Win enterprises Mb-73440 User manual

WIN Enterprises, Inc.

Custom Embedded Solutions

COM Express

MB-73440

User’s Manual

Version:

Release Date:

Part Number:

Revision History

Revision Description Date By

1.0 Initial Release 2016.5.23 T.C.

Preface

This user m nu l offers det il inform tion bout components, pinouts, connectors nd BIOS Setups of

WIN's MB-73440 bo rd. For more inform tion bout design nd development for COM Express™

pplic tions, ple se refer to documents rele sed from the PCI Industri l Computer M nuf cturers Group

(PICMG):

COM Express™ Design Guide

COM Express™ Specific tion

provided in good f ith nd is protected by copyright l ws worldwide nd no p rt of this document m y be

reproduced or tr nsmitted in ny form or by ny me ns, electronic or mech nic l, without the express

written permission of WIN Enterprises, Inc. All other tr dem rks re cknowledged s the property of their

respective owners.

Disclaimer

The inform tion cont ined within this user’s guide, including but not limited to ny product specific tion, is

subject to ch nge without notice. All inform tion listed in this user m nu l, including but not limited to

product specific tions or dr wings, is subject to ch nge without prior notice. WIN Enterprises, Inc. provides

no w rr nty in ny form with reg rd to this document nd inform tion cont ined herein nd hereby

expressly discl ims ny expressed or implied w rr nties of merch nt bility or fitness for ny p rticul r

purpose with reg rd to ny ofthe foregoing nd WIN Enterprises, Inc. ssumes no li bility for ny d m ges

incurred directly or indirectly from ny kinds of errors or omissions cont ined herein or for discrep ncies

between the product nd this document. In no event sh ll WIN Enterprises, Inc. be li ble for ny incident l,

consequenti l, speci l, or exempl ry d m ges, whether b sed on tort, contr ct or otherwise, rising out of

or in connection with this document or ny other inform tion cont ined herein or the use thereof.

Hazardous substance-Free RoHS) Compliant

This product is designed nd developed on h z rdous subst nce-free components nd p rts nd tot lly

RoHS (Restriction of H z rdous Subst nces Directive 2002/95/EC) compli nt.

Certification

WIN Enterprises, Inc. is certified to DIN EN ISO 9001 nd 14001 st nd rds.

Electrostatic Sensitive Device

This product is n electrost tic sensitive device (ESD) nd p ck ged

ccordingly. In ny c se this product c n not be opened, h ndled, stored or

tr nsported without proper ESD protection mech nisms nd ple se store

nd ship this product in its origin l m nuf cturer’s p ck ging. F ilure to

comply with these guidelines will m ke this product d m ged nd void

Limited W rr nty offered by

WIN Enterprises, Inc

Table of Contents

Revision History ..................................................................................................................... 1

Preface................................................................................................................................... 2

Table of Contents ................................................................................................................... 4

1. Introduction ....................................................................................................................... 7

1.1. H rdw re Briefing .............................................................................................................8

1.1.1. TOP VIEW ...................................................................................................................8

1.1.2. BOTTOM VIEW ...........................................................................................................9

2. Specifications ................................................................................................................... 10

2.1. CoreSystem .....................................................................................................................10

2.2. Exp nsion Busses ............................................................................................................11

2.3. Video ..............................................................................................................................11

2.4. Audio ..............................................................................................................................12

2.5. LAN .................................................................................................................................12

2.6. Multi I/O nd Stor ge......................................................................................................12

2.7. Seri l I/O .........................................................................................................................12

2.8. Trusted Pl tform Module (TPM) (Option l)......................................................................13

2.9. Debug He ders................................................................................................................13

2.10. Power Specific tions .....................................................................................................13

2.11. Environment l Requirements ........................................................................................13

2.12. Regul tory Compli nce..................................................................................................14

2.13. Oper ting Systems.........................................................................................................14

2.14. Function l Di gr m .......................................................................................................15

3. Mechanical Information.................................................................................................... 16

3.1 Mech nic l Dimensions....................................................................................................16

3.2. Module Connector ..........................................................................................................18

3.3. Therm l Solution (for reference only)..............................................................................19

3.3.1. He t Sink ..................................................................................................................19

3.3.2. Inst ll tion ...............................................................................................................19

3.4. Mounting Methods .........................................................................................................22

3.4.1. Mech nic l Specific tion ..........................................................................................22

4. Pinout Definitions............................................................................................................. 26

4.1. Connector A/B.................................................................................................................26

4.2. Connector C/D.................................................................................................................29

4.3. Sign l Definition ..............................................................................................................33

4.4. Sign l Descriptions – Connector A/B................................................................................33

4.4.1. Audio Sign ls ............................................................................................................33

4.4.2. An log VGA ..............................................................................................................34

