Bailey IMCIS12 User manual

®
®
Process Control and
Automation Solutions
from Elsag Bailey Group
IMCIS12/IMQRS12
Control I/O Module and
Quick Response I/O Module

WARNING notices as used in this instruction apply to hazards or unsafe practices that could result in
personal injury or death.
CAUTION notices apply to hazards or unsafe practices that could result in property damage.
NOTES highlight procedures and contain information that assists the operator in understanding the
information contained in this instruction.
WARNING
INSTRUCTION MANUALS
DO NOT INSTALL, MAINTAIN, OR OPERATE THIS EQUIPMENT WITHOUT READING, UNDERSTANDING,
AND FOLLOWING THE PROPER Elsag Bailey INSTRUCTIONS AND MANUALS; OTHERWISE, INJURY OR
DAMAGE MAY RESULT.
RADIO FREQUENCY INTERFERENCE
MOST ELECTRONIC EQUIPMENT IS INFLUENCED BY RADIO FREQUENCY INTERFERENCE (RFI). CAU-
TION SHOULD BE EXERCISED WITH REGARD TO THE USE OF PORTABLE COMMUNICATIONS EQUIP-
MENT IN THE AREA AROUND SUCH EQUIPMENT. PRUDENT PRACTICE DICTATES THAT SIGNS SHOULD
BE POSTED IN THE VICINITY OF THE EQUIPMENT CAUTIONING AGAINST THE USE OF PORTABLE COM-
MUNICATIONS EQUIPMENT.
POSSIBLE PROCESS UPSETS
MAINTENANCE MUST BE PERFORMED ONLY BY QUALIFIED PERSONNEL AND ONLY AFTER SECURING
EQUIPMENT CONTROLLED BY THIS PRODUCT. ADJUSTING OR REMOVING THIS PRODUCT WHILE IT IS
IN THE SYSTEM MAY UPSET THE PROCESS BEING CONTROLLED. SOME PROCESS UPSETS MAY
CAUSE INJURY OR DAMAGE.
NOTICE
The information contained in this document is subject to change without notice.
Elsag Bailey, its affiliates, employees, and agents, and the authors and contributors to this publication specifi-
cally disclaim all liabilities and warranties, express and implied (including warranties of merchantability and fit-
ness for a particular purpose), for the accuracy, currency, completeness, and/or reliability of the information
contained herein and/or for the fitness for any particular use and/or for the performance of any material and/
or equipment selected in whole or part with the user of/or in reliance upon information contained herein.
Selection of materials and/or equipment is at the sole risk of the user of this publication.
This document contains proprietary information of Elsag Bailey, Elsag Bailey Process Automation, and is
issued in strict confidence. Its use, or reproduction for use, for the reverse engineering, development or
manufacture of hardware or software described herein is prohibited. No part of this document may be
photocopied or reproduced without the prior written consent of Elsag Bailey.

WBPEEUI240755B0
Preface
The IMCIS12 Control I/O and IMQRS12 Quick Response I/O
modules bring process field signals into the INFI 90 OPEN ®
Strategic Process Management System, and output INFI 90
OPEN signals to the process.
The IMCIS12 and IMQRS12 modules are the functional equiva-
lent of the IMCIS02 and IMQRS02 modules with the restriction
that the digital inputs on the IMCIS02 and IMQRS02 modules
offer selectable debounce filter times of 1.5 milliseconds (fast)
and 17 milliseconds (slow), and the IMCIS12 and IMQRS12
modules offer only the 17 milliseconds (slow) debounce filter
time. The slow debounce filter is used in the majority of digital
input applications. Several advantages of the IMCIS12 and
IMQRS12 modules include EMI protection circuitry and a digi-
tal input and output voltage selection of 48 VDC.
This instruction explains the I/O module specifications and
operations. It details the procedures necessary to complete
setup, installation, maintenance, troubleshooting and replace-
ment of the CIS and QRS modules.
The system engineer or technician using the CIS or QRS mod-
ule should read and understand this instruction before install-
ing and operating the I/O module. A complete understanding
of the INFI 90 OPEN system is beneficial to the user.

