Zeiss Crossbeam 340 User manual

Crossbeam® 340
Crossbeam®workstation
Instruction Manual

Crossbeam®340
Crossbeam®workstation
Original instructions
Carl Zeiss Microscopy GmbH
Carl-Zeiss-Promenade 10
07745 Jena, Germany
[email protected]
www.zeiss.com/microscopy
Carl Zeiss Microscopy GmbH
Carl-Zeiss-Straße 22
73447 Oberkochen
Document name: Instruction Manual Crossbeam®340
Revision: en02(COR)
Effective from: February 2015
© by Carl Zeiss Microscopy GmbH
349500-8022-200
This document or any part of it must not be translated, reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying, recording, or by any information or retrieval system. Violations will be prosecuted.
The use of general descriptive names, registered names, trademarks, etc. in this document does not imply, even in the absence of a
specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use.
Software programs will fully remain the property of Carl Zeiss Microscopy. No program, documentation or subsequent upgrade thereof
may be disclosed to any third party, unless prior written consent of Carl Zeiss Microscopy has been procured to do so, nor may they be
copied or otherwise duplicated, even for the customer’s internal needs apart from a single back-up copy for safety purposes.
Due to an ongoing process of improvement Carl Zeiss Microscopy reserves the right to make modifications of this document without
notice.

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Table of contents
1. About this instruction manual .................................................................... 7
1.1. Safety instructions in this manual .................................................................. 8
1.2. Typographical conventions ............................................................................ 9
1.3. Definition of terms ......................................................................................... 10
2. Safety .......................................................................................................... 11
2.1. Intended use ................................................................................................... 11
2.2. Prevention of accidents and of improper use ............................................. 12
2.3. Safety summary ............................................................................................. 13
2.3.1. Hazards related to personal injury ......................................................................... 13
2.3.2. Hazards not related to personal injury ................................................................... 16
2.4. Safety equipment ........................................................................................... 16
2.4.1. Safety devices ....................................................................................................... 16
2.4.1.1. Protective cover panels................................................................................................. 16
2.4.1.2. Interlock system ............................................................................................................ 17
2.4.1.3. MAIN switch .................................................................................................................. 17
2.4.1.4. Start button S2 (with optional EMO function only)......................................................... 18
2.4.1.5. EMO button (optional, but mandatory for compliance with SEMI S2) ........................... 18
2.4.1.6. Main shut-off valves ...................................................................................................... 19
2.4.2. Safety labels and labels ........................................................................................ 19
2.4.2.1. At the front of the microscope ....................................................................................... 20
2.4.2.2. At the rear of the electron optical column...................................................................... 21
2.4.2.3. At the rear of the microscope........................................................................................ 22
2.4.2.4. Inside microscope ......................................................................................................... 23
2.4.3. Material Safety Data Sheets .................................................................................. 23
3. Description ................................................................................................. 25
3.1. Workstation .................................................................................................... 25
3.2. Control elements ............................................................................................ 26
3.2.1. SmartSEM®user interface .................................................................................... 26
3.2.1.1. Main areas in SmartSEM®............................................................................................ 26
3.2.1.2. SmartSEM®controls ..................................................................................................... 27
3.2.2. Dual joystick .......................................................................................................... 28
3.3. Principle of operation .................................................................................... 29
3.3.1. Vacuum system ..................................................................................................... 29
3.3.2. Electron optics (GEMINI®column) ........................................................................ 33
3.3.3. Imaging modes ...................................................................................................... 34
3.3.4. Signal detection ..................................................................................................... 35
3.3.4.1. In-lens SE detector........................................................................................................ 36
3.3.4.2. SE2 detector.................................................................................................................. 37
3.3.4.3. VPSE detector............................................................................................................... 39
3.3.5. Specimen stage ..................................................................................................... 40

