO S.p.A. 

INDEX 
 INTRODUCTION.......................................................................................................................................................................... 6 
1 Warranty........................................................................................................................................................................................................................................ 7 
2 Information and assistance............................................................................................................................................................................................................. 8 
3 RMA number request..................................................................................................................................................................................................................... 8 
4 Safety............................................................................................................................................................................................................................................9 
5 Electrostatic discharges ................................................................................................................................................................................................................. 9 
6 RoHS compliance.......................................................................................................................................................................................................................... 9 
7 FCC certification ..........................................................................................................................................................................................................................10 
8 ISED certification..........................................................................................................................................................................................................................11 
9 Terminology and definitions ..........................................................................................................................................................................................................12 
10 Reference specifications ..............................................................................................................................................................................................................14 
 OVERVIEW ............................................................................................................................................................................... 15
1 Introduction..................................................................................................................................................................................................................................16 
2 Technical specifications ...............................................................................................................................................................................................................17 
3 Electrical specifications ................................................................................................................................................................................................................18 
3.1 RTC Battery ................................................................................................................................................................................................................................................18 
3.2 Power consumption.....................................................................................................................................................................................................................................19 
3.3 Power rails naming convention .....................................................................................................................................................................................................................20 
4 Mechanical specifications............................................................................................................................................................................................................. 21 
5 Block diagram..............................................................................................................................................................................................................................22 
 CONNECTORS......................................................................................................................................................................... 23 
1 Introduction..................................................................................................................................................................................................................................24 
2 Connectors overview ...................................................................................................................................................................................................................25 
3 Connectors description................................................................................................................................................................................................................ 26 
3.1 Ethernet connector......................................................................................................................................................................................................................................26 
3.2 USB ports...................................................................................................................................................................................................................................................27 
3.3 HDMI connectors ........................................................................................................................................................................................................................................30 
3.4 Audio interfaces...........................................................................................................................................................................................................................................32 
3.5 Buttons / LED header ..................................................................................................................................................................................................................................33 
3.6 SATA connectors ........................................................................................................................................................................................................................................34 
3.7 M.2 SATA/PCI-e Slot: Socket 2 Key B type 2242/2260 ................................................................................................................................................................................35 
3.8 M.2 Connectivity Slot: Socket 1 Key E Type 2230.........................................................................................................................................................................................36 
3.9 M.2 NVMe Slot: Socket 3 Key M Type 2280.................................................................................................................................................................................................38 

 
 BOLT 
UDOO BOLT User Manual - Rev. First Edition: 1.0 - Last Edition: 1.0 - Author: S.B. - Reviewed by L.V. Copyright © 2019 SECO S.p.A. 