WBPEEUI240755B0
®
List of Effective Pages
Total number of pages in this instruction is 55, consisting of the following:
Page No. Change Date
Preface Original
List of Effective Pages Original
iii through vii Original
1-1 through 1-10 Original
2-1 through 2-7 Original
3-1 through 3-8 Original
4-1 through 4-2 Original
5-1 through 5-4 Original
6-1 through 6-4 Original
7-1 Original
8-1 Original
A-1 through A-4 Original
B-1 through B-2 Original
C-1 through C-3 Original
Index-1 through Index-2 Original
When an update is received, insert the latest changed pages and dispose of the super-
seded pages.
NOTE: On an update page, the changed text or table is indicated by a vertical bar in the outer mar-
gin of the page adjacent to the changed area. A changed figure is indicated by a vertical bar in the
outer margin next to the figure caption. The date the update was prepared will appear beside the
page number.

Table of Contents
Page
WBPEEUI240755B0 iii
SECTION 1 - INTRODUCTION....................................................................................................1-1
OVERVIEW ..................................................................................................................1-1
INTENDED USER.........................................................................................................1-1
MODULE DESCRIPTION ..............................................................................................1-1
INSTRUCTION CONTENT .............................................................................................1-3
HOW TO USE THIS MANUAL .......................................................................................1-3
DOCUMENT CONVENTIONS ........................................................................................1-4
GLOSSARY OF TERMS AND ABBREVIATIONS .............................................................1-4
REFERENCE DOCUMENTS..........................................................................................1-5
NOMENCLATURE ........................................................................................................1-5
RELATED HARDWARE.................................................................................................1-5
SPECIFICATIONS.........................................................................................................1-6
SECTION 2 - DESCRIPTION AND OPERATION........................................................................2-1
INTRODUCTION...........................................................................................................2-1
ANALOG I/O ................................................................................................................2-2
Analog Inputs ........................................................................................................2-2
Analog Input Circuit Calibration ............................................................................2-3
Analog Outputs......................................................................................................2-3
DIGITAL I/O ................................................................................................................2-4
Digital Inputs.........................................................................................................2-4
Digital Outputs ......................................................................................................2-4
Digital I/O Buffer...................................................................................................2-4
I/O CIRCUIT CONNECTIONS .......................................................................................2-5
I/O EXPANDER BUS....................................................................................................2-5
UNIVERSAL I/O EXPANDER BUS INTERFACE .............................................................2-6
MODULE DATA............................................................................................................2-6
I/O Data................................................................................................................2-6
Status Data ...........................................................................................................2-7
LOGIC POWER.............................................................................................................2-7
BUS FAULT TIMER ......................................................................................................2-7
STATUS LED INDICATORS...........................................................................................2-7
SECTION 3 - INSTALLATION.....................................................................................................3-1
INTRODUCTION...........................................................................................................3-1
SPECIAL HANDLING ....................................................................................................3-1
UNPACKING AND INSPECTION ....................................................................................3-2
SETUP/PHYSICAL INSTALLATION ...............................................................................3-2
Address Selection Switch (S1) ................................................................................3-2
Analog Output Default Jumpers (J7, J8, J12, J14, J10, J16) .................................3-4
Analog Output Mode Jumpers (J9, J11, J13, J15) ..................................................3-5
Analog Input Mode Jumpers (J17, J18, J19, J20) ..................................................3-5
Digital Input Jumper Settings (J1, J2, J3, J4, J5, J6) ............................................3-6
Digital Output Configuration..................................................................................3-6
Termination Unit/Module Configuration ................................................................3-6
Physical Installation...............................................................................................3-6
WIRING CONNECTIONS AND CABLING .......................................................................3-7
Wiring....................................................................................................................3-7
Cable Connections .................................................................................................3-7
FUSING........................................................................................................................3-8
PREOPERATING ADJUSTMENTS .................................................................................3-8

