ASRock Industrial iEP-9000 Series User manual

iEPF-9000S-EX4
iEPF-9002S-EX4
iEP-9000E
iEP-9002E
User Manual
Version 1.0
Published August 2022
Copyright©2022 ASRock Industrial Computer Corp. All rights reserved.

ii iii
Version Date Description Page
1.00 2022/8 Initial release
1.10 2023/10 Update all
Copyright©2022 ASRock Industrial Computer Corp. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or translated
in any language, in any form or by any means, except duplication of documentation by the
purchaser for backup purpose, without written consent of ASRock Industrial Computer
Corp.
Products and corporate names appearing in this documentation may or may not be
registered trademarks or copyrights of their respective companies, and are used only for
identication or explanation and to the owners’ benet, without intent to infringe.
Disclaimer:
Specifications and information contained in this documentation are furnished for
informational use only and subject to change wit hout notice, and should not be
constructed as a commitment by ASRock Industrial Computer Corp. ASRock Industrial
Computer Corp. assumes no responsibility for any errors or omissions that may appear in
this documentation.
With respect to the contents of this documentation, ASRock Industrial Computer
Corp. does not provide warranty of any kind, either expressed or implied, including but
not limited to the implied warranties or conditions of merchantability or fitness for a
particular purpose.
In no event shall ASRock Industrial Computer Corp., its directors, ocers, employees, or
agents be liable for any indirect, special, incidental, or consequential damages (including
damages for loss of prots, loss of business, loss of data, interruption of business and the
like), even if ASRock Industrial Computer Corp. has been advised of the possibility of such
damages arising from any defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
1. this device may not cause harmful interference, and
2. this device must accept any interference received, including interference that may cause
undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Industrial Website: http://www.asrockind.com

ii iii
Important Safety Instructions
For user safety, please read and follow all instructions, Warnings, Cautions, and Notes
marked in this manual and on the associated device before handling/operating the device,
to avoid injury or damage.
1. Read these safety instructions carefully.
2. Retain this user manual for future reference.
3. Read the Specifications section of this manual for detailed information on the
recommended operating environment.
4. Disconnect the equipment from all AC outlets before cleaning. Use only a damp cloth
for cleaning. Do not use liquid or sprayed detergent.
5. Place the equipment on a reliable surface during installation. Dropping or letting the
equipment fall may cause damage.
6. Do not leave the equipment in an environment with a storage temperature of below
-40 °C (-40 °F) or above 85 °C (185 °F) as this may cause damage. The equipment
should be stored in a controlled environment.
7. Ensure that the voltage of the power source is correct before connecting the
equipment to a power outlet.
8. Position the power cord away from high-trac areas. Do not place anything over the
power cord.
9. If the equipment is not used for a long time, disconnect the equipment from the
power source to avoid damage from transient over-voltage.
10. All cautions and warnings on the equipment should be noted.
11. To avoid electrical shock and/or damage to the device:
• Keep the device away from water or liquid sources.
• Keep the device away from high heat or humidity.
• Keep device properly ventilated (do not block or cover ventilation openings).
• Always use designated voltage and power source settings.
• Always install and operate the device near an easily accessible electrical outlet.
• Secure the power cord (do not place any object on/over the power cord).
• Only install/attach and operate the device on stable surfaces and/or designated
mountings.
• e power cord must be connected to a socket or outlet with a ground connection.
12. If one of the following occurs, have the equipment checked by service personnel:
• e power cord or plug is damaged.
• Liquid has penetrated into the equipment.
• e equipment has been exposed to moisture.
• The equipment is malfunctioning or does not operate according to the user
manual.
• e equipment has been dropped and damaged.
• e equipment shows obvious signs of breakage.

