Artaflex AWP24S Guide

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HARDWARE DESIGN GUIDE
FOR
ARTAFLEX WIRELESS MODULES
For Models:
AWP24S
AWS24S
AWP24U
AWAC24U
AWA24S
AW24MCHL-SM
AW24MCHL-H2
AW24MUFL-SM
Document:
AN-121-0001
Written y:
Kashif Ahmed
Date:
Jul 05,2012

Artaflex Inc.
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Contents
1 0 Introduction 3
2 0 Main Features 3
3 0 Module Types 4
4 0 Mechanical Dimensions 5
5 0 Design Guidelines
5 1 PCB Design 5
5 2 Module Placement Strategy 14
5 3 External Antenna Applications 18
6 0 SMT Assembly Guidelines for AW24MCHL-SM 19

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1. Introduction
This document provides information on designing Artaflex wireless modules into
products that require 2 4 GHz ISM band wireless data transmission A brief description
is provided for all the modules to aid in assisting the designer on selecting the right
model for the design For more detailed information, please refer to engineering
datasheets or contact Artaflex technical sales/support
To ensure optimal RF performance, suggested design guidelines are provided for
placement on PCB Information on mating connectors on host board, solder reflow
temperature profiles for assembly and reworking information are also provided
manufacturing are also provided
Artaflex wireless modules operate in the 2 4 GHZ ISM band The Falcon series
modules are based on Cypress Semiconductor CyFi chipset and offer seamless
compliance to the CyFi protocol The modules are low power with transmitting data
rates up to 1Mb/s and operating range from 50 meters for embedded antenna devices
to 1 kilometer for devices equipped with a power amplifier All modules are
FCC/EU/ETS/Industry Canada agency certified
2. Main Features
• Low operating current
• Transmit power from 4dBm up to +21 dBm
• Receive sensitivity up to –97 dBm
• Sleep current <1-10 µA
• Operating range from 10m to 1km or more depending on model and conditions
• DSSS data rates up to 250 kbps, GFSK data rate of 1 Mbps
• Auto Transaction Sequencer (ATS) - no micro controller intervention
• Framing, Length, CRC16, and Auto ACK
• Fast startup and fast channel changes
• Separate 16-byte transmit and receive FIFOs
• AutoRate™ - dynamic data rate reception
• Receive Signal Strength Indication (RSSI)
• 4-MHz SPI microcontroller interface
• No proprietary software required
• Serial Peripheral Interface (SPI) control while in sleep mode
• Operating voltage from 2 4 to 3 6 volts
• Operating temperature from 0 to 70°C
• Size: as small as 15mm(L) x 13 5(W) x 1 8mm(H)

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• Weight: 5 - 27 grams
• FCC Modular Approval Grant to meet FCC Part 15, EN 300 328-1, EN 301 489-1,
EN 301 489-7 and Industry Canada RSS-210 standards
3. Module Types
There are many packaging options available
The following is a list of available modules with a brief description.
1) AWP24S has an integrated PCB print antenna It is a first generation module
2) AWS24S has a co-axial U FL connector for attaching an external antenna It is a
first generation module
3) AWP24U is a USB dongle version allowing it to plug into computers
4) AWA24S has a power amplifier for longest operating range
5) AWAC24U is a USB dongle with a power amplifier that offers longest range and
a computer interface
6) AW24MCHL-H2 has a chip antenna and header connector It is a second
generation module that offers high performance in the smallest available
package
7) AW24MCHL-HR is the same as AW24MCHL-H2 but has a right angle connector
allowing the module to be mounted perpendicular to host PCB
8) AW24MCHL-SM is a surface mount version that has the lowest profile since
there is no header connector
9) AW24MUFL has a header connector and has a U FL connector for connecting
an external antenna

