Artesyn iHP User manual

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iHP Owner’s Manual

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Contents
Overview ........................................................................................................................................................ 10
1.1 General Description .............................................................................................................................. 10
1.2 Operational Overview ........................................................................................................................... 10
1.3 Specification Summary.......................................................................................................................... 11
1.3.1 Environmental................................................................................................................................... 14
1.3.2 Electrical Specifications..................................................................................................................... 14
1.3.3 Mechanical Outline ........................................................................................................................... 17
1.3.4 Front and Rear Panel......................................................................................................................... 17
Installation ..................................................................................................................................................... 19
2.1 Inspection of Packaging and IHP System............................................................................................... 19
2.2 Package Contents.................................................................................................................................. 19
2.3 Installation Requirements..................................................................................................................... 20
2.3.1 Location Requirements ..................................................................................................................... 20
2.3.2 Lifting Provision................................................................................................................................. 21
2.3.3 Mounting........................................................................................................................................... 21
2.4 Inserting Modules ................................................................................................................................. 21
2.5 Input and Output Wiring....................................................................................................................... 23
2.5.1 AC Input Wiring ................................................................................................................................. 24
2.5.2 DC Output Wiring .............................................................................................................................. 26
2.5.3 Remote Sense Wiring ........................................................................................................................ 27
2.5.4 Parallel Module Connection.............................................................................................................. 27
2.5.5 Current Share Signal Wiring .............................................................................................................. 28
2.5.6 Series Modules Connection............................................................................................................... 28
2.5.7 Output Blocking Diode and Antiparallel Diode Recommendation ................................................... 29
Digital Communication .................................................................................................................................. 32
3.1 iHP Digital Communication Identifier.................................................................................................... 33
3.1.1 iHP Address ....................................................................................................................................... 34
3.1.2 Internal Device Address inside iHP.................................................................................................... 35
3.2 iHP Commands ...................................................................................................................................... 35

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3.3 Interval Between User Commands ....................................................................................................... 36
3.4 Ethernet Communication...................................................................................................................... 36
3.5 RS485 Communication .......................................................................................................................... 40
3.6 CAN Communication ............................................................................................................................. 41
Operation....................................................................................................................................................... 43
4.1 iHP System Power-up............................................................................................................................ 43
4.1.1 Initial Power-up................................................................................................................................. 43
4.1.2 iHP Module Default Settings ............................................................................................................. 44
4.1.3 ISOCOMM Default Settings ............................................................................................................... 46
4.2 Module and Rack Hardware Signals...................................................................................................... 46
4.2.1 Module Interface Signals................................................................................................................... 47
4.2.1.1 Module’s J1 Signal..................................................................................................................... 47
4.2.1.1.1 Analog Voltage Programming ............................................................................................. 48
4.2.1.1.2 Analog Current Programming ............................................................................................. 49
4.2.1.1.3 SYS_RTN .............................................................................................................................. 50
4.2.1.1.4 Isolated Output Inhibit........................................................................................................ 50
4.2.1.1.5 Isolated Output Enable ....................................................................................................... 51
4.2.1.1.6 Isolated Fault Signal ............................................................................................................ 52
4.2.1.2 Module’s J2 Signal..................................................................................................................... 53
4.2.1.2.1 V_SNS+ and V_SNS-............................................................................................................. 54
4.2.1.2.2 External Current Sense........................................................................................................ 55
4.2.1.2.3 Current Monitor (IMON) ..................................................................................................... 56
4.2.1.2.4 Voltage Monitor (VMON).................................................................................................... 57
4.2.1.2.5 Current Sharing Signal (ISHARE).......................................................................................... 57
4.2.1.2.6 D_RTN ................................................................................................................................. 57
4.2.2 iHP Rack Communications and Interfaces......................................................................................... 58
4.2.2.1 USB Port .................................................................................................................................... 59
4.2.2.2 ETHERNET Port .......................................................................................................................... 59
4.2.2.3 RS485/CAN Port ........................................................................................................................ 59
4.2.2.3.1 CANL and CANH................................................................................................................... 59
4.2.2.3.2 RS485_A and RS485_B ........................................................................................................ 59
4.2.2.3.3 GND ..................................................................................................................................... 60