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3.4. Options ............................................................................................................41
3.4.1. Applications ........................................................................................................... 41
3.4.2. Control panel ......................................................................................................... 42
3.4.3. Ion optics (FIB column) .......................................................................................... 43
3.4.4. Gas injection system (GIS) .................................................................................... 44
3.4.5. Charge Compensator ............................................................................................ 44
3.4.6. Airlock .................................................................................................................... 44
3.4.7. Rapid Laser Ablation Upgrade .............................................................................. 44
3.4.8. Detectors ...............................................................................................................45
3.4.8.1. In-lens Duo detector...................................................................................................... 45
3.4.8.2. SESI detector................................................................................................................ 46
3.5. Technical data .................................................................................................47
3.5.1. Specifications ........................................................................................................ 47
3.5.2. Installation requirements ....................................................................................... 52
3.5.3. Layout and connections ........................................................................................ 54
3.5.4. System layout ........................................................................................................ 55
3.6. Customer service ............................................................................................56
3.7. Radiation protection .......................................................................................56
4. Transport and storage ...............................................................................57
4.1. Transport .........................................................................................................57
4.2. Storage ............................................................................................................58
5. Installation ...................................................................................................59
6. Operation .....................................................................................................61
6.1. Switching on the microscope ........................................................................61
6.2. Starting the SmartSEM®user interface ........................................................62
6.3. Finding your way in the SmartSEM®user interface ....................................63
6.3.1. Showing or hiding toolbars .................................................................................... 63
6.3.2. Showing or hiding the data zone ........................................................................... 63
6.3.3. Showing a full screen image .................................................................................. 64
6.3.4. Preparing the docking panel for operation ............................................................. 64
6.3.4.1. Showing the docking panel........................................................................................... 64
6.3.4.2. Adding control panels to the docking panel .................................................................. 65
6.4. Obtaining a first image ...................................................................................66
6.4.1. Preparing the sample holder ................................................................................. 67
6.4.2. Loading the specimen chamber ............................................................................ 68
6.4.3. Locating the specimen .......................................................................................... 71
6.4.4. Switching on the gun ............................................................................................. 73
6.4.5. Switching on the EHT ............................................................................................ 74
6.4.6. Generating an image ............................................................................................. 75
6.4.7. Optimising the image ............................................................................................. 77
6.4.8. Saving the image ................................................................................................... 80

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6.5. Changing between vacuum modes .............................................................. 82
6.5.1. Changing to VP mode ........................................................................................... 82
6.5.2. Returning to HV mode ........................................................................................... 82
6.6. Setting SEM parameters ................................................................................ 83
6.6.1. Viewing the probe current ..................................................................................... 83
6.6.1.1. Changing the extractor voltage ..................................................................................... 83
6.6.1.2. Measuring the specimen current................................................................................... 84
6.6.2. Setting detection parameters ................................................................................ 85
6.6.2.1. Selecting a detector....................................................................................................... 86
6.6.2.2. Using the SE2 detector ................................................................................................. 86
6.6.2.3. Using the VPSE detector............................................................................................... 87
6.6.2.4. Using the SESI detector (optional)................................................................................ 88
6.7. Electron beam deposition or etching (with GIS upgrade only) ................. 89
6.7.1. Heating the reservoirs ........................................................................................... 90
6.7.2. Depositing or etching with the electron beam ....................................................... 91
6.8. Crossbeam operation .................................................................................... 92
6.8.1. Preparing the workstation ...................................................................................... 92
6.8.1.1. Getting started............................................................................................................... 92
6.8.1.2. Adjusting tilt eucentricity................................................................................................ 93
6.8.1.3. Switching on the ion beam (FIB)................................................................................... 94
6.8.1.4. Setting the coincidence point ........................................................................................ 97
6.8.2. Gas assisted deposition: Platinum (with GIS upgrade only) ................................. 98
6.8.2.1. Heating the platinum reservoir ...................................................................................... 98
6.8.2.2. Outgassing the platinum reservoir................................................................................. 99
6.9. Using the help functions ............................................................................. 101
6.9.1. Calling the SmartSEM®help window .................................................................. 101
6.9.1.1. Printing help texts........................................................................................................ 101
6.9.1.2. Bringing help texts to the foreground .......................................................................... 101
6.9.2. Calling the context-sensitive help ........................................................................ 101
6.9.3. Searching for a topic ........................................................................................... 102
6.9.4. Using the step-by-step guides ............................................................................. 102
6.9.4.1. Getting started............................................................................................................. 102
6.9.4.2. Frequently used operation sequences........................................................................ 102
6.9.5. Calling the short cuts help ................................................................................... 102
6.9.6. Showing information about SmartSEM®............................................................. 103
6.9.6.1. Version history............................................................................................................. 103
6.9.6.2. About SmartSEM®....................................................................................................... 103
6.10. Finishing the work session ....................................................................... 104
6.10.1. Switching off the EHT ........................................................................................ 104
6.10.2. Logging off from the SmartSEM®user interface ............................................... 104
6.11. Changing to STANDBY mode ................................................................... 105
6.12. Switching off the microscope ................................................................... 106
6.12.1. Changing to OFF mode ..................................................................................... 106
6.12.2. Closing the main shut-off valves ....................................................................... 106
6.13. Switching off the microscope in an emergency (EMO) .......................... 107