3.10 FAN connector............................................................................................................................................................................................................................................39 
3.11 ARDUINO interface....................................................................................................................................................................................................................................40 
3.12 GROVE connectors.....................................................................................................................................................................................................................................41 
3.13 Embedded Controller I/O Header .................................................................................................................................................................................................................42 
3.14 IR Receiver..................................................................................................................................................................................................................................................44 
3.15 UEFI BIOS Default Restore switch.................................................................................................................................................................................................................44 
 UEFI BIOS SETUP..................................................................................................................................................................... 45
1 Aptio setup Utility .........................................................................................................................................................................................................................46 
2 Main menu ..................................................................................................................................................................................................................................47 
2.1 System Time / System Date.........................................................................................................................................................................................................................47 
3 Advanced menu ..........................................................................................................................................................................................................................48 
3.1 AMD CBS submenu....................................................................................................................................................................................................................................49 
3.2 AMD PBS submenu ....................................................................................................................................................................................................................................52 
3.3 RAM Disk Configuration submenu ................................................................................................................................................................................................................52 
3.4 Battery Failure Manager submenu.................................................................................................................................................................................................................53 
3.5 Trusted computing submenu........................................................................................................................................................................................................................53 
3.6 ACPI Settings..............................................................................................................................................................................................................................................54 
3.7 SATA presence submenu............................................................................................................................................................................................................................54 
3.8 DXIO Settings submenu...............................................................................................................................................................................................................................54 
3.9 S5 RTC Wake Settings submenu.................................................................................................................................................................................................................56 
3.10 CPU configuration submenu.........................................................................................................................................................................................................................57 
3.11 AMI graphic Output Protocol Policy submenu................................................................................................................................................................................................57 
3.12 PCI Subsystem Settings submenu ...............................................................................................................................................................................................................57 
3.13 Network Stack configuration submenu..........................................................................................................................................................................................................58 
3.14 CSM configuration submenu........................................................................................................................................................................................................................59 
3.15 NVMe configuration submenu ......................................................................................................................................................................................................................59 
3.16 SDIO configuration submenu........................................................................................................................................................................................................................60 
3.17 USB configuration submenu.........................................................................................................................................................................................................................60 
3.18 Main Thermal Configuration submenu...........................................................................................................................................................................................................61 
3.19 SMBIOS Information ....................................................................................................................................................................................................................................61 
3.20 Embedded Controller...................................................................................................................................................................................................................................61 
3.21 USB-C Port Controller..................................................................................................................................................................................................................................61 
4 Chipset menu.............................................................................................................................................................................................................................. 62 
4.1 South Bridge Configuration submenu............................................................................................................................................................................................................62 
4.2 North Bridge Configuration submenu............................................................................................................................................................................................................62 
5 Security menu..............................................................................................................................................................................................................................64 
5.1 Secure Boot submenu.................................................................................................................................................................................................................................64 

BOLT

4.6 Boot menu ..................................................................................................................................................................................................................................66

4.7 Save & Exit menu.........................................................................................................................................................................................................................67

APPENDICES............................................................................................................................................................................ 68

5.1 Accessories.................................................................................................................................................................................................................................69

5.1.1 M.2 Dual network modules ..........................................................................................................................................................................................................................69

5.1.2 I/O Expansion board....................................................................................................................................................................................................................................69

BOLT

•Warranty

•Information and assistance

•RMA number request

•Safety

•Electrostatic discharges

•RoHS compliance

•Terminology and definitions

•Reference specifications

BOLT

1.1 Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts for 2 years.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Items cannot be returned unless previously authorized by the supplier.

The authorization is released after completing the specific form available on the web-site http://www.udoo.org/customer-care/ (Open a New Ticket →Return

Merchandise Application). The RMA authorization number must be put both on the packaging and on the documents shipped with the items, which must include all

the accessories in their original packaging, with no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item.

Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.p.A. could impair the equipment’s functionalities and could

void the warranty

BOLT

1.2 Information and assistance

What do I have to do if I’m experiencing problems with my product?

The following services are available:

•UDOO website: visit http://www.udoo.org to receive the latest information on the product. In most cases it is possible to find useful information to solve the

problem.

•UDOO Forum: join to the community of UDOO users. In the forum, available at http://www.udoo.org/forum/, it is possible to search the multiple topics of the

community, and look for other users that had the same kind of problem - and how they solved it. It is also possible to post new topics to ask for specific

help.

•Repair centre: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

oReturned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

•Name and serial number of the product;

•Description of Customer’s peripheral connections;

•Description of Customer’s software (operating system, version, application software, etc.);

•A complete description of the problem;

•The exact words of every kind of error message encountered.

1.3 RMA number request

To request a RMA number, please visit UDOO web-site. On the bottom of the page, please select “Customer Care”, click on the “Open a New ticket”button and.

A RMA Number will be sent within 1 working day (only for on-line RMA requests).

BOLT

1.4 Safety

The UDOO BOLT board uses only extremely-low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

CE and FCC certification retained using only the UDOO BOLT qualified Power Supply Unit (19V Brick Power Adapter). When not using UDOO BOLT qualified Power

Supply, use 19VDC (min 60W power) PSUs certified for your country (make sure that the power cable is less than 3 mt. long).

1.5 Electrostatic discharges

The UDOO BOLT board, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all

the devices and/or components on-board.

1.6 RoHS compliance

The UDOO BOLT board is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

This product should be operated in a well-ventilated environment and, if used inside a case, the case should not be covered.