iv WBPEEUI240755B0
Table of Contents (continued)
Page
®
SECTION 4 - OPERATING PROCEDURES...............................................................................4-1
INTRODUCTION .......................................................................................................... 4-1
MODULE STATUS INDICATOR .................................................................................... 4-1
START-UP PROCEDURES............................................................................................ 4-2
FUNCTION CODE CONFIGURATION............................................................................ 4-2
SECTION 5 - TROUBLESHOOTING...........................................................................................5-1
INTRODUCTION .......................................................................................................... 5-1
ERROR INDICATIONS AND CORRECTIVE ACTION ...................................................... 5-1
Status LED............................................................................................................ 5-1
Control Module Errors ........................................................................................... 5-2
MODULE PIN CONNECTIONS ...................................................................................... 5-3
SECTION 6 - MAINTENANCE.....................................................................................................6-1
INTRODUCTION .......................................................................................................... 6-1
PREVENTIVE MAINTENANCE SCHEDULE................................................................... 6-1
EQUIPMENT AND TOOLS REQUIRED ......................................................................... 6-1
PREVENTIVE MAINTENANCE PROCEDURES .............................................................. 6-2
Printed Circuit Board Cleaning .............................................................................. 6-2
General Cleaning and Washing........................................................................ 6-2
Edge Connector Cleaning ................................................................................ 6-3
Checking Connections ........................................................................................... 6-3
SECTION 7 - REPAIR/REPLACEMENT PROCEDURES...........................................................7-1
INTRODUCTION .......................................................................................................... 7-1
MODULE REPAIR/REPLACEMENT PROCEDURES ...................................................... 7-1
SECTION 8 - SUPPORT SERVICES...........................................................................................8-1
INTRODUCTION .......................................................................................................... 8-1
REPLACEMENT PARTS AND ORDERING INFORMATION ............................................. 8-1
TRAINING.................................................................................................................... 8-1
TECHNICAL DOCUMENTATION................................................................................... 8-1
APPENDIX A - TERMINATION UNIT (NTCS04) CONFIGURATION ........................................A-1
INTRODUCTION ..........................................................................................................A-1
APPENDIX B - TERMINATION MODULE (NICS01) CONFIGURATION ..................................B-1
INTRODUCTION ..........................................................................................................B-1
APPENDIX C - QUICK REFERENCE.........................................................................................C-1
INTRODUCTION ..........................................................................................................C-1

List of Figures
No. Title Page
WBPEEUI240755B0 v
1-1. INFI 90 OPEN Communication Levels.....................................................................1-2
2-1. Block Diagram .......................................................................................................2-1
2-2. Analog Input Circuit Example ................................................................................2-2
2-3. Analog Output Circuit Example .............................................................................2-3
2-4. Digital Input Circuit Example.................................................................................2-5
2-5. Digital Output Circuit Example ..............................................................................2-5
3-1. Switch and Jumper Locations ................................................................................3-3
3-2. Address Select Switch (S1) .....................................................................................3-3
3-3. Cable Connections and Termination.......................................................................3-8
4-1. Front Panel Indicators...........................................................................................4-1
A-1. NTCS04 Termination Unit Layout ......................................................................... A-1
A-2. Switching Hot vs. Switching Neutral...................................................................... A-4
B-1. NICS01 Terminal Assignments .............................................................................. B-2
C-1. Switch and Jumper Locations ............................................................................... C-1
C-2. Address Select Switch (S1) .................................................................................... C-1
List of Tables
No. Title Page
1-1. Glossary of Terms and Abbreviations .....................................................................1-4
1-2. Reference Documents ............................................................................................1-5
1-3. Nomenclature ........................................................................................................1-5
1-4. Related Hardware ..................................................................................................1-5
1-5. Specifications.........................................................................................................1-6
3-1. S1 Address Switch Settings....................................................................................3-3
3-2. Analog Output Default Jumpers.............................................................................3-5
3-3. Analog Output Mode Jumpers................................................................................3-5
3-4. Analog Input Mode Jumpers ..................................................................................3-6
3-5. Digital Input Jumper Settings ................................................................................3-6
4-1. Status LED Indicator .............................................................................................4-1
5-1. Status LED Indications and Correction Actions ......................................................5-1
5-2. P1 Power Pin Connections......................................................................................5-3
5-3. P2 Expander Bus Connections ...............................................................................5-3
5-4. P3 I/O Pin Connections .........................................................................................5-4
6-1. Preventive Maintenance Schedule ..........................................................................6-2
A-1. Analog Input Dipshunt Configuration ................................................................... A-2
A-2. Analog Input Destination for Station Feedback...................................................... A-2
A-3. Analog Output Dipshunt Configuration................................................................. A-3
A-4. Digital Input Dipshunt Configuration .................................................................... A-3
B-1. NICS01 Dipswitch Configuration........................................................................... B-1
C-1. S1 Address Switch Settings................................................................................... C-2
C-2. Analog Output Default Jumpers............................................................................ C-2
C-3. Analog Output Mode Jumpers............................................................................... C-3
C-4. Analog Input Mode Jumpers ................................................................................. C-3
C-5. Digital Input Jumper Settings ............................................................................... C-3