iv v
13. Never attempt to repair the device, which should only be serviced by qualified
technical personnel using suitable tools.
14. Any unverified component may cause unexpected damage. To ensure correct
installation, always use the components (e.g., screws) provided in the accessory box.
15. This equipment is not suitable for use in locations where children are likely to be
present.
16. e equipment should only be installed in a restricted access area.
17. Restricted Access Location:
e device must be installed only in a server room or computer room where:
• Access can only be gained by service persons or by users who have been
instructed about the reasons for the restrictions applied to the location and about
any precautions that shall be taken.
• Access is through the use of a tool or lock and key, or other means of security, and
is controlled by the authority responsible for the location.
• Leave enough clearance (25 inches in the front and 30 inches in the back of the
rack) to allow the front door to be opened completely and to allow for sucient
airow.
• is product is intended for installation only in a Restricted Access Location.
• is product is not suitable for use with visual display devices in the workplace
according to §2 of "the German Ordinance for Work with Visual Display Units".
18. e equipment is intended to be supplied by the external power source (UL listed/
IEC 60950-1/ IEC 62368-1 approved) whose output complies with ES1/SELV. To
reduce potential safety issues, only the AC adapter provided with the product, a
replacement AC adapter provided by ASRock Industrial or an agency, or an AC
adapter purchased as an accessory from ASRock Industrial or an agency should be
used with the product.
19. This power adapter (FSP330-AAAN3) is intended to be supplied based on a UL-
certied and suitable for use at an operating/storage temperature of 0 °C (32 °F)~
40 °C (104 °F)/ -20 °C (-4 °F)~80 °C (176 °F), and the current output is rated 13.75A.
If you need further assistance, contact ASRock Industrial for additional information.
20. e ambient temperature of the iEP-9000E series: 70 °C (158°F) max.; the ambient
temperature of the iEPF-9000S series: 75 °C (167°F) max.
21. e terminal block is suitable for V+V-, with 3 units each (16~18AWG), totaling 6
units. e torque value is 0.69Nm. Please ensure the use of copper conductors only.
Kindly note that installation must be carried out by a professional.
22. LAN port must use shielded LAN cable.

iv v
Replaceable Batteries
CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS.
CAUTION
e equipment is equipped with a battery-powered real-time clock circuit. ere is a risk
of explosion if a battery is incorrectly replaced. Replace only with the same or equivalent
type as designated by the manufacturer. Discard all used batteries according to the
manufacturer's instructions.
LITHIUM-METAL BATTERY WARNING
Danger of explosion if the battery is incorrectly replaced. Replace only with the same or
equivalent type designated by the manufacturer. Dispose of used batteries according to the
manufacturer's instructions.
WARNING
All interconnection to the EUT is intended for indoor locations, and as a result, the PoE
network interconnected to the EUT is considered ES1/SELV, designed exclusively for
connection to the PoE network without routing to the outside plant.
WARNING
Input voltage rated 9~36V, 30~18A.
Packing: e unit should be carried with both hands and handled with care.
Maintenance: Use only approved products or a dry applicator to clean and maintain the
surfaces.
e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.

vi vii
Contact Information
If you need to contact ASRock Industrial or want to know more about ASRock Industrial,
you’re welcome to visit ASRock Industrial’s website at www.asrockind.com; or you may
contact your dealer for further information.
ASRock Industrial Incorporation
Email: [e-mail]

vi vii
Contents
Chapter 1 Introduction 1
1.1 Key Features 1
1.2 Package List 3
1.3 Order Information 5
1.4 Optional Items 5
1.5 Serial Number Label 6
1.5.1 Serial Number Label Location 6
1.5.2 Serial Number Label Illustration 6
1.6 Specications 7
1.7 CPU Support List 15
1.8 Dimensions and Size 17
1.9 Block Diagram 24
Chapter 2 Product Overview 26
2.1 System Front Panel 26
2.1.1 System Front Panel I/O Functions 28
2.2 HDD Panel 38
2.3 Drive Tray LEDs 39
2.4 Motherboard 40
2.4.1 Motherboard Layout for iEP(F)-9000 Series 40
2.4.2 Motherboard Layout for iEP(F)-9002 Series 45
2.4.3 Jumpers Setup 52