This product should be elevated on a stable, flat, electrically non-conductive surface whilst in operation, and clear from any object that can

induce a short-circuit.

Do not expose it to water, moisture or heat from any source; UDOO BOLT is designed for reliable operation at normal ambient room

temperatures.

Avoid handling the warm and moving parts (like the fan) and generally the printed circuit board while it is powered

Only handle by the edges to minimise the risk of electrostatic discharge damage.

Take care whilst handling to avoid mechanical or electrical damage to the printed circuit board and connectors. Also use a grounded

wrist strap or touch a safely grounded object before you handle components.

BOLT

1.7 FCC certification

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to

provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and,

if not installed and used in accordance with the instructions, may causeharmful interference toradio communications. However, there is no guarantee that interference

will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the

equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.

To comply with FCC RF exposure compliance requirements, a separation distance of at least 20 cm must be maintained between the antenna of this

device and all nearby persons.

FCC certification retained using only the UDOO BOLT qualified Power Supply Unit (19V Brick Power Adapter). When not using UDOO BOLT qualified Power Supply,

use 19VDC (min 60W power) PSUs certified for your country (make sure that the power cable is less than 3 mt. long).

SECO S.p.A.

Model: UDOO BOLT V3; UDOO BOLT V8

Warning!

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the

equipment.

BOLT

1.8 ISED certification

This device complies with Industry Canada licence-exempt RSS standard(s).

Operation is subject to the following two conditions:

(1) This device may not cause interference

(2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.

L’exploitation est autorisée aux deux conditions suivantes:

(1) l’appareil ne doit pas produire de brouillage, et

(2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.

Ce dispositif a été conçu pour fonctionner avec les antennes fournies avec ce produit. L’utilisation d’autres antennes peut enfreindre les règles industrielles du

Canada et annuler l’autorité de l’utilisateur quant au fonctionnement de l’équipement.

This device complies with RSS-210, ICES-3(B)/NMB-3(B)

BOLT

1.9 Terminology and definitions

ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management

AHCI Advanced Host Controller Interface, a standard which defines the operation modes of SATA interface

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

BIOS Basic Input / Output System, the Firmware Interface that initializes the board before the OS starts loading

CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock

DDR4 DDR, 4th generation

EC Embedded Controller

GbE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel®in 2004 for higher audio quality

HDMI High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

M.2 Specifications for internal expansion modules, which defines many pinouts and sizes for different purposes. Can include SATA, PCI Express, USB,

UART, DP interfaces

Mbps Megabits per second

MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface as the SD card. The eMMC is the embedded version of the

MMC. They are devices that incorporate the flash memories on a single BGA chip.

N.A. Not Applicable

N.C. Not Connected

OpenCL Open Computing Language, a software library based on C99 programming language, conceived explicitly to realise parallel computing using

Graphics Processing Units (GPU)

OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics

OS Operating System

BOLT

PCI-e Peripheral Component Interface Express

PSU Power Supply Unit

PWM Pulse Width Modulation

PWR Power

PXE Preboot Execution Environment, a way to perform the boot from the network ignoring local data storage devices and/or the installed OS

SATA Serial Advance Technology Attachment, a differential full duplex serial interface for Hard Disks

SD Secure Digital, a memory card type

SDHC Secure Digital Host Controller

SDIO Secure Digital Input/Output, an evolution of the SD standard that allows the use of the same SD interface to drive different Input/Output devices,

like cameras, GPS, Tuners and so on

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually

enabled through a Chip Select line

TBM To Be Measured

TDP Thermal Design Power, an indication of the amount of heat generated by the processor that must be used for the design of the thermal solution.

TMDS Transition-Minimized Differential Signaling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

UEFI Unified Extensible Firmware Interface, a specification defining the interface between the OS and the board’s firmware. It is meant to replace the

original BIOS interface

UMA Unified Memory Architecture, synonym of Integrated Graphics, uses a portion of a computer’s system RAM dedicated to graphics rather than using

dedicated graphics memory only.

