WIN Enterprises MB-73440 User manual

WIN Enterprises, Inc.
Custom Embedded Solutions
COM Express
MB-73440
User’s Manual

Copyright © WIN Enterprises, Inc. MB-73440
2
Version:
Release Date:
Part Number:

Copyright © WIN Enterprises, Inc. MB-73440
1
Revision History
Revision Description Date By
1.0 Initial Release 2016.5.23 T.C.

Copyright © WIN Enterprises, Inc. MB-73440
2
Preface
This user m nu l offers det il inform tion bout components, pinouts, connectors nd BIOS Setups of
WIN's MB-73440 bo rd. For more inform tion bout design nd development for COM Express™
pplic tions, ple se refer to documents rele sed from the PCI Industri l Computer M nuf cturers Group
(PICMG):
COM Express™ Design Guide
COM Express™ Specific tion
Copyright
©2016 WIN Enterprises, Inc. All rights reserved Worldwide. All inform tion cont ined in this document is
provided in good f ith nd is protected by copyright l ws worldwide nd no p rt of this document m y be
reproduced or tr nsmitted in ny form or by ny me ns, electronic or mech nic l, without the express
written permission of WIN Enterprises, Inc. All other tr dem rks re cknowledged s the property of their
respective owners.
Disclaimer
The inform tion cont ined within this user’s guide, including but not limited to ny product specific tion, is
subject to ch nge without notice. All inform tion listed in this user m nu l, including but not limited to
product specific tions or dr wings, is subject to ch nge without prior notice. WIN Enterprises, Inc. provides
no w rr nty in ny form with reg rd to this document nd inform tion cont ined herein nd hereby
expressly discl ims ny expressed or implied w rr nties of merch nt bility or fitness for ny p rticul r
purpose with reg rd to ny ofthe foregoing nd WIN Enterprises, Inc. ssumes no li bility for ny d m ges
incurred directly or indirectly from ny kinds of errors or omissions cont ined herein or for discrep ncies
between the product nd this document. In no event sh ll WIN Enterprises, Inc. be li ble for ny incident l,
consequenti l, speci l, or exempl ry d m ges, whether b sed on tort, contr ct or otherwise, rising out of
or in connection with this document or ny other inform tion cont ined herein or the use thereof.
Hazardous substance-Free RoHS) Compliant
This product is designed nd developed on h z rdous subst nce-free components nd p rts nd tot lly
RoHS (Restriction of H z rdous Subst nces Directive 2002/95/EC) compli nt.
Certification
WIN Enterprises, Inc. is certified to DIN EN ISO 9001 nd 14001 st nd rds.

Copyright © WIN Enterprises, Inc. MB-73440
3
Electrostatic Sensitive Device
This product is n electrost tic sensitive device (ESD) nd p ck ged
ccordingly. In ny c se this product c n not be opened, h ndled, stored or
tr nsported without proper ESD protection mech nisms nd ple se store
nd ship this product in its origin l m nuf cturer’s p ck ging. F ilure to
comply with these guidelines will m ke this product d m ged nd void
Limited W rr nty offered by WIN Enterprises, Inc .

