Zeiss AURIGA Compact Crossbeam User manual

AURIGA®Compact
Crossbeam®workstation
Instruction Manual

AURIGA® Compact
Crossbeam®workstation
Original instructions
Carl Zeiss Microscopy GmbH
Carl-Zeiss-Promenade 10
07745 Jena, Germany
[email protected]
www.zeiss.com/microscopy
Carl Zeiss Microscopy GmbH
Carl-Zeiss-Straße 22
73447 Oberkochen
Document name: Instruction Manual AURIGA® Compact
Revision: en03
Effective from: January 2015
© by Carl Zeiss Microscopy GmbH
346500-8099-000
This document or any part of it must not be translated, reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying, recording, or by any information or retrieval system. Violations will be prosecuted.
The use of general descriptive names, registered names, trademarks, etc. in this document does not imply, even in the absence of a
specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use.
Software programs will fully remain the property of Carl Zeiss Microscopy. No program, documentation or subsequent upgrade thereof
may be disclosed to any third party, unless prior written consent of Carl Zeiss Microscopy has been procured to do so, nor may they be
copied or otherwise duplicated, even for the customer’s internal needs apart from a single back-up copy for safety purposes.
Due to an ongoing process of improvement Carl Zeiss Microscopy reserves the right to make modifications of this document without
notice.

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Table of contents
1. About this manual ........................................................................................ 7
1.1. Safety instructions in this manual .................................................................. 8
1.2. Typographical conventions ............................................................................ 9
1.3. Definition of terms ......................................................................................... 10
2. Safety .......................................................................................................... 11
2.1. Intended use ................................................................................................... 11
2.2. Prevention of accidents and of improper use ............................................. 13
2.3. Safety summary ............................................................................................. 14
2.3.1. Hazards related to personal injury ......................................................................... 14
2.3.2. Hazards not related to personal injury ................................................................... 17
2.4. Safety equipment ........................................................................................... 18
2.4.1. Safety devices ....................................................................................................... 18
2.4.1.1. Protective cover panels................................................................................................. 18
2.4.1.2. Interlock system ............................................................................................................ 18
2.4.1.3. ON/OFF switch.............................................................................................................. 19
2.4.1.4. EMO box with main switch............................................................................................ 19
2.4.1.5. EMO button................................................................................................................... 20
2.4.1.6. Main shut-off valves ...................................................................................................... 20
2.4.2. Safety labels and labels ........................................................................................ 21
2.4.2.1. At the front of the workstation........................................................................................ 21
2.4.2.2. At the rear of the workstation ........................................................................................ 22
2.4.2.3. At the rear of the electron optical column...................................................................... 23
2.4.2.4. Inside the workstation.................................................................................................... 23
2.4.3. Material Safety Data Sheets .................................................................................. 23
2.5. Safety instructions for handling precursors (with GIS upgrade only) ...... 24
3. Description ................................................................................................. 25
3.1. Overview ......................................................................................................... 25
3.2. Workstation .................................................................................................... 26
3.2.1. Gas injection system (GIS) upgrade ..................................................................... 27
3.2.1.1. Multi GIS........................................................................................................................ 27
3.2.1.2. Single GIS..................................................................................................................... 27
3.2.2. Charge compensation upgrade ............................................................................. 28
3.2.2.1. Charge Compensator.................................................................................................... 28
3.2.2.2. Five-channel GIS with integrated charge compensation............................................... 28
3.3. Control elements ............................................................................................ 29
3.3.1. SmartSEM®user interface .................................................................................... 29
3.3.2. Dual joystick .......................................................................................................... 30
3.3.3. Optional control panel ........................................................................................... 31

