Apogee DDX-2050 User manual

DDX-2050
Specifications are subject to change without notice.
129 Morgan Drive, Norwood, MA 02062 voice: [phone] fax: [phone] email: [email protected]
CONTROLLED DOCUMENT: DRN: PRELIMINARY Page 1 of 13
All-Digital High Efficiency Power Amplifier
FEATURES
• HIGH OUTPUT CAPABILITY
• 2 x 30W into 8Ωor 1 x 60W into 4 Ω
@ <1% THD
• SINGLE SUPPLY (+9V to +30V)
• COMPACT SURFACE MOUNT PACKAGE
• HIGH EFFICIENCY, >88%
• THERMAL OVERLOAD AND SHORT
CIRCUIT PROTECTION
BENEFITS
• COMPLETE SURFACE MOUNT DESIGN
• POWER SUPPLY SAVINGS
APPLICATIONS
• DIGITAL POWERED SPEAKERS
• PC SOUND CARDS
• CAR AUDIO
• SURROUND SOUND SYSTEMS
• DIGITAL AUDIO COMPONENTS
GENERAL DESCRIPTION
The DDX-2050 power device is a monolithic dual
channel H-Bridge that can provide up to 30 watts
per channel of audio power at very high
efficiency. The DDX-2050 power device
contains a logic interface, integrated bridge
drivers, high efficiency MOSFET output
transistors and protection circuitry. The device
may be used as a dual bridge or reconfigured as
a single bridge with double the output current
capability.
The benefits of the DDX amplification system are
an all-digital design that eliminates the need for a
digital to analog converter (DAC) and the high
efficiency operation derived from the use of
Apogee's patented damped ternary pulse width
modulation (PWM). This approach provides an
efficiency advantage over conventional Class-D
designs and up to three times the efficiency of
typical Class A/B amplifiers with music input
signals.
Figure 1. Block Diagram
TRISTATE
CONFIG
INL
A
BIAS OUTPL
OUTPL
VCC1P
PGND1P
PGND1N
OUTNL
OUTNL
VCC1N
PGND2P
OUTPR
OUTPR
VCC2P
PGND2N
OUTNR
OUTNR
VCC2N
PWRDN
FAULT
TWARN
INLB
INR
A
INRB
VREG2
VREG2
VREG1
VREG1
GNDREF
VSIG
GNDR1
FET
DRIVE
FET
DRIVE
PROTECTION
AND
DRIVER
LOGIC
REGULATORS
FET
DRIVE
FET
DRIVE