Copyright © WIN Enterprises Inc. 4
Table of Contents
Revision History ..................................................................................................................... 1
Preface................................................................................................................................... 2
Table of Contents ................................................................................................................... 4
1. Introduction ....................................................................................................................... 7
1.1. H rdw re Briefing .............................................................................................................8
1.1.1. TOP VIEW ...................................................................................................................8
1.1.2. BOTTOM VIEW ...........................................................................................................9
2. Specifications ................................................................................................................... 10
2.1. CoreSystem .....................................................................................................................10
2.2. Exp nsion Busses ............................................................................................................11
2.3. Video ..............................................................................................................................11
2.4. Audio ..............................................................................................................................12
2.5. LAN .................................................................................................................................12
2.6. Multi I/O nd Stor ge......................................................................................................12
2.7. Seri l I/O .........................................................................................................................12
2.8. Trusted Pl tform Module (TPM) (Option l)......................................................................13
2.9. Debug He ders................................................................................................................13
2.10. Power Specific tions .....................................................................................................13
2.11. Environment l Requirements ........................................................................................13
2.12. Regul tory Compli nce..................................................................................................14
2.13. Oper ting Systems.........................................................................................................14
2.14. Function l Di gr m .......................................................................................................15
3. Mechanical Information.................................................................................................... 16
3.1 Mech nic l Dimensions....................................................................................................16
3.2. Module Connector ..........................................................................................................18
3.3. Therm l Solution (for reference only)..............................................................................19
3.3.1. He t Sink ..................................................................................................................19
3.3.2. Inst ll tion ...............................................................................................................19
3.4. Mounting Methods .........................................................................................................22
3.4.1. Mech nic l Specific tion ..........................................................................................22
4. Pinout Definitions............................................................................................................. 26
4.1. Connector A/B.................................................................................................................26
4.2. Connector C/D.................................................................................................................29
4.3. Sign l Definition ..............................................................................................................33
4.4. Sign l Descriptions – Connector A/B................................................................................33
4.4.1. Audio Sign ls ............................................................................................................33
4.4.2. An log VGA ..............................................................................................................34

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4.4.3. LVDS/eDP .................................................................................................................34
4.4.5. Gig bit Ethernet .......................................................................................................36
4.4.6. SATA .........................................................................................................................37
4.4.7. PCI Express ...............................................................................................................38
4.4.8. LPC Bus.....................................................................................................................39
4.4.9. USB ..........................................................................................................................39
4.4.11. SPI (BIOS only) ........................................................................................................40
4.4.12. Miscell neous.........................................................................................................41
4.4.13. SMBus ....................................................................................................................41
4.4.14. I2C Bus ...................................................................................................................42
4.4.15. Gener l Purpose I/O (GPIO)....................................................................................42
4.4.16. Seri l Interf ce Sign ls............................................................................................43
4.4.17. Power nd System M n gement ............................................................................43
4.4.18. Power nd Ground..................................................................................................45
4.5. Sign l Descriptions – Connector C/D ...............................................................................46
4.5.1. USB 3.0 Extension.....................................................................................................46
4.5.2. PCI Express x1...........................................................................................................46
4.5.3. DDI Ch nnels ............................................................................................................47
4.5.4. DDI to DP/HDMI/SDVO M pping ..............................................................................49
4.5.5. Module Type Definition ............................................................................................50
4.5.6. Power nd Ground ...................................................................................................51
5. System Resources ............................................................................................................. 52
5.1. System Memory M p ......................................................................................................52
5.2. I/O M p...........................................................................................................................52
5.3. Interrupt Request (IRQ) Lines ..........................................................................................53
5.3.1. PIC Mode..................................................................................................................53
5.3.2. APIC Mode ...............................................................................................................54
5.4. PCI Configur tion Sp ce M p ..........................................................................................55
5.5. PCI Interrupt Routing M p...............................................................................................56
5.6. SMBus Address T ble.......................................................................................................56
6. BIOS Setup ....................................................................................................................... 57
6.1. M in................................................................................................................................58
6.1.1. BIOS Inform tion ......................................................................................................58
6.1.2. Memory Inform tion ................................................................................................58
6.1.3. D te nd Time ..........................................................................................................58
6.2. Adv nced ........................................................................................................................58
6.2.1. Trusted Computing ...................................................................................................58
6.2.2. CPU Configur tion ....................................................................................................59