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2.4.4 Expansion Slots (M.2 Slots) 53
2.4.5 Ignition Control 54
2.5 Other Boards 57
2.5.1 DSC-SATA001-WT Layout and I/O Connectors 57
2.5.2 DSC-POE001-WT Layout and I/O Connectors 57
2.5.3 DSC-COMDIO002-WT Layout and I/O
Connectors 58
2.5.4 DSC-COMDIO003-WT Layout and I/O Connectors
(Optional) 60
2.5.5 DSC-SLOT001-WT Layout and I/O Connectors
(9000S&9002S Only) 63
2.5.6 DSC-SLOT002-WT Layout and I/O Connectors
(Optional) 67
2.5.7 VGA-PWR Layout and I/O Connectors (Optional) 71
Chapter 3 Hardware Installation and
Maintenance 72
3.1 How to Disassemble the System 73
3.2 How to Install the CPU 78
3.3 How to Install the Hard Disk Drive 81
3.4 How to Install the SIM Card 83
3.5 How to Install the Desk Mount Bracket 85
3.6 How to Install the Rubber Foot 86
3.7 How to Install the Memory Module with Heatsink 87
3.8 How to Install the M.2 SSD with Heatsink 88

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3.9 How to Install the Riser Card 89
3.10 How to Install the Mini-PCIe Card 92
3.11 How to Install the WiFi Module (M.2 Key E Socket
(2230)) 93
3.12 How to Install the 4G / 5G module (M.2 Key B Socket
(2280/3042/3052)) 94
3.13 How to Install the WiFi/4G/5G Antennas and Cables 95
3.13.1 Antennas 95
3.13.2 SMA Cables 96
Chapter 4 UEFI Setup Utility 98
4.1 Introduction 98
4.1.1 Entering BIOS Setup 98
4.1.2 UEFI Menu Bar 99
4.1.3 Navigation Keys 100
4.2 Main Screen 101
4.3 Advanced Screen 102
4.3.1 CPU Conguration 103
4.3.2 Chipset Conguration 105
4.3.3 Storage Conguration 107
4.3.4 Super IO Conguration 108
4.3.5 ACPI Conguration 111
4.3.6 USB Conguration 112
4.3.7 Trusted Computing 113
4.4 Hardware Health Event Monitoring Screen 115

x 1x 1
4.5 Security Screen 116
4.6 Boot Screen 117
Chapter 5 Appendix 118
Appendix 1 Power Consumption 118
Appendix 2 Link to the API Library 119
Appendix 3 How to Install Power Supply or Power
Adapter 119

