ZTEWelink ZM8620 User manual

Hardware Development Guide of Module Product
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Hardware Development Guide of
Module Product
ProductModelNo:ZM8620
DocumentVersion:2.0
Release Date: 2013-03-20

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Revision Record
Version No.
Revised by
Revised on
Reason for Revision
V1.0
Luo Pingbo
2013-02-22
First published
V2.0
2012-03-20
Delete the part of PCM, and change the header,
front cover, legal information and footer.

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TABLE OF CONTENTS
1ABOUT THIS DOCUMENT ........................................................................................................................1
1.1 Application Range ..............................................................................................................................1
1.2 Purpose..............................................................................................................................................1
1.3 Supported & Reference Document List ..............................................................................................1
1.4 Abbreviations......................................................................................................................................1
2PRODUCT OVERVIEW..............................................................................................................................2
2.1 Product Technical Parameter..............................................................................................................2
2.2 Function Overview..............................................................................................................................5
2.2.1 Baseband Function.........................................................................................................................5
2.2.2 Radio Frequency Function .............................................................................................................5
3MECHANIC FEATURE...............................................................................................................................6
3.1 Dimensions and Interface...................................................................................................................6
3.2 Antenna Interface ...............................................................................................................................7
3.3 Thermal Design..................................................................................................................................8
4PIN DESCRIPTION .................................................................................................................................... 9
4.1 Dimensions and Interface...................................................................................................................9
4.1.1 Definition of PIN I/O Parameters ....................................................................................................9
4.1.2 PIN Configuration Diagram.............................................................................................................9
4.1.3 PIN Description ............................................................................................................................10
4.2 Working Condition ............................................................................................................................ 12
4.3 Feature of Interface Power Level...................................................................................................... 12
4.3.1 Feature of Digital Power Level Signal...........................................................................................12
4.4 Power Interface ................................................................................................................................ 12
4.4.1 Description of Power PINs............................................................................................................ 12
4.4.2 Requirement of Power Supply......................................................................................................13

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4.5 (U)SIM Card Interface.......................................................................................................................13
4.5.1 Description of PINs.......................................................................................................................13
4.5.2 Electric Feature ............................................................................................................................13
4.6 USB2.0 Interface .............................................................................................................................. 14
4.6.1 Description of PINs.......................................................................................................................14
4.6.2 Electric Feature ............................................................................................................................14
4.7 UART Interface.................................................................................................................................14
4.8 Power-on/Power-off & Reset Signal ................................................................................................. 14
4.9 WAKE# Signal..................................................................................................................................15
5ELECTRIC FEATURE .............................................................................................................................. 16
5.1 Power Feature..................................................................................................................................16
5.1.1 Power Supply ...............................................................................................................................16
5.1.2 Working Current ........................................................................................................................... 16
5.2 Power-on/Power-off Flow ................................................................................................................. 17
5.3 Resetting Flow..................................................................................................................................17
6RF SPECIFICATIONS .............................................................................................................................. 17
6.1 Technical Specification for UMTS Mode Radio Frequency............................................................... 18
6.1.1 Test Environment in which Transmission Indices are Obtained....................................................18
6.1.2 Maximum Transmission Power..................................................................................................... 18
6.1.3 Receiving Sensitivity..................................................................................................................... 18
6.1.4 Spurious Specification..................................................................................................................18
6.2 Technical Specification of GSM Mode Radio Frequency..................................................................19
6.2.1 Test Environment in which Transmission Indices are Obtained....................................................19
6.2.2 Maximum Transmission Power..................................................................................................... 19
6.2.3 Receiving Sensitivity..................................................................................................................... 19
6.3 Technical Specification of LTE Mode Radio Frequency....................................................................20
6.3.1 Test Environment in which Transmission Indices are Obtained....................................................20
6.3.2 Maximum Transmission Power..................................................................................................... 20
6.3.3 Receiving Sensitivity..................................................................................................................... 20
6.3.4 Spurious Specification..................................................................................................................21
7ANTENNA ................................................................................................................................................ 24