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6.13.1. Switching off in an emergency with EMO option installed ................................. 107
6.13.2. Switching off in an emergency without EMO option installed ............................ 107
6.13.3. Switching on again the microscope after an emergency off .............................. 108
7. Maintenance and repair ...........................................................................109
7.1. Maintenance work .........................................................................................109
7.2. Maintenance intervals ..................................................................................109
7.3. Change of consumables and chemicals ....................................................110
8. Troubleshooting .......................................................................................111
8.1. Overview ........................................................................................................111
8.2. Chamber ........................................................................................................113
8.2.1. Initialising the stage ............................................................................................. 113
8.2.2. Replacing the chamber door seal ........................................................................ 113
8.3. Column ..........................................................................................................115
8.3.1. Baking out the gun head ..................................................................................... 115
8.3.2. Ion source ............................................................................................................ 116
8.3.2.1. Checking the lifetime of the ion source....................................................................... 116
8.3.2.2. Regenerating by heating............................................................................................. 116
8.4. Power circuit .................................................................................................119
8.4.1. Checking the circuit breakers .............................................................................. 119
9. Shutdown and disposal ...........................................................................121
9.1. Putting the microscope out of operation ...................................................121
9.2. Disposal .........................................................................................................122
9.2.1. Disposing of solid waste (consumables) ............................................................. 122
9.2.2. Disposing of the microscope ............................................................................... 122
10. Parts and tools ........................................................................................123
10.1. Important consumables .............................................................................123
10.2. Important spare parts .................................................................................124
10.3. Tools and accessories ...............................................................................124
11. Abbreviations ..........................................................................................125
12. Glossary ..................................................................................................127
13. Declaration of conformity ......................................................................129
14. Index ........................................................................................................131

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1. About this instruction manual
This instruction manual is considered to be part of the field emission scanning electron micro-
scope with focused ion beam option (FIB-SEM), hereinafter referred to as "microscope".
Read the instructions carefully. Keep the instruction manual nearby the microscope and hand it
over to future owners of the microscope.
This instruction manual is designed for users/operators who have been trained to operate the mi-
croscope by an authorised Carl Zeiss expert. Users/operators of the microscope must not deviate
from the instructions provided in this document.
Reference to
related
documents
and software
For details on options, such as Charge Compensator or 80-mm airlock, refer to the respective in-
struction manuals delivered with the microscope. You will find these manuals in the microscope
document folder.
For detailed information regarding the operating software of the microscope, refer to the Software
Manual SmartSEM®.
For detailed information regarding the operating software of the FIB refer to the SmartFIB online
help.
For technical data, refer to the documents Product Specification and Installation Requirements.
This instruction manual refers to the operating software SmartSEM®V05.07.
At a glance This instruction manual contains the following chapters:
1. About this manual Explains function and structure of this instruction manual
2. Safety Summarises important safety details
3. Description Describes structure and principle of operation of the microscope
4. Transport and storage Gives details on transport and storage
5. Installation Refers to Carl Zeiss service staff
6. Operation Introduces fundamental operation procedures
7. Maintenance and repair Describes preventive maintenance and repair tasks
8. Troubleshooting Summarises clues to solve possible problems
9. Shutdown and disposal Summarises notes on shutdown and disposal
10. Parts and tools Lists consumables, spare parts, tools, and accessories
11. Abbreviations Alphabetical list of abbreviations used in this instruction manual
12. Glossary Alphabetical list of important technical terms
13. Declaration of conformity Manufacturers declaration that the equipment is in conformity with all
applicable European Directives
14. Index Alphabetical list of key words that are referred to in this instruction
manual