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3.4. Principle of operation .....................................................................................32
3.4.1. Vacuum system ..................................................................................................... 32
3.4.2. Specimen stage ..................................................................................................... 33
3.4.3. Electron optics (GEMINI®column) ........................................................................ 34
3.4.4. Ion optics (FIB column) .......................................................................................... 36
3.4.4.1. Imaging modes.............................................................................................................. 38
3.4.5. Signal detection ..................................................................................................... 39
3.4.5.1. In-lens detector............................................................................................................. 40
3.4.5.2. SE2 detector ................................................................................................................. 41
3.4.5.3. InlensDuo detector (optional)........................................................................................ 42
3.4.5.4. SESI detector (optional)................................................................................................ 43
3.5. Specification ...................................................................................................44
3.5.1. Workstation ........................................................................................................... 44
3.5.2. FIB column ............................................................................................................ 46
3.6. Installation requirements ...............................................................................47
3.7. Options ............................................................................................................49
3.7.1. Airlock .................................................................................................................... 49
3.8. Customer service ............................................................................................49
4. Transport and storage ...............................................................................51
4.1. Transport .........................................................................................................51
4.2. Storage ............................................................................................................52
5. Installation ...................................................................................................53
6. Operation .....................................................................................................55
6.1. Switching on the workstation ........................................................................55
6.2. Starting the SmartSEM®user interface ........................................................56
6.3. Finding your way in the SmartSEM®user interface ....................................58
6.3.1. Showing or hiding toolbars .................................................................................... 58
6.3.2. Showing or hiding the data zone ........................................................................... 59
6.3.3. Showing a full screen image .................................................................................. 59
6.3.4. Docking panels ...................................................................................................... 60
6.3.5. Opening the Panel Configuration Bar .................................................................... 62
6.4. SEM operation .................................................................................................63
6.4.1. Obtaining a first image ........................................................................................... 63
6.4.1.1. Preparing the sample holder......................................................................................... 64
6.4.1.2. Loading the specimen chamber.................................................................................... 65
6.4.1.3. Locating the specimen.................................................................................................. 69
6.4.1.4. Switching on the electron gun....................................................................................... 70
6.4.1.5. Switching on the EHT.................................................................................................... 71
6.4.1.6. Generating an image..................................................................................................... 73
6.4.1.7. Optimising the image.................................................................................................... 75
6.4.1.8. Saving the image.......................................................................................................... 79
6.4.1.9. Finishing the work session............................................................................................ 81

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6.4.2. Setting detection parameters ................................................................................ 82
6.4.2.1. Selecting a detector....................................................................................................... 82
6.4.2.2. Using the SE2 detector ................................................................................................. 83
6.5. Electron beam deposition or etching (with GIS upgrade only) ................. 83
6.5.1. Heating the reservoirs ........................................................................................... 84
6.5.2. Depositing or etching with the electron beam ....................................................... 85
6.6. CrossBeam® operation .................................................................................. 86
6.6.1. Preparing the workstation ...................................................................................... 86
6.6.1.1. Getting started............................................................................................................... 86
6.6.1.2. Adjusting tilt eucentricity................................................................................................ 87
6.6.1.3. Switching on the ion beam (FIB)................................................................................... 88
6.6.1.4. Setting the coincidence point ........................................................................................ 93
6.6.2. Milling for depth ..................................................................................................... 94
6.6.2.1. Selecting milling conditions ........................................................................................... 94
6.6.2.2. Starting the milling procedure........................................................................................ 97
6.6.3. Recording images during milling ........................................................................... 99
6.6.4. Gas assisted deposition: Platinum (with GIS upgrade only) ............................... 100
6.6.4.1. Heating the platinum reservoir .................................................................................... 100
6.6.4.2. Outgassing the platinum reservoir (only with five-channel GIS).................................. 102
6.6.4.3. Selecting deposition conditions................................................................................... 105
6.6.4.4. Starting the deposition procedure ............................................................................... 107
6.6.5. Setting detection parameters .............................................................................. 110
6.6.5.1. Using the SESI detector (optional).............................................................................. 110
6.6.6. Adjusting a FIB probe current at high kV (30 kV) ................................................ 112
6.6.6.1. Overview ..................................................................................................................... 112
6.6.6.2. Adjusting a low probe current (pA).............................................................................. 114
6.6.6.3. Adjusting a high probe current (nA)............................................................................. 116
6.6.6.4. Optimising a high probe current (nA) .......................................................................... 118
6.6.6.5. Adjusting Beam Shift correction.................................................................................. 121
6.7. Using the help functions ............................................................................. 124
6.7.1. Calling the SmartSEM®help ............................................................................... 124
6.7.1.1. Printing help texts........................................................................................................ 124
6.7.1.2. Bringing help texts to the foreground .......................................................................... 124
6.7.2. Calling the context-sensitive help ........................................................................ 125
6.7.3. Searching for a topic ........................................................................................... 125
6.7.4. Using the step-by-step guides ............................................................................. 126
6.7.4.1. Getting started............................................................................................................. 126
6.7.4.2. Frequently used operation sequences........................................................................ 126
6.7.5. Calling the short cuts help ................................................................................... 127
6.7.6. Showing information about SmartSEM®............................................................. 128
6.7.6.1. Version history............................................................................................................. 128
6.7.6.2. About SmartSEM®....................................................................................................... 128
6.8. Closing the SmartSEM®user interface ...................................................... 129
6.8.1. Logging off ........................................................................................................... 129
6.8.2. Exiting .................................................................................................................. 129