DDX-2050
PRELIMINARY Specifications are subject to change without notice. PRELIMINARY
129 Morgan Drive, Norwood, MA 02062 voice: [phone] fax: [phone] email: [email protected]
CONTROLLED DOCUMENT: P_903-000030_Rev00 Data Sheet, DDX-2050.doc DRN: PRELIMINARY Page 2 of 13
Absolute Maximum Ratings [Note 1]
SYMBOL PARAMETER VALUE UNIT
VCC Power supply voltage 40V V
VL Input logic reference 5.5V V
Tj Operating junction temperature range -40 to +150 °C
Tstg Storage temperature range -40 to +150 °C
Note 1: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Recommended Operating Conditions [Note 2]
SYMBOL PARAMETER MIN TYP MAX UNIT
VCC Power supply voltage [Note 3] 10.0 36.0 V
VL Input logic reference 2.7 3.3 5.0 V
T
A
Ambient Temperature 0 70
°C
Note 2: Performance not guaranteed beyond recommended operating conditions.
Note 3: Overvoltage protection may preclude operation above 30V.
Thermal Data
SYMBOL PARAMETER MIN TYP MAX UNIT
θ
JC
Thermal resistance junction-case (heat spreader) 2.5 °C/W
T
jSD
Thermal shut-down junction temperature 150 °C
Twarn Thermal warning temperature 130
°C
T
hSD
Thermal shut-down hysteresis 25 °C
Electrical Characteristics
Refer to circuit in Figure 4. VCC = 28V, VL = 3.3V, fsw = 384kHz, T
A
= 25C, RL = 8Ω unless otherwise specified.
SYMBOL PARAMETER CONDITION MIN TYP MAX UNIT
Po Output power per channel [Notes 4,5] THD+N <1% 35 Wrms
Po Output power per channel [Notes 4,5] VCC = 30V,
@ 10% THD+N 50 Wrms
UVL Undervoltage Lockout Threshold 7 9 V
OVP Overvoltage Protection Threshold 30 35 40 V
I
PD
Vcc supply current in Powerdown 1 3 mA
I
cc
tri Supply current from Vcc in Tristate TRISTATE = 0 22 mA
I
cc
Vcc supply current
2-Channel
switching at
384kHz.
72 mA
I
sc
Output Short-circuit Protection limit Speaker outputs. 3.0 5.0 6.5 A
THD+N Total Harmonic Distortion+Noise [Note 4] Po=1 Wrms
Po=30 Wrms 0.08 0.33
0.18
0.50
%
%
THD+N Total Harmonic Distortion+Noise [Note 5] Po=1 Wrms
Po=30 Wrms 0.05
0.15 %
%
SNR Signal to Noise Ratio [Note 4] A-Weighted 93 dB
SNR Signal to Noise Ratio [Note 5] A-Weighted 100 dB
η Efficiency Po=2 x 30 W 88 %
RdsON Power MOSFET output resistance Id=1A 200 270 mΩ
RdsON
matching Id=1A 95 %
t
on
Turn-on delay time Resistive load 100 ns
t
off
Turn-off delay time Resistive load 100 ns
t
r
Rise time Resistive load 25 ns
t
f
Fall Time Resistive load 25 ns
V
IL
Low logic input voltage on PWRDN,
TRISTATE pins
V
L
= 2.7V
V
L
= 3.3V
V
L
= 5.0V
0.7
0.8
0.85
V

DDX-2050
PRELIMINARY Specifications are subject to change without notice. PRELIMINARY
129 Morgan Drive, Norwood, MA 02062 voice: [phone] fax: [phone] email: [email protected]
CONTROLLED DOCUMENT: P_903-000030_Rev00 Data Sheet, DDX-2050.doc DRN: PRELIMINARY Page 3 of 13
Electrical Characteristics (continued)
SYMBOL PARAMETER CONDITION MIN TYP MAX UNIT
V
IH
High logic input voltage on PWRDN,
TRISTATE pins
V
L
= 2.7V
V
L
= 3.3V
V
L
= 5.0V
1.5
1.7
1.85
V
V
IL
, PWM
Inputs
Low logic input voltage on INLA, INLB,
INRA, INRB pins
V
L
= 2.7V
V
L
= 3.3V
V
L
= 5.0V
1.05
1.35
2.2
V
V
IH
, PWM
Inputs
High logic input voltage on INLA, INLB,
INRA, INRB pins
V
L
= 2.7V
V
L
= 3.3V
V
L
= 5.0V
1.65
1.95
2.8
V
I
fault
Output Sink Current, FAULT, TWARN pins Fault Active 1 mA
P
w
min Minimum output pulse width No load 70 150 ns
Note 4: Characteristics are for the DDX-2050 power device driven by either the DDX-2000 or DDX-4100(A) processor.
Note 5: Characteristics are for the DDX-2050 power device driven by DDX-8000 processor.
Logic Truth Table
TRISTATE InxA INxB OUTPx OUTNx OUTPUT MODE
0 X X OFF OFF Hi-Z
1 0 0 GND GND DAMPED
1 0 1 GND VCC NEGATIVE
1 1 0 VCC GND POSITIVE
1 1 1 VCC VCC Not Used
DDX-2050 Pin Function Description
PWM Inputs
Pin Name Pin No. Description
INLA 29 Left A logic input signal
INLB 30 Left B logic input signal
INRA 31 Right A logic input signal
INRB 32 Right B logic input signal
Control/Miscellaneous
Pin Name Pin No. Description
PWRDN 25 Power Down (0=Shutdown, 1= Normal).
TRI-STATE 26 Tri-State (0=All MOSFETS Hi-Z, 1=Normal).
FAULT [Note 6] 27 Fault output indicator; Overcurrent, Overvoltage or Overtemperature
(0=Fault, 1=Normal).
TWARN [Note 6] 28 Thermal warning output
(0=Warning T
J
>= 130°C, 1=Normal).
CONFIG [Note 7] 24 Configuration (0=Normal, 1=Parallel operation for mono).
NC 18 Do not connect.
Note 6: FAULT and TWARN outputs are open-drain
Note 7: Connect CONFIG Pin 24 to VREG1 Pins 21,22 to implement single bridge operation for high current.
Power Outputs [Note 8]
Pin
Name Pin No. Description
OUTPL 16, 17 Left output, positive reference
OUTNL 10, 11 Left output, negative reference
OUTPR 8, 9 Right output, positive reference
OUTNR 2, 3 Right output, negative reference
Note 8: DDX outputs are bridged. The outputs OUTPx produce signals in phase with the input.