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4.2.2.3.4 5V Housekeeping Bias ......................................................................................................... 60
4.2.2.4 LAN RESET BUTTON................................................................................................................... 60
4.2.2.5 LAN STATUS LED........................................................................................................................ 60
4.2.2.6 DSUB9 Port................................................................................................................................ 60
4.2.2.6.1 5V Housekeeping Bias ......................................................................................................... 61
4.2.2.6.2 5V Housekeeping Bias Return ............................................................................................. 61
4.2.2.6.3 Global Inhibit/Enable Logic “1”........................................................................................... 61
4.2.2.6.4 Global Inhibit/Enable Logic “0”........................................................................................... 62
4.2.2.6.5 ACOK Signal “Power Fail” (Uncommitted Transistor) ......................................................... 63
4.2.2.6.6 DCOK Signal “Output Fail” (Uncommitted Transistor)........................................................ 63
4.3 Module Operating Mode ...................................................................................................................... 64
4.4 Digital Control ....................................................................................................................................... 65
4.4.1 Digital Voltage Source (DVS) ............................................................................................................. 65
4.4.1.1 DVS Protection Modes .............................................................................................................. 67
4.4.1.1.1 DVS Protection Over Current Response.............................................................................. 67
4.4.1.1.2 DVS Short Circuit Protection ............................................................................................... 68
4.4.1.1.3 DVS Protection Over Voltage Protection (OVP).................................................................. 68
4.4.1.1.4 DVS Protection Under Voltage Protection (UVP)................................................................ 68
4.4.2 Digital Current Source (DCS) ............................................................................................................. 69
4.4.2.1 DCS Protection Modes .............................................................................................................. 70
4.4.2.1.1 DCS Protection: Constant Voltage Clamp ........................................................................... 70
4.4.2.1.2 DCS Protection: Over Current Response and Short Circuit Protection............................... 70
4.4.2.1.3 DCS Protection: Over Voltage Protection (OVP) ................................................................. 71
4.4.2.1.4 DCS Protection: Under Voltage Protection (UVP)............................................................... 71
4.4.3 Module Grouping for Series or Parallel Connection Digital Operation............................................. 71
4.4.3.1 DVS Parallel Connection............................................................................................................ 71
4.4.3.1.1 DVS Parallel Connection Protection.................................................................................... 72
4.4.3.2 DVS Series Connection .............................................................................................................. 72
4.4.3.2.1 DVS Series Connection Protection ...................................................................................... 74
4.4.3.3 DCS Parallel Connection ............................................................................................................ 74
4.4.3.3.1 DCS Parallel Connection Protection.................................................................................... 74
4.5 Analog Control....................................................................................................................................... 75

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4.5.1 Analog Voltage Source (AVS)............................................................................................................. 75
4.5.1.1 AVS Protection Modes .............................................................................................................. 77
4.5.1.1.1 AVS Protection Over Current Response.............................................................................. 77
4.5.1.1.2 AVS Short Circuit Protection ............................................................................................... 78
4.5.1.1.3 AVS Protection Over Voltage Protection (OVP) .................................................................. 78
4.5.1.1.4 AVS Protection Under Voltage Protection (UVP)................................................................ 78
4.5.2 Analog Current Source (ACS)............................................................................................................. 78
4.5.2.1 ACS Protection Modes............................................................................................................... 80
4.5.2.1.1 ACS Protection: Constant Voltage Clamp ........................................................................... 80
4.5.2.1.2 ACS Protection: Over Current Protection and Short Circuit Protection.............................. 80
4.5.2.1.3 ACS Protection: Over Voltage Protection (OVP) ................................................................. 80
4.5.2.1.4 ACS Protection: Under Voltage Protection (UVP)............................................................... 80
4.5.3 Module Grouping for Series or Parallel Connection Analog Operation............................................ 80
4.5.3.1 AVS Parallel Connection ............................................................................................................ 81
4.5.3.1.1 AVS Parallel Connection Protection.................................................................................... 81
4.5.3.2 AVS Series Connection .............................................................................................................. 81
4.5.3.2.1 AVS Parallel Connection Protection.................................................................................... 82
4.5.3.3 ACS Parallel Connection ............................................................................................................ 82
4.5.3.3.1 AVS Series Connection Protection ...................................................................................... 83
Configuration ................................................................................................................................................. 84
5.1 ISOCOMM User Configurable Parameters ............................................................................................ 84
5.1.1 Home Section .................................................................................................................................... 87
5.1.1.1 Home Page ISOCOMM Section ................................................................................................. 88
5.1.1.2 Home Page Module Section...................................................................................................... 88
5.1.1.3 Home Page Racks Section ......................................................................................................... 88
5.1.2 Network Section................................................................................................................................ 89
5.1.2.1 DHCP.......................................................................................................................................... 90
5.1.2.2 Static IP Address........................................................................................................................ 90
5.1.2.3 CAN/RS485 Setting.................................................................................................................... 90
5.1.3 Rack Section ...................................................................................................................................... 91
5.1.3.1 Internal Ambient Temperature OTP ......................................................................................... 91
5.1.3.2 Power-Up Sequence.................................................................................................................. 92