USB Universal Serial Bus

V_REF Voltage reference Pin

xHCI eXtensible Host Controller Interface, Host controller for USB 3.0 ports, which can also manage USB 2.0 and USB1.1 ports

BOLT

1.10 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

ACPI

http://www.acpi.info

AHCI

http://www.intel.com/content/www/us/en/io/serial-ata/ahci.html

DDC

http://www.vesa.org

Gigabit Ethernet

http://standards.ieee.org/about/get/802/802.3.html

HD Audio

http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf

HDMI

http://www.hdmi.org/index.aspx

I2C

http://www.nxp.com/documents/other/UM10204_v5.pdf

Intel®Front Panel I/O connectivity DG

http://www.formfactors.org/developer/specs/A2928604-005.pdf

M.2

http://pcisig.com/specifications

MMC/eMMC

http://www.jedec.org/committees/jc-649

OpenCL

http://www.khronos.org/opencl

OpenGL

http://www.opengl.org

PCI Express

http://www.pcisig.com/specifications/pciexpress

SATA

https://www.sata-io.org

SD Card Association

https://www.sdcard.org/home

SM Bus

http://www.smbus.org/specs

TMDS

http://www.siliconimage.com/technologies/tmds

UEFI

http://www.uefi.org

USB 2.0 and USB OTG

http://www.usb.org/developers/docs/usb_20_070113.zip

USB 3.0

http://www.usb.org/developers/docs/usb_30_spec_070113.zip

xHCI

http://www.intel.com/content/www/us/en/io/universal-serial-bus/extensible-host-controler-interface-usb-xhci.html?wapkw=xhci

AMD Ryzen Embedded V1000

https://www.amd.com/en/products/embedded-ryzen-v1000-series

BOLT

•Introduction

•Technical specifications

•Electrical specifications

•Mechanical specifications

•Block diagram

BOLT

2.1 Introduction

The UDOO BOLT is a portable, breakthrough supercomputer that goes up to 3.6 GHz thanks to the brand-new AMD Ryzen Embedded V1000 SoC, a top-notch,

multicore CPU with a powerful mobile GPU - AMD Radeon Vega 8 or AMD Radeon Vega 3 Graphics, the most incredible GPUs ever seen on a maker platform

and an Arduino Leonardo compatible platform, all wrapped into one.

The UDOO BOLT can mount a Dual-Core Quad-Thread or a Quad-Core eight-thread SoCs, base frequency 2.3 or 2.0 GHz, Turbo boost at 3.2 or 3.6 GHz, with

64-bit instruction set and very low TDP. This single chip solution includes the memory controller, which gives support for up to 32GB of DDR4 memory on two SO-

DIMM Slots, also capable of supporting ECC memory.

All SoCs embed an AMD Radeon Vega Graphics controller, with 3 or 8 Execution units, which offers extremely high graphical performances, supporting also High

Dynamical range (HDR) Imaging. DirectX®12, EGL 1.4, OpenCL 2.1, OpenGL®ES 1.1/ 2.x / 3.x (Halti), OpenGL®Next (Vulkan®), OpenGL®4.6 are also supported

by this GPU, which can also offer H.265 10-bit video decoding and 8-bit encoding.

Finally, this embedded GPU is able to drive four 4K independent displays, by using the HDMI and the USB-C interfaces available.

Other features offered by the AMD Ryzen Embedded V1000 SoCs, and included in UDOO BOLT board, are two SATA Revision 3.0 Channels (one used for the

common SATA / SSD drives, the other used to implement a M.2 Socket 2 Key B SSD slot), six USB ports (two USB 3.1 on standard Type-A sockets, two USB 3.1

on standard type-C sockets supporting Display Port Alternate Mode and Power Delivery functions, one USB 2.0 on M.2 Socket 1 Key E Connectivity slot and another

USB 2.0 port used for the communications with the Atmega32u4 microcontroller), HD Audio and eight PCI Express lanes (two lanes are carried out on M.2 Socket

2 Key B SSD slot where they can be used as a single PCI-e x2 port, a PCI express lane is used for the implementation of the Gigabit Ethernet interface, ,another is

available on M.2 Socket 1 Key E Connectivity Slot and four PCI-express Graphics lanes are carried to the M.2 Key M Slot for NVMe SSDs, where they can be used

as a single PCI-e x 4 port).