iEPF-9000S-EX4 / iEPF-9002S-EX4 /
iEP-9000E / iEP-9002E
x 1
English
x 1
Chapter 1 Introduction
ank you for purchasing iEPF-9000S-EX4 / iEPF-9002S-EX4 / iEP-9000E / iEP-9002E,
a reliable barebone system produced under ASRock Industrial’s consistently stringent
quality control. It delivers excellent performance with robust design conforming to
ASRock Industrial’s commitment to quality and endurance.
Because the hardware specications might be updated, the content of this documentation
will be subject to change without notice. In case any modications of this documentation
occur, the updated version will be available on ASRock Industrial’s website without further
notice. If you require technical support related to this product, please visit our website for
specic information about the model you are using.
ASRock Industrial’s Website: www.ASRockInd.com
e illustrations shown in this manual are examples only. e actual system may dier
depending on the product model you purchased.
1.1 Key Features
iEPF-9000S-EX4
• Intel® 10th Gen Xeon® W or Core™ Processors with W480E chipset
• 4 x 260-pin DDR4 SO-DIMM up to 128GB (32GB per DIMM)
• 1 x PCIe x16 (PCIe Gen3) or 2 x PCIe x8 (PCIe Gen3), 2 x PCIe x4 (PCIe Gen3)
• 1 x M.2 Key M, 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
• 4 x USB 3.2 Gen2x1, 2 x USB 2.0, 6 x COM, 4 x SATA3, 8 x DI, 8 x DO
• 5 x Intel Gigabit LAN (2 support PoE)
• Supports Triple Display, 2 x DisplayPort, 1 x VGA
• Powerful Edge AI acceleration enabled by the most exible mechanical, thermal, and
power design, with support for 275mm x 121mm x 42mm (L x H x D) max. and up to
255W graphics card
iEPF-9002S-EX4
• Intel®10th Gen Core™ Processors with H420E chipset
• 2 x 260-pin DDR4 SO-DIMM up to 64GB (32GB per DIMM)
• 1 x PCIe x16 (PCIe Gen3)
• 1 x M.2 Key M, 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
• 4 x USB 3.2 Gen1x1, 2 x USB 2.0, 6 x COM, 2 x SATA3, 8 x DI, 8 x DO
• 3 x Intel Gigabit LAN
• Powerful Edge AI acceleration enabled by the most exible mechanical, thermal, and
power design, with support for 275mm x 121mm x 42mm (L x H x D) max. and up to
255W graphics card

2 3
English
iEP-9000E
• Intel® 10th Gen Xeon® W or Core™ Processors with W480E chipset
• 4 x 260-pin DDR4 SO-DIMM up to 128GB (32GB per DIMM)
• 1 x M.2 Key M, 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
• 4 x USB 3.2 Gen2x1, 2 x USB 2.0, 6 x COM, 4 x SATA3, 8 x DI, 8 x DO
• 5 x Intel Gigabit LAN (2 support PoE)
• Supports Triple Display, 2 x DisplayPort, 1 x VGA
iEP-9002E
• Intel®10th Gen Core™ Processors with H420E chipset
• 2 x 260-pin DDR4 SO-DIMM up to 64GB (32GB per DIMM)
• 1 x M.2 Key M, 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
• 4 x USB 3.2 Gen1x1, 2 x USB 2.0, 6 x COM, 2 x SATA3, 8 x DI, 8 x DO
• 3 x Intel Gigabit LAN

iEPF-9000S-EX4 / iEPF-9002S-EX4 /
iEP-9000E / iEP-9002E
2 3
English
1.2 Package List
No. Accessories PN Q'ty Picture Description
1 Rubber Foot NA 4Protect the device from
damage during a move.
2M3x8 Screw for
rubber foot NA 4 To x the rubber foot.
3Desk Mount NA 2To attach the device to
any horizontal surface.
4M3x5 Screw for
desk mount NA 8To x the desk mount.
5M4x10 Screw
for desk mount NA 4To x the desk mount.
6M3x4 Screw for
DIMM bracket NA 4To x the DIMM bracket.
7Terminal Block
1x3P ST 7.62m 12G082000034AI 1For power supply.
8Terminal Block
1x3P ST 5.0m 12G082000033AI 1
Used to safely connect
two or more wires
together.
9Terminal Block
1x10P ST 3.5m 12G082000103AI 2For Digital Input and Digital Output.
10 M3x4 Screw for
SSD/HDD 13G020570000AI 16 To x the SSD/HDD.
11
M2 Nut (w/Hex
Head Bolt, H
3.55mm)
13G020271011AK 1
To x NUT. (is is
required when installing
Key M 2242 and Key E
2230 at the same time)
12 M2x2 Screw 13G020302034AK 3To x M.2.
13 Screw for wi
card 13G020305012AK 2To couse with POE FPC screw and Mini PCIe.
14 M.2 Heatsink 13G070640000AI 1To provide better heat
dissipation for M.2.