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5.1.3.3 INH0/EN0 TTL and INH1/EN1 TTL Function............................................................................... 92
5.1.3.4 Disable on 5V_STBY Fault.......................................................................................................... 93
5.1.3.5 Rack Synchronized Off............................................................................................................... 93
5.1.4 Module Section ................................................................................................................................. 94
5.1.4.1 Module Synchronized OFF ........................................................................................................ 95
5.1.4.2 Module Group ........................................................................................................................... 96
5.1.5 Firmware Section .............................................................................................................................. 96
5.1.6 Maintenance Section ...................................................................................................................... 101
5.2 iHP Module User Configurable Parameters ........................................................................................ 102
5.2.1 Module Command 01h: MODULE_OPERATION.............................................................................. 103
5.2.2 Module Command 48h: OV_FAULT_LIMIT_MULTIPLIER................................................................ 103
5.2.3 Module Command 4Bh: UV_FAULT_LIMIT_MULTIPLIER................................................................ 103
5.2.4 Module Command 4Dh: OC_FAULT_LIMIT_MULTIPLIER................................................................ 104
5.2.5 Module Command 52h: OC_RESPONSE_TYPE................................................................................ 104
5.2.6 Module Command B7h: SET_IO_ACTIVE_LEVEL_LOGIC ................................................................. 105
5.2.7 Module Command B1h: VREF ......................................................................................................... 105
Module Group.............................................................................................................................................. 107
6.1 Group Device Address......................................................................................................................... 107
6.2 Group Initialization at Start up............................................................................................................ 108
6.3 Module within a Group Read/Write Command.................................................................................. 108
6.4 Group Write Command....................................................................................................................... 108
6.5 Accepted Group Commands using Group Device Address ................................................................. 109
6.6 Accepted Group Commands using ISOCOMM Device Address .......................................................... 109
6.7 Group Status and Reporting................................................................................................................ 109
Multi-Rack Operation................................................................................................................................... 112
7.1 During Turn-On.................................................................................................................................... 113
7.2 During Turn-off.................................................................................................................................... 114
7.3 From Module Standby Activated to Module Standby De-activated................................................... 114
7.4 From Fault to Fault Clear..................................................................................................................... 114
7.5 Broadcast Command on Multi Rack Operation .................................................................................. 114
Faults and Output Recovery. ....................................................................................................................... 116
8.1 Module Fault ....................................................................................................................................... 116