vi WBPEEUI240755B0
Safety Summary
®
GENERAL
WARNINGS Equipment Environment
All components, whether in transportation, operation or storage,
must be in a noncorrosive environment.
Electrical Shock Hazard During Maintenance
Disconnect power or take precautions to insure that contact with
energized parts is avoided when servicing.
SPECIFIC
WARNINGS Disconnect power before installing dipshunts on the MMU back-
plane. Failure to do so will result in contact with cabinet areas that
could cause severe or fatal shock. (p. 3-7)
Never clean electrical parts or components with live power present.
Doing so exposes you to an electrical shock hazard. (p. 6-2)
Wear eye protection whenever working with cleaning solvents.
When removing solvents from printed circuit boards using com-
pressed air, injury to the eyes could result from splashing solvent as
it is removed from the printed circuit board. (p. 6-2)
There are exposed AC and DC connections inside the cabinet.
These exposed electrical connections present a shock hazard that
can cause injury or death. (p. 6-4)
If input or output circuits are a shock hazard after disconnecting sys-
tem power at the power entry panel, then the door of the cabinet
containing these externally powered circuits must be marked with a
warning stating that multiple power sources exist. (p. 6-4)

WBPEEUI240755B0 vii
Trademarks and Registrations
Registrations and trademarks used in this document include:
® INFI 90 Registered trademark of Elsag Bailey Process Automation
® INFI-NET Registered trademark of Elsag Bailey Process Automation

OVERVIEW
WBPEEUI240755B0 1 - 1
SECTION 1 - INTRODUCTION
OVERVIEW
The IMCIS12 Control I/O and IMQRS12 Quick Response I/O
modules bring four analog and three digital process field sig-
nals into the INFI 90 OPEN system for processing and monitor-
ing. They output four digital and two analog signals for process
control. The control I/O (CIS) and quick response I/O (QRS)
modules are interfaces between the process and the INFI 90
OPEN Strategic Process Management System.
The IMCIS12 and IMQRS12 modules are functionally the
same; however, the QRS module provides approximately ten
times faster response for the analog inputs. By doing this, the
input signal noise rejection is lower for the QRS module than it
is for the CIS module. The process requirements determine the
module to use for your application.
NOTE: In this instruction, any reference to I/O module means either
IMCIS12 module or IMQRS12 module.
Control modules (e.g., MFP modules) perform the control func-
tions; I/O modules provide the I/O to the control modules.
This manual explains the purpose, operation and maintenance
of the I/O module. It addresses handling precautions and
installation procedures. Figure 1-1 illustrates the INFI 90
OPEN communication levels and the position of the CIS and
QRS modules within these levels.
INTENDED USER
System engineers and technicians should read this manual
before installing and operating the I/O module. A module
SHOULD NOT be put into operation until this instruction is
read and understood. You can refer to the Table of Contents to
find specific information after the module is operating.
MODULE DESCRIPTION
The CIS and QRS modules consist of a single printed circuit
board (PCB) that occupies one slot in a module mounting unit
(MMU). Jumpers on the printed circuit board configure each of
the analog inputs, analog outputs and digital inputs. Analog
inputs can also be configured on its respective termination
unit (TU) or termination module (TM).
Two captive screws on the faceplate secure the module to the
MMU. Two front panel LEDs indicate the module status.