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7.1 RF Antenna Specification .................................................................................................................24
7.1.1 Technical Parameter for the Main Antenna Test Base ..................................................................24
7.2 Proposal on Layout of Product in Terminal Product..........................................................................24
7.3 Antenna Size and Placement ...........................................................................................................24
7.4 Diversity Antenna Design..................................................................................................................24
8DEBUGGING ENVIRONMENT AND METHOD ....................................................................................... 25

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Figures
Figure 2-1 Product Material Object Picture.........................................................................................................2
Figure 2-2 System Connection Diagram..............................................................................................................5
Figure 3-1 PCI Express Mini Card Dimensions Type and Slot Compatibility.................................................7
Figure 3-2 Antenna Interface Flag Diagram (with Diversity).............................................................................8
Figure 3-3 Radio Frequency Interface Test Base...............................................................................................8
Tables
Table 1-1 List for Support Documents..................................................................................................................1
Table 1-2 Abbreviation List ....................................................................................................................................1
Table 2-1 an Overview of Major Technical Parameters.....................................................................................2
Table 2-2 Product Operating Frequency Band ...................................................................................................5
Table 6-1 Maximum Transmission Power..........................................................................................................18
Table 6-2 Receiving Sensitivity Reference Table.............................................................................................18
Table 6-3 General Requirement of Receiver Spurious Emission......................................................................19
Table 6-4 Additional Spurious Emission Requirement........................................................................................19

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1 About This Document
1.1 Application Range
This document is applicable as the hardware development guide of ZM8620 module product.
The user can conduct secondary development according to the requirement and guidance in
this document. It is only applicable for the hardware application development based on the use
of ZM8620 module product.
1.2 Purpose
This document provides the design and development fundamentals for the users of ZM8620. By
reading this document, the user can have an overall knowledge of this product, and a clear
understanding of the technical parameters of this product. With this document, the user can use
ZM8620 successfully fulfill the wireless communication function development of the mobile
terminal products such as Tablet,Notepad etc.
1.3 Supported & Reference Document List
Besides this hardware development document, ZTE also provides the software development
guide. Table 1-1 is the list of supported documents.
Table 1-1 List for Support Documents
Version
Document Name
V1.0
Software Development Guide of ZM8620 Module
1.4 Abbreviations
Table 1-2 is a list of the relevant abbreviations, and interpretations in Chinese and English
involved in the whole document. Table 1-2 Abbreviation List
Abbreviations
English full name
Chinese interpretation
ESD
Electro-Static Discharge
静电放电
UMTS
Universal Mobile Telecommunication System
通用移动通信系统
SMS
Short Message Service
短消息业务
FDD
Frequency Division Duplexing
频分双工

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2 Product Overview
ZM8620 is a multimode wireless communication module with mini-PCIE module, which can be
applied in but not limited to equipment such as Tablet, Vehicle Mounted Terminals and
electronic consumer products, and provides equipment with high-speed data access service in
mobile environment (LTE FDD、UTMS and GSM network). The frequency bands supported by
ZM8620 are as follows: LTE FDD Band 1/2/4/5/7/8/12&17, LTE TDD Band 38, UTMS Band
1/2/4/5/8, GSM 850/900/1800/1900MHz frequency band. Figure 2-1 shows the product material
object picture.
Figure 2-1 Product Material Object Picture
2.1 Product Technical Parameter
The major features of ZM8620 can be described from the aspects of mechanic feature, base
band, radio frequency, technical standard and environment feature. Table 2-1 is a list of the
major technical parameters and features supported by ZM8620.
Table 2-1 an Overview of Major Technical Parameters
Item
Specifications
Mechanic
Specifications
Dimensions
51mm x 30mm x 4.9mm
Weight
About 11g
Form Factor
Mini-PCIE package(52Pin)
Solution
Chipset supplier
Qualcomm MDM9215
Baseband
Processor architecture
Cortex-A5+QDSP+ARM7