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8.2 Module Clear Fault and output Recovery ........................................................................................... 117
8.3 PFC Fault.............................................................................................................................................. 118
8.4 PFC Clear Fault and Output Recovery ................................................................................................. 120
8.5 ISOCOMM Fault................................................................................................................................... 121
8.6 ISOCOMM Clear Fault and Output Recovery ...................................................................................... 122
Accepted iHP Configuration......................................................................................................................... 124
9.1 Module Stand-Alone Configuration .................................................................................................... 124
9.2 Parallel Configuration.......................................................................................................................... 125
9.3 Series Configuration............................................................................................................................ 126
Troubleshooting....................................................................................................................................... 129
Appendix A –LED ................................................................................................................................................ 131
Appendix B –COMMAND .................................................................................................................................... 132
B.1 PFC Command ........................................................................................................................................... 132
B.2 MODULE Command................................................................................................................................... 136
B.3 ISOCOMM Command ................................................................................................................................ 162
B.4 Data Format: Linear................................................................................................................................... 172
B.5 Data Format: Direct................................................................................................................................... 174
Appendix C –MODULE REGISTER MFR_REG (FAE and VAR only)....................................................................... 176
Appendix D –FAE and VAR Only ......................................................................................................................... 189

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List of Figures
Figure 1-1 External dimensions of iHP system ..................................................................................................... 17
Figure 1-2 Front panel of iHP system.................................................................................................................... 18
Figure 1-3 Rear Panel of iHP system ..................................................................................................................... 18
Figure 2-1 Package contents of typical iHP system.............................................................................................. 19
Figure 2-2 Lifting hole location for the power system .......................................................................................... 21
Figure 2-3 Module insertion into system.............................................................................................................. 22
Figure 2-4 Blank panel covering for rear of system .............................................................................................. 23
Figure 2-5 Rear panel showing AC wiring and ground terminal ........................................................................... 25
Figure 2-6 AC terminals and ferrule diagram........................................................................................................ 26
Figure 2-7 DC output wiring diagram.................................................................................................................... 26
Figure 2-8 Output modules in parallel with busbars............................................................................................. 28
Figure 2-9 Output modules in series and parallel................................................................................................. 29
Figure 2-10 Blocking diode for use when connecting modules in parallel ........................................................... 30
Figure 2-11 Antiparallel diode for use when connecting modules in series......................................................... 31
Figure 3-1 12kW and 24kW ISOCOMM Section .................................................................................................... 32
Figure 3-2 24kW iHP rack internal communication architecture.......................................................................... 33
Figure 3-3 12kW iHP rack internal communication architecture.......................................................................... 34
Figure 3-4 iHP system connected directly to the PC (static IP) ............................................................................. 37
Figure 3-5 IHP system connected using a router or switch .................................................................................. 38
Figure 3-6 Multiple iHP systems connected to PC via a router or switch............................................................. 39
Figure 3-7 Terminating resistors required for RS485 interface ............................................................................ 40
Figure 3-8 Terminating resistors are required for CAN interface ......................................................................... 41
Figure 4-1 AC Input connections and AC input rating label location .................................................................... 43
Figure 4-2 Front Panel Power LED......................................................................................................................... 44
Figure 4-3 Module J1 and J2 signal connections for controlling the modules...................................................... 47
Figure 4-4 Isolated output inhibit circuits to externally inhibit the module......................................................... 51
Figure 4-5 Isolated Output Enable to externally Enable module.......................................................................... 52
Figure 4-6 Isolated fault signal to signal a module fault condition....................................................................... 53
Figure 4-7 Examples of star connections for remote sensing............................................................................... 55
Figure 4-8 Location of external shunt and external shunt sense lines ................................................................. 56
Figure 4-9 Communication ports on back panel of iHP rack................................................................................. 58
Figure 4-10 RS485/CAN Port pinout...................................................................................................................... 59
Figure 4-11 Dsub9 Port pinout.............................................................................................................................. 60
Figure 4-12 Possible circuits configuration for ACOK functionality ...................................................................... 63
Figure 4-13 Possible circuits configuration for DCOK functionality ...................................................................... 64

