ZTEWelink ZM8620 User manual

Hardware Development Guide of Module Product
I All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of
Module Product
ProductModelNo:ZM8620
DocumentVersion:2.0
Release Date: 2013-03-20

Hardware Development Guide of Module Product
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Hardware Development Guide of Module Product
III All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Revision Record
Version No.
Revised by
Revised on
Reason for Revision
V1.0
Luo Pingbo
2013-02-22
First published
V2.0
2012-03-20
Delete the part of PCM, and change the header,
front cover, legal information and footer.

Hardware Development Guide of Module Product
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TABLE OF CONTENTS
1ABOUT THIS DOCUMENT ........................................................................................................................1
1.1 Application Range ..............................................................................................................................1
1.2 Purpose..............................................................................................................................................1
1.3 Supported & Reference Document List ..............................................................................................1
1.4 Abbreviations......................................................................................................................................1
2PRODUCT OVERVIEW..............................................................................................................................2
2.1 Product Technical Parameter..............................................................................................................2
2.2 Function Overview..............................................................................................................................5
2.2.1 Baseband Function.........................................................................................................................5
2.2.2 Radio Frequency Function .............................................................................................................5
3MECHANIC FEATURE...............................................................................................................................6
3.1 Dimensions and Interface...................................................................................................................6
3.2 Antenna Interface ...............................................................................................................................7
3.3 Thermal Design..................................................................................................................................8
4PIN DESCRIPTION .................................................................................................................................... 9
4.1 Dimensions and Interface...................................................................................................................9
4.1.1 Definition of PIN I/O Parameters ....................................................................................................9
4.1.2 PIN Configuration Diagram.............................................................................................................9
4.1.3 PIN Description ............................................................................................................................10
4.2 Working Condition ............................................................................................................................ 12
4.3 Feature of Interface Power Level...................................................................................................... 12
4.3.1 Feature of Digital Power Level Signal...........................................................................................12
4.4 Power Interface ................................................................................................................................ 12
4.4.1 Description of Power PINs............................................................................................................ 12
4.4.2 Requirement of Power Supply......................................................................................................13

Hardware Development Guide of Module Product
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4.5 (U)SIM Card Interface.......................................................................................................................13
4.5.1 Description of PINs.......................................................................................................................13
4.5.2 Electric Feature ............................................................................................................................13
4.6 USB2.0 Interface .............................................................................................................................. 14
4.6.1 Description of PINs.......................................................................................................................14
4.6.2 Electric Feature ............................................................................................................................14
4.7 UART Interface.................................................................................................................................14
4.8 Power-on/Power-off & Reset Signal ................................................................................................. 14
4.9 WAKE# Signal..................................................................................................................................15
5ELECTRIC FEATURE .............................................................................................................................. 16
5.1 Power Feature..................................................................................................................................16
5.1.1 Power Supply ...............................................................................................................................16
5.1.2 Working Current ........................................................................................................................... 16
5.2 Power-on/Power-off Flow ................................................................................................................. 17
5.3 Resetting Flow..................................................................................................................................17
6RF SPECIFICATIONS .............................................................................................................................. 17
6.1 Technical Specification for UMTS Mode Radio Frequency............................................................... 18
6.1.1 Test Environment in which Transmission Indices are Obtained....................................................18
6.1.2 Maximum Transmission Power..................................................................................................... 18
6.1.3 Receiving Sensitivity..................................................................................................................... 18
6.1.4 Spurious Specification..................................................................................................................18
6.2 Technical Specification of GSM Mode Radio Frequency..................................................................19
6.2.1 Test Environment in which Transmission Indices are Obtained....................................................19
6.2.2 Maximum Transmission Power..................................................................................................... 19
6.2.3 Receiving Sensitivity..................................................................................................................... 19
6.3 Technical Specification of LTE Mode Radio Frequency....................................................................20
6.3.1 Test Environment in which Transmission Indices are Obtained....................................................20
6.3.2 Maximum Transmission Power..................................................................................................... 20
6.3.3 Receiving Sensitivity..................................................................................................................... 20
6.3.4 Spurious Specification..................................................................................................................21
7ANTENNA ................................................................................................................................................ 24