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1.1. Safety instructions in this manual
The safety instructions in this manual follow a system of risk levels, that are defined as follows:
DANGER
This safety alert symbol and signal word indicates an imminently hazardous situation.
Disregarding this warning WILL result in death or serious injury.
WARNING
This safety alert symbol and signal word indicates a potentially hazardous situation.
Disregarding this warning COULD result in death or serious injury.
CAUTION
This safety alert symbol and signal word indicates a potentially hazardous situation.
Disregarding this warning MAY result in minor or moderate injury.
CAUTION
This signal word used without a safety symbol indicates a potentially hazardous situation.
Disregarding this warning MAY result in property damage.
IMPORTANT
This symbol and signal word draws your attention to important and useful
information.

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1.2. Typographical conventions
For the description of software, the following typographical conventions are used:
Typography Meaning
Push <ENTER>. Push the ENTER key on the keyboard.
Type <key1, key2> Type key 1 first, then type key 2 on the keyboard.
Type <Ctrl + Alt + Del>. Simultaneously type CTRL key, ALT key and DEL
key on the keyboard.
Click the Magnification icon.
On the menu, select File/Exit.Icons, buttons, and menus are printed in bold.
In the EHT target field, enter 10 kV. Values to be selected are printed in italics.
Text Meaning
Click... Press the left mouse button.
Right-click... Press the right mouse button.
Double-click.... Press the left mouse button twice.
Right double-click... Press the right mouse button twice.

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1.3. Definition of terms
The following terms are used in this instruction manual:
FIB-SEM Crossbeam 340 is a field emission scanning electron microscope
equipped with the focused ion beam option.
SmartSEM®Operating software for ZEISS field emission scanning electron micro-
scopes.
SmartFIB®Operating software for ZEISS FIB option.
Carl Zeiss service engineer,
Carl Zeiss service staff Specially trained service expert, either Carl Zeiss staff or authorised service partner of Carl Zeiss.
Operator A trained person, who operates the microscope.
User A person or organisation that uses products of Carl Zeiss Microscopy.
EMO box The Emergency OFF Box (EMO-Box) is a safety device integrated in
the AC-Unit. When pushing the EMO button in an emergency situation,
the EMO-Box will interrupt the mains between main switch and the rest
of the equipment by two contactors connected in series.
The EMO box is optional, but mandatory for compliance with SEMI S2.

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2. Safety
2.1. Intended use
Crossbeam 340 is aworkstation that allows microscopic examination and modification of suitable
specimens.
The workstation allows you to perform the full range of FESEM and CrossBeam® applications,
which are:
•SEM operation
A focused beam of electrons is scanned across the specimen to generate an image or to an-
alyse the specimen.
Suitable for the analysis of surface structures and near-surfacestructuresof appropriatespec-
imens.
•FIB Imaging
A focused beam of ions is scanned across the specimen to generate an image or to analyse
the specimen.
•Milling
A focused beam of ions locally removes material from the specimen surface.
•Gas assisted etching with ion beam (requires optional gas injection system)
With the help of a process gas, the removal of material via the focused ion beam can be ac-
celerated.
•Gas assisted deposition with ion beam (requires optional gas injection system)
With the help of a process gas, the focused ion beam deposits material onto the specimen
surface.
•Gas assisted etching with electron beam (requires optional gas injection system)
With the help of a process gas, the removal of material via the focused electron beam can be
accelerated.
•Gas assisted deposition with electron beam (requires optional gas injection system)
With the help of a process gas, the electron beam deposits material onto the specimen sur-
face.
For all of these applications, the specimen has to be located in the evacuated specimen chamber.
IMPORTANT
Depending on the upgrade stage of your workstation, not all of theses features may be
available.
Commercial
use only The microscope is to be used in a laboratory environment for commercial and scientific purpose
only.
Using the microscope for any other purpose is not allowed and could be hazardous.