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4. Mechanical Dimensions
a. AWP24S - Integrated PC Antenna Module
Size: 38 1 mm x 25 4 mm (1 5” x 1 0”)
AWP24S Connector Pin Information
Pin Name Type Defa lt Description
1 GND Power GND Ground
2 VCC Power VCC Main Supply 2.4 to 3.6 volts
3 IRQ I/O - Interrupt output configurable active high or low), or GPIO
4 RST Input Input Module Reset. Internal on Chip 10k-ohm pull-down resistor. Active HIGH
5 MOSI I/O Input SPI data input, or SDAT
6 SS Input Pull Up SPI Interface enable, Active LOW
7 SCK Input Input SPI Clock
8 MISO I/O Hi Z SPI data output pin or GPIO in 3-pin SPI mode.
9 GND Power GND Ground
10 PACTL NC No Connect
11 TXPA NC No Connect
12 RXPA NC No Connect

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b. AWS24S - Co-axial External Antenna Module
Size: 38 1 mm x 25 4 mm (1 5” x 1 0”)
AWS24S Connector Pin Information
Pin Name Type Defa lt Description
1 GND Power GND Ground
2 VCC Power VCC Main Supply 2.4 to 3.6 volts
3 IRQ I/O - Interrupt output configurable active high or low), or GPIO
4 RST Input Input Module Reset. Internal on Chip 10k-ohm pull-down resistor. Active HIGH
5 MOSI I/O Input SPI data input, or SDAT
6 SS Input Pull Up SPI Interface enable, Active LOW
7 SCK Input Input SPI Clock
8 MISO I/O Hi Z SPI data output pin or GPIO in 3-pin SPI mode.
9 GND Power GND Ground
10 PACTL NC No Connect
11 TXPA NC No Connect
12 RXPA NC No Connect

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c. AWA24S - Power Amplifier Module
Size: 25 4 mm x 20 32 mm
AWA24S Connector Pin Information
Pin Name Type Defa lt Description
1 GND Power GND Ground
2 VCC Power VCC Main Supply 2.4 to 3.6 volts
3 IRQ I/O - Interrupt output configurable active high or low), or GPIO
4 RST Input Input Module Reset. Internal on Chip 10k-ohm pull-down resistor. Active HIGH
5 MOSI I/O Input SPI data input, or SDAT
6 SS Input Pull Up SPI Interface enable, Active LOW
7 SCK Input Input SPI Clock
8 MISO I/O Hi Z SPI data output pin or GPIO in 3-pin SPI mode.
9 GND Power GND Ground
10 *PACTL Input Power Control – max power at 3.3V - Shut down “0V”
11 TXPA Input Active High to set Module into a Transmit mode RXPA = Low)
12 RXPA Input Active High to set the Module into a Receive mode TXPA = Low)

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d. AWP24U - Wireless US Dongle
Size: 45 7 mm x 20 3 mm
e. AWAC24U – Wireless US Dongle with PA

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No Drawing Available. Mechanical Specifications Pending Release.

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f. AW24MCHL-H2 - Micro Module with Chip Antenna
Size: 16 mm x 13 5 mm

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g. AW24MCHL-HR - Micro Module with Chip Antenna and RA Connector
AW24MCHL-H2 / HR Connector Pin Information
Header
Pin No Name
Type Defa lt Description
1 GND Power GND Ground
2 VCC Power VCC Main Supply 2.4 to 3.6 volts
3 IRQ I/O - Interrupt output configurable active high or
low), or GPIO
4 RST Input Input Module Reset. Internal on Chip 10k-ohm pull-
down resistor. Active HIGH
5 MOSI I/O Input SPI data input, or SDAT
6 SS Input Pull Up SPI Interface enable, Active LOW
7 SCK Input Input SPI Clock
8 MISO I/O Hi Z SPI data output pin or GPIO in 3-pin SPI mode.
9 GND Power GND Ground
10 NC No Connect
11 TXPA NC No Connect
12 RXPA NC No Connect