DDX-2050
PRELIMINARY Specifications are subject to change without notice. PRELIMINARY
129 Morgan Drive, Norwood, MA 02062 voice: [phone] fax: [phone] email: [email protected]
CONTROLLED DOCUMENT: P_903-000030_Rev00 Data Sheet, DDX-2050.doc DRN: PRELIMINARY Page 4 of 13
Power Supplies
Pin Name Pin No. Description
VCC [1P, 1N, 2P, 2N] 4, 7, 12, 15 Power
PGND [1P, 1N, 2P, 2N] 5, 6, 13, 14 Power grounds
VREG1 21, 22 Internal regulator voltage requires bypass capacitor.
VREG2 33, 34 Internal regulator voltage requires bypass capacitor.
VSIG 35, 36 Signal Positive supply.
VL 23 Logic reference voltage.
GNDREF 19 Logic reference ground.
GNDS 1 Substrate ground.
GNDR1 20 Internal regulator ground.

DDX-2050
PRELIMINARY Specifications are subject to change without notice. PRELIMINARY
129 Morgan Drive, Norwood, MA 02062 voice: [phone] fax: [phone] email: [email protected]
CONTROLLED DOCUMENT: P_903-000030_Rev00 Data Sheet, DDX-2050.doc DRN: PRELIMINARY Page 5 of 13
Figure 2. Output Power vs. Supply Voltage for Stereo Bridge.
Figure 2 shows the full-scale output power (0dB FS digital input with unity amplifier gain) as a function
of Power Supply Voltage for 4, 6, and 8 Ohm loads. Output power is constrained for higher impedance
loads by the over-voltage protection limit of the DDX-2050 IC and by the over-current protection limit for
lower impedance loads. The minimum threshold for the over-current protection circuit is 3.0A (at 25 ºC)
but the typical threshold is 5A. Solid curves depict the worst case output power capability constrained
to a 3.0A current limit. Dashed curves depict typical output power capability of the device. Of course,
the output power curves assume proper thermal management of the power device’s internal
dissipation.
5 10 15 20 25 30
0
5
10
15
20
25
30
35
40
45
50
55
60
8 Ohm Load, Iout = 3A
8 Ohm Load, Iout = 5A
6 Ohm Load, Iout = 3A
6 Ohm Load, Iout = 5A
4 Ohm Load, Iout = 3A
4 Ohm Load, Iout = 5A
Output Power vs Supply
Power Supply Voltage (VDC)
O
U
T
P
W
R
W
R
M
S
8
Ω
6
Ω
4
Ω

DDX-2050
PRELIMINARY Specifications are subject to change without notice. PRELIMINARY
129 Morgan Drive, Norwood, MA 02062 voice: [phone] fax: [phone] email: [email protected]
CONTROLLED DOCUMENT: P_903-000030_Rev00 Data Sheet, DDX-2050.doc DRN: PRELIMINARY Page 6 of 13
Figure 3. Mono Bridge Output Power vs Supply <1% THD.
Figure 3 depicts the output power as a function of power supply voltages for loads of 2, 3, and 4 Ohms.
The same notes from Figure 2 apply except output current is 6A minimum, 10A typical. for a mono
bridge. Solid curves depict the worst case minimum and dashed curves depict typical performance.
5 10 15 20 25 30
0
10
20
30
40
50
60
70
80
90
100
110
120
4 Ohm Load, Iout = 6A
4 Ohm Load, Iout = 10A
3 Ohm Load, Iout = 6A
3 Ohm Load, Iout = 10A
2 Ohm Load, Iout = 6A
2 Ohm Load, Iout = 10A
Mono Bridge Output Power vs Supply
Power Supply Voltage (VDC)
O
U
T
P
W
R
W
R
M
S
4Ω
3Ω
2
Ω