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(U)SIM/SIM
Standard 6 PIN SIM card interface，3V SIM card and 1.8V SIM card
Memory(SDRAM/NAND)
128MByte & 256MByte
MICRO SD Card
No memory card support
USB Version
USB 2.0
Interface
Mini-PCIE package(52 Pin)
Maximum power
consumption
TBD
Power supply
DC 3.6V ±9%
Working current
Peak current
TBD
Average normal working current
TBD
Average normal working current (idle mode)
TBD
Standby current
TBD
LED Control
Yes
RF
Chipset
WTR1605L
GSM Band
EDGE/GPRS/GSM: 1900/1800/900/850MHz
UMTS Band
DC-HSPA+/ HSPA+/HSUPA/HSDPA/UMTS:
2100/1900/1700/850(900)MHz
CDMA Band
N/A
LTE Band
LTE FDD: 2100/1900/1700/850/900/2600/700MHz
LTE TDD: Band 38
RxDiv Band
UMTS: 2100/1900/1700/850(900)MHz
GSM: 1900/ 1800/900/850MHz
LTE FDD: Band 1,2,4,5,7,8,12&17
LTE TDD: Band 38
Max. transmitter power
WCDMA/HSDPA 2100/1900/1700/850/900MHz: Power Class 3
( +24dBm +1/-3dB)
LTE FDD: 2600/2100/1900/1700/900/850/700MHz Power Class 3
(+23dBm +2.7/-2.7dB)
LTE TDD: Band 38 Power Class 3 (+23dBm +2.7/-2.7dB)
GSM/GPRS 850MHz/900MHz: Power Class 4 (+33dBm ±2dBm)
GSM/GPRS 1800MHz/1900MHz: Power Class 1 (+30dBm ±2dBm)
EDGE 850MHz/900MHz: Power Class E2 (+27dBm ±3dBm)
EDGE 1800MHz/1900MHz: Power Class E2 (+26dBm -4/+3dBm)
Receiving sensitivity
UMTS2100: ≤-106.7 dBm
UMTS1900: ≤-104.7 dBm
UMTS850: ≤-104.7 dBm
UMTS900: ≤-103.7 dBm
UMTS1700: ≤-106.7 dBm
LTE 2600: ≤-92dBm(20 MHz)
LTE 2100: ≤-94dBm(20 MHz)
LTE1900: ≤-92dBm(20 MHz)
LTE1700: ≤-94dBm(20 MHz)

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LTE 900: ≤-94dBm(10 MHz)
LTE 850: ≤-95dBm(10 MHz)
LTE 700: ≤-94dBm(10 MHz)
LTE Band 38: ≤-94dBm(20 MHz)
GSM850/900/1800/1900: ≤-102dBm
Equalization
Yes
Main Antenna
External
Receive Diversity
Antenna
External
Technical
Standard
LTE TDD
DL 61Mbps / UL 18Mbps
GSM/EDGE/WCDMA
GSM CS: UL 9.6kbps/DL 9.6kbps
GPRS: Multi-slot Class 10
EDGE: Multi-slot Class 12
WCDMA CS: UL 64kbps/DL 64kbps
WCDMA PS: UL 384kbps/DL 384kbps
HSDPA/HSUPA/
HSPA+/ DC-HSPA+
HSDPA Rel 6: DL 14.4Mb/s
HSUPA Rel 6: UL 5.76Mb/s
HSPA+ Rel 7: DL 28/UL 5.76Mb/s
DC-HSPA+ Rel 8: DL 42/UL 5.76 Mb/s
CDMA 1xEV-DO
N/A
LTE-FDD
DL 100Mbps / UL 50Mbps (Category 3)
3GPP Release
R99, R5, R6, R7, R8, R9
OS
Windows XP/Vista/7, Androd2.x, Linux
GPRS Class
Class B
Environment
Operating Temperature
-10 to 60 °C
Storage Temperature
-40 to 85 °C
Humidity
5%~ 95%
Application
RAS
No
NDIS
Yes
Voice
N/A
Video Call
No
SMS
Yes
MMS
No
STK
No
USSD
No
Phonebook
No
NETWORK LOCK
Optional
SIM READER
No
Language
N/A
GPS
Yes
Online Update
No

