Zeiss Crossbeam 340 User manual

Crossbeam® 340
Crossbeam®workstation
Instruction Manual

Crossbeam®340
Crossbeam®workstation
Original instructions
Carl Zeiss Microscopy GmbH
Carl-Zeiss-Promenade 10
07745 Jena, Germany
[email protected]
www.zeiss.com/microscopy
Carl Zeiss Microscopy GmbH
Carl-Zeiss-Straße 22
73447 Oberkochen
Document name: Instruction Manual Crossbeam®340
Revision: en02(COR)
Effective from: February 2015
© by Carl Zeiss Microscopy GmbH
349500-8022-200
This document or any part of it must not be translated, reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying, recording, or by any information or retrieval system. Violations will be prosecuted.
The use of general descriptive names, registered names, trademarks, etc. in this document does not imply, even in the absence of a
specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use.
Software programs will fully remain the property of Carl Zeiss Microscopy. No program, documentation or subsequent upgrade thereof
may be disclosed to any third party, unless prior written consent of Carl Zeiss Microscopy has been procured to do so, nor may they be
copied or otherwise duplicated, even for the customer’s internal needs apart from a single back-up copy for safety purposes.
Due to an ongoing process of improvement Carl Zeiss Microscopy reserves the right to make modifications of this document without
notice.

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Table of contents
1. About this instruction manual .................................................................... 7
1.1. Safety instructions in this manual .................................................................. 8
1.2. Typographical conventions ............................................................................ 9
1.3. Definition of terms ......................................................................................... 10
2. Safety .......................................................................................................... 11
2.1. Intended use ................................................................................................... 11
2.2. Prevention of accidents and of improper use ............................................. 12
2.3. Safety summary ............................................................................................. 13
2.3.1. Hazards related to personal injury ......................................................................... 13
2.3.2. Hazards not related to personal injury ................................................................... 16
2.4. Safety equipment ........................................................................................... 16
2.4.1. Safety devices ....................................................................................................... 16
2.4.1.1. Protective cover panels................................................................................................. 16
2.4.1.2. Interlock system ............................................................................................................ 17
2.4.1.3. MAIN switch .................................................................................................................. 17
2.4.1.4. Start button S2 (with optional EMO function only)......................................................... 18
2.4.1.5. EMO button (optional, but mandatory for compliance with SEMI S2) ........................... 18
2.4.1.6. Main shut-off valves ...................................................................................................... 19
2.4.2. Safety labels and labels ........................................................................................ 19
2.4.2.1. At the front of the microscope ....................................................................................... 20
2.4.2.2. At the rear of the electron optical column...................................................................... 21
2.4.2.3. At the rear of the microscope........................................................................................ 22
2.4.2.4. Inside microscope ......................................................................................................... 23
2.4.3. Material Safety Data Sheets .................................................................................. 23
3. Description ................................................................................................. 25
3.1. Workstation .................................................................................................... 25
3.2. Control elements ............................................................................................ 26
3.2.1. SmartSEM®user interface .................................................................................... 26
3.2.1.1. Main areas in SmartSEM®............................................................................................ 26
3.2.1.2. SmartSEM®controls ..................................................................................................... 27
3.2.2. Dual joystick .......................................................................................................... 28
3.3. Principle of operation .................................................................................... 29
3.3.1. Vacuum system ..................................................................................................... 29
3.3.2. Electron optics (GEMINI®column) ........................................................................ 33
3.3.3. Imaging modes ...................................................................................................... 34
3.3.4. Signal detection ..................................................................................................... 35
3.3.4.1. In-lens SE detector........................................................................................................ 36
3.3.4.2. SE2 detector.................................................................................................................. 37
3.3.4.3. VPSE detector............................................................................................................... 39
3.3.5. Specimen stage ..................................................................................................... 40

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3.4. Options ............................................................................................................41
3.4.1. Applications ........................................................................................................... 41
3.4.2. Control panel ......................................................................................................... 42
3.4.3. Ion optics (FIB column) .......................................................................................... 43
3.4.4. Gas injection system (GIS) .................................................................................... 44
3.4.5. Charge Compensator ............................................................................................ 44
3.4.6. Airlock .................................................................................................................... 44
3.4.7. Rapid Laser Ablation Upgrade .............................................................................. 44
3.4.8. Detectors ...............................................................................................................45
3.4.8.1. In-lens Duo detector...................................................................................................... 45
3.4.8.2. SESI detector................................................................................................................ 46
3.5. Technical data .................................................................................................47
3.5.1. Specifications ........................................................................................................ 47
3.5.2. Installation requirements ....................................................................................... 52
3.5.3. Layout and connections ........................................................................................ 54
3.5.4. System layout ........................................................................................................ 55
3.6. Customer service ............................................................................................56
3.7. Radiation protection .......................................................................................56
4. Transport and storage ...............................................................................57
4.1. Transport .........................................................................................................57
4.2. Storage ............................................................................................................58
5. Installation ...................................................................................................59
6. Operation .....................................................................................................61
6.1. Switching on the microscope ........................................................................61
6.2. Starting the SmartSEM®user interface ........................................................62
6.3. Finding your way in the SmartSEM®user interface ....................................63
6.3.1. Showing or hiding toolbars .................................................................................... 63
6.3.2. Showing or hiding the data zone ........................................................................... 63
6.3.3. Showing a full screen image .................................................................................. 64
6.3.4. Preparing the docking panel for operation ............................................................. 64
6.3.4.1. Showing the docking panel........................................................................................... 64
6.3.4.2. Adding control panels to the docking panel .................................................................. 65
6.4. Obtaining a first image ...................................................................................66
6.4.1. Preparing the sample holder ................................................................................. 67
6.4.2. Loading the specimen chamber ............................................................................ 68
6.4.3. Locating the specimen .......................................................................................... 71
6.4.4. Switching on the gun ............................................................................................. 73
6.4.5. Switching on the EHT ............................................................................................ 74
6.4.6. Generating an image ............................................................................................. 75
6.4.7. Optimising the image ............................................................................................. 77
6.4.8. Saving the image ................................................................................................... 80