DDX-2050
PRELIMINARY Specifications are subject to change without notice. PRELIMINARY
129 Morgan Drive, Norwood, MA 02062 voice: [phone] fax: [phone] email: [email protected]
CONTROLLED DOCUMENT: P_903-000030_Rev00 Data Sheet, DDX-2050.doc DRN: PRELIMINARY Page 7 of 13
100nF
X7R
C4
10 to 28V
R7
10k
100nF
X7R
C32
100nF
X7R
C15
U2
DDX-2060
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
1819
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36 GNDS
OUTNR
OUTNR
VCC2N
PGND2N
PGND2P
VCC2P
OUTPR
OUTPR
OUTNL
OUTNL
VCC1N
PGND1N
PGND1P
VCC1P
OUTPL
OUTPL
NCGNDREF
GNDR1
VREG1
VREG1
VL
CONFIG
PWRDN
TRI-STATE
FAULT
TWARN
INLA
INLB
INRA
INRB
VREG2
VREG2
VSIG
VSIG
8 OHM
330pF
C13
X7R
100nF
X7R
C7
100nF
C14
22uH
L1
470nF
FILM
C23
470nF
FILM
C10
6.2
1/4W
R5
100nF
X7R
C25
100nF
C17
100nF X7R
C11
LEFTB
22uH
L2
EAPD
20
1/4W
R3
100nF
X7R
C22
100nF
C9
+3.3V
+3.3V
1uF
X7R
C12
+
1000uF
35V
C6
10k
R6
100nF
X7R
C19
LEFTA
330pF
C24
X7R
LEFT-
1uF
X7R
C33
LEFT+
RIGHT+
6.2
1/4W
R10
22uHL3
RIGHTB
10 to 28V
8 OHM
100nF
X7R
C20
100nF
X7R
C26
100nF
X7R
C21
6.2
1/4W
R9
100nF
X7R
C31
LS1
SPEAKER
RIGHTA
6.2
1/4W
R4
LS2
SPEAKER
RIGHT-
22uH
L4
20
1/4W
R8
TWARN
Figure 4. Stereo Audio Application Circuit
10k
R6
EAPD
LFE+
100nF
C9
LFE-
10 to 28V
10 to 28V
LFEA
LFEB
U2
DDX-2060
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
1819
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36 GNDS
OUTNR
OUTNR
VCC2N
PGND2N
PGND2P
VCC2P
OUTPR
OUTPR
OUTNL
OUTNL
VCC1N
PGND1N
PGND1P
VCC1P
OUTPL
OUTPL
NCGNDREF
GNDR1
VREG1
VREG1
VL
CONFIG
PWRDN
TRI-STATE
FAULT
TWARN
INLA
INLB
INRA
INRB
VREG2
VREG2
VSIG
VSIG 10uH
L12
3.0
1/2W
R5
10
1/4W
R3
220nF
X7R
C7
100nF
X7R
C32
1uF
X7R
C12
TWARN
680pF
C13
X7R
220nF
X7R
C4
100nF
X7R
C31
LS1
SPEAKER
+3.3V
3.0
1/2W
R4
100nF
X7R
C21
100nF
X7R
C19
100nF
C17
220nF
X7R
C15
100nF X7R
C11
4 OHM
10uH
L1
+
1000uF 35V
C6
1.0uF
FILM
C10
1uF
X7R
C33
220nF
X7R
C14
Figure 5. Mono Audio Application Circuit
50
50