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6.2.3. ACPI Settings ............................................................................................................61
6.2.4. AMT Configur tion ...................................................................................................61
6.2.5. PCH-FW Configur tion ..............................................................................................62
6.2.6. W83627DHG Super IO Configur tion ........................................................................62
6.2.7. NCT7802Y HW Monitor ............................................................................................63
6.2.8. NVMe Configur tion.................................................................................................64
6.2.9.USB Configur tion .....................................................................................................64
6.2.10. SATA Configur tion .................................................................................................65
6.2.11.System Agent (SA) Configur tion .............................................................................66
6.2.12. PCH-IO Configur tion..............................................................................................69
6.3. Boot ................................................................................................................................71
6.4. Security ...........................................................................................................................71
6.5. S ve & Exit ......................................................................................................................71
7. BIOS Checkpoints, Beep Codes .......................................................................................... 73
7.1. St tus Code R nges .........................................................................................................73
7.2. St nd rd St tus Codes.....................................................................................................73
7.2.1. SEC St tus Codes ......................................................................................................73
7.2.2. SEC Beep Codes ........................................................................................................74
7.2.3. PEI St tus Codes .......................................................................................................74
7.2.4. PEI Beep Codes.........................................................................................................76
7.2.5. DXE St tus Codes......................................................................................................76
7.2.6. DXE Beep Codes .......................................................................................................79
7.2.7. ACPI/ASL Checkpoint ................................................................................................79
7.3. OEM-Reserved Checkpoint R nges ..................................................................................80
Contact Information ............................................................................................................. 80

Copyright © WIN Enterprises, Inc. MB-73440
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1. Introduction
COM Express™ is n open industry st nd rd defined exclusively for COMs (computer on modules) nd
offers f st solution of forw rd/b ckw rd comp tibility for leg cy I/O interf ce nd the l test
technologies v il ble now d ys. COM Express™ modules re v il ble in following form f ctors:
Type Size
COM Express ® mini 84mm x 55mm
COM Express ® Compact 95mm x 95mm
COM Express ® asic 125mm x 95mm
COM Express ® Extended 155mm x110mm
The MB-73440 bo rd is COM Express® COM.0 R2.1 Type 6 Comp ct size module fe turing the 64-bit
6th Gener tion Intel® Core™ i7/i5/i3 nd Intel® Celeron® Ultr -Low TDP processors (formerly
“Skyl ke-U”) with CPU, memory controller, gr phics processor nd I/O hub on single chip. Lever ging
the benefits provided by the 6th gener tion Intel® Core™ nd Celeron™ System-on-Chip, the MB-73440
bo rd is specific lly designed for customers who need optimum processing nd gr phics perform nce
with suit ble power consumption using Intel’s Configur ble TDP in long product life solution. The
MB-73440 bo rd’s Intel® processors support Intel® Hyper-Thre ding Technology (up to 2 cores, 4
thre ds) nd up to 32 GB of non-ECC DDR4 du l-ch nnel memory t 1866/2133 MHz in du l st cked
SODIMM sockets to provide excellent over ll perform nce.
Integr ted Intel® Gener tion 9 Low Power Gr phics includes fe tures such s OpenGL 4.4/4.3, DirectX
11.3/11, Intel® Cle r Video HD Technology, Adv nced Scheduler 2.0, 1.0, XPDM support, nd DirectX
Video Acceler tion (DXVA2) support for AVC/VC1/MPEG2/HEVC/ VP8/JPEG h rdw re decode nd
AVC/MPEG2/HEVC/VP8/JPEG h rdw re encode. Gr phics outputs include du l-ch nnel 18/24-bit LVDS
(eDP option l) nd two DDI ports supporting HDMI/DVI/Displ yPort. The MB-73440 bo rd is
specific lly designed for customers with high-perform nce processing gr phics requirements who w nt
to outsource the custom core logic of their systems for reduced development time.
The MB-73440 bo rd fe tures single onbo rd Gig bit Ethernet port, five PCIeGen3 /2 ports, four USB
3.0 ports, eight USB 2.0 ports, nd up to three SATA 6Gb/s ports(Premium-U). Support is provided for
SMBus nd I2C. The module is equipped with SPI AMI EFI BIOS with CMOS b ckup.
Types Type 1 Type 2 Type 6 Type 10
Connector Row
A- A- C-D A- C-D A-
PCI Express Lane
Up to 6 Up to 22 Up to 24 Up to 4

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PCI
N/A 32 bit N/A N/A
IDE Channel
1 1
LAN port
1 1 1 1
USB 2.0/USB 3.0
8 / 0 8 / 0 8 / 4 8 / 0
Display Interfaces
VGA, LVDS VGA, LVDS,PEG/SDVO VGA,LVDS,PEG, 3 X DDI 1x DDI
1.1. Hardware Briefing
1.1.1. TOP VIEW