Buehler EcoMet 300 User manual

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
Version 1.0
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Standard Operating Manual
___________________________________________________________
Buehler EcoMetTM300 Silicon Polisher

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Contents
1. Picture and Location
2. Process Capabilities
2.1 Cleanliness Standard
2.2 Possible Polishing Materials
2.3 Process Specification
3. Contact List and How to Become a Qualified User
3.1 Emergency Responses and Communications
3.2 Training to Become a Qualified EcoMetTM300 User
4Operating Procedures
4.1 System Description
4.2 Safety Warnings
4.3 Operation Precautions and Rules
4.4 Initial Status Checks
4.5 Initial System Checks
4.6 Preparation before Polishing
4.7 Polish Cloth and Slurry Selection
4.8 Polish Parameters setting
4.9 During the Run
4.10 Process Recording during the Process
4.11 Clean up
4.12 Check out
4.13 Important Notice

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Buehler EcoMetTM300 Silicon Polisher
1. Picture and Location
This tool is located at Room 2227.
2. Process Capabilities
2.1 Cleanliness Standard
EcoMetTM300 silicon polisher is classified as a Semi-Clean equipment.
2.2 Possible Polishing Materials
Silicon, Silicon Oxide, Silicon Nitride
Fig.1 Buehler EcoMetTM300 Silicon Polishing Machine

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2.3 Process Specification
What EcoMetTM300 Silicon Polisher CAN do
1. EcoMetTM300 can provide mechanical polish of sample surface using different
size of slurry corresponding to different type of polish cloth.
2. EcoMetTM300 can polish the samples with thickness from tens microns to one
millimeters.
3. EcoMetTM300 can polish the samples in any shape, with size smaller than 4
inch.
What the EcoMetTM300 Silicon Polisher CANNOT do
1. EcoMetTM300 should not be used to polish a sample larger than 4 inch in
diameter.
2. EcoMetTM300 should not be used to polish a sample not bounded on our
standard holder.
3. EcoMetTM300 should not be used to polish a sample with large area of metal
on the surface.
4. EcoMetTM300 should not be used to polish a sample with any photoresist
coated on the surface.
5. EcoMetTM300 should not be used to polish a sample with fine structures on the
surface.
6. EcoMetTM300 should not be used to polish a sample using polishing cloth,
slurry or lubricant not from NFF.

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3. Contact List and How to Become a Qualified User
3.1 Emergency Responses and Communications
1. Security Control Center: 2358-8999 (24hr) & 2358-6565 (24hr)
2. Wing Leong CHUNG - Safety Officer (2358-7211 & 64406238)
3. Preason Man Wai Lee –Deputy Safety Officer (2358-7900),
4. Henry Chun Fai YEUNG –Senior Technician (2358-7896 & 2358-7219)
In case of technical help, please contact NFF staffs,
1. Henry Chun Fai YEUNG –Senior Technician (2358-7896 & 2358-7219))
2. Shuyun ZHAO –Scientific Officer (2358-7212)
3.2 Training to Become a Qualified EcoMetTM300 User
Please follow the procedures below to become a qualified user of the EcoMetTM300:
1. Read all materials provided on the NFF website of the EcoMetTM300.
2. E-mail to Mr. Henry Chun Fai YEUNG requesting EcoMetTM300 operation
training.
3. Hands-on operation training for EcoMetTM300 is required.
4. Pass the examination for the equipment operation and the security.
4. Operating Procedures
4.1 System Description
EcoMetTM300 silicon polisher is composed of power head, D-shape bowl and
control panel. This system is designed to provide mechanical polish of sample

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surface using different slurry corresponding to different type of polish cloth. To
get a defect-free surface, it normally needs multi-steps from coarse to intermediate
and to fine polish.
The sample needs to be bounded on a 4-inch ceramic holder using wax. Then put
the ceramic holder and the drive adapter together and fix them using adhesive tape.
After fine polishing, the surface roughness can reach the level of ~1nm.
4.2 Safety Warnings
1. If the equipment failure while being used, never try to fix the problem by
yourself. Please contact NFF staffs.
2. In emergency, please push the red emergency button to interrupt the
equipment power, and report to the NFF staffs immediately. DO NOT attempt
to resume the equipment on before the problem is solved.
3. During process, if something going wrong and you are not sure what happens,
please report to NFF module staffs.
4.3 Operation Precautions and Rules
1. Please reserve the time slot on your own, and make sure you use your own
time slot to do the polish process.
2. Please fill all the details of the logbook attached, i.e. date, name, project
number, email, project details, material …
3. Do not operate the equipment unless you are properly trained and approved by
NFF staffs.
4. Do not leave an on-going etching process unattended.