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2.2. Prevention of accidents and of improper use
CAUTION
Risk of injury or damage due to improper operation of the microscope.
Read the user documentation carefully.
Do not operate the microscope until you have completely read and understood this in-
struction manual and the entire user documentation delivered with the microscope. You
will find the user documentation in the microscope document folder.
Operator
training Within the scope of initial start-up the Carl Zeiss Microscopy service staff will perform a basic op-
erator training. The basic operator training consists of fundamental operation procedures includ-
ing safety instructions. Besides, an introduction to basic maintenance tasks will be given for an
advanced operator, who has to be an electrically skilled person.
The training performed shall be documented appropriately.
Special application trainings are offered on request.
CAUTION
All pursuing tasks of maintenance, service, and repair not described in this instruction
manual have to be performed by authorised Carl Zeiss service staff only.

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2.3. Safety summary
Follow the safety instructions given in this instruction manual. This is essential to protect yourself
and others against accidents and unsafe practices and to prevent damage. Do not deviate from
the instructions provided in this instruction manual.
This section summarises hazards and recommended safety procedures.
2.3.1. Hazards related to personal injury
Service tasks
DANGER
Danger to life: Hazardous voltage inside the microscope.
Only service engineers trained and authorised by Carl Zeiss are allowed to service the mi-
croscope.
Radiation
protection X-rays are produced within the microscope during operation. This is unavoidable during operation
due to accelerated electrons by voltages up to 30 kV.
WARNING
Radiation hazard: X-rays are generated inside the microscope during operation.
Only authorised Carl Zeiss service engineers are allowed to service the microscope.
Do not remove any parts around column and chamber.
Observe all safety and X-ray protection regulations.
In Germany, the operation of themicroscope is permission-free as the following requirements are
fulfilled:
•The acceleration voltage is limited to 30 kV.
•The local dose rate at a distance of 0.1 m from the accessible surface of the microscope does
not exceed 1 µSv/h.
•A respective label is attached to the microscope.
Outside Germany, the user of the microscope has to comply with the local regulations of the coun-
try where the microscope is operated.
The microscope is equipped with several radiation protection devices, which ensure - under reg-
ular operation conditions - that the workstation operates in accordance withthe German X-ray pro-
tection regulation (RöV) respectively the German radiation protection regulation (StrSchV) as well
as with the EC Directive 96/29/EURATOM.

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Electrical
connections CAUTION
High leakage current
Ensure proper grounding.
Do not operate the microscope without separate ground connection.
Gases Gaseous dry nitrogen is used to ventilate the specimen chamber during specimen exchange.
Compressed air is used to operate several valves and the auto levelling system.
CAUTION
Suffocation hazard due to lack of oxygen
Inhaling nitrogen may cause unconsciousness.
During specimen exchange, keep the chamber door open as short as possible.
Avoid inhaling the air from within the specimen chamber.
Ensure the area around the microscope is sufficiently ventilated.
Concerning the hazards of nitrogen installations and associated safety precautions refer to guide-
line IGC Doc 44/xx/E: Hazards of inert gases, published by EIGA (European Industrial Gases As-
sociation).
To download the document:
1 Go to EIGA homepage www.eiga.org > Publications > IGC/MGC/SAC Documents.
2 From the Quick list, select Doc. 44/09.
3 Click download.
CAUTION
Risk of injury or damage due to the high internal pressure in gas cylinders (e.g. containing
nitrogen or compressed air).
Observe all safety instructions given by the gas cylinder manufacturer and all safety labels
on the gas cylinders.
Operation
CAUTION
Risk of injury
Fingers could be trapped in the moving specimen stage.
Always close the chamber door before moving the specimen stage.

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CAUTION
Risk of injury when working with aggressive or toxic chemicals.
Wear suitable protective clothing, gloves and eye/face protection. Do not eat, drink or
smoke at work. Refer to local safety regulations.
CAUTION
Risk of damage to environment due to aggressive or toxic chemicals.
When disposing of waste that has been generated during a service operation (e.g. used ro-
tary pump oil) comply with all national and local safety and environmental protection reg-
ulations.
Maintenance
procedures Baking out the gun head has to be performed as a regular maintenance procedure.
Only advanced operators are allowed to perform the bakeout procedure.
CAUTION
Burn hazard
Some parts inside the microscope will get hot during the bakeout procedure.
Do not place any combustible objects on the top of the electron optical column during
bakeout and afterwards until the surfaces have cooled down again.
Only authorised Carl Zeiss service staff is allowed to service the equipment. After the bake-
out procedure let surfaces cool down before working around the column.