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2.2 Function Overview
2.2.1 Baseband Function
When module product ZM8620 and the system board connects, there are the following main
signal groups: USB signal, SIM card signal, radio frequency switch control signal, power on and
overall system resetting signal, power supply and ground. At the same time, ZM8620 has the
main antenna interface and diversity antenna interface, and GPS antenna interface.
Main
Antenna
USB
SIM card
POWER
GND
GPIO
UART
Wakeup &
query status
signal
GPS
Antenna
ZM8620
PCIE LTE wireless
Internet access
module
Diversity
Antenna
Figure 2-2 System Connection Diagram
2.2.2 Radio Frequency Function
The radio frequency function of ZM8620 can be viewed from the aspect of over-the-air wireless
bearer network, frequency band, whether receive diversity feature is supported.
(a) Support LTE FDD 2100/1900/1700/850/900/2600/700 MHz;
(b) Support LTE TDD Band 38;
(c) Support UMTS 850/900/1700/1800/1900 MHz;
(d) Support GSM 850/900/1800/1900 MHz;
(e) Support the diversity receives;
The operating frequencies of ZM8620 is as shown in Table.
Table 2-2 Product Operating Frequency Band
Operating
Frequency Band
Uplink Frequency Band (Uplink)
Downlink Frequency Band
(Downlink)
UMTS850
824 MHz - 849 MHz
869 MHz - 894 MHz
UMTS900
880 MHz —915 MHz
925 MHz —960 MHz
UMTS1700
1710 MHz —1755MHz
2110 MHz —2155MHz

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UMTS1900
1850 MHz —1910 MHz
1930 MHz —1990 MHz
UMTS2100
1920 MHz —1980 MHz
2110 MHz —2170 MHz
GSM1900
1850 MHz —1910 MHz
1930 MHz —1990 MHz
GSM850
824 MHz - 849 MHz
869 MHz - 894 MHz
GSM900
890 MHz —915MHz
935 MHz —960MHz
GSM1800
1710 MHz —1785MHz
1805 MHz —1880MHz
GSM1900
1850 MHz —1910 MHz
1930 MHz —1990 MHz
LTE-FDD Band17
788 MHz -798 MHz
734 MHz - 746 MHz
LTE-FDD Band5
824 MHz —849MHz
869 MHz —894 MHz
LTE-FDD Band8
880 MHz —915 MHz
925 MHz —960 MHz
LTE-FDD Band4
1710 MHz - 1755MHz
2110 MHz - 2155 MHz
LTE-FDD Band2
1850 MHz —1910MHz
1930 MHz —1990MHz
LTE-FDD Band1
1920 MHz —1980 MHz
2110 MHz —2170 MHz
LTE-FDD Band7
2500 MHz —2570MHz
2620 MHz —2690MHz
LTE TDD: Band 38
2570 MHz —2620MHz
2570 MHz —2620MHz
3 Mechanic Feature
3.1 Dimensions and Interface
This product adopts the standard PCI Express Mini Card interface type, and the contour size is
designed according to F1 type. Figure 3-1 illustrates the dimensions and slot compatibility of
PCI Express Mini Card.
Table 3-1 PCI Express Mini Card
Card Type
Full-Mini-
Only Socket
Half-Mini-
Only Socket
Dual-Use
Socket
Dual Head-to-Head Socket
Connector
A
Connector
A
Connector
A
Connector
A
Connector
B
F1
Full-Mini
Yes
No
No
No
No
F2
Full-Mini with
bottom-side
keep outs
Yes
No
Yes
Yes
No
F3
Half-Mini
No
Yes
Yes
Yes
No
F4
Half-Mini with
bottom-side
keep outs
No
Yes
Yes
Yes
Yes

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(a) (b)
(c)
Figure 3-1 PCI Express Mini Card Dimensions Type and Slot Compatibility
Figure (a) is TOP surface dimensions; Figure (b) is BOTTOM surface dimensions;
Figure (c) is thickness information.
3.2 Antenna Interface
This product has three radio frequency antenna interfaces: One is the main antenna interface
(there is the “MAIN” flag on the PCB), one is a diversity receiving antenna (diversity optional)
interface (there is “AUX” flag on the PCB), and one is GPS antenna, as shown in Figure 3-2.
The radio frequency bases adopted by the antenna interface are all HRS company U.FL-R-SMT
(10), as shown in Figure 3-3.