Hardware Development Guide of Module Product
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7.1 RF Antenna Specification .................................................................................................................24
7.1.1 Technical Parameter for the Main Antenna Test Base ..................................................................24
7.2 Proposal on Layout of Product in Terminal Product..........................................................................24
7.3 Antenna Size and Placement ...........................................................................................................24
7.4 Diversity Antenna Design..................................................................................................................24
8DEBUGGING ENVIRONMENT AND METHOD ....................................................................................... 25

Hardware Development Guide of Module Product
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Figures
Figure 2-1 Product Material Object Picture.........................................................................................................2
Figure 2-2 System Connection Diagram..............................................................................................................5
Figure 3-1 PCI Express Mini Card Dimensions Type and Slot Compatibility.................................................7
Figure 3-2 Antenna Interface Flag Diagram (with Diversity).............................................................................8
Figure 3-3 Radio Frequency Interface Test Base...............................................................................................8
Tables
Table 1-1 List for Support Documents..................................................................................................................1
Table 1-2 Abbreviation List ....................................................................................................................................1
Table 2-1 an Overview of Major Technical Parameters.....................................................................................2
Table 2-2 Product Operating Frequency Band ...................................................................................................5
Table 6-1 Maximum Transmission Power..........................................................................................................18
Table 6-2 Receiving Sensitivity Reference Table.............................................................................................18
Table 6-3 General Requirement of Receiver Spurious Emission......................................................................19
Table 6-4 Additional Spurious Emission Requirement........................................................................................19

Hardware Development Guide of Module Product
1 All Rights reserved, No Spreading abroad without Permission of ZTEWelink
1 About This Document
1.1 Application Range
This document is applicable as the hardware development guide of ZM8620 module product.
The user can conduct secondary development according to the requirement and guidance in
this document. It is only applicable for the hardware application development based on the use
of ZM8620 module product.
1.2 Purpose
This document provides the design and development fundamentals for the users of ZM8620. By
reading this document, the user can have an overall knowledge of this product, and a clear
understanding of the technical parameters of this product. With this document, the user can use
ZM8620 successfully fulfill the wireless communication function development of the mobile
terminal products such as Tablet,Notepad etc.
1.3 Supported & Reference Document List
Besides this hardware development document, ZTE also provides the software development
guide. Table 1-1 is the list of supported documents.
Table 1-1 List for Support Documents
Version
Document Name
V1.0
Software Development Guide of ZM8620 Module
1.4 Abbreviations
Table 1-2 is a list of the relevant abbreviations, and interpretations in Chinese and English
involved in the whole document. Table 1-2 Abbreviation List
Abbreviations
English full name
Chinese interpretation
ESD
Electro-Static Discharge
静电放电
UMTS
Universal Mobile Telecommunication System
通用移动通信系统
SMS
Short Message Service
短消息业务
FDD
Frequency Division Duplexing
频分双工

Hardware Development Guide of Module Product
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2 Product Overview
ZM8620 is a multimode wireless communication module with mini-PCIE module, which can be
applied in but not limited to equipment such as Tablet, Vehicle Mounted Terminals and
electronic consumer products, and provides equipment with high-speed data access service in
mobile environment (LTE FDD、UTMS and GSM network). The frequency bands supported by
ZM8620 are as follows: LTE FDD Band 1/2/4/5/7/8/12&17, LTE TDD Band 38, UTMS Band
1/2/4/5/8, GSM 850/900/1800/1900MHz frequency band. Figure 2-1 shows the product material
object picture.
Figure 2-1 Product Material Object Picture
2.1 Product Technical Parameter
The major features of ZM8620 can be described from the aspects of mechanic feature, base
band, radio frequency, technical standard and environment feature. Table 2-1 is a list of the
major technical parameters and features supported by ZM8620.
Table 2-1 an Overview of Major Technical Parameters
Item
Specifications
Mechanic
Specifications
Dimensions
51mm x 30mm x 4.9mm
Weight
About 11g
Form Factor
Mini-PCIE package(52Pin)
Solution
Chipset supplier
Qualcomm MDM9215
Baseband
Processor architecture
Cortex-A5+QDSP+ARM7