4.4.3. LVDS/eDP .................................................................................................................34

4.4.5. Gig bit Ethernet .......................................................................................................36

4.4.6. SATA .........................................................................................................................37

4.4.7. PCI Express ...............................................................................................................38

4.4.8. LPC Bus.....................................................................................................................39

4.4.9. USB ..........................................................................................................................39

4.4.11. SPI (BIOS only) ........................................................................................................40

4.4.12. Miscell neous.........................................................................................................41

4.4.13. SMBus ....................................................................................................................41

4.4.14. I2C Bus ...................................................................................................................42

4.4.15. Gener l Purpose I/O (GPIO)....................................................................................42

4.4.16. Seri l Interf ce Sign ls............................................................................................43

4.4.17. Power nd System M n gement ............................................................................43

4.4.18. Power nd Ground..................................................................................................45

4.5. Sign l Descriptions – Connector C/D ...............................................................................46

4.5.1. USB 3.0 Extension.....................................................................................................46

4.5.2. PCI Express x1...........................................................................................................46

4.5.3. DDI Ch nnels ............................................................................................................47

4.5.4. DDI to DP/HDMI/SDVO M pping ..............................................................................49

4.5.5. Module Type Definition ............................................................................................50

4.5.6. Power nd Ground ...................................................................................................51

5. System Resources ............................................................................................................. 52

5.1. System Memory M p ......................................................................................................52

5.2. I/O M p...........................................................................................................................52

5.3. Interrupt Request (IRQ) Lines ..........................................................................................53

5.3.1. PIC Mode..................................................................................................................53

5.3.2. APIC Mode ...............................................................................................................54

5.4. PCI Configur tion Sp ce M p ..........................................................................................55

5.5. PCI Interrupt Routing M p...............................................................................................56

5.6. SMBus Address T ble.......................................................................................................56

6. BIOS Setup ....................................................................................................................... 57

6.1. M in................................................................................................................................58

6.1.1. BIOS Inform tion ......................................................................................................58

6.1.2. Memory Inform tion ................................................................................................58

6.1.3. D te nd Time ..........................................................................................................58

6.2. Adv nced ........................................................................................................................58

6.2.1. Trusted Computing ...................................................................................................58

6.2.2. CPU Configur tion ....................................................................................................59

6.2.3. ACPI Settings ............................................................................................................61

6.2.4. AMT Configur tion ...................................................................................................61

6.2.5. PCH-FW Configur tion ..............................................................................................62

6.2.6. W83627DHG Super IO Configur tion ........................................................................62

6.2.7. NCT7802Y HW Monitor ............................................................................................63

6.2.8. NVMe Configur tion.................................................................................................64

6.2.9.USB Configur tion .....................................................................................................64

6.2.10. SATA Configur tion .................................................................................................65

6.2.11.System Agent (SA) Configur tion .............................................................................66

6.2.12. PCH-IO Configur tion..............................................................................................69

6.3. Boot ................................................................................................................................71

6.4. Security ...........................................................................................................................71

6.5. S ve & Exit ......................................................................................................................71

7. BIOS Checkpoints, Beep Codes .......................................................................................... 73

7.1. St tus Code R nges .........................................................................................................73

7.2. St nd rd St tus Codes.....................................................................................................73

7.2.1. SEC St tus Codes ......................................................................................................73

7.2.2. SEC Beep Codes ........................................................................................................74

7.2.3. PEI St tus Codes .......................................................................................................74

7.2.4. PEI Beep Codes.........................................................................................................76

7.2.5. DXE St tus Codes......................................................................................................76

7.2.6. DXE Beep Codes .......................................................................................................79

7.2.7. ACPI/ASL Checkpoint ................................................................................................79

7.3. OEM-Reserved Checkpoint R nges ..................................................................................80

Contact Information ............................................................................................................. 80

1. Introduction

COM Express™ is n open industry st nd rd defined exclusively for COMs (computer on modules) nd

offers f st solution of forw rd/b ckw rd comp tibility for leg cy I/O interf ce nd the l test

technologies v il ble now d ys. COM Express™ modules re v il ble in following form f ctors:

Type Size

COM Express

mini 84mm x 55mm

COM Express

Compact 95mm x 95mm

COM Express

asic 125mm x 95mm

COM Express

Extended 155mm x110mm

The MB-73440 bo rd is COM Express® COM.0 R2.1 Type 6 Comp ct size module fe turing the 64-bit

6th Gener tion Intel® Core™ i7/i5/i3 nd Intel® Celeron® Ultr -Low TDP processors (formerly

“Skyl ke-U”) with CPU, memory controller, gr phics processor nd I/O hub on single chip. Lever ging

the benefits provided by the 6th gener tion Intel® Core™ nd Celeron™ System-on-Chip, the MB-73440

bo rd is specific lly designed for customers who need optimum processing nd gr phics perform nce

with suit ble power consumption using Intel’s Configur ble TDP in long product life solution. The

MB-73440 bo rd’s Intel® processors support Intel® Hyper-Thre ding Technology (up to 2 cores, 4

thre ds) nd up to 32 GB of non-ECC DDR4 du l-ch nnel memory t 1866/2133 MHz in du l st cked

SODIMM sockets to provide excellent over ll perform nce.