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Figure 3-2 Antenna Interface Flag Diagram (with Diversity)
Figure 3-3 Radio Frequency Interface Test Base
This product antenna is placed on the side of the system board, it is recommended that antenna
space size is above 7 mm * 10 mm * 100 mm. If this product is embedded in a notebook, place it
on the top of the LCD screen.
3.3 Thermal Design
The thermal design of this product strictly complies with the specification [PCI Express Mini
Card Electromechanical Specification Revision 1.2, October 26, 2007], and distributes the heat
source evenly, and has excellent heat dissipating design. But as the maximum power
consumption of the overall system in the LTE standard is very high, if it is impossible to ensure
ZM8620 ambient temperature is lower than 60 °C, the rise of the overall system temperature will
lead to the decline of ZM8620 performance, and even it cannot operate normally. In order to
ensure to bring the product working performance into full play, the following proposals are
provided for the main board design:
(a) Design heat dissipating chip for ZM8620. Design it at a place as closely to the outer
casing as possible and design heat dissipating holes in the corresponding position.
(b) Conduct shiny copper processing near the main board on ZM8620 BOTTOM surface
to reach sound heat dissipating path.

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(c) Lay ZM8620 and its heat dissipating chip out on the active heat dissipating channel of
the main board. Place ZM8620 on the side with a relatively lower temperature.
(d) Do not place ZM8620 near components with relatively heat a large generation, such as
CPU, and south bridge.
4 Pin Description
4.1 Dimensions and Interface
4.1.1 Definition of PIN I/O Parameters
The definition of ZM8620 I/O parameter is as shown in Table 4-1.
Table 4-1 PIN Parameters
PIN Attribute
Description
AI
Analog signal input
AO
Analog signal output
B
bidirectional digital with CMOS
input
DI
Digital signal input
DO
Digital signal output
Z
High-resistance output
P1
PIN group 1, the power supply
voltage is VDD_P1
P2
PIN group 2, the power supply
voltage is VDD_P2
PU
PIN internal pull-up
PD
PIN internal pull-down
4.1.2 PIN Configuration Diagram
The PIN sequence of interfaces on ZM8620 is following the mini-PCIE interface and defined as
shown in Figure 4-1.

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12
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
49
51
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
VDD_3V3
USIM_POWER
USIM_DATA
USIM_CLK
USIM_RESET
PON_TRIG
W_DISABLE
PERST
VDD_3V3
USB_DM
USB_DP
VDD_3V3
VDD_3V3 LED_PWR
VDD_3V3
47
GND
KPD_PWR_N
GND
GND
BQ_CE2
UART_RFR
GND
UART_CTS
GND
PCI_UART_RX
PCI_UART_TX
VBAT
GND
PCI_WAKE
PCI_SPI_MISO
PCI_SPI_MOSI
PCI_SPI_CLK
GND
GND
GND
GND
GND
GND
GND
PCI_SPI_CS_N
SLIC_RST0
SLIC_INT0
GPIO_79
BQ_CE2
PCI_3V3
BATT_NTC
BQ_CHG
GND
PCI_PCM_CLK
PCI_PCM_DIN
PCI_PCM_DOUT
PCI_PCM_SYNC
WAKE*
COEX1
COEX2
CLKREQ*
GND[1]
REFCLK-
REFCLK+
GND[2]
RESERVED5_UIM_C8
RESERVED4_UIM_C4
GND[4]
PERN0
PERP0
GND[6]
GND[7]
PETN0
PETP0
GND[9]
GND[10]
3V3VAUX[2]
3V3VAUX[3]
GND[12]
RESERVED3
RESERVED2
RESERVED0
RESERVED1
3V3VAUX[0]
GND[0]
1V5[0]
UIM_PWR
UIM_DATA
UIM_CLK
UIM_RESET
UIM_VPP
GND[3]
W_DISABLE*
PERST*
3V3VAUX[1]
GND[5]
1V5[1]
SMB_CLK
SMB_DATA
GND[8]
USB_D-
USB_D+
GND[11]
LED_WWAN*
LED_WLAN*
LED_WPAN*
1V5[2]
GND[13]
3V3VAUX[4]
Figure 4-1 PIN Configuration Diagram
4.1.3 PIN Description
Table 4-2 PIN Interface Definition
Pin
number
Protocol signal
name
Signal definition
1.
WAKE#
PCI_WAKE
2.
3.3Vaux
VDD_3V3
3.
COEX1
PCI_SPI_MISO
4.
GND
GND
5.
COEX2
PCI_SPI_MOSI
6.
1.5V
KPD_PWR_N
7.
CLKREQ#
PCI_SPI_CLK
8.
UIM_PWR
USIM_POWER
9.
GND
GND
10.
UIM_DATA
USIM_DATA
11.
REFCLK-
PCI_SPI_CS_N
12.
UIM_CLK
USIM_CLK
13.
REFCLK+
SLIC_RST0