Through the AMD Ryzen Embedded V1000 SoC’s USB interface #5 pass all the communications with the ATMEL ATmgea32u4 microcontroller, which implements

the Arduino Leonardo interface: this situation reproduces exactly the situation of an external Arduino board connected to an x86 PC, with the advantages given

by an integrated board solution.

All these features, combined together, make UDOO BOLT the most powerful maker board ever.

Please refer to following chapter for a complete list of all the integrated peripherals and the characteristics.

2.2 Technical specifications

SoC

AMD Ryzen Embedded V1605B with AMD Radeon Vega 8 Graphics, Quad

Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W

AMD Ryzen Embedded V1202B with AMD Radeon Vega 3 Graphics, Dual

Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W

Memory

2x DDR4 SO-DIMM Slots, supporting DDR4-2400 ECC and non-ECC memory

Graphics

AMD Radeon Vega GPU with 8 (V1605B) or 3 (V1202B) Compute Units

4 independent displays supported

DirectX®12, EGL1.4, OpenCL 2.1, OpenGL®ES 1.1/ 2.x / 3.x (Halti), OpenGL®

Next (Vulkan®), OpenGL®4.6 supported

H.265 (10-bit) decode and 8-bit video encode

VP9 decode

Video Interfaces

2x HDMI connector, supporting HDMI 1.4 / HDMI 2.0a

2x DP alternate mode interfaces on USB Type-C connectors

Video Resolution

Up to 4K

Mass Storage

32GB eMMC 5.0 drive on-board

SATA 6Gb/s 7p M connector

M.2 Key B SATA SSD slot (Type 2242 or 2260 modules accepted)

M.2 Key M NVMe Slot (PCI-e x4 Gen3 interface)

Networking

Realtek RTL811G Gigabit Ethernet controller

Gigabit Ethernet LAN interface

M.2 Key E Slot for optional Wireless modules

M.2 Key B Slot for optional 2x GbEthernet

USB

2x USB 3.1 Host ports on Type-A sockets

2x USB 3.1 Host ports on Type-C sockets, with DisplayPort Alternate Mode and

Power Delivery Role

1 x USB 2.0 Host port on M.2 Key E slot

PCI-Express

1 x PCI-e x2 port on M.2 Key B SSD Slot

1 x PCI-e x1 port on M.2 Key E slot

1 x PCI-e x4 port on M.2 Key M Slot

Audio

HD Audio Codec Realtek ALC888S

Combo TRSS connector with Mic In and Line out support

S/PDIF or additional headphone signal

2 x Speaker internal headers

Other Interfaces

I2C Grove connectors

Switch/LED Front Panel Header

CIR (Consumer InfraRed) Sensor

Arduino Leonardo compatible interface

Embedded controller I/O header with 2x UART, SPI, 2x I2C, FAN Control,

Keyboard Scan or GPI/O signals

Power supply: +19VDC ± 5% DC Power Jack

USB Type-C Power In

RTC Coin cell Battery

Operating temperature: 0°C ÷ +50°C** (Commercial temperature)

Dimensions: 120 x 120 mm (4.72”x 4.72”).

Supported Operating Systems:

Microsoft®Windows 10

Any Linux distribution for X86 64-bit platform

** Environmental temperature, measured using UDOO BOLT Standard

heatsink with Fan

BOLT

2.3 Electrical specifications

The UDOO BOLT board can be supplied only with an external 19VDC ± 5% power supply, minimum 60W (i.e. min. 3.15A @ 19V) for basic

functionalities recommended. Always make sure that the power cable is less than 3mt. long.

This voltage can be supplied through a DC power jack (CN5) type Singatron p/n 2DC3122-007111F. Internal pin is VIN power line.

Mating DC plug as shown in the picture below (Singatron p/n 45P06CV230-1A00-01 or equivalent).

The Board can also be powered by using a standard USB-C power adapter, with the same minimum wattage (power profile: 20V 3A).