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h. AW24MUFL-H2 - Micro Module with UFL connector
Size: 16 mm x 13 5 mm
AW24MUFL-H2 Connector Pin Information
Header
Pin No Name
Type Defa lt Description
1 GND Power GND Ground
2 VCC Power VCC Main Supply 2.4 to 3.6 volts
3 IRQ I/O - Interrupt output configurable active high or
low), or GPIO
4 RST Input Input Module Reset. Internal on Chip 10k-ohm pull-
down resistor. Active HIGH
5 MOSI I/O Input SPI data input, or SDAT
6 SS Input Pull Up SPI Interface enable, Active LOW
7 SCK Input Input SPI Clock
8 MISO I/O Hi Z SPI data output pin or GPIO in 3-pin SPI mode.
9 GND Power GND Ground
10 NC No Connect
11 TXPA NC No Connect
12 RXPA NC No Connect

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i. AW24MCHL-SM - Micro Module with Surface Mount Connections
Size: 15 mm x 13 5 mm
AW24MCHL-SM Connector Pin out Information
SMT
Pin No Name
Type Defa lt Description
12 GND Power GND Ground
11 VCC Power VCC Main Supply 2.4 to 3.6 volts
5 IRQ I/O - Interrupt output configurable active high or
low), or GPIO
9 RST Input Input Module Reset. Internal on Chip 10k-ohm pull-
down resistor. Active HIGH
3 MOSI I/O Input SPI data input, or SDAT
4 SS Input Pull Up SPI Interface enable, Active LOW
2 SCK Input Input SPI Clock
6 MISO I/O Hi Z SPI data output pin or GPIO in 3-pin SPI mode.
13 GND Power GND Ground
1,14,15,16,10 NC No Connect.
7 XOUT I/O O
Buffered 0 75, 1 5, 3, 6, or 12 MHz clock, PACTL, or
GPIO Tri-states in sleep mode (configure as GPIO
drive LOW)
8 PACTL I/O O
CYRF7936 Control signal for external PA, T/R
switch, or GPIO.

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5.0 Design Guidelines
5.1 PC Design
All Falcon wireless modules except the surface mount version require a mating
receptacle connector on the host PCB The following are recommended
connectors manufactured by FCI that will mate to the modules Equivalents
from other manufacturers can also be used
These are available as surface mount versions or through-hole:
FCI part number 55508-112TRLF (12 pin dual row 2mm vertical SM receptacle)
http://portal fciconnect com/portal/page/portal/FcicntPublic/ComergentConnect?appname=catDi
splayStyle$domProductQueryName=55508-112TRLF*$OP=search
FCI part number 63453-112LF (12 pin dual row 2mm vertical through hole
receptacle)
http://portal fciconnect com/portal/page/portal/FcicntPublic/ComergentConnect?appname=catDi
splayStyle$domProductQueryName=63453-112lf*$OP=search

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For Artaflex wireless module AW24MCHL-SM, there is no mating connector required
since it is mounted directly onto the host PCB See below for recommended land
pattern

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5.2 Module Placement Strategy
Artaflex wireless modules are RF devices that require proper placement on
PCB to ensure optimal performance The antenna on the PCB has an omni-
directional radiation pattern To maximize antenna efficiency, an adequate
grounding plane must be provided under the module However, the areas
underneath and surrounding the antenna area must be free of copper The
position of the module on the host board and overall design of the product
enclosure contribute to antenna performance Poor design effects radiation
patterns and can result in reflection, diffraction, and/or scattering of the
transmitted signal thus limiting the range Measured radiation patterns of these
modules are available from Artaflex and can be used to benchmark design
performance In summary:
i Never place the ground plane or route copper traces directly underneath the
antenna portion of the module
ii Never place the antenna close to metallic objects
iii Keep wiring, components and objects away from antenna
iv Do not place the antenna in a metallic or metalized plastic enclosure
v Enclosure walls should be 1cm or more away from the antenna in all
directions
vi If possible, mount antenna overhanging the edge of the host board Add an
uninterrupted ground plane on host board, directly underneath the module, up
to the PCB edge Adding a ground plane will allow traces to be run on the on
the bottom side of the host board if required See diagram following
vii If antenna cannot be mounted in overhanging position, then provisions must
be made to keep area clear of copper as recommended in diagram
viii For designs that require external antenna and U FL connector, use
recommended antenna The rules for placement on edge are not required
However, a ground plane is necessary underneath the module
If required, please contact Artaflex for assistance for PCB layout and RF design.