4 5
English
No. Accessories PN Q'ty Picture Description
15
SODIMM
Bracket w/
mylar (le side)
13G030035000AI 2To x the SODIMM
Heatsink.
SODIMM
Heatsink (right
side)
13G070640010AI 2
To provide better
heat dissipation for
SODIMM.
16 4x4 EPE Bag 15G162200200AI 1For QIG.
17 QIG 15G06M118000AI 1Quick Installation
Guide
1. If any items are missing or appear damaged, contact your authorized dealer.
2. Based on dierent conguration, package list may be dierent.
Note:
Please refer to the following for more information about the adapters:
330W Power adapter
- Input voltage: 100-240 Vac
- Input frequency: 47-63 Hz (±1Hz)
- Rating output current: 13.75A
- Rating output voltage: 24.0 V ±5%
1. Actual power consumption may dier based on dierent applications and dierent hardware
congurations. Sucient power for the entire system is required to meet these specications.
We recommend that 330W adapter (Certied adapter, Output: 24Vdc,13.75A) is used if there
is no PCIe or PCI add-on cards assembled on the iEPF-9000S-EX4. Users may use a DC source
instead of the optional 330W adapter (Certied adapter, Output: 24Vdc,13.75A) when the
power consumption is over 330W in an environment where the temperature is 40OC and DC
source should be within 9~36 VDC/30~18A.
2. External power source ratings:
(1) 24Vdc, min.3.75A, Operating Temperature 40°C
(2) 9-36Vdc, min. 30-18A, Operating Temperature refer to Chapter 1.6 for each CPU.
WARNING! Use ONLY approved NRTL LISTED ITE power supply with electrical ratings.

iEPF-9000S-EX4 / iEPF-9002S-EX4 /
iEP-9000E / iEP-9002E
4 5
English
1.3 Order Information
Model Name PN Description
iEP-9000E 90PXG7G0-20000000
Intel® 10th Gen Xeon® W or Core™ Processors
with W480E Chipset, W/O CPU, RAM, SSD,
ADAPTER
iEP-9002E 90PXG8P0-20000000 Intel®10th Gen Core™ Processors with H420E
chipset, W/O CPU, RAM, SSD, ADAPTER
iEPF-9000S-EX4 90PXG7G0-10000000
Intel® 10th Gen Xeon® W or Core™ Processors
with W480E Chipset, W/O CPU, RAM, SSD,
ADAPTER
iEPF-9002S-EX4 90PXG8P0-10000000 Intel®10th Gen Core™ Processors with H420E
chipset, W/O CPU, RAM, SSD, ADAPTER
1.4 Optional Items
Model Name PN Description
ACPWR CORD EU+KR;
L=1.8M ( 品)14G110001800AK 立訊 /L72AC007-SD-R
AC POWER CORD CN
L:1.8M ( 品頭 )14G110001300AK I-SHENG/Y646B301912180Q
US PWR CORD, L:1.5M
BLACK ( 品頭 )14G110001100AK 立訊 /L72AC001-SD-R
PSU MEAN WELL
648W 04G180004400AI 捍宇 /HRP-600-24
ADAPTER 330W 24V
3PIN (W/ PSE) 04G266000701AI FSP/FSP330-AAAN3/9NA3300214
ADAPTER 330W 24V
W/O CONN(PHX) 04G266001200AI FSP/FSP330-AAAN3/9NA3300215

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English
1.5 Serial Number Label
e serial number is printed below or above the bar code and can be found on the
rear side of the chassis.
1.5.1 Serial Number Label Location
iEPF-9000S Series iEP-9000E Series
1.5.2 Serial Number Label Illustration

