Ai-thinker Esp-01 User manual

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ESP-

01 WiFi Module

Information in this document, including URL references, is subject to change without notice

.

DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANYWARRANTY OF MERCHANTABILITY, NON

PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL,

g liability for infringement of any proprietary rights, relating to use

document is disclaimed. No licenses express or implied, by estoppel or

otherwise, to any intellectual property rights are granted herein.

r Logo is a trademark of the WiFi Alliance.

All trade names, trademarks and registered trademarks mentioned in this document are property of

their respective owners, and are

.

Product version upgrades or other reasons, possible changes i

n the contents of this manual. AI-

Thinker reserves i

notice or indication of the circumstances the right to modify the content of this manual. This manual is used only as a guide,

make every effort to provide accurate information in this manual, but

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does not ensure that manual content without error, in

this manual all statements, information and advice nor does it constitute any express or imp

lied warranty.

01 WiFi Module

Version1.0

DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANYWARRANTY OF MERCHANTABILITY, NON

-

PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL,

g liability for infringement of any proprietary rights, relating to use

of information in this

otherwise, to any intellectual property rights are granted herein.

their respective owners, and are

Thinker reserves i

n the absence of any

only as a guide,

Ai-thinker

does not ensure that manual content without error, in

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Table of Contents

1. Preambles

................................

1.1. Features

................................

1.2. Parameters

................................

2. Pin Descriptions

................................

3.

Packaging and Dimension

4.

Functional Descriptions

4.1. MCU

................................

4.2.

Memory Organization

4.2.1.

Internal SRAM and ROM

4.2.2.

External SPI Flash

4.3. Crystal

................................

4.4. Interfaces

................................

4.5.

Absolute Maximum Ratings

4.6.

Recommended Operating Conditions

4.7.

Digital Terminal Characteristics

5. RF Performance

................................

6. Power Consumption

................................

7. Reflow Profile

................................

8. Schematics

................................

Table of Contents

................................

...........................

................................

......................

................................

.........................

Packaging and Dimension

................................

Functional Descriptions

................................

...............................

Memory Organization

................................

Internal SRAM and ROM

................................

...........................

External SPI Flash

................................

............................

................................

.......................

Absolute Maximum Ratings

................................

..........................

Recommended Operating Conditions

................................

Digital Terminal Characteristics

................................

.....................

................................

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................................................................

................................

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................................

.. 3

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4

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6

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7

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12

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... 12

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12

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13

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13

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15

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15

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16

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1.

Preambles

ESP-01 WiFi

module is developed by

encapsulates

Tensilica L106 integrates industry

Clock speed support 80 MHz, 160 MHz, supports the RTOS, integrated Wi

The module supports standard IEEE802.11

add modules to an existing device networking, or building a separate network controller.

ESP8266 is high integration

wireless SOCs, designed for space and power constrained mobile platform

It provides

unsurpassed ability to embed Wi

application, with the lowest cost, and minimal space requirement.

Figure 1 ESP8266EX Block Diagram

ESP8266EX offers a complete and

self

or to offload Wi-

Fi networking functions from another application processor

When ESP8266EX hosts the application, it boots up directly from an external flash. In has

improve the performance of the system in such applications.

Alternately, serving as a Wi-

Fi adapter, wireless internet access can be added to any micro controllerbased design

with simple connectivity (SPI/SDIO or I2C/UART interface).

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module is developed by

Ai-thinker Team.

core processor ESP8266 in smaller sizes of the module

Tensilica L106 integrates industry

-leading ultra low power 32-

bit MCU micro, with the 16

Clock speed support 80 MHz, 160 MHz, supports the RTOS, integrated Wi

-Fi MAC

/BB/RF/PA/LNA, on

The module supports standard IEEE802.11 b/g/n agreement, complete TCP/IP protocol stack. Users can use the

add modules to an existing device networking, or building a separate network controller.

wireless SOCs, designed for space and power constrained mobile platform

unsurpassed ability to embed Wi

-

Fi capabilities within other systems, or to function as a standalone

application, with the lowest cost, and minimal space requirement.

Figure 1 ESP8266EX Block Diagram

self

-contained Wi-

Fi networking solution; it can be used to host

Fi networking functions from another application processor

.

When ESP8266EX hosts the application, it boots up directly from an external flash. In has integrated

improve the performance of the system in such applications.

Fi adapter, wireless internet access can be added to any micro controllerbased design

with simple connectivity (SPI/SDIO or I2C/UART interface).