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List of Tables
Table 1-1................................................................................................................................................................ 11
Table 1-2................................................................................................................................................................ 12
Table 1-3................................................................................................................................................................ 13
Table 1-4................................................................................................................................................................ 14
Table 1-5................................................................................................................................................................ 15
Table 1-6................................................................................................................................................................ 16
Table 2-1................................................................................................................................................................ 24
Table 2-2................................................................................................................................................................ 25
Table 2-3................................................................................................................................................................ 27
Table 2-4................................................................................................................................................................ 29
Table 2-5................................................................................................................................................................ 31
Table 3-1................................................................................................................................................................ 35
Table 3-2................................................................................................................................................................ 36
Table 4-1................................................................................................................................................................ 45
Table 4-2................................................................................................................................................................ 46
Table 4-3................................................................................................................................................................ 47
Table 4-4................................................................................................................................................................ 48
Table 4-5................................................................................................................................................................ 49
Table 4-6................................................................................................................................................................ 49
Table 4-7................................................................................................................................................................ 50
Table 4-8................................................................................................................................................................ 53
Table 4-9................................................................................................................................................................ 56
Table 4-10.............................................................................................................................................................. 57
Table 4-11.............................................................................................................................................................. 57
Table 4-12.............................................................................................................................................................. 59
Table 4-13.............................................................................................................................................................. 61
Table 4-14.............................................................................................................................................................. 62
Table 4-15.............................................................................................................................................................. 65
Table 4-16.............................................................................................................................................................. 66
Table 4-17.............................................................................................................................................................. 69
Table 4-18.............................................................................................................................................................. 73
Table 4-19.............................................................................................................................................................. 76
Table 4-20.............................................................................................................................................................. 79
Table 4-21.............................................................................................................................................................. 82

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Overview
1.1 General Description
The Intelligent High Power (iHP) series is an addition to Artesyn’s existing breadth of configurable AC to DC
power supply products. The iHP series offers the highest power and voltage rating in the configurable family
and provides the most flexible and universal solutions for medical and industrial applications. The iHP series
provides accuracy, resolution, and stability as either a programmable voltage or current source. The basic
modular concept consists of an iHP rack into which iHP modules are inserted. The rack is a Power Factor
corrected front-end converting worldwide standard AC input voltages into a regulated high voltage DC (HVDC)
output. The pluggable modules provide an extended range of voltage and current combinations converting
the HVDC input into programmable 3KW increments of output power. iHP output modules are configured into
a power system by plugging the modules into one of two different standard 19” AC-HVDC racks. One rack
houses up to four modules (12KW) and the other rack up to eight modules (24KW). Provisions are made for up
to six racks to be connected and controlled in parallel.
Safety approvals secured by Artesyn eliminate the need for an isolation transformer in medical equipment.
The iHP system also has industrial safety approvals, including compliance to the SEMI F47 standard for
semiconductor processing equipment.
The iHP series offers developers either an analog or digital interface to their system, supporting standard
communications protocols, including CANbus, Ethernet, and RS485. Digital control enables the use of
Artesyn’s high-level PowerPro software graphical user interface (GUI) to control and monitor all functions on
one or multiple iHP systems. The PowerPro GUI also incorporates graphical script creation that allows users to
write their own process control routines.
The iHP series offers efficient power factor correction (PFC) and low total harmonic distortion (THD) over a
wide range of loads. It uses a multi-phase continuous mode boost PFC architecture, resulting in ripple current
cancellation that offers lower EMI and extends the life of electrolytic capacitors.
Users can configure and customize the iHP modules to fit exact applications requirements. A qualified service
personnel can configure the iHP rack for single or three phase inputs. The modules can be connected in series
or parallel, while achieving accurate voltage and current sharing. Using grouping commands, modules in
parallel or series can be controlled as one single output. For specific types of load applications, the iHP system
can be programmed to three different compensation configurations including resistive load, capacitive load
and LED load. The LED load compensation opens new applications for large horticulture farms that require
high voltage for many LED strings tied in series.
1.2 Operational Overview
The iHP system is designed to be configurable to meet varied design requirements. The number of
configurable parameters is extensive and access to the parameters is via a computer interface instead of the
front panel. Before operating the supply, it is important that communication between a computer and the
supply be established and the supply operational parameters be configured for the intended application.