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5. Do not use the equipment after office hour.
4.4 Initial Status checks
1. Please check the status of shutdown notice posted in the NFF reservation
website.
2. Please check the reservation status on the website, and reserve the right time
slot by your own.
3. Please check-in the equipment on your own according to the reserved time
slot.
4. Before operate the machine, please make sure you have read and check the
details of the check list.
4.5 Initial system checks
1. Turn on the main power on the backside and check the front blue power button
in ON.
2. Check the N2pressure is ~35psi.
4.6 Preparation before Polishing
A) Sample preparation--wafer bonding*
(*If the sample is grinded using NVG-200A Silicon Grinder firstly, please ignore
this step)
1) If the sample is irregular shape, please polish the sharp corner using abrasive
paper before wafer bonding.
2) Put the ceramic holder on the hotplate.
3) Turn on the hotplate, as shown in Fig. 2, adjust the knob to position 6-7, wait

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for 3~5 minute.
4) Melting enough wax on the ceramic holder, as shown in Fig. 3.
5) Put your sample on top of the wax, and move the wafer in different direction to
even the wax for a flat surface, see Fig. 4.
Fig. 2
Fig. 3
Fig. 4

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6) Move the ceramic holder onto the bonder very carefully, and put an oil-paper
(Fig.5a) and a soft silicone pad on the top, as shown in Fig. 5b.
7) Switch the RED pneumatic button to horizontal (position 2), as shown in Fig.
6a, and let the heavy metal drop down to the sample surface. Then switch the
RED pneumatic button to position 3 to add 0.5MPa pressure to heavy metal for
around 5mins until the ceramic holder is cooled down to room temperature (Fig.
6b). DON’T adjust the pressure by yourself.
Oil paper
Silicone pad
Fig. 5
(a)
(b)
Position2
Position3
Fig. 6
(a)
(b)
0.5MPa
Position1

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8) Take out the ceramic holder by switching the RED pneumatic button back to
position 2 and then position 1. The heavy metal will lift up to initial position.
Please be careful about the ceramic holder. Sometimes the ceramic holder will
goes up together with the heavy metal. User should put one hand under it
immediately, otherwise, the ceramic holder will drop to the bottom and might
be broken.
9) Measure the thickness or flatness using dial gauge, shown in Fig. 7.
Put the sample on top of the granite master flat;
Press the ON/OFF button to turn on the dial gauge;
Push the hand vacuum pump to rise up the probe, and release it to let the
probe touch sample surface.
Click the reset button to reset the zero position (optional);
Push the hand vacuum pump and move the sample, then release it to do the
measurement.
Fig. 7
Reset button
Granite
master flat
Hand vacuum
pump
Probe
Digital display
ON/OFF

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B) Drive adapter and ceramic holder bonding
As shown in Fig. 8. The sample is bonded on the ceramic holder.
Put the ceramic holder and the drive adapter together as shown in step 2.
Use the adhesive tape to fix them together as shown in step 3.
4.7 Polish Cloth and Slurry Selection
Select proper polishing cloth and slurry (diamond suspension) size according to
your requirements.
The polishing pad is bonded on a Teflon coated metal plate. Put the polishing
pad and metal plate on top of the magnetic disc.
We will help user to develop your own process using NFF polishing pad at
Step1
Step2
Step3
Fig. 8

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the beginning.
You have to buy your own polishing pad from NFF for normal user.
You have to keep your own polishing pad by yourself.
DON’T use any polishing cloth, slurry or lubricant not from NFF
Different size of diamond suspension and
Lubricant
Different type of polishing cloth in cabinet
Fig. 9

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4.8 Polish Parameters Setting
Fig. 10 shows the control panel of EcoMetTM300 silicon polisher. The detailed
functions of the buttons are listed below.
Water (ON/OFF)
Fig. 10 Control panel of EcoMetTM300 silicon polisher
Fresh water
Recirculating
None
Increase
Decrease
Platen Only
Dispenser
(NA for us)
PAUSE/STOP
TIME
SPEED
FLUIDS
Head Rotation
Complementary
Contra
Force
N-Newtons
LBS-Pounds
Force mode
Central
Single

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Example of polishing procedure:
Polishing procedure:
If #300 grinding wheel is used for grinding, the polishing process should be started from
step 1.
If #800 grinding wheel is used for grinding, the polishing process should be started from
TIME
………
Displays the time set for a grinding polishing cycle
SPEED
………
Displays the selected rpms of the platen or power
head
Fluids
………
Selects between fresh water, recirculated water, and
OFF
Head rotation
………
Selects the rotational direction of the head and
specimen holder. (Complementary or Contra)
Force
………
Displays the amount of operational force applied to
the specimens in specimen holder.
Water
………
Activates the water flow for platen cooling and
rinsing
Force mode
………
Selects between Single or Central mode (Central for
large sample)
Increase
………
Increase the parameter value for time, speed, and
force.
Decrease
………
Decrease the parameter value for time, speed, and
force.
Platen only
………
Activates the platen for manual polishing
Dispense
………
Activates a connected dispenser (No use for us)
Pause/stop
………
Pauses or stops a cycle