iEPF-9000S-EX4 / iEPF-9002S-EX4 /
iEP-9000E / iEP-9002E
6 7
English
1.6 Specications
iEPF-9000S-EX4
Processor
System
CPU Intel® 10 Gen Xeon® W or Core™ Processors
Chipset Intel® W480E
Socket LGA 1200
Memory
Technology
Dual Channel DDR4 2400 MHz
(ECC memory supported by W480E w/ Xeon W/Core i3
CPU)
Capacity 128 GB (32 GB per DIMM)
Socket 4 x 260-pin SO-DIMM
Graphics
Controller Intel® UHD Graphics
DisplayPort DisplayPort 1.4, DP++
Maximum resolution up to 4096 x 2160@60Hz
VGA Maximum resolution up to 1920 x 1200@60Hz
MultiDisplay Triple Display
Expansion Slot
PCIe
1 x PCIe Gen3 x16 (single x16 or dual x8), PCIe x16 slot
with default power cable can support up to 180W graphic
card (275mm x 111.15 mm x 42mm (L x H x D), if the
card holder is removed, it can be limited on 275mm x
121mm x 42mm, dual slot width max.)
Graphic card can be up to 255W with optional VGA
module
1 x PCIe Gen3 x8 (shared with dual x8)
2 x PCIe Gen3 x4 (1 shared with M.2 Key M)
Mini-PCIe 2 x Full/Half size with PCIe Gen3 x1 and USB 2.0
RF & Antenna 8 x SMA connector hole reserved
M.2
1 x M.2 (Key E, 2230) with CNVI/PCIe Gen3 x1 and USB
2.0 for Wi-Fi/BT module
1 x M.2 (Key B, 2280/3042/3052) with PCIe Gen3 x1 /
USB3.2 Gen1x1 for 4G / 5G
SIM Socket 2 x Nano SIM Card slot
(1 connected to Mini PCIe, 1 connected to M.2 Key B)
Audio Interface Realtek ALC897, High Denition Audio
Ethernet
Controller/
Speed
4 x I210IT (2 support PoE, PoE output max.15.4W/port,
each port supports IEEE 802.3AF PoE)
1 x I219LM (vPro support)
Controller 5 x RJ-45
Storage
M.2 1 x M.2 (Key M, 2280) with PCIe Gen3 x4 (shared with
PCIe x4 slot) or SATA3 for SSD
SATA 4 x SATA3 (6Gb/s), support RAID 0/1/5/10
4 x 2.5" HDD/SSD Tray
CFast (Option) 1 x Type II socket (Shared with SATA3)

8 9
English
Rear I/O
DisplayPort 2
VGA 1
Ethernet 5 x 1 Gigabit LAN
USB 4 x USB 3.2 Gen2x1, 2 x USB2.0
(1x USB2.0 internal connector w/ lock function)
Audio 1 x Mic-in
1 x Line-out
COM 4 x RS232/422/485
2 x RS232
DIO 8DIs/8DOs
Watchdog
Timer
Output From Super I/O to drag RESETCON#
Interval 256 Segments, 0, 1, 2, ...255sec
Power
Requirements Input PWR
9V~36V VDC with Ignition control and remote power
on/o switch.
80V Surge Protection, OVP, UVP, OCP and reverse
protection
Ignition Power Input w/ 13-mode condition
Environment
Operating
Temperature
35W CPU: -40°C~75°C (-40°F~167°F)
65W CPU: -40°C~55°C (-40°F~131°F)
80W CPU: -40°C~45°C (-40°F~113°F)
(with FAN inside, without Add-on Card) (w/ air ow
0.5~0.8 m/s)
Storage
Temperature -40°C~85°C (-40°F~185°F)
Humidity ~95% @ 40°C (non-condensing)
Shock Operating: 50 G, half sine 11ms duration with SSD
Vibration Operating: 5 Grms, 5-500 Hz, 3 axes with SSD
ESD Contact ±4kV, Air ±8kV
EMC EN61000-6-4/-2, CE & FCC Class A
Safety LVD
Mechanical
Construction Aluminum heatsink and Metal chassis
Mounting Desk Mount
Dimensions 202mm (W) x 290mm (D) x 209.3mm (H)
(7.95" x 11.42" x 8.24")
Net Weight 10kg
Others OS Support Windows 10 & Linux
TPM TPM 2.0