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The simplest way to get started is to use the Power Pro Connect Module (PPCM) to establish a link to the
supply. The PPCM allows the user to quickly establish a connection with the power supply with a Web based
GUI and set up the power supply. The configuration of the supply can be set up to run autonomously when
powered on, controlled via rear panel digital and analog input and outputs, or actively controlled via the
PPCM.
For more advanced users developing their own software control, the PPCM is not required and the supply can
be directly interfaced via the users preferred standard communications protocols, including CANbus, Ethernet
and RS485.
1.3 Specification Summary
Tables 1-1 and Table 1-2 below summarize the 24K and 12K input parameters, followed by Table 1-3 outlining
the general Module specifications
Table 1-1
iHP24 Electrical Specifications
Input Parameter
19” Rack 24 KW strapped as 3-phase
380/480 Vac Nominal (iHP24H3A/L)
19” Rack 24 KW strapped as 3-phase
208/240 Vac Nominal (iHP24L3A/L)
Input range
342 Vac to 528 Vac
(Nominal rating 380/480 Vac)
187.5 Vac to 264 Vac
(Nominal rating 208/240 Vac)
Number of phases
3-phase (Wye or Delta) 4 wire total (3-phase and 1 protective earth ground)
Frequency
47-63 Hz
Phase detection
Loss of phase will inhibit unit off. Housekeeping/comms must continue with phase loss.
Max current/phase
51 A @ 342 Vac
40 A @ 432 Vac
84 A @ 187.5 Vac
Under voltage detection
Nominal input locked on at turn-on. Under voltage shutdown at 15% below nominal.
Turn-on at 12% below nominal. Not to interfere with SEMI F47 specs.
Current inrush
2.5 x Max input current
Power factor
> 0.98 @ full load and nominal line
Harmonic distortion
THD < 13%, PWHD < 22% (refer to EN 61000-3-12)
Line interruption
Designed to meet SEMI F47-0706, 53, 58, S14 at nominal input voltages
Input leakage current
< 2.5 mA (Note for fixed condition 3rd edition leakage = 5 mA)
Power switch
Front panel power switch provided
Input protection
Internal fuse (not user serviceable)
Input overvoltage protection
Up to 115% of nominal input shall not damage unit
Phase imbalance
≤ 5%
Rack parallel
Up to 6 racks (144 KW)
Efficiency
> 90% @ 3P 380 Vac full load
> 91% @ 3P 480 Vac full load
> 90% @ 3P 208 Vac full load
> 91% @ 3P 240 Vac full load
Standby voltage
5 V
Standby regulation
4.75 - 5.25 V
Standby max current
1 A

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Table 1-2
iHP12 Electrical Specifications
Input
Parameter
19” Rack 12 KW
strapped as 1-phase
200/220/230/240 Vac
Nominal (iHP12L1A)
19” Rack 12 KW strapped as 3-phase
200/208/240 Vac Nominal (iHP12L3A)
19” Rack 12 KW strapped as 3-phase
380/480 Vac Nominal (iHP12H3A)
Input range
180 Vac to 264 Vac
(Nominal rating
200/220/230/240 Vac)
180 Vac to 264 Vac (Nominal rating
200/208/240 Vac)
342 Vac to 528 Vac (Nominal rating
380/480 Vac)
Number of
phases
1-phase 3-wire total (2-
phase and 1 protective
earth ground)
3-phase (Wye or Delta) 4-wire total (3-phase and 1 protective earth ground)
Frequency
47-63 Hz
Phase
detection
NA
Loss of phase will inhibit unit off. Housekeeping/comms must continue with phase loss.
Max
current/phase
75 A @ 180 Vac
44 A @ 180 Vac
23 A @ 342 Vac
19 A @ 432 Vac
Under voltage
detection
Nominal input locked on at turn-on. Under voltage shutdown at 15% below nominal. Turn-on at 12% below
nominal. Not to interfere with SEMI F47 specs.
Current inrush
2.5 x Max input current
Power factor
> 0.99 @ full load and
nominal line
> 0.98 @ full load and nominal line
Harmonic
distortion
THD < 13%, PWHD < 22% (refer to EN 61000-3-12)
Line
interruption
Designed to meet SEMI F47-0706, 53, 58, S14 at nominal input voltages
Input leakage
current
< 1.25 mA
<2.5 mA
Power switch
Front panel power switch provided
Input
protection
Internal fuse (not user serviceable)
Input
overvoltage
protection
Up to 115% of nominal input shall not damage unit
Phase
imbalance
NA
< 5%
< 5%
Rack parallel
Up to 6 racks (72 KW)
Efficiency
> 91% @ 1P 240 Vac
full load
> 90% @ 1P 208
Vac/200 Vac full load
> 91% @ 3P 240 Vac full load
> 90% @ 3P 208 Vac/200 Vac full load
> 90% @ 3P 380 Vac full load
> 91% @ 3P 480 Vac full load
Standby
voltage
5 V
Standby
regulation
4.75 - 5.25 V
Standby max
current
1 A