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6.5. Changing between vacuum modes .............................................................. 82
6.5.1. Changing to VP mode ........................................................................................... 82
6.5.2. Returning to HV mode ........................................................................................... 82
6.6. Setting SEM parameters ................................................................................ 83
6.6.1. Viewing the probe current ..................................................................................... 83
6.6.1.1. Changing the extractor voltage ..................................................................................... 83
6.6.1.2. Measuring the specimen current................................................................................... 84
6.6.2. Setting detection parameters ................................................................................ 85
6.6.2.1. Selecting a detector....................................................................................................... 86
6.6.2.2. Using the SE2 detector ................................................................................................. 86
6.6.2.3. Using the VPSE detector............................................................................................... 87
6.6.2.4. Using the SESI detector (optional)................................................................................ 88
6.7. Electron beam deposition or etching (with GIS upgrade only) ................. 89
6.7.1. Heating the reservoirs ........................................................................................... 90
6.7.2. Depositing or etching with the electron beam ....................................................... 91
6.8. Crossbeam operation .................................................................................... 92
6.8.1. Preparing the workstation ...................................................................................... 92
6.8.1.1. Getting started............................................................................................................... 92
6.8.1.2. Adjusting tilt eucentricity................................................................................................ 93
6.8.1.3. Switching on the ion beam (FIB)................................................................................... 94
6.8.1.4. Setting the coincidence point ........................................................................................ 97
6.8.2. Gas assisted deposition: Platinum (with GIS upgrade only) ................................. 98
6.8.2.1. Heating the platinum reservoir ...................................................................................... 98
6.8.2.2. Outgassing the platinum reservoir................................................................................. 99
6.9. Using the help functions ............................................................................. 101
6.9.1. Calling the SmartSEM®help window .................................................................. 101
6.9.1.1. Printing help texts........................................................................................................ 101
6.9.1.2. Bringing help texts to the foreground .......................................................................... 101
6.9.2. Calling the context-sensitive help ........................................................................ 101
6.9.3. Searching for a topic ........................................................................................... 102
6.9.4. Using the step-by-step guides ............................................................................. 102
6.9.4.1. Getting started............................................................................................................. 102
6.9.4.2. Frequently used operation sequences........................................................................ 102
6.9.5. Calling the short cuts help ................................................................................... 102
6.9.6. Showing information about SmartSEM®............................................................. 103
6.9.6.1. Version history............................................................................................................. 103
6.9.6.2. About SmartSEM®....................................................................................................... 103
6.10. Finishing the work session ....................................................................... 104
6.10.1. Switching off the EHT ........................................................................................ 104
6.10.2. Logging off from the SmartSEM®user interface ............................................... 104
6.11. Changing to STANDBY mode ................................................................... 105
6.12. Switching off the microscope ................................................................... 106
6.12.1. Changing to OFF mode ..................................................................................... 106
6.12.2. Closing the main shut-off valves ....................................................................... 106
6.13. Switching off the microscope in an emergency (EMO) .......................... 107

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6.13.1. Switching off in an emergency with EMO option installed ................................. 107
6.13.2. Switching off in an emergency without EMO option installed ............................ 107
6.13.3. Switching on again the microscope after an emergency off .............................. 108
7. Maintenance and repair ...........................................................................109
7.1. Maintenance work .........................................................................................109
7.2. Maintenance intervals ..................................................................................109
7.3. Change of consumables and chemicals ....................................................110
8. Troubleshooting .......................................................................................111
8.1. Overview ........................................................................................................111
8.2. Chamber ........................................................................................................113
8.2.1. Initialising the stage ............................................................................................. 113
8.2.2. Replacing the chamber door seal ........................................................................ 113
8.3. Column ..........................................................................................................115
8.3.1. Baking out the gun head ..................................................................................... 115
8.3.2. Ion source ............................................................................................................ 116
8.3.2.1. Checking the lifetime of the ion source....................................................................... 116
8.3.2.2. Regenerating by heating............................................................................................. 116
8.4. Power circuit .................................................................................................119
8.4.1. Checking the circuit breakers .............................................................................. 119
9. Shutdown and disposal ...........................................................................121
9.1. Putting the microscope out of operation ...................................................121
9.2. Disposal .........................................................................................................122
9.2.1. Disposing of solid waste (consumables) ............................................................. 122
9.2.2. Disposing of the microscope ............................................................................... 122
10. Parts and tools ........................................................................................123
10.1. Important consumables .............................................................................123
10.2. Important spare parts .................................................................................124
10.3. Tools and accessories ...............................................................................124
11. Abbreviations ..........................................................................................125
12. Glossary ..................................................................................................127
13. Declaration of conformity ......................................................................129
14. Index ........................................................................................................131