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14.
UIM_RESET
USIM_RESET
15.
GND
GND
16.
UIM_VPP
PON_TRIG
17.
Reserved(UIM_C8)
SLIC_INT0
18.
GND
GND
19.
Reserved(UIM_C4)
GPIO_79
20.
W_DISABLE#
W_DISABLE
21.
GND
GND
22.
PERST#
PERST
23.
PERn0
BQ_CE2
24.
+3.3Vaux
VDD_3V3
25.
PERp0
PCI_3V3
26.
GND
GND
27.
GND
GND
28.
+1.5V
BQ_CE1
29.
GND
GND
30.
SMB_CLK
UART_RFR
31.
PETn0
BATT_NTC
32.
SMB_DATA
UART_CTS
33.
PETp0
BQ_CHG
34.
GND
GND
35.
GND
GND
36.
USB_D-
USB_DM
37.
GND
GND
38.
USB_D+
USB_DP
39.
+3.3Vaux
VDD_3V3
40.
GND
GND
41.
+3.3Vaux
VDD_3V3
42.
LED_WWAN#
LED_PWR
43.
GND
GND
44.
LED_WLAN#
PCI_UART_RX
45.
Reserved
PCI_PCM_CLK
46.
LED_WPAN#
PCI_UART_TX
47.
Reserved
PCI_PCM_DIN
48.
+1.5V
VBAT
49.
Reserved
PCI_PCM_DOUT
50.
GND
GND
51.
Reserved
PCI_PCM_SYNC
52.
+3.3Vaux
VDD_3V3

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4.2 Working Condition
Table 4-3 Working Condition
Signal
Description
Min
Typical
Max
Unit
VCC
Main power supply of
the of the module
3.4
3.6
4.2
V
VDD_P1
Voltage of PIN group P1
1.65
1.8
1.95
V
VDD_P2
Voltage of PIN group P2
2.85
3
3.15
V
Note: The typical voltage refers to the default I/O voltage of P1 and P2 PIN group. It is required that the external input PIN provides this
voltage. 2. The voltage design of external circuit interfaces should match that of the ZM8620 PINs.
4.3 Feature of Interface Power Level
4.3.1 Feature of Digital Power Level Signal
Table4-4 Power Level Range of Digital Signal
Signal
Description
Min
Max
Units
VIH
High level of input
voltage
0.65*VDD_PX
VDD_PX+0.3
V
VIL
Low level of input
voltage
-0.3
0.35* VDD_PX
V
VOH
High level of output
voltage
VDD_PX-0.45
VDD_PX
V
VOL
Low level of output
voltage
0
0.45
V
Note: 1. the high/low PWL of input voltage should comply with the range in the table. 2. The high/low PWL of external interface signal
should match the interface PWL of ZM8620. 3. In VDD_PX, X=1 or 2, indicating the attribute of P1 group PIN or P2 group PIN.
4.4 Power Interface
4.4.1 Description of Power PINs
Power VCC (PIN No: 2, 24, 39, 41, 52). This is the positive signal of 3.6 power supply.
GND signal (PIN No: 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50). This is the power
ground and signal ground of ZM8620, which needs to be connected to the ground on the
system board. If the GND signal is not connected completely, the performance of ZM8620 will
be affected.