iEPF-9000S-EX4 / iEPF-9002S-EX4 /
iEP-9000E / iEP-9002E
8 9
English
iEPF-9002S-EX4
Processor
System
CPU Intel® 10th Gen Core™ Processors
Chipset Intel® H420E
Socket LGA 1200
Memory
Technology Dual Channel DDR4 2400 MHz
Capacity 64GB (32 GB per DIMM)
Socket 2 x 260-pin SO-DIMM
Graphics
Controller Intel® UHD Graphics
DisplayPort DisplayPort 1.4 , DP++
Maximum resolution up to 4096x2160@60Hz
VGA Maximum resolution up to 1920x1200@60Hz
MultiDisplay Dual Display
Expansion Slot
PCIe
1 x PCIe Gen3 x16*, PCIe x16 slot with default power
cable can support up to 180W graphic card (275mm x
111.15 mm x 42mm (L x H x D), if the card holder is
removed, it can be limited on 275mm x 121mm x 42mm,
dual slot width max.)
Graphic card can be up to 255W with optional VGA
module
Mini-PCIe 1 x Full/Half size with PCIe Gen3 x1 and USB 2.0
1 x Full/Half size with PCIe Gen3 x1
RF & Antenna 8 x SMA connector hole reserved
M.2
1 x M.2 (Key E, 2230) with PCIe Gen3 x1 and USB 2.0 for
Wi-Fi/BT module
1 x M.2 (Key B, 2280/3042/3052) with PCIe Gen3 x1,
USB3.2 Gen1 x1 for 4G / 5G
SIM Socket 2 x Nano SIM Card slot
(1 connected to Mini PCIe, 1 connected to M.2 Key B)
Audio Interface Realtek ALC897, High Denition Audio
Ethernet
Controller/
Speed 2x I210IT + 1 x I219V
Controller 3 x RJ-45
Storage
M.2 1 x M.2 (KeyM, 2280) with SATA3 for SSD
SATA 2 x SATA3 (6Gb/s)
2 x 2.5" HDD/SSD Tray
Rear I/O
DisplayPort 2
VGA 1
Ethernet 3 x 1 Gigabit LAN
USB
4 x USB 3.2 Gen1x1
2 x USB2.0
1 x USB2.0 internal connector w/ lock function
Audio 1 x Mic-in
1 x Line-out
COM 4 x RS232/422/485
2 x RS232
DIO 8DIs/8DOs

10 11
English
Watchdog
Timer
Output From Super I/O to drag RESETCON#
Interval 256 Segments, 0, 1, 2, ...255sec
Power
Requirements Input PWR
9V~36V VDC with Ignition control and remote power
on/o switch.
80V Surge Protection, OVP, UVP, OCP and reverse
protection
Ignition Power Input w/ 13-mode condition
Environment
Operating
Temperature
35W CPU: -40°C~75°C (-40°F~167°F)
65W CPU: -40°C~55°C (-40°F~131°F)
80W CPU: -40°C~45°C (-40°F~113°F)
(with FAN inside, without Add-on Card) (w/ air ow
0.5~0.8 m/s)
Storage
Temperature -40°C~85°C (-40°F~185°F)
Humidity ~95% @ 40°C (non-condensing)
Shock Operating: 50 G, half sine 11ms duration with SSD
Vibration Operating: 5 Grms, 5-500 Hz, 3 axes with SSD
ESD Contact ±4kV, Air ±8kV
EMC EN61000-6-4/-2, CE & FCC Class A
Safety LVD
Mechanical
Construction Aluminum heatsink and Metal chassis
Mounting Desk Mount
Dimensions 202mm (W) x 290mm (D) x 209.3mm (H)
(7.95" x 11.42" x 8.24")
Net Weight 10kg
Others OS Support Windows 10 & Linux
TPM TPM 2.0