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6.9. Switching off the workstation as a matter of routine ................................130
6.9.1. Changing to STANDBY mode ............................................................................. 130
6.9.2. Changing to OFF mode ....................................................................................... 131
6.10. Switching off in an emergency ..................................................................132
6.10.1. Switching on again after an emergency off ....................................................... 132
6.11. Switching off the workstation completely ................................................134
7. Maintenance and repair ...........................................................................135
7.1. Maintenance work .........................................................................................135
7.2. Maintenance intervals ..................................................................................135
7.3. Change of consumables and chemicals ....................................................136
8. Troubleshooting .......................................................................................137
8.1. Overview ........................................................................................................137
8.2. Chamber ........................................................................................................139
8.2.1. Initialising the stage ............................................................................................. 139
8.2.2. Replacing the chamber door seal ........................................................................ 139
8.3. Column ..........................................................................................................141
8.3.1. Baking ot the gun head ....................................................................................... 141
8.3.2. Ion source (Workstation with FIB) ....................................................................... 144
8.3.2.1. Checking the lifetime................................................................................................... 144
8.3.2.2. Regenerating by heating............................................................................................. 144
8.4. Power circuit .................................................................................................147
8.4.1. Checking the circuit breakers .............................................................................. 147
9. Shutdown and disposal ...........................................................................151
9.1. Putting the workstation out of operation ...................................................151
9.2. Disposal .........................................................................................................151
9.2.1. Disposing of solid waste (consumables) ............................................................. 151
9.2.2. Disposing of the workstation ................................................................................ 152
10. Parts and tools ........................................................................................153
10.1. Important consumables .............................................................................153
10.2. Important spare parts .................................................................................154
10.3. Tools and accessories ...............................................................................154
11. Abbreviations ..........................................................................................155
12. Glossary ..................................................................................................157
13. Declaration of conformity ......................................................................159
14. Index ........................................................................................................161

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1. About this manual
This instruction manual is considered to be part of the AURIGA®Compact workstation.
Read the instructions carefully. Keep the instruction manual nearby the workstation and hand it
over to future owners of the instrument.
This instruction manual is designed for users who have been trained to operate the workstation
by an authorised Carl Zeiss expert. Operators of the workstation must not deviate from the instruc-
tions provided in this document.
Reference to
related
documents
For detailed information regarding the operating software refer to
•Software Manual SmartSEM®for general information on FESEM operation (basic work-
station)
•Software Manual SmartSEM®XB for CrossBeam® specific topics (FIB and GIS upgrade)
For details on technical data refer to the documents Product Specification and Installation
Requirements.
For details on optional components of the workstation refer to the respective manuals delivered
with the workstation. You will find these manuals in the document folder.
At a glance This instruction manual contains the following chapters:
1. About this manual Explains function and structure of this instruction manual
2. Safety Summarises important safety details
3. Description Describes structure and principle of operation of the workstation
4. Transport and storage Gives details on transport and storage
5. Installation Refers to Carl Zeiss service staff
6. Operation Introduces fundamental operation procedures
7. Maintenance and repair Describes preventive maintenance and repair tasks
8. Troubleshooting Summarises clues to solve possible problems
9. Shutdown and disposal Summarises notes on shutdown and disposal
10. Parts and tools Lists consumables, spare parts, tools, and accessories
11. Abbreviations Alphabetical list of abbreviations used in this instruction manual
12. Glossary Alphabetical list of important technical terms
13. Declaration of conformity Important declaration
14. Index Alphabetical list of key words that are referred to in this instruction
manual

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1.1. Safety instructions in this manual
The safety instructions in this manual follow a system of risk levels, that are defined as follows:
DANGER
This safety symbol and signal word indicates an imminently hazardous situation.
Disregarding this warning WILL result in death or serious injury.
WARNING
This safety symbol and signal word indicates a potentially hazardous situation.
Disregarding this warning COULD result in death or serious injury.
CAUTION
This safety symbol and signal word indicates a potentially hazardous situation.
Disregarding this warning MAY result in minor or moderate injury.
CAUTION
This signal word used without a safety symbol indicates a potentially hazardous situation.
Disregarding this warning MAY result in property damage.
IMPORTANT
This symbol and signal word draws your attention to important and useful
information.