INTRODUCTION
MODULE DESCRIPTION
1 - 2 WBPEEUI240755B0
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The I/O module has three connection points for external sig-
nals and power (P1, P2 and P3). P1 connects to a common
(ground) and +5 VDC and ±15 VDC power (refer to Table 5-2).
P2 connects the module to the control module through the I/O
expander bus (refer to Table 5-3). The field I/O signals are
exchanged through connector P3 using a cable connected to a
TU or TM (refer to Table 5-4). The terminal blocks (physical
connection points) for field wiring are on the TU or TM.
The I/O module accepts digital signals of 24 VDC, 48 VDC, 125
VDC and 120 VAC. Individual voltage jumpers on the module
configure each input. A fixed response time (17 milliseconds)
allows the INFI 90 OPEN system to compensate for process
field device debounce time. It outputs digital signals of 24 VDC
that can sink 250 milliamperes at 24 VDC and 125 milliam-
peres at 48 VDC.
It accepts analog signals of one to five VDC (single ended or
differential). Its respective termination unit (TU) or termination
module (TM) converts a four to 20-milliampere current to a
voltage that is sent to the I/O module. The analog output mode
Figure 1-1. INFI 90 OPEN Communication Levels
T01315A
COMMUNICATION HIGHWAY (INFI-NET OR PLANT LOOP)
CONTROLWAY
MFP
OTHER MODULES
COMMUNICATION
MODULES
TU/TMTU/TM
OTHER I/O
MODULES
QRSCIS
I/O EXPANDER BUS

INTRODUCTION
INSTRUCTION CONTENT
WBPEEUI240755B0 1 - 3
is selectable; jumpers select current or voltage mode for each
analog output depending on the process requirements.
The two front panel LEDs provide a visual indication of the
module status to aid in system test and diagnostics. The I/O
module can be removed or installed without powering the sys-
tem down.
INSTRUCTION CONTENT
This instruction is divided into eight sections and three appen-
dices. Read this instruction before installing or operating the
IMCIS12 or IMQRS12 module. A summary of section content
follows:
Introduction Contains a brief description, general usage information and
technical specifications.
Description and
Operation Uses block diagrams and schematics to explain module opera-
tion and input circuitry.
Installation Covers the preliminary steps to install the module and prepare
for operation. It covers address switch settings, mounting, wir-
ing connections, cabling and preoperational checks.
Operating Procedures Provides information on front panel indicators and start-up
procedures.
Troubleshooting Explains the meaning of error indications and contains trou-
bleshooting procedures.
Maintenance Contains scheduled maintenance tasks and procedures.
Repair and Replacement
Procedures Contains procedures that explain how to replace the module.
Support Services Explains the services and training that Elsag Bailey makes
available to their customers.
Appendices Appendix A provides configuration information for the NTCS04
termination unit. Appendix B provides configuration informa-
tion for the NICS01 termination module. Appendix C provides
a quick reference for switch and jumper locations and settings.
HOW TO USE THIS MANUAL
Read this instruction before handling the IMCIS12  or IMQRS12
module. Refer to a specific section for information as needed.
1. Read the operating procedures section before installing the
module.
2. Do the steps in the installation section.

INTRODUCTION
DOCUMENT CONVENTIONS
1 - 4 WBPEEUI240755B0
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3. Refer to the troubleshooting section to resolve problems if
they occur.
4. Refer to the maintenance section for scheduled mainte-
nance requirements.
5. Refer to the repair and replacement procedures to replace
a module.
6. Use the support services section for information on order-
ing spare modules and warranty information.
DOCUMENT CONVENTIONS
The  in a nomenclature item indicates variables for that posi-
tion, e.g., IMCIS
 2.
GLOSSARY OF TERMS AND ABBREVIATIONS
Table 1-1 contains those terms and abbreviations that are
unique to Elsag Bailey or have a definition that is different
from standard industry usage.
Table 1-1. Glossary of Terms and Abbreviations
Term Definition
EWS Engineering work station.
Function Code (FC) An algorithm which manipulates specific functions.
These functions are linked together to form the con-
trol strategy.
I/O Expander Bus Parallel communication bus between the control and
I/O modules.
MFP Multi-function processor module. A multiple loop con-
troller with data acquisition and information process-
ing capabilities.
MMU Module mounting unit. A card cage that provides
electrical and communication support for INFI 90
OPEN/Network 90 modules.
OIS Operator interface station. Integrated operator con-
sole with data acquisition and reporting capabilities.
It provides a digital access into the process for flexi-
ble control and monitoring.
TM Termination module. Provides input/output direct
connection between plant equipment and the INFI 90
OPEN/Network 90 modules.
TU Termination unit. Provides input/output direct con-
nection between plant equipment and the INFI 90
OPEN/Network 90 modules.