3

core processor ESP8266 in smaller sizes of the module

bit MCU micro, with the 16

-bit short mode,

/BB/RF/PA/LNA, on

-board antenna.

b/g/n agreement, complete TCP/IP protocol stack. Users can use the

wireless SOCs, designed for space and power constrained mobile platform

designers.

Fi capabilities within other systems, or to function as a standalone

Fi networking solution; it can be used to host

the application

integrated

cache to

Fi adapter, wireless internet access can be added to any micro controllerbased design

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ESP8266EX is among the most integrated WiFi chip in the industry; it integrates the antenna

power amplifier, low noise receive amplifier, filters, power management modules,

and the entire solution, including front-

end module, is designed

ESP8266EX also integrates an enhanced version of Tensilica’s L106 Diamond series 32

SRAM, besides the Wi-

Fi functionalities. ESP8266EX is often integrated wit

specific devices through its GPIOs; codes for such applications are

Espressif Systems’ Smart Connectivity Platform (ESCP) demonstrates sophisticated system

fas

t sleep/wake context switching for energy

signal processing, and spur cancellation and radio co

LCD interference mitigation.

1.1.

Features

•

802.11 b/g/n

•

Integrated low power 32-bit MCU

•

Integrated 10-bit ADC

•

Integrated TCP/IP protocol stack

•

Integrated TR switch, balun, LNA, power amplifier and matching network

•

Integrated PLL, regulators, and power management units

•

Supports antenna diversity

•

Wi-Fi 2.4 GHz, support WPA/WPA2

•

Support STA/AP/STA+AP operation modes

•

Support Smart Link Function for both Android and iOS devices

•

Support Smart Link Function for both Android and iOS devices

•

SDIO 2.0, (H) SPI, UART, I2C, I2S, IRDA, PWM,

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ESP8266EX is among the most integrated WiFi chip in the industry; it integrates the antenna

power amplifier, low noise receive amplifier, filters, power management modules,

it requires minimal external circuitry,

end module, is designed

to occupy minimal PCB area.

ESP8266EX also integrates an enhanced version of Tensilica’s L106 Diamond series 32

-

bit processor,

Fi functionalities. ESP8266EX is often integrated wit

h external

sensors and other application

specific devices through its GPIOs; codes for such applications are

provided in examples in the SDK.

Espressif Systems’ Smart Connectivity Platform (ESCP) demonstrates sophisticated system-

t sleep/wake context switching for energy

-efficient VoIP, adaptive radio biasing.

for low-

power operation, advance

signal processing, and spur cancellation and radio co

-existence

features for common cellular, Bluetooth, DDR, LVDS,

Integrated TR switch, balun, LNA, power amplifier and matching network

Integrated PLL, regulators, and power management units

Support STA/AP/STA+AP operation modes

Support Smart Link Function for both Android and iOS devices

SDIO 2.0, (H) SPI, UART, I2C, I2S, IRDA, PWM,

GPIO

4

ESP8266EX is among the most integrated WiFi chip in the industry; it integrates the antenna

switches, RF balun,

it requires minimal external circuitry,

bit processor,

with on-chip

sensors and other application

provided in examples in the SDK.

-

level features include

power operation, advance

features for common cellular, Bluetooth, DDR, LVDS,

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•

STBC, 1x1 MIMO, 2x1 MIMO

•

A-MPDU & A-

MSDU aggregation and 0.4s guard interval

•

Deep sleep power <10uA, Power down leakage current < 5uA

•

Wake up and transmit packets in < 2ms

•

Standby power consumption of < 1.0mW (DTIM3)

•

+20dBm output power in 802.11b

mode

•

Operating temperature range -

40C ~ 125C

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MSDU aggregation and 0.4s guard interval

Deep sleep power <10uA, Power down leakage current < 5uA

Wake up and transmit packets in < 2ms

Standby power consumption of < 1.0mW (DTIM3)

mode

40C ~ 125C

5

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1.2.

Parameters

Table 1 below describes the major parameters.

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Table 1 below describes the major parameters.

Table 1 Parameters

6

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2.

Pin Descriptions

There are altogether 8

pin counts, the definitions of which are described in Table 2 below

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pin counts, the definitions of which are described in Table 2 below

。

Table 2 ESP-01 Pin design

7

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NO.

1

2

3

4

5

6

7

8

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Table 2 Pin Descriptions

Pin Name

Function

GND

GPIO2 GPIO

,Internal Pull

GPIO0

GPIO,Internal Pull

RXD

UART0,data received pin RXD

VCC

3.3V power supply (VDD)

RST

1)

External reset pin

2)

Can loft or external MCU

CH_PD

Chip enable pin. Active high

TXD

UART0,data

8

Function

GND

,Internal Pull

-up

GPIO,Internal Pull

-up

UART0,data received pin RXD

3.3V power supply (VDD)

External reset pin

,

active low

Can loft or external MCU

,

Chip enable pin. Active high

UART0,data

send pin RXD

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Mode

GPIO15

UART

Low

Flash Boot

Low

Table

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Table 3 Pin Mode

GPIO15

GPIO0

Low

High

Table

4 Receiver Sensitivity

9

GPIO2

High

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3.