Integr ted Intel® Gener tion 9 Low Power Gr phics includes fe tures such s OpenGL 4.4/4.3, DirectX

11.3/11, Intel® Cle r Video HD Technology, Adv nced Scheduler 2.0, 1.0, XPDM support, nd DirectX

Video Acceler tion (DXVA2) support for AVC/VC1/MPEG2/HEVC/ VP8/JPEG h rdw re decode nd

AVC/MPEG2/HEVC/VP8/JPEG h rdw re encode. Gr phics outputs include du l-ch nnel 18/24-bit LVDS

(eDP option l) nd two DDI ports supporting HDMI/DVI/Displ yPort. The MB-73440 bo rd is

specific lly designed for customers with high-perform nce processing gr phics requirements who w nt

to outsource the custom core logic of their systems for reduced development time.

The MB-73440 bo rd fe tures single onbo rd Gig bit Ethernet port, five PCIeGen3 /2 ports, four USB

3.0 ports, eight USB 2.0 ports, nd up to three SATA 6Gb/s ports(Premium-U). Support is provided for

SMBus nd I2C. The module is equipped with SPI AMI EFI BIOS with CMOS b ckup.

Types Type 1 Type 2 Type 6 Type 10

Connector Row

A- A- C-D A- C-D A-

PCI Express Lane

Up to 6 Up to 22 Up to 24 Up to 4

PCI

N/A 32 bit N/A

N/A

IDE Channel

1 1

LAN port

1 1 1 1

USB 2.0/USB 3.0

8 / 0 8 / 0 8 / 4 8 / 0

Display Interfaces

VGA, LVDS VGA, LVDS,PEG/SDVO VGA,LVDS,PEG, 3 X DDI 1x DDI

1.1. Hardware Briefing

1.1.1. TOP VIEW

Mounting holes

SODIMMDDR4 slot

Port 80

XDP (Debug Header)

SATA SSD

S yLa e-U

BIOS

1.1.2. BOTTOM VIEW

Board-to-board Connector A-B

Board-to-board Connector C-D

TPM (1.2/2.0)

2. Specifications

2.1. CoreSystem

CPU



Intel® Core™

i7-6600U 2.6 GHz (3.4 GHz Turbo), 15W (cTDP support) (2C/GT2)

Intel® Core™ i5-6300U 2.4 GHz (3.0 GHz Turbo), 15W (cTDP support) (2C/GT2)

Intel® Core™ i3-6100U 2.3 GHz (no Turbo), 15W (cTDP support) (2C/GT2)

CPU Supported

Intel® VT Intel® Turbo Boost Technology 2.0

Intel® TXT Intel® AVX2

Intel® SSE4.2 Intel® AES-NI

Intel® HT Technology Intel®PCLMULQDQ Instruction

Intel® 64 Architecture Intel® Device Protection Technology with Intel® Secure Key

Intel®Execute Dis ble Bit Intel® TSXNI

Note: Av il bility of fe tures m y v ry between processor SKUs.

L3 Cache

Core™ i7 4 MB

Core™ i5 3 MB

Core™ i3 3 MB

Memory

Du l ch nnel non-ECC 1866/2133 MHz DDR4 memory up to 32 GB in du l SODIMM socket

BIOS

AMI EFI with CMOS b ckup in 16MB SPI BIOS with Intel® AMT 11.0 support (AMT supported on i7/i5

SKUs only)

Platform Controller Hub

Integr ted PCH-LP (i7/i5/i3: Premium PCH-LP)

2.2. Expansion Busses

PCIe x1

Gen3

) X5

Core™i7/i5/i3,

Lanes 1/2/3/4/6

c n be configured to:

LPC bus X1

SMBus system) X1

2.3. Video

GPU

Intel® Gener tion 9 Gr phics integr ted in CPU nd fe tured with:

Supports 3 displ ys (independently/simult neously) vi Displ y Port/HDMI/LVDS monitors (eDP

option l in pl ce of LVDS)

Encode/tr nscode high definition (HD) video supported

High definition (HD) video (e.g. Blu-r y DVD) supported

Pl yb ck of Blu-r y Disc 3D content vi HDMI (HDMI e1.4 )

DirectX Video Acceler tion (DXVA2) supported

HEVC/H.265, H.264, M/JPEG, MPEG2, VC1, WMV9, VP8/VP9 HW decode supported

HEVC/H.265, M/JPEG, MPEG2 HW encode supported

Adv nced Scheduler 2.0, 1.0 nd XPDM supported

DirectX 12, DirectX 11.3, DirectX 11, DirectX 10.1, DirectX 10 nd DirectX 9 supported

Open Gr phics Libr ry(OpenGL) 4.4 supported

OpenCL (Open Computing L ngu ge) supported

Adv nced Scheduler 2.0, 1.0, XPDM support

DirectX 11.3, OpenGL 4.4, OpenGL ES 2.0 nd OpenCL 2.0

Multi Displ y Support: 3 independent displ ys

Note: fe tures listed bove is v il ble depending on oper ting systems.