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5.3 External Antenna Applications
Artaflex recommends using Centurion antenna WRR2400-IP04-B for modules
that require an external antenna This antenna has been qualified and approved
for use by regulatory agencies in the US, Canada and European Union under the
Modular Approval certification It is compatible with the RF impedance and
frequency range of all Artaflex models that have an external antenna with U FL
connector The use of any antenna that does not meet the same parameters as
the antenna recommended voids the Modular Approval grant
Follow the recommended rules for optimal performance:
i Place antenna vertically for longest range and best communication
ii Allow 75-130 mm clearance from antenna to any metallic objects
iii

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6. SMT Assembly Guidelines for AW24MCHL-SM
j. Solder Reflow Profiles
Package Reflow Parameters
J-STD-020
Convention 220 +/- Reflow Profile
Average ramp-up rate (183◌
ْ C to peak) 3◌
ْْ C/second max
Preheat temperature 125◌
ْ C (+/- 25◌ ْ C) 120 seconds max
Temperature maintained above 183◌
ْْ C 60~150 seconds
Time within 5◌
ْْ C of actual peak temperature 10~20 seconds
Peak temperature range 220 +5/-0◌
ْ C
Ramp-down rate 6◌
ْ C/second max
Time 25◌
ْ C to peak temperature 6 minutes max
Package Reflow Parameters
J-STD-020
Convention 235 +5/-0 ْ◌ C Reflow Profile
Average ramp-up rate (183◌
ْ C to peak) 3◌
ْْ C/second max
Preheat temperature 125◌
ْ C (+/- 25◌ ْ C) 120 seconds max
Temperature maintained above 183◌
ْْ C 60 ~150 seconds
Time within 5◌
ْْ C of actual peak temperature 10 ~ 20 seconds
Peak temperature range 235 +5/-0◌
ْ C
Ramp-down rate 6◌
ْ C/second max
Time 25◌
ْ C to peak temperature 6 minutes max
Package Reflow Parameters
NEMI Recommended
Convection or IR 260 ْ◌ C Reflow Profile
Ramp-up rate (217◌
ْ C to peak) 3◌
ْْ C/second max
Preheat temperature 125◌
ْ C (+/- 25◌ ْ C) 60 to 120 seconds max
Time 50◌
ْْ C to peak temperature 3 5 minutes, 6 minutes max
Temperature maintained above 217◌
ْ C 60 to 150 seconds
Time within 5◌
ْ C of actual peak temperature 10 ~ 20 seconds
Peak temperature range 260◌
ْ C -5/+0◌ ْ C
Ramp-down rate 6◌
ْ C/second max

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k. Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not
require cleaning after the soldering process
Note: The quality of the solder joints on the castellations (‘half vias’) where they
contact the host board should meet the appropriate IPC specification See IPC-
A-610-D Acceptability of Electronic Assemblies, section 8 2 4 Castellated
Terminations
l. Cleaning
In general, cleaning the populated modules is strongly discouraged Residuals
under the module cannot be easily removed with any cleaning process
Cleaning with water can lead to capillary effects where water is absorbed into
the gap between the host board and the module The combination of soldering
flux residuals and encapsulated water could lead to short circuits between
neighboring pads Water could also damage any stickers or labels
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux
residuals into the two housings, which is not accessible for post-washing
inspection The solvent could also damage any stickers or labels
Ultrasonic cleaning could damage the module permanently
The best approach is to consider using a “no clean” soldering paste and
eliminate the post-soldering cleaning step
m. Optical Inspection
After soldering the Module to the host board, consider optical inspection to
check the following:
Proper alignment and centering of the module over the pads
Proper solder joints on all pads
Excessive solder or contacts to neighboring pads, or vias