Packaging and Dimension

The external size of the module is 14.3

mm*2

integrated in this module is an SPI f

lash, the capacity of which is

The antenna applied on this module is a 3DBi PCB

Figure 3

[Module Pin Counts,

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Packaging and Dimension

mm*2

4.8mm*3mm, as is illustrated in Figure 3

below. The type of

lash, the capacity of which is

1 MB, and the package size of

which is SOP

The antenna applied on this module is a 3DBi PCB

-on-board antenna.

[Module Pin Counts,

8 pin, 14.3 mm *24.8 mm *

3.0 mm]

10

below. The type of

flash

which is SOP

-210mil.

3.0 mm]

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Table 5

Length

Width

14.3 mm

24.8 mm

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Figure 4 Top View of ESP-01

WiFi Module

Dimension of ESP-01 WiFi Module

Height

PAD Size(Bottom)

3 mm

0.9 mm x 1.7 mm

11

WiFi Module

Pin Pitch

2.54 mm

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4.

Functional Descriptions

4.1.

MCU

ESP8266EX is embedded with Tensilica L106 32

consumption and 16-

bit RSIC. The CPU clock speed is 80MHz. It can

ESP8266EX is often integrated with external sensors and other specific devices through its GPIOs;

applications are provided in examples in the SDK.

4.2.

Memory Organization

4.2.1.

Internal SRAM and ROM

ESP8266EX

WiFi SoC is embedded with memory controller, including SRAM and ROM. MCU can visit

units through iBus, dBus, and AHB interfaces. All memory units can be visited upon

will decide the running sequence according to t

According to our current version of SDK provided, SRAM space that is available to users is assigned

▪

RAM size < 36kB, that is to say, when ESP8266EX is working under the station mode and

router, programmable space accessible to user in heap and data section is

▪

There is no programmable ROM in the SoC, therefore, user program must be stored in an

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Functional Descriptions

ESP8266EX is embedded with Tensilica L106 32

-

bit micro controller (MCU), which features extra low

bit RSIC. The CPU clock speed is 80MHz. It can

also reach a maximum

value of 160MHz.

ESP8266EX is often integrated with external sensors and other specific devices through its GPIOs;

applications are provided in examples in the SDK.

Memory Organization

Internal SRAM and ROM

WiFi SoC is embedded with memory controller, including SRAM and ROM. MCU can visit

units through iBus, dBus, and AHB interfaces. All memory units can be visited upon

request, while a memory arbiter

will decide the running sequence according to t

he time when these

requests are received by the processor.

According to our current version of SDK provided, SRAM space that is available to users is assigned

RAM size < 36kB, that is to say, when ESP8266EX is working under the station mode and is

router, programmable space accessible to user in heap and data section is

around 36kB.)

There is no programmable ROM in the SoC, therefore, user program must be stored in an

12

bit micro controller (MCU), which features extra low

power

value of 160MHz.

ESP8266EX is often integrated with external sensors and other specific devices through its GPIOs;

codes for such

WiFi SoC is embedded with memory controller, including SRAM and ROM. MCU can visit

the memory

request, while a memory arbiter

requests are received by the processor.

According to our current version of SDK provided, SRAM space that is available to users is assigned

as below:

is

connected to the

There is no programmable ROM in the SoC, therefore, user program must be stored in an

external SPI flash.

4.2.2.

External

SPI Flash

efinable

MB external SPI flash to store user programs. If larger deThis module is mounted with an

1

M

storage space

is required, a SPI flash with larger memorry size is preferred. Theoretically speaking, up

to 16 MB

B memory capacity can

be supported.

Suggested

tySPI Flash memory capacit

:

▪

h memory that can be supported is 512 kB;OTA is disabled: the minimum flash

▪

h memory that can be supported is 1 MB.OTA is enabled: the minimum flash

Several SPI modes can be supportedd, including Standard SPI, Dual SPI, and Quad SPI.

, otherwise

ct SPI mode when you are downloading into the flash,Therefore, please choose the correc

firmwares/programs that you downnloaded may not work in the right way.

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4.3.