DDX-2050
PRELIMINARY Specifications are subject to change without notice. PRELIMINARY
129 Morgan Drive, Norwood, MA 02062 voice: [phone] fax: [phone] email: [email protected]
CONTROLLED DOCUMENT: P_903-000030_Rev00 Data Sheet, DDX-2050.doc DRN: PRELIMINARY Page 8 of 13
Figure 6. Silkscreen Layer

DDX-2050
PRELIMINARY Specifications are subject to change without notice. PRELIMINARY
129 Morgan Drive, Norwood, MA 02062 voice: [phone] fax: [phone] email: [email protected]
CONTROLLED DOCUMENT: P_903-000030_Rev00 Data Sheet, DDX-2050.doc DRN: PRELIMINARY Page 9 of 13
Figure 7. : P. C. Board, Top (Component Side)
Figure 8. P. C. Board, Bottom (Solder Side)

DDX-2050
PRELIMINARY Specifications are subject to change without notice. PRELIMINARY
129 Morgan Drive, Norwood, MA 02062 voice: [phone] fax: [phone] email: [email protected]
CONTROLLED DOCUMENT: P_903-000030_Rev00 Data Sheet, DDX-2050.doc DRN: PRELIMINARY Page 10 of 13
Figure 9. Drill Diagram
Figure 10. Solder Mask

DDX-2050
Specifications are subject to change without notice.
129 Morgan Drive, Norwood, MA 02062 voice: [phone] fax: [phone] email: [email protected]
CONTROLLED DOCUMENT: DRN: PRELIMINARY Page 11 of 13
DDX-2050 POWER DEVICE
The DDX-2050 Power Device is a dual channel
H-Bridge that can deliver over 30 watts per
channel of audio output power at very high
efficiency. It converts DDX controlled PWM
signals to power at the load. The DDX-2050
includes a logic interface, integrated bridge
drivers, high efficiency MOSFET outputs and
over-voltage, thermal and short circuit
protection circuitry. Two logic level signals per
channel are used to control high-speed
MOSFET switches to connect the speaker load
to the input supply or to ground in a bridge
configuration, according to Apogee's patented
damped ternary PWM. The DDX-2050 includes
over-current, thermal, and over-voltage
protection and under-voltage lockout with
automatic recovery. A thermal warning status
is also provided.
Logic I/F
and Decode
Left
H-Bridge
Protection
Circuitry
INL[1:2]
INR[1:2]
PWRDN
OUTPL
FAULT
VL
TRI-STATE
OUTNL
OUTPR
OUTNR
TWARN
Regulators
Right
H-Bridge
Figure 9: DDX-2050 Block Diagram
Logic Interface and Decode
The DDX-2050 power outputs are controlled
using two logic level timing signals. In order to
provide a proper logic interface, the VL input
must operate at the same voltage as the DDX
controller logic supply.
Protection Circuitry
The DDX-2050 includes protection circuitry for
over-current, over-voltage, and thermal
overload conditions. A thermal warning pin
TWARN is activated low (open-drain MOSFET)
when the IC temperature exceeds 130°C, in
advance of the thermal shutdown protection.
When a fault condition is detected (logical OR
of over-current,
over-voltage, and thermal), an internal fault
signal acts to immediately disable the output
power MOSFETs, placing both H-bridges in a
high impedance state. At the same time an
open-drain MOSFET connected to the FAULT
pin is switched on. There are two possible
modes subsequent to activating a fault. The
first is a SHUTDOWN mode. With FAULT (pull-
up resistor) and TRI-STATE pins independent,
an activated fault will disable the device,
signaling low at the FAULT output. The device
may subsequently be reset to normal operation
by toggling the TRI-STATE pin from High to
Low to High using an external logic signal. The
second is an AUTOMATIC recovery mode.
This is depicted in the application circuit in
Figure 4. The FAULT and TRI-STATE pins are
shorted together and connected to a time
constant circuit comprising R6 and C17. An
activated FAULT will force a reset on the TRI-
STATE pin causing normal operation to resume
following a delay determined by the time
constant of the circuit. If the fault condition is
still presented, the circuit operation will continue
repeating until such time as the fault condition
is removed. An increase in the time constant of
the circuit will produce a longer recovery
interval. Care must be taken in the overall
system design so as not to exceed the
protection thresholds under normal operation.
Power Outputs
The DDX-2050 power and output pins are
duplicated to provide a low impedance path for
the devices bridged outputs. All duplicate
power, ground and output pins must be
connected for proper operation. The PWRDN or
TRI-STATE pins should be used to set all
MOSFETS to the Hi-Z state during power-up
until the logic power supply, VL, is settled.
Parallel Output/High Current Operation
The DDX-2050 outputs can be connected in
parallel to increase the output current to a load.
In this configuration the device can provide over
60W into 4Ω (see Figure 3). This mode is
enabled with the CONFIG pin connected to
VREG1 and the inputs combined INLA = INLB,