INTRODUCTION
REFERENCE DOCUMENTS
WBPEEUI240755B0 1 - 5
REFERENCE DOCUMENTS
Table 1-2 lists Elsag Bailey instructions for equipment that is
referenced in this instruction.
NOMENCLATURE
Table 1-3 contains the control I/O module nomenclature used
in this instruction.
RELATED HARDWARE
Refer to Table 1-4 for modules and equipment that can be used
with a control I/O module:
Table 1-2. Reference Documents
Number Document
I-E92-501-2 Configuration and Tuning Terminal (CTT)
I-E96-192-1 Operation, Operator Interface Station (40 Series)
IIOIS42
I-E96-200 Function Code Application Manual
I-E96-201 Multi-Function Processor (IMMFP01)
I-E96-202 Multi-Function Processor (IMMFP02)
I-E96-203 Multi-Function Processor (IMMFP03/03B)
I-E96-209 Logic Master Module (IMLMM02)
I-E96-409 Termination Module (NICS01)
I-E96-442 Termination Unit (NTCS04)
WBPEEUI200502A0 Module Mounting Unit (IEMMU11/12/21/22)
WBPEEUI220756A0 Operation, Operator Interface Station (40 Series)
IIOIS43
Table 1-3. Nomenclature
Nomenclature Description
IMCIS12 Control I/O module
IMQRS12 Quick response I/O module
Table 1-4. Related Hardware
Nomenclature Description
IMMFP01/02/03/03B Multi-function processor module
IMLMM02 Logic master module
NICS01 Termination module, control I/O

INTRODUCTION
SPECIFICATIONS
1 - 6 WBPEEUI240755B0
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SPECIFICATIONS
Table 1-5 contains specifications relative to the IMCIS12 and
IMQRS12 modules.
NTCS04 Termination unit, control I/O
NKTM01 Cable, termination module
NKTU01/11 Cable, termination unit
NKTU02/12 Cable, termination module
Table 1-4. Related Hardware (continued)
Nomenclature Description
Table 1-5. Specifications
Property Characteristic/Value
Power Requirements
Voltage 5 VDC (±5%)
+15 VDC (-2.5%, +5%)
-15 VDC (-5%, +2.5%)
+24 VDC (±10%) (supplied via P3 connector from termination unit)
Current
Dissipation (logic only)
Overvoltage category for I/O II, per IEC 1010-1
Current Typical Maximum
+5 V 265 mA 332 mA
+15 V 27 mA 35 mA
-15 V 23 mA 30 mA
+24 V 46 mA 50 mA
Current Typical Maximum
+5 V 1.33 W 1.66 W
+15 V 405 mW 525 mW
-15 V 345 mW 450 mW
+24 V 1.10 W 1.2 W

INTRODUCTION
SPECIFICATIONS
WBPEEUI240755B0 1 - 7
Digital I/O
Digital inputs 3, optically isolated
Digital outputs 4, open collector, optically isolated
Off output voltage VI/O (nominal 24 VDC or 48 VDC)
On output voltage 1.5 VDC maximum
Off output current 10 µA maximum
On output current 250 mA maximum at 24 VDC; 125 mA maximum at 48 VDC
Analog I/O
Analog inputs 4, 1-5 VDC (differential/single ended) or 4-20 mA
TU/TM configured to accept: 1 powered or unpowered current (4-20 mA)
Single ended or differential voltage (1-5 VDC)
Input impedance >1 MΩ
Common mode voltage ±10 VDC
IMCIS12
Normal mode rejection >76 db at 50/60 Hz
Common mode rejection 90 db from DC to 60 Hz
Response time per channel
(100% step change) 2.4 sec to 95% of final value
IMQRS12
Normal mode rejection 37 db at 50/60 Hz
Common mode rejection 53 db from DC to 60 Hz
Response time per channel
(100% step change) 0.27 sec to 95% of final value
A/D resolution 12 bits for analog inputs
Table 1-5. Specifications (continued)
Property Characteristic/Value
Voltages (±10%)
(jumper selectable)
Current (typical)
Turn-on voltage
(minimum)
Tun-off voltage
(maximum
Maximum input current at
minimum turn-on
Off-leakage current
(maximum)
DC response time
(debounce filter)
24 VDC 48 VDC 125 VDC 120 VAC
5.5 mA 4.7 mA 4.5 mA 4.8 mA
16.8 VDC 20.1 VDC 69.3 VDC 54 VAC
13 VDC 29 VDC 58 VDC 48 VAC
4 mA at
14.7 VDC 4 mA at 32.2 VDC 4 mA at 68.4 VDC 3 mA at 53.8 VAC
7 µA (at Vin
≤12 VDC) 10 µA (at Vin ≤12 VDC) 10 µA (at Vin ≤60 VDC) 10 µA (at Vin ≤60 VAC)
17 ms (fixed)