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1.2. Typographical conventions
For the description of software, the following typographical conventions are used:
Typography Meaning
Push <ENTER>. Push the ENTER key on the keyboard.
Type <key1, key2> Type key 1 first, then type key 2 on the keyboard.
Type <Ctrl + Alt + Del>. Simultaneously type CTRL key, ALT key and DEL
key on the keyboard.
Click the Magnification icon.
Select File/Exit from the menu. Icons, buttons, and menus are printed in bold.
Enter 10 kV in the EHT target field. Values to be selected are printed in italics.
Text Meaning
Click... Press the left mouse button.
Right-click... Press the right mouse button.
Double-click.... Press the left mouse button twice.

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1.3. Definition of terms
The following terms are used in this instruction manual:
This instruction manual refers to the operating software SmartSEM®V05.05.
Workstation The AURIGA®Compact CrossBeam® workstation, referred to as work-
station.
SmartSEM®Operating software for Carl Zeiss field emission scanning electron
microscopes
Operator A trained person, who is assigned to operate the workstation.
Basic operator:
Person who has been trained to perform fundamental operation
sequences
Specially trained operator:
Electrically skilled person who has been trained to perform basic main-
tenance tasks
User A person or organisation that uses products of Carl Zeiss.
Carl Zeiss service engineer,
Carl Zeiss service staff Specially trained service expert, either Carl Zeiss staff or authorised service partner of Carl Zeiss.
EMO box Emergency off box; a safety device that contains the safety related
electronics to switch off the workstation (and connected options) com-
pletely in case of an emergency.
EMO button Emergency off button; to be pressed in an emergency to de-energize
the workstation completely.
FIB Focused ion beam
GEMINI®column Electron optical column
Canion column Type of FIB column
Coincidence point Point where electron beam and ion beam are crossed.
GIS Gas injection system (optional)
Several different types of available

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2. Safety
2.1. Intended use
AURIGA®Compact is a CrossBeam® workstation that allows microscopic examination and mod-
ification of suitable specimens.
The workstation allows you to perform the full range of
FESEM and CrossBeam® applications, which are:
•SEM operation
A focused beam of electrons is scanned across the specimen to generate an image or to
analyse the specimen.
Suitable for the analysis of surface structures andnear-surfacestructures ofappropriatespec-
imens.
•FIB Imaging
A focused beam of ions is scanned across the specimen to generate an image or to analyse
the specimen.
•Milling
A focused beam of ions locally removes material from the specimen surface.
•Gas assisted etching with ion beam (requires optional gas injection system)
With the help of a process gas, the focused ion beam cuts into the specimen surface.
•Gas assisted deposition with ion beam (requires optional gas injection system)
With the help of a process gas, the focused ion beam deposits material onto the specimen
surface.
•Gas assisted etching with electron beam (requires optional gas injection system)
With the help of a process gas, the electron beam cuts into the specimen surface.
•Gas assisted deposition with electron beam (requires optional gas injection system)
With the help of a process gas, the electron beam deposits material onto the specimen
surface.
For all of these applications, the specimen has to be located in the evacuated specimen chamber.
IMPORTANT
Depending on the upgrade stage of your workstation, not all of theses features may be
available.
Commercial
use only The workstation is to be used in a laboratory environment for commercial purposes only.
Using the workstation for any other purpose is not allowed and could be hazardous.

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Gas injection
system If the workstation is equipped with a gas injection system (GIS), up to five different precursors out
of the following can be available:
Using the GIS for any other purpose is not allowed and could be hazardous.
Likewise, it is not allowed to use the GIS in combination with any other precursor not mentioned
in table 2.1.
For safety reasons, mixing of precursors is not possible due to technical measures.
Reactiveproduct Precursor Used for
Tungsten W(CO)6
Tungsten hexacarbonyl deposition
Platinum C9H16Pt
Methylcyclopentadienyl(trimethyl)platinum (IV) deposition
Silicon dioxide
(insulator) C12H24O6Si
Diacetoxydi-t-butoxysilane deposition
Carbon C14H10
Phenanthrene deposition
Gold Dimethyl(acetylacetonate)gold(III) deposition
Fluorine XeF2
Xenondifluoride gas assisted etching,
selectively etches Si, SiOx
Water (reactive pro-
duct) MgSO4 * 7 H2O
Magnesium sulphate heptahydrate gas assisted etching
selectively etches hydrocarbon
Iodine I2gas assisted etching,
selectively etches aluminum/
aluminum oxide
Table 2.1: Overview of available precursors