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Table 1-3
OUTPUT –General Specifications
Parameter
MODULE CODE
SL
SQ
SW
S8
S1
SA
S2
# Outputs
1
1
1
1
1
1
1
Nominal O/P (V)
12.0 V
24.0 V
48.0 V
80.0 V
125.0 V
200.0V
250.0 V
Max Power (W)
2400 W
2880 W
3000 W
3000 W
3000 W
3000 W
3000 W
O/P Current
Range (A)
0.0 A - 200 A
0.0 A - 120 A
0.0 A - 62.5 A
0.0 A - 37.5 A
0.0 A -24 A
0.0 A -15 A
0.0 A -12 A
Power Density
(W/cu-in)
32.5
39.0
40.6
40.6
40.6
40.6
40.6
Efficiency (%)
93.5
93.5
93.5
93.5
93.5
93.5
93.5
Module Input
Voltage
400 V
Module
Operating Temp
-0 °C to +65 °C; Baseplate Temp TBD
Series Operation
12V, 24V & 48V modules can be connected in series up to 300 V for Medical
12V, 24V & 48V modules can be connected in series up to 400 V for ITE
80V, 125V, 200V & 250 V modules can be connected in series up to 800 V for Medical
80V, 125V, 200V & 250 V modules can be connected in series up to 1000 V for ITE
Parallel
Operation
Up to 8 modules can be paralleled in 1 rack, with up to 6 racks connected in parallel. Single Wire Parallel
connection will be provided as part of configuration

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1.3.1 Environmental
Table 1-4 outlines the operating and non-operating environmental requirements.
Table 1-4
Environmental Specifications
Operating Conditions
ALL MODELS (Unless Otherwise Specified)
Operating Temperature
0 °C to +50 °C at 100% rated load.
Storage Temperature
-40 °C to +85 °C. For Liquid Cooled models, liquid must be drained before storage
Operating Humidity
20% - 90% non-condensing
Storage Humidity
10% - 95% non-condensing
Operating Altitude
Up to 9,842 feet above sea level (3,000 meters)
Storage Altitude
Up to 30,000 feet above sea level (9,144 meters)
Vibration
Operating Sinusoidal Vibration MIL-STD-810G Method 528 Procedure I (Type 1): NEBS Office
Vibration Environment, Alternate Procedure Operating Random Vibration: IPC-9592B Class 1
Non-Operating Vibration (Packaged): IPC-9592B Class 1; MIL-STD-810G, Method 514.6, Procedure 1,
Category 7, Table 514.6C-VII General Exposure
Shock
MIL-STD-810G Method 516.6 Procedures I, II, IV, VI
Shipping and Handling
NSTA for <100 lbs.; MIL-STD-2073-1 >100 lbs.
Cooling and Audible Noise
<65 dBA with 80% load @ 30 °C at nominal input voltage with Smart Fan algorithm to be optimized
based on module and rack thermal sensors. When modules are inhibited via software control, the
fan speed is reduced to idle and acoustic noise is <46 dBA. With modules off via front panel switch
fans are at idle for 1 min, and off for 9 min.
Ingress Protection
Fan Cooled = IP20
Pollution Degree
2
RoHS Compliance
Yes
1.3.2 Electrical Specifications
The electrical specification for each module type is dependent on if the module is operating in voltage mode or
current mode. Table 1-5 lists the electrical specifications when operating in voltage mode and Table 1-6 lists
the specifications when operating in current mode.