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step 2.
Steps 5&6 are for final polish. The polishing time here is typical and can be adjusted
according to the result.
Steps
Slurry
Polishing cloth
Lubricant
Time
(min)
Ingredients/Size
Color
Name
Color
1
Diamond/15µm
Brown
TexMetTM P
Lt yellow
MetaDi Fluid
3
2
Diamond/6 µm
Yellow
Verdu Tex
Green
MetaDi Fluid
3
3
Diamond/3 µm
Green
Verdu Tex
Green
MetaDi Fluid
3
4
Diamond/1 µm
Blue
Micro Cloth
Gray
MetaDi Fluid
3
5
Silica /0.06 µm
Blue
Micro Cloth
Gray
Water
3
6
NO
NA
Micro Cloth
Gray
Water
3
Step 1 is for coarse polish, steps 2&3 are for intermediate polish and steps 4-6
are for fine polish.
Typical parameters:
TIME=3mins
SPEED=60rpm for both base and head
Fluid is set to fresh
Water is set to OFF
Head rotation is complementary
Force=10 LBS
Note: To use water, position the Water Dispensing Arm over the platen. Press the
“Water” button. The “Water” LED will light and water will be dispensed from
both the Water Dispensing Arm and the Platen Bowl Wash.
Turn the Water Control Knob counter-clockwise to increase the water flow
through the Water Dispensing Arm. This will decrease the flow of water through
the Platen Bowl Wash. Vice versa is true.

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4.9 During the Run
(1) Moving and positioning the power head
Remove the cover of the D-shape bowl.
Rotate the locking handle, as shown in Fig. 11, counter-clockwise to loosen
the power head.
Move the power head into the desired position.
Rotate the locking handle clockwise to tighten and secure the power head into
position.
(2) Loading sample
Position the power head for easy loading of the sample.
Locking
Handle
Fig. 11 Locking handle of the power head

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Raise the outer sleeve of the lift-lock of the power head, as shown in Fig.
12-step 1.
Insert the sample holder, and gently rotate it until it aligns to the lock, as
shown in Fig.12-step 2.
Release the outer sleeve of the lift-lock, the sample holder will be fixed to
power head, as shown in Fig. 12-step 3.
Check whether the sample holder is fastened or not by your hand.
Position the polishing head and it is ready to begin the polishing cycle.
Step1
Step2
Step3
Alignment lock
Fig. 12 Sample loading

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(3) Start the polishing process
Before the process, spray proper lubricant and diamond suspension to the
polishing pad and spread them by rotating the platen manually.
The green power head start buttons are located on each side of the power head,
as shown in Fig. 13.
Simultaneously press both buttons, the power head will move toward the
polishing pad and automatically stop when it touches the surface, then the
polishing cycle is activated.
The polishing cycle will stop when the setting time is up, and the polishing
head will move to the original position automatically.
Unload the sample and check the surface using microscope.
Unloaded polishing cloth should be wiped clean using clean room papers and
put it to the shelf and dry it.
All the polishing cloths should be put into the plastic bags and put back into
the cabinet according to their labels.
Green start button 1#
(not shown)
Green start button 2#
Fig. 13 Power head start buttons

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Repeat the above polishing steps using suitable polishing cloth, slurry and
lubricant until the surface roughness meets the requirement.
(4) Unloading and cleaning
When process is finished, raise the lift-lock chuck and release the sample
holder.
Cleaning the D-shape bowl using DI water and wipe dry using dust-free
paper.
Move the power head to side and cover the D-shape bowl.
Turn off the power buttons both in front panel and in backside.
Turn off the DI water and N2flow.
Pack the polishing clothes and put them back to cabinet.
Put the slurry and lubricant bottles back.
Turn off the dial gauge.
Turn off the hotplate.
4.10 Process Recording during the process
1. Please be reminded you are required to fill all the details of the log sheets
2. However, if you fail to do this, a punishment will be given
3. Write down any problems or comments in the log sheets
4.11 Clean up
1. Clean the work table and make sure everything is back to the original place.
2. Turn off the dial gauge.
3. Turn off the hot plate.
4. Tie the garbage bag and put it outside the door to prevent the small particles

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from coming into air.
4.12 Check out
Check out the equipment in the NFF equipment reservation website immediately after
use
4.13 Important Notice
DON’T spray any water on the polishing cloth except using silica 0.06µm
slurry.
DON’T spray too much diamond suspensions and lubricant.
DON’T mix the polishing cloth and the plastic bags.
DON’T use any polishing cloth and slurry not from NFF.
Increase the force gradually. DON’T increase a force with the step larger
than 20LBS.
If the sample is irregular shape, please polish the sharp corner using abrasive
paper before wafer bonding to prevent damage of the polishing cloth.