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2.2. Prevention of accidents and of improper use
CAUTION
Risk of injury or damage due to improper operation of the workstation.
Read the user documentation carefully.
Do not operate the workstation until you have completely read and understood this in-
struction manual and the entire user documentation delivered with the workstation.
You will find the user documentation in the document folder.
Operator
training Within thescope ofinitial start-upthe Carl Zeiss service staff will performabasic operatortraining.
The basic operator training consists of fundamental operation procedures including safety instruc-
tions. Besides, an introduction to basic maintenance tasks will be given for an advanced operator,
who has to be an electrically skilled person.
The training performed shall be documented appropriately.
Special application trainings are offered on request.
IMPORTANT
All pursuing tasks of maintenance, service, and repair not described in this instruction
manual have to be performed by authorised Carl Zeiss service staff only.

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2.3. Safety summary
Follow the safety instructions given in this instruction manual. This is essential to prevent damage
andto protectyourself and othersagainst accidents and unsafe practices. Do not deviate from the
instructions provided in this instruction manual.
This section summarises possible hazards and recommended safety procedures.
2.3.1. Hazards related to personal injury
Service tasks
DANGER
Danger to life: Hazardous voltage inside the workstation.
Only service engineers trained and authorised by Carl Zeiss are allowed to service the
workstation.
Radiation
protection X-rays are produced within the workstation during operation. This is unavoidable since accelerat-
ed electrons hit material thus generating radiation.
WARNING
Radiation hazard: X-rays are generated inside the workstation during operation.
Only authorised Carl Zeiss service engineers are allowed to service the workstation.
Do not remove any parts. Do not disable any parts of the interlock system.
Use genuine Carl Zeiss parts exclusively.
Observe all safety and X-ray protection regulations.
In Germany, the operation of the workstation is permission-free as the following requirements are
fulfilled:
•The maximum acceleration voltage is limited to 30 kV.
•The local dose rate at a distance of 0.1 m from the accessible surface of the workstation does
not exceed 1 µSv/h.
•A respective label is attached to the workstation.
Outside Germany, the user of the workstation has to comply with the local regulations of the
country where the workstation is operated.
The workstation is equipped with several radiation protection devices, which ensure - under reg-
ular operation conditions - that the workstation operates inaccordance with the German X-ray pro-
tection regulation (RöV) respectively the German radiation protection regulation (StrSchV) as well
as with the EC Directive 96/29/EURATOM.

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Electrical
connections
CAUTION
High leakage current
Ensure proper grounding.
Do not operate the workstation without separate ground connection.
Gases Gaseous dry nitrogen is used to ventilate the specimen chamber during specimen exchange.
Compressed air is used to operate several valves and the auto levelling system.
WARNING
Risk of poisoning: When working with certain specimens, poisonous or toxic substances
will be deposited in the vacuum system.
While servicing the vacuum system, these deposited substances could be inhaled by the
service staff.
Keep a logbook of processed materials in order to inform the service staff about potential
poisoning hazards.
CAUTION
Suffocation hazard due to lack of oxygen, since the specimen chamber is ventilated with
gaseous nitrogen. Inhaling nitrogen may cause unconsciousness.
During specimen exchange, keep the chamber door open as short as possible.
Avoid inhaling the air from within the specimen chamber.
Ensure the area around the workstation is sufficiently ventilated.
IMPORTANT
Concerning the hazards of nitrogen installations and associated safety precautions refer
to the current version of guideline IGC Doc 44/00/E: Hazards of inert gases, published by
EIGA (European Industrial Gases Association) which can be found on the EIGA homepage
www.eiga.org/Publications/Documents.
CAUTION
Risk of injury or damage due to the high internal pressure in gas cylinders (e.g. containing
nitrogen or compressed air).
Observe all safety labels on the gas cylinders and all safety instructions given by the gas
cylinder manufacturer.
CAUTION
Crushing hazard while load is being lowered.
Maintain a safe distance. Do not walk or place your hands or feet under the load while it is
being lowered. Wear safety shoes and gloves.