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1. About this instruction manual
This instruction manual is considered to be part of the field emission scanning electron micro-
scope with focused ion beam option (FIB-SEM), hereinafter referred to as "microscope".
Read the instructions carefully. Keep the instruction manual nearby the microscope and hand it
over to future owners of the microscope.
This instruction manual is designed for users/operators who have been trained to operate the mi-
croscope by an authorised Carl Zeiss expert. Users/operators of the microscope must not deviate
from the instructions provided in this document.
Reference to
related
documents
and software
For details on options, such as Charge Compensator or 80-mm airlock, refer to the respective in-
struction manuals delivered with the microscope. You will find these manuals in the microscope
document folder.
For detailed information regarding the operating software of the microscope, refer to the Software
Manual SmartSEM®.
For detailed information regarding the operating software of the FIB refer to the SmartFIB online
help.
For technical data, refer to the documents Product Specification and Installation Requirements.
This instruction manual refers to the operating software SmartSEM®V05.07.
At a glance This instruction manual contains the following chapters:
1. About this manual Explains function and structure of this instruction manual
2. Safety Summarises important safety details
3. Description Describes structure and principle of operation of the microscope
4. Transport and storage Gives details on transport and storage
5. Installation Refers to Carl Zeiss service staff
6. Operation Introduces fundamental operation procedures
7. Maintenance and repair Describes preventive maintenance and repair tasks
8. Troubleshooting Summarises clues to solve possible problems
9. Shutdown and disposal Summarises notes on shutdown and disposal
10. Parts and tools Lists consumables, spare parts, tools, and accessories
11. Abbreviations Alphabetical list of abbreviations used in this instruction manual
12. Glossary Alphabetical list of important technical terms
13. Declaration of conformity Manufacturers declaration that the equipment is in conformity with all
applicable European Directives
14. Index Alphabetical list of key words that are referred to in this instruction
manual

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1.1. Safety instructions in this manual
The safety instructions in this manual follow a system of risk levels, that are defined as follows:
DANGER
This safety alert symbol and signal word indicates an imminently hazardous situation.
Disregarding this warning WILL result in death or serious injury.
WARNING
This safety alert symbol and signal word indicates a potentially hazardous situation.
Disregarding this warning COULD result in death or serious injury.
CAUTION
This safety alert symbol and signal word indicates a potentially hazardous situation.
Disregarding this warning MAY result in minor or moderate injury.
CAUTION
This signal word used without a safety symbol indicates a potentially hazardous situation.
Disregarding this warning MAY result in property damage.
IMPORTANT
This symbol and signal word draws your attention to important and useful
information.

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1.2. Typographical conventions
For the description of software, the following typographical conventions are used:
Typography Meaning
Push <ENTER>. Push the ENTER key on the keyboard.
Type <key1, key2> Type key 1 first, then type key 2 on the keyboard.
Type <Ctrl + Alt + Del>. Simultaneously type CTRL key, ALT key and DEL
key on the keyboard.
Click the Magnification icon.
On the menu, select File/Exit.Icons, buttons, and menus are printed in bold.
In the EHT target field, enter 10 kV. Values to be selected are printed in italics.
Text Meaning
Click... Press the left mouse button.
Right-click... Press the right mouse button.
Double-click.... Press the left mouse button twice.
Right double-click... Press the right mouse button twice.

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1.3. Definition of terms
The following terms are used in this instruction manual:
FIB-SEM Crossbeam 340 is a field emission scanning electron microscope
equipped with the focused ion beam option.
SmartSEM®Operating software for ZEISS field emission scanning electron micro-
scopes.
SmartFIB®Operating software for ZEISS FIB option.
Carl Zeiss service engineer,
Carl Zeiss service staff Specially trained service expert, either Carl Zeiss staff or authorised service partner of Carl Zeiss.
Operator A trained person, who operates the microscope.
User A person or organisation that uses products of Carl Zeiss Microscopy.
EMO box The Emergency OFF Box (EMO-Box) is a safety device integrated in
the AC-Unit. When pushing the EMO button in an emergency situation,
the EMO-Box will interrupt the mains between main switch and the rest
of the equipment by two contactors connected in series.
The EMO box is optional, but mandatory for compliance with SEMI S2.