INTRODUCTION
SPECIFICATIONS
1 - 8 WBPEEUI240755B0
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Analog I/O
(continued)
Analog outputs 2, 4-20 mA or 1-5 VDC
Output load - current load 600 Ω/600 mH (maximum)
Output load - voltage load >1 kΩ
D/A resolution 10 bits for analog outputs
Analog accuracy
Input at 25°C (77°F) standard
condition
Terminal based linearity ±0.03% of full scale range
Repeatability ±0.03% of full scale range
Deadband ±0.03% of full scale range
Accuracy ±0.1% of full scale range
Output at 25°C (77°F)
standard condition
Terminal based linearity ±0.1% of full scale range
Repeatability ±0.05% of full scale range
Accuracy ±0.15% of full scale range (voltage mode)
±0.25% of full scale range (current mode)
Temperature effect
0° to 70°C (32° to 158°F) ±0.002% of full scale range/°C
Input cross talk rejection
(channel to channel) 50 db (min.) at 25°C (77°F)/-78 db (typ) at 25°C (77°F)
Mounting Occupies one slot in a standard INFI 90 OPEN module mounting
unit (MMU)
Environmental
Ambient temperature
(per IEC-68-2-1, 2,14) Temperature rating within the cabinet or enclosure applies. INFI 90 OPEN internal cabinet rating: 0° to 70° C (32° to 158° F)
Relative humidity
(per IEC68-2-3) 5% to 95% up to 55°C (131°F) (noncondensing) 5% to 45% at 70°C (158°F) (noncondensing)
Pollution degree: 1 (no condensation)
Atmospheric pressure Sea level to 3 km (1.86 miles)
Air quality (per ISA S71.04,
Class LA, LB, LC - level 1) Noncorrosive
Table 1-5. Specifications (continued)
Property Characteristic/Value

INTRODUCTION
SPECIFICATIONS
WBPEEUI240755B0 1 - 9
Isolation
(per IEC 1010-1, IEC 255, IEC 60)
Channel to channel and channel to
logic
Electromagnetic compatibility
Electrostatic discharge
(IEC 1000-4-2, EN 61000-4-2) Contact: ±6 kV Air: ±8 kV
Magnetic and electromagnetic fields
Power frequency magnetic
field
(IEC 1000-4-8, EN 61000-4-8)
Continuous: 30 A/m (rms)
Short duration: 300 A/m (rms)
Pulse magnetic field
(IEC 1000-4-9, EN 61000-4-9) Peak value: 300 A/m
Table 1-5. Specifications (continued)
Property Characteristic/Value
Test Common Mode Normal
Mode
Digital Input
Insulation resistance
(100/500 VDC) 100 MΩN/A
Dielectric VAC (45 to 65 Hz) or VDC 1.4 kV rms/1
min. or 1.95 kV
DC/1min.
N/A
Impulse voltage (1.2/50 µS) ±2.55 kVp ±1 kVp
Digital Output
Insulation resistance
(100/500 VDC) 100 MΩN/A
Dielectric VAC (45 to 65 Hz) or VDC 1 kV rms/1 min.
or 1.5 kV DC/
1min.
N/A
Impulse voltage (1.2/50 µS) ±2 kVp ±1 kVp
Analog Input/Output
Insulation resistance
(100/500 VDC) N/A N/A
Dielectric VAC (45 to 65 Hz) or VDC N/A N/A
Impulse voltage (1.2/50 µS) N/A ±1 kVp
Test Common Mode Normal
Mode
Voltage/current surge (1.2/50 µS to
8/20 µS )
(IEC 1000-4-5, EN 61000-4-5)
±2 kVp ±1 kVp
Fast transient bursts
(IEC 1000-4-4, EN 61000-4-4) ±2 kVp N/A
Damped oscillatory wave, 0.1 MHz
and 1 MHz
(IEC 1000-4-12, EN 61000-4-12)
±2 kVp ±1 kVp
Ring wave
(IEC 1000-4-12, EN 61000-4-12) ±2 kVp ±1 kVp