Crystal

Currently, the frequency of crystal oscillators supported include

crystal oscillators applied should be ±10PPM, and the operating temperature range

When using the downloading tools, please remember to select the right crystal oscillator type. In

capacitors C1 and C2, which are connected to the earth, are added to the input and

oscillator respectively. The values of the two capacitors can be

cap

acitive values of C1 and C2 depend on

circuit. Normally, the

capacitive values of C1 and C2 are within 10pF if the crystal oscillator frequency is 26MHz, while

the values of C1 and C2 a

re 10pF<C1, C2<22pF if the crystal oscillator frequency is 40MHz

4.4.

Interfaces

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Currently, the frequency of crystal oscillators supported include

40MHz, 26MHz and 24MHz. The

crystal oscillators applied should be ±10PPM, and the operating temperature range

should be between

When using the downloading tools, please remember to select the right crystal oscillator type. In

capacitors C1 and C2, which are connected to the earth, are added to the input and

output terminals of the crystal

oscillator respectively. The values of the two capacitors can be

flexible, ranging from 6pF to 22pF, however, the specific

acitive values of C1 and C2 depend on

further testing and adjustment on the overall performance of the whole

capacitive values of C1 and C2 are within 10pF if the crystal oscillator frequency is 26MHz, while

re 10pF<C1, C2<22pF if the crystal oscillator frequency is 40MHz

.

Table 6 Descriptions of Interfaces

13

40MHz, 26MHz and 24MHz. The

accuracy of

should be between

-20°C and 85°C.

When using the downloading tools, please remember to select the right crystal oscillator type. In

circuit design,

output terminals of the crystal

flexible, ranging from 6pF to 22pF, however, the specific

further testing and adjustment on the overall performance of the whole

capacitive values of C1 and C2 are within 10pF if the crystal oscillator frequency is 26MHz, while

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14

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4.5.

Absolute Maximum Ratings

4.6.

Recommended Operating Conditions

4.7.

Digital Terminal Characteristics

Table

Note: Test conditions: VDD = 3.3V, Temperature = 20

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Absolute Maximum Ratings

Table 7 Absolute Maximum Ratings

Recommended Operating Conditions

Table 8 Recommended Operating Conditions

Digital Terminal Characteristics

Table

9 Digital Terminal Characteristics

Note: Test conditions: VDD = 3.3V, Temperature = 20

℃, if nothing special is stated.

15

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5.

RF Performance

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Table 10 RF Performance

16

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6.

Power Consumption

❶

Modem-

Sleep requires the CPU to be working, as in PWM or I2S applications. According to

U-

APSD), it saves power to shut down the Wi

transmission. E.g. in DTIM3, to maintain a sleep 300mswake 3ms cycle to receive AP’s Beacon packages, the current is

about 15mA.

❷

During Light-

Sleep, the CPU may be suspended in applications like Wi

Wi-

Fi Modem circuit can be turned off and CPU suspended to save power

E.g. in DTIM3, to maintain a sleep 300ms

-

❸

Deep-Sleep does not require Wi-

Fi connection to be maintained. For application with long time

transmission, e.g. a temperature sensor that checks the temperature every 100s

to the AP (taking about 0.3~1s), t

he overall average current is

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Table 11 Power Consumption

Sleep requires the CPU to be working, as in PWM or I2S applications. According to

APSD), it saves power to shut down the Wi

-Fi Modem circuit while maintaining a Wi-

Fi connection with no data

transmission. E.g. in DTIM3, to maintain a sleep 300mswake 3ms cycle to receive AP’s Beacon packages, the current is

Sleep, the CPU may be suspended in applications like Wi

-

Fi switch. Without data

Fi Modem circuit can be turned off and CPU suspended to save power

according to the 802.11 standard (U

-

wake 3ms

cycle to receive AP’s Beacon packages, the current is about 0.9mA.

Fi connection to be maintained. For application with long time

transmission, e.g. a temperature sensor that checks the temperature every 100s

,

sleep 300s and waking up to connect

he overall average current is

less than 1mA.

17

Sleep requires the CPU to be working, as in PWM or I2S applications. According to

802.11 standards (like

Fi connection with no data

transmission. E.g. in DTIM3, to maintain a sleep 300mswake 3ms cycle to receive AP’s Beacon packages, the current is

Fi switch. Without data

transmission, the

according to the 802.11 standard (U

-APSD).

cycle to receive AP’s Beacon packages, the current is about 0.9mA.

Fi connection to be maintained. For application with long time

lags between data

sleep 300s and waking up to connect

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7.

Reflow Profile

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Table 12 Instructions

18

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8.

Schematics

Figure 4 Schematics of E

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Figure 4 Schematics of E

sp-01 WiFi Module

19

Ai-Thinker ESP-01 User manual

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