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Operation
CAUTION
Risk of injury
Fingers could be trapped in the moving specimen stage.
Always close the chamber door before you move the specimen stage.
CAUTION
If you work with aggressive or toxic chemicals there may be a risk of injury.
Wear suitable protective clothing, gloves and eye/face protection. Do not eat, drink or
smoke at work. Refer to local safety regulations.
CAUTION
Risk of injury due to aggressive or toxic chemicals.
Risk of damage to environment.
When disposing of waste that has been generated during a service operation comply with
all national and local safety and environmental protection regulations.
GIS The optional gas injection system allows injecting process gases onto the specimen surface.
During operation, the process gases are generated out of precursor substances.
CAUTION
Hazard due to irritant gases that might be released from the precursors.
Gases can cause irritation to eyes, skin, and respiratory system.
Do not remove a reservoir from the workstation.
Contact the Carl Zeiss service to have an empty reservoir replaced.
Never try to open a reservoir.
During operation, unknown reaction products may be generated, when specimen material, reac-
tive precursor products, electron beam and/or ion beam get in contact.
CAUTION
Hazard due to dangerous reaction products that might be present in the specimen cham-
ber during or after operation.
Wear personal protective equipment when touching the inner parts of the specimen cham-
ber or the specimen.
Do not remove a reservoir from the workstation.
Contact the Carl Zeiss service to have an empty reservoir replaced.
Never try to open a reservoir.

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Maintenance
procedures Baking out the gun head has to be performed as a regular maintenance procedure.
Only advanced operators are allowed to perform the bakeout procedure.
CAUTION
Burn hazard
Some parts inside the workstation will get hot during the bakeout procedure.
Do not place any combustible objects on the grids of the electron optical column.
2.3.2. Hazards not related to personal injury
CAUTION
Risk of property damage when opening the chamber door.
Workstation or specimen could be damaged if specimen stage is at short working dis-
tance.
Always move specimen stage to long working distance before opening the chamber door.
CAUTION
Risk of property damage
Connect Carl Zeiss approved equipment only.
Ensure the total load connected to the workstation does not exceed 10 A.
IMPORTANT
Fingerprints can cause virtual vacuum leaks.
Always wear lint-free gloves when touching the specimen or inner parts of the specimen
chamber.

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2.4. Safety equipment
2.4.1. Safety devices
In order to prevent any risk of hazard to human health or of property damage, the workstation is
equipped with several safety and protective devices.
2.4.1.1. Protective cover panels
Plinth, electron optical column and specimen chamber are secured with protective cover panels.
WARNING
Hazardous voltage inside the workstation. Contact may cause burn or electric shock.
X-rays are generated inside the workstation during operation.
Do not remove any parts.
The workstation must not be operated with removed protective cover panels.
2.4.1.2. Interlock system
The interlock system includes several functions.
Chamber door interlock
The chamber door interlock is located at the inner
bottom front side of the specimen chamber.
It ensures that the door of the specimen chamber
is closed properly.
When this interlock is activated (i.e. no electrical
contact) ’EHT Vac ready = no’ is indicated in the
SmartSEM®user interface. EHT and detector volt-
ages are blocked.
Gun head interlock
The gun head interlock is located at the top of the
electron optical column.
It ensures that the high voltage interlock circuit is
cut off when the gun head is opened.
When this interlock is activated (i.e. no electrical
contact), gun and EHT cannot be switched on. All
high voltages are blocked.

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Vacuum interlock
The vacuum interlock is an internal interlock.
It ensures that Gun vacuum and System vacuum
are better than the required thresholds.
If this interlock is activated gun respectively EHT
cannot be switched on.
2.4.1.3. ON/OFF switch
The ON/OFF SWITCH is located at the rear of the
plinth. It cuts off the mains power from the
FESEM.
Other devices connected to the EMO box remain
turned on.
2.4.1.4. EMO box with main switch
The MAIN switch (1) is located at the front panel
of the EMO box.
It cuts off all devices connected to the EMO box
from the mains power supply. The main switch
can be secured against re-activation.
The main switch guarantees an ampere interrupt-
ing capacity (AIC) of at least 10000 A rms.
The START button (2) is located underneath the
MAIN switch.
IMPORTANT
The EMO box with MAIN switch has an emergency off function.
2
1

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2.4.1.5. EMO button
The emergency off button (EMO button) is
located on the plinth.
The EMO button is to be pressed in an emergency
to cut off power to all devices connected to the
EMO box.
It must always be readily accessible and operable.
2.4.1.6. Main shut-off valves
The user is responsible for the installation of main shut-off valves at the site of installation. The
following main shut-off valves are required:
•water supply
•water runback
•nitrogen supply
•compressed air supply
The main shut-off valves have to be easily accessible. They must close off the connections to the
corresponding media when needed. The main shut-off valves have to be lockable in their OFF
position in order to prevent accidental re-activation.
As the user is responsible for installing the main shut-off valves, he/she should also provide in-
structions how to operate the main shut-off valves properly.