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Table 1-5
OUTPUT –Module in Voltage Source Mode
Voltage Source
MODULE CODE
SL
SQ
SW
S8
S1
SA
S2
Nominal
Output (V)
12
24
48
80
125
200
250
Setting
Range (V)
0.6 V - 14.4 V
1.2 V - 28.8 V
2.4 V - 57.6 V
4.0 V - 96.0 V
6.25 V - 150.0 V
10.0 V –240.0 V
12.5 V - 300.0 V
Low Frequency
RMS Ripple (mV)
24
48
96
160
250
500
500
Line
Regulation (mV)
12
24
48
80
125
200
250
Load
Regulation (mV)
24
48
96
160
250
400
500
P-P Ripple (mV)
60
120
240
400
625
1250
1250
Drift
(Temp Stability)
±0.05% of Iout Rated over 8 hours, after 30-minute warm up, constant Line, Load and Temp
Temp
Coefficient
(PPM/°C)
200
Pgm
Accuracy (mV)
Digital: 0.1% of Nominal Output Voltage; Analog: 1.0% of Nominal Output Voltage
Pgm
Resolution (mV)
SL=TBD; SQ=1; SW=2; S8=8; S1=6; SA=21; S2=21
Meas
Accuracy (mV)
0.2% + 0.2% of Nominal Output Voltage
Meas
Resolution
SL=TBD; SQ=1; SW=2; S8=8; S1=6; SA=21; S2=21
Transient
Response
Max 5.0% deviation from current set point must recover within 1mS for a 50% step load.
Current Sense
Method
Internal Shunt; External Shunt can be used for better temperature stability.

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Table 1-6
OUTPUT –Module in Current Source Mode
Current Source - Programmable load compensation available for resistive and inductive loads; capacitive load
applications; and LED drive applications
MODULE CODE
SL
SQ
SW
S8
S1
SA
S2
Nominal Output
(V)
12
24
48
80
125
200
250
Setting Range
(A)
0.0 A - 200 A
0.0 A - 120 A
0.0 A - 62.5 A
0.0 A - 37.5 A
0.0 A - 24 A
0.0 A –15 A
0.0 A - 12 A
RMS Ripple
(mA)
200
120
62.5
37.5
24
40
12
Line Regulation
(mA)
200
120
125
93.75
48
50
24
Load Regulation
(mA)
800
480
250
150
96
56
48
P-P Ripple (mA)
N/A
Drift (Temp
Stability)
±0.05% of Iout Rated over 8 hours, after 30-minute warm up, constant Line, Load and Temp
Temp Co-
efficient (PPM/°C)
SL, SQ = 300 PPM; All other modules are 200 PPM. Temp Co-efficient at rack level is [Temp Co-efficient (module level)] + [4500 PPM of
Iout-max]
Pgm Accuracy
(A)
0.7% digital, 1.3% analog of rated output max
Pgm Resolution
(mA)
79.2
26.4
13.2
10
5.2
2.6
2.6
Meas Accuracy
0.7% + 0.7% of Rated Output Max
Meas
Resolution
79.2
26.4
13.2
10
5.2
2.6
2.6
Transient
Response
0-63% output current change in 7.5 mSec, residual value 1%, settling time 35 mSec
Current Sense
Method
Internal Shunt / External Shunt

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1.3.3 Mechanical Outline
The external dimensions of the iHP system are shown in Figure 1-1.
Figure 1-1 External dimensions of iHP system
1.3.4 Front and Rear Panel
Figures 1-2 and 1-3 display the front and rear panels of iHP system. The user interface and connectors are
shown.
Note: Please Refer to Appendix A for the Front Panel LED response.

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Figure 1-2 Front panel of iHP system
Figure 1-3 Rear Panel of iHP system

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Installation
2.1 Inspection of Packaging and IHP System
The iHP system is inspected before packaging and is shipped in containers designed to minimize damage
during transport. However, damage may still occur during transportation. Inspect the power supply and
packaging upon receipt. If damage is observed that indicates the iHP system was dropped or subject to other
damage, immediately notify the responsible shipping company.
2.2 Package Contents
Figure 2-1 displays the typical contents of an iHP system.
Figure 2-1 Package contents of typical iHP system