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2.3.2. Hazards not related to personal injury
CAUTION
Risk of property damage when opening the chamber door.
microscope or specimen could be damaged if specimen stage is at a short working dis-
tance when opening the chamber door.
Always move specimen stage to long working distance before opening the chamber door.
CAUTION
Risk of property damage
Connect ZEISS approved equipment only.
Ensure the total load connected to the microscope does not exceed 10 A at 230VAC.
IMPORTANT
Fingerprints can cause virtual vacuum leaks.
Always wear lint-free gloves when touching the specimen or inner parts of the specimen
chamber.
2.4. Safety equipment
2.4.1. Safety devices
Inorderto preventhazardsto humanhealth,or propertydamage,themicroscopeis equippedwith
several safety and protective devices.
2.4.1.1. Protective cover panels
Plinth, electron optical column and specimen chamber are secured with protective cover panels.
WARNING
Hazardous voltage inside the microscope. Contact may cause burn or electric shock.
X-rays are generated inside the microscope during operation.
Do not remove any parts.
The microscope must not be operated with removed protective cover panels.

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2.4.1.2. Interlock system
The interlock system includes several functions.
Chamber door interlock
The chamber door interlock is located at the inner
bottom front side of the specimen chamber.
It ensures that the door of the specimen chamber
is closed properly.
When this interlock is activated (i.e. no electrical
contact) ’EHT Vac ready = no’ is indicated in the
SmartSEM®userinterface. EHTand SE2detector
voltages are blocked.
Interlock to airlock
On the right side of the rear there is an interlock to
the optional 80-mm airlock.
Vacuum interlock
The vacuum interlock is an internal interlock.
It ensures that gun vacuum and system vacuum
are better than the required thresholds.
2.4.1.3. MAIN switch
The MAIN switch is essential for compliance with
SEMI standard.
The MAIN switch is located at the rear of the plinth.
It cuts off both phases of the mains power from the
microscope.
The MAIN switch has an emergency off function
and can be secured against resetting.

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2.4.1.4. Start button S2 (with optional EMO function only)
TheS2 button (1) is located at the rear of the plinth
underneath the MAIN switch.
It is required to confirm the setting of the MAIN
switch.
It cuts off all devices connected to the EMO box
fromthe mainspower supply.The mainswitch can
be secured against re-activation.
The main switch guarantees an ampere interrupt-
ing capacity (AIC) of at least 10000 A rms.
2.4.1.5. EMO button (optional, but mandatory for compliance with SEMI S2)
The Emergency off button (1, EMO button) is
located on the plinth adjacent to the specimen
chamber.
The EMO button is to be pressed in an emergency
to cut off mains power to the microscope and all
devices connected to the EMO box via the AC-
Unit.
The EMO button must always be readily accessi-
ble and operable.
1
1

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2.4.1.6. Main shut-off valves
The user is responsible for the installation of main shut-off valves at the site of installation. The
following main shut-off valves are required:
•water supply
•water runback
•nitrogen supply
•compressed air supply
The main shut-off valves have to be easily accessible. They must close off the connections to the
corresponding media when needed. The main shut-off valves have to be lockable in their OFF
position in order to prevent accidental re-activation.
As the user is responsible for installing the main shut-off valves, he/she should also provide in-
structions how to operate the main shut-off valves properly.
2.4.2. Safety labels and labels
Appropriate safety labels on the microscope warn users of hazards. Each safety label is
affixed close to the point where a particular hazard exists. Moreover, you will find several labels
which provide legal information.

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2.4.2.1. At the front of the microscope
Position Subject Label
A Safety
information
Risk of injury
Fingers could be trapped.
Always close the chamber door
before you move the stage.
Order number: 347800-0033-000-02en
B Safety
information
Risk of damage
Microscope or specimen stage could be damaged if
the specimen stage is at short working distance. Move
specimen stage to longer working distance before
opening the chamber door.
Order number: 347800-0033-000-04en
C Safety
information
Avoid injury
Read and understand the instruction manual before
operating this product.
Order number: 347800-0033-000-01en
C
A
B
WARNING
CAUTION
CAUTION