INTRODUCTION
SPECIFICATIONS
1 - 10 WBPEEUI240755B0
®
Magnetic and electromagnetic fields
(continued)
Damped oscillatory magnetic
field, 0.1 MHz and 1 MHz
(IEC 1000-4-10, EN 61000-4-10)
Peak value: 30 A/m
Radiated radio-frequency elec-
tromagnetic field, 80 MHz to
1 GHz (ENV 50140)
Unmodulated rms: 10 V/m
Amplitude modulated: 80% AM (1 kHz)
Radiated radio-frequency field,
900 ±5 MHz (ENV 50204) Unmodulated rms: 10 V/m Pulse modulated: Duty cycle 50%
Rep. cycle 200 Hz
Radio-frequency common
mode, amplitude modulated,
0.15 MHz to 80 MHz
(ENV 50141)
Unmodulated rms: 10 V/m
Amplitude modulated: 80% AM (1 kHz)
Source impedance: 150 Ω
Emission test
RF radiated fields, 30 MHz to 1000
MHz (ENV 55011)
Class A
CE Mark Declaration
EMC96 Directive 89/336/EEC
Low Voltage Directive 73/23/EEC
This product, when installed in an INFI 90 OPEN cabinet, complies
with the following Directives/Standards requested for CE marking:
EN50081-2 Generic Emission Standard - Part 2: Industrial
Environment
EN50082-2 Generic Immunity Standard - Part 2: Industrial
Environment
EN 61010-1 Safety Requirement for Electrical Equipment for Mea-
surement, Control and Laboratory Use - Part 1: General
Requirements
Certifications
CSA (Canadian Standards
Association)
FM (Factory Mutual)
pending
Certified for use as process control equipment in an ordinary
(nonhazardous) location per CSA 22.2 No. 1010.1-92
Approval for the following categories.
Nonincendive for:
Class I, Division 2, Groups A,B,C,D
Class II, Division 2, Groups F,G
SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE.
Table 1-5. Specifications (continued)
Property Characteristic/Value

INTRODUCTION
WBPEEUI240755B0 2 - 1
SECTION 2 - DESCRIPTION AND OPERATION
INTRODUCTION
This section explains the inputs, outputs, logic power and con-
nections for the IMCIS12 and IMQRS12 modules. The CIS and
QRS modules are process field I/O interfaces for a multi-func-
tion processor (MFP) module. The I/O module circuitry per-
forms the following functions:
•Analog to digital (A/D) conversion. It changes analog
inputs to digital values the MFP can process.
•Digital to analog (D/A) conversion. It changes the MFP dig-
ital values to analog voltage or current signals to control
process field devices.
•Accepts digital field inputs and isolates the module cir-
cuitry from the process.
•Outputs digital signals to process field devices and isolates
the module circuitry from the process.
The MFP communicates with its I/O modules on a parallel I/O
expander bus as shown in Figure 1-1. It references the address
set by I/O address dipswitch (S1). Figure 2-1 is a block dia-
gram of the CIS and QRS modules.
Figure 2-1. Block Diagram
18
OPEN
LOGIC POWER
DIGITAL INPUTS
ANALOG INPUTS
DIGITAL OUTPUTS
ANALOG OUTPUTS
I/O EXPANDER
BUS
T00084A
DIGITAL I/O
BUFFER
A/D
CONVERTER INPUT SELECT INPUT
CONDITIONING
JUMPERS
I/O EXPANDER
BUS
INTERFACE
BUS FAULT
DETECTOR
MODULE
STATUS
THRESHOLD
DETECTION
D/A
CONVERTER E/I JUMPERS
REFERENCE
OUTPUT
ISOLATION
INPUT
ISOLATION
DRIVER
P2
P3
P1
S1
ADDRESS
SWITCH
MODULE
STATUS LEDS
ANALOG OUTPUT
DEFAULT JUMPERS