A bicolour Green/Yellow LED is placed near the DC IN power jack to signal the power state of the board. When the board is powered but turned off, then the LED

turns on Yellow, during normal working (S0 State) the LED turns on Green light.

2.3.1 RTC Battery

For the occurrences when the module is not powered with an external power supply, on board there is a cabled coin Lithium Battery to supply, with a 3V voltage,

the Real Time Clock embedded inside the AMD Ryzen Embedded V1000 SoC.

Battery used is a cabled CR2032-LD Lithium coin-cell battery, with a nominal capacity of 220mAh.

The battery is not rechargeable, and can be connected to the board using dedicated connector CN5 which is a 2-pin

p1.27 mm type MOLEX p/n 53261-0271 or equivalent, with pinout shown in the table on the left.

Mating connector: MOLEX 51021-0200 receptacle with MOLEX 50079-8000 female crimp terminals.

In case of exhaustion, the battery should only be replaced with devices of the same type. Always check the orientation before

inserting and make sure that they are aligned correctly and are not damaged or leaking.

Never allow the batteries to become short-circuited during handling.

Batteries supplied with UDOO BOLT are compliant to requirements of European Directive 2006/66/EC regarding batteries and accumulators. When putting out of

order UDOO BOLT, remove the batteries from the board in order to collect and dispose them according to the requirement of the same European Directive above

mentioned. Even when replacing the batteries, the disposal has to be made according to these requirements.

Battery connector CN4

Signal

VRTC

GND

CAUTION: handling batteries incorrectly or replacing with not-approved devices may present a risk of fire or explosion.

BOLT

2.3.2 Power consumption

Using the following setup, and using all possible SoCs offered for UDOO BOLT board, the current consumption (RMS) has been measured on the VIN Power line.

The board is supplied with a 19V voltage through DC power jack CN4 using a Keysight DC Power Analyzer model N6700B.

•O.S. Windows 10 Professional

•32GB eMMC onboard

•8GB DDR4-2133 Single Channel Memory

•USB mouse and keyboard connected

•HDMI display connected

•UEFI BIOS Release 1.00 RC 03

Status

SoC V1202B

TDP 12W

TDP 25W

Average (120s)

Peak

Average (120s)

Peak

Idle, power saving configuration

0.357A

0.704A

0.327A

0.674A

OS Boot, power saving configuration

0.838A

1.388A

0.851A

1.450A

Video reproduction@1080p, power saving configuration

0.712A

0.983A

0.722A

1.230A

Video reproduction@4K, power saving configuration

0.822A

1.363A

0.753A

1.380A

Internal Stress Test Tool, package power set at specific TDP

1.411A

1.480A

1.348A

1.634A

BOLT

Independently by the SoC mounted onboard, the following power consumptions are common to all boards:

Battery Backup power consumption: 3.68μA

Soft-Off State power consumption: TBM

Suspend State power consumption: TBM

Please consider that the power consumption depends strongly on the utilization scenario.

2.3.3 Power rails naming convention

In all the tables contained in this manual, Power rails are named with the following meaning:

_RUN: Switched voltages, i.e. power rails that are active only when the board is in ACPI’s S0 (Working) state. Examples: +3.3V_RUN, +5V_RUN.

_ALW: Always-on voltages, i.e. power rails that are active both in ACPI’s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_ALW, +3.3V_ALW.

_DSW: Deep Sleep Well voltage, i.e. power rails that remain active also when the _ALW voltages have been turned off, in a state very similar to the Mechanical Off

(G3) but with the possibility of awakening of the module upon a very limited set of events. It is not supported by UDOO Bolt firmware, however.

_SUS: unswitched ACPI S3 voltages, i.e. power rails that are active both in ACPI’s S0 (Working) and S3 (Standby) state. Examples: +1.5V_SUS

Other suffixes are used for application specific power rails, which are derived from same voltage value of voltage switched rails, if it is not differently stated (for

example, +5VHDMI is derived from +5V_RUN, and so on).

Status

SoC V1605B

TDP 12W

TDP 25W

Average (120s)

Peak

Average (120s)

Peak