DDX-2050
PRELIMINARY Specifications are subject to change without notice. PRELIMINARY
129 Morgan Drive, Norwood, MA 02062 voice: [phone] fax: [phone] email: [email protected]
CONTROLLED DOCUMENT: P_903-000030_Rev00 Data Sheet, DDX-2050.doc DRN: PRELIMINARY Page 12 of 13
INRA = INRB and outputs combined OUTLA =
OUTLB, OUTRA = OUTRB.
ADDITIONAL INFORMATION
Output Filter
A passive two-pole low pass filter is used on the
DDX-2050 power outputs to reconstruct an
analog signal. System performance can be
significantly affected by the output filter design
and choice of components. A filter design for
8Ωloads is shown in the Typical Application
Circuit in Figure 4.
Power Dissipation/Heat Sink Requirements
The power dissipation of the device will depend
primarily on the supply voltage, load
impedance, and output modulation level.
The DDX-2050 surface mount package
includes an exposed thermal pad on the bottom
of the device to provide a direct thermal path
from the integrated circuit to the PCB. This pad
must be soldered to a low thermal impedance
path at circuit ground potential for proper
operation, e.g. a PCB ground plane. For
continuous duty rated applications, careful
consideration must be made to the overall
thermal design.
For additional thermal design considerations,
see
http://www.apogeeddx.com/DDX_Themal_Cons
iderations.PDF

DDX-2050
Specifications are subject to change without notice.
129 Morgan Drive, Norwood, MA 02062 voice: [phone] fax: [phone] email: [email protected]
CONTROLLED DOCUMENT: DRN: PRELIMINARY Page 13 of 13
PHYSICAL DIMENSIONS (Dimensions shown in mm)
e
a2
A
E
a1
DETAIL A
D
11 8
1936
E1
E2
h x 45
DETAIL A
lead
slug
a3
S
Gage
Pl
0.35
L
DETAIL B
DETAIL B
(COPLANARIT
)
GC
- C -
SEATING
PLANE
e3
c
N N
⊕
M
0.12 AB
b
B
A
H
E3
D1
BOTTOM VIEW
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 3.60 0.141
a1 0.10 0.30 0.004 0.012
a2 3.30 0.130
a3 0 0.10 0 0.004
b 0.22 0.38 0.008 0.015
c 0.23 0.32 0.009 0.012
D (1) 15.80 16.00 0.622 0.630
D1 9.40 9.80 0.370 0.385
E 13.90 14.50 0.547 0.570
e 0.65 0.0256
e3 11.05 0.435
E1 (1) 10.90 11.10 0.429 0.437
E2 2.90 0.114
E3 5.80 6.20 0.228 0.244
E4 2.90 3.20 0.114 0.126
G 0 0.10 0 0.004
H 15.50 15.90 0.610 0.626
h 1.10 0.043
L 0.80 1.10 0.031 0.043
N1 0
° (max.)
S8
° (max.)
(1): "D" and "E1" do not include mold flash or protrusions
- Mold flash or protrusions shall not exceed 0.15mm (0.006 inch)
- Critical dimensions are "a3", "E" and "G".
Information furnished in this publication is believed to be accurate and reliable. However, Apogee Technology, Inc. assumes no responsibility
for its use, or for any infringements of patents or other rights of third parties that may result form its use. Specifications in this publication are
subject to change without notice. This publication supersedes and replaces all information previous supplied.
Apogee Technology, Inc. All Rights Reserved