Display Interface

LVDS Single/du l ch nnel 18/24-bit LVDS to LVDS (NXP IC) vi eDP-to-LVDS chip.

eDP 4 l nes supported m ximum, integr ted in LVDS (BOM option l)

Digital Display Port x 2 Displ yPort/HDMI/DVI supported

2.4. Audio

Intel® HD Audio integr ted on SoC

Audio Codec Integr ted in AW-COMe-EVAL c rrier bo rd

2.5. LAN

Intel PHY: Intel® Ethernet Controller i219LM

Interf ce: 10/100/1000 GbE connection

2.6. Multi I/O and Storage

USB 4x USB 3.0 (USB 1,2,3)

8x USB 2.0 (USB 0,1,2,3,4,5,6,7)

SATA 3 x SATA 6Gb/s (SATA 0,1,2)

GPIO 4 GPO nd 4 GPI

Note: For SATA 6Gb/s, it is strongly recommended to inst ll SATA re-driver on the c rrier bo rd.

2.7. Serial I/O

Ports 2x UART for Rx/Tx only (Av il bility depends on the c rrier bo rd you use

with n W83627DHG LPC I/O chipset)

Description

IRQ Address

COM 1 Support by Super I/O (W83627DHG) from c rrier bo rd 4 3F8h

COM 2 Support by Super I/O (W83627DHG) from c rrier bo rd 3 2F8h

2.8. Trusted Platform Module TPM) Optional)

Chipset SLB9660XT1.2

Type TPM 1.2/TMP 2.0 (option l)

2.9. Debug Headers

Port 80 10-pin

debug

he der for LPC debug c rd di gnosing module.

60-pin XDPmerged connector for ICE debug of CPU/chipset (option l)

2.10. Power Specifications

Power Modes AT nd ATX mode

Standard Voltage Input ATX = 12V±5% / 5Vsb ±5%

AT = 12V±5%

Wide Voltage Input ATX = 5~20 V / 5Vsb ±5%

AT = 5 ~20V

Power Management ACPI 5.0 compli nt

Power States supports C1-C6, S0, S3, S4, S5 (W ke-on-USB S3, WoL S3/S4/S5)

Power Consumption For inform tion bout power consumption, ple se cont cts our business

represent tive.

2.11. Environmental Requirements

Operating Temperature St nd rd: 0

-60

C (32 – 140

Extended: -40

– 85

C (-40

– 180

Storage Temperature -40

– 85

C (-40

– 180

C @ 95% rel tive humidity, non-condensing

Humidity 5-90% RH oper ting, non-condensing

5-95% RH stor ge ( nd oper ting with conform l co ting).

Vibration Resistance IEC 60068-2-64

Halt Vibr tion Stress

2.12. Regulatory Compliance

Hazardous Substance-free RoHS) Compliant

This product is designed nd developed on h z rdous subst nce-free components nd p rts nd tot lly

RoHS (Restriction of H z rdous Subst nces Directive 2002/95/EC) compli nt.

2.13. Operating Systems

MB-73440 bo rd supports following oper ting systems:

Red H t® Enterprise 6.4

Fedor ® 20

Microsoft® Windows 7 Ultim te 64 bit

Microsoft® Windows® 8.1 Profession l 64 bit

Windows® 10 Profession l 64 bit

2.14. Functional Diagram

3. Mechanical Information

3.1 Mechanical Dimensions

Unit: mm

3.2. Module Connector

The bo rd-to-bo rd connectors re 440-pin recept cles th t re composed of 2 pieces of 220-pin, 0.5

mm pitch recept cle.

Tyco 3-6318490-6

220-pin bo rd-to-bo rd connector with 0.5mm for st cking height of 8 mm.

This connector c n be used with 8 mm through-hole st ndoffs (SMT type).

Common Specifications

Current c p city: 0.5A per pin

R ted volt ge: 50 VAC

Insul tion resist nce: 100M or gre ter @ 500 VDC

Temper ture r ting: -40

C ~ 85

UL certific tion (ECBT2.E28476)

Copper lloy (cont cts)

Housing: thermo-pl stic molded compound (L.C.P.)

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