Charmhigh CHM-T36VA User manual

长沙常衡机电设备有限公司
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Charmhigh Automatic Chip Mounter
（CHM-T36VA CHM-T48VA CHM-T48VB）
User Manual
2016
Hunan Charmhigh mechanical and electrical co., LTD
Charmhigh-V1.0-2016
2016-09-20

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Catalogue
1.SACURITY MATTERS....................................................................................................................... 1
2.MAIN PARAMETERS.........................................................................................................................2
2.1.CHM-T36VA................................................................................................................................... 2
2.2.CHM-T48VA................................................................................................................................... 3
2.3.CHM-T48VB...................................................................................................................................3
3.MACHINE PROFILE.......................................................................................................................... 5
3.1.CHM-T36VA................................................................................................................................... 5
3.2.CHM-T48VA................................................................................................................................... 6
3.3.CHM-T48VB...................................................................................................................................7
4.INSTALLTION MACHINE....................................................................................................................... 9
5.START..................................................................................................................................................... 9
6.RUN....................................................................................................................................................... 10
6.1. EDIT WORK FILE...........................................................................................................................10
6.1.1.Component edit ................................................................................................................. 11
6.1.2.Material Stack edit ....................................................................................................... 15
6.1.3.Batch ................................................................................................................................... 18
6.1.4.IC Tray edit ..................................................................................................................... 20
6.1.5.PCB Calibration ............................................................................................................... 22
6.2.LOAD WORK FILE.............................................................................................................................24
7.TEST..................................................................................................................................................... 27
8.SET....................................................................................................................................................... 29
8.1.SYSTEM SET.................................................................................................................................... 30
8.2.VACUUM DETECTION SET................................................................................................................... 32
8.3.BACKUP/RESTORE..............................................................................................................................34
9.FILE..................................................................................................................................................... 36
9.1.GENERATE CSV FILE....................................................................................................................... 36
9.1.1.By Altium Designer ......................................................................... 错误！未定义书签。
9.1.2.By Protel ........................................................................................... 错误！未定义书签。
9.2.FILE CONVERT.................................................................................................................................38
9.2.1.Material Stack ................................................................................................................. 39
9.2.2.Components list ............................................................................................................... 40
9.2.3.Batch ................................................................................................................................... 41
10.LOG..................................................................................................................................................... 43
11.SYSTEM LOG....................................................................................................................................... 45

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12.QUICK START................................................................................................................................ 45
13.MAINTENANCE.............................................................................................................................. 50
14.WARRANTY.....................................................................................................................................51
15.CONTACT US..................................................................................................................................52

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1.SACURITY MATTERS
(1) Keep the machine away from humidity and dust, otherwise may cause the
machine work abnormal or damaged.
(2) Keep the machine away from flammable and explosive goods.
(3) Do not place the machine in the platform of instability or tilted, otherwise the
vibration of the machine when working may lead to lower precision, even personal
injury caused by overturned.
(4) Don't place the components to the area where the infants can contact.
(5) Don’t dismounting the machine, otherwise will lower the precision or damage the
machine.
(6) Ensure the power supply meet machine requirements.
(7) Ensure the power supply socket with good grounding.
(8) Don’t touch the parts when the machine is working, otherwise it will damage the
machine or injured.
(9) All the power line only can be used for the machine, otherwise it may cause fire
due to the low power.
(10) Please read the user manual carefully when using the machine, if you have any
question please contact us.

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2.MAIN PARAMETERS
2.1.CHM-T36VA
model
CHMT36VA
X,Y Z axis stroke
400mm(X)*460mm(Y)*15mm(Z)
PCB area
355*355mm
Component support
0402~5050, SOP, QFN and etc
Material support
8mm, 12mm, 16mm, 24mm
mount speed
do not use the visual: 4000 cph (max)
use visual: 2500 cph
Note: cph is chip per hour
SMT precision
±0.025mm
Nozzle
2
Material system
29pcs material stack
14pcs IC stack
Support custom IC tray
Visual system
Up camara automatic adjust(max 22mm*22mm)
Down camara PCB automatic MARK adjust
Controlling system
XY axis with motor for driving
Z axis with reset detection
All motors with S flexibility lower or faster speed
Pull needle auto reset
Vacuum detection
With 2 big no noise vacuum air pump, no need external air
pump
Air pressure: -92KPa
Leak detection
Vacuum detection, visual detection
Need external PC
YES
Compatible
operationg system
Windows XP, windows 7
Compatible software
Altium Designer
Power
AC 220V 50HZ/AC 110V 60HZ
Dimension
960mm(L)*705mm(W)*335mm(H)
Power
250W
Net weight
65Kg

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2.2.CHM-T48VA
model
CHMT48VA
X,Y Z axis stroke
400mm(X)*460mm(Y)*15mm(Z)
PCB area
355*355mm
Component support
0402~5050, SOP, QFN and etc
Material support
8mm, 12mm, 16mm, 24mm
mount speed
do not use the visual: 6000 cph (max)
use visual: 4000 cph
Note: cph is chip per hour
SMT precision
±0.025mm
Nozzle
2
Material system
29pcs material stack
14pcs IC stack
Support custom IC tray
Visual system
Up camara automatic adjust(max 22mm*22mm)
Down camara PCB automatic MARK adjust
Controlling system
XY axis with motor for driving
Z axis with reset detection
All motors with S flexibility lower or faster speed
Pull needle auto reset
Vacuum detection
With 2 big no noise vacuum air pump, no need external air
pump
Air pressure: -92KPa
Leak detection
Vacuum detection, visual detection
Controlling PC
With good quality industrial PC
7 inch LCD touch screen
Embedded Linux system
Compatible software
Altium Designer
Power
AC 220V 50HZ/AC 110V 60HZ
Dimension
960mm(L)*705mm(W)*335mm(H)
Power
250W
Net weight
65Kg

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2.3.CHM-T48VB
model
CHMT48VB
X,Y Z axis stroke
510mm(X)*460mm(Y)*15mm(Z)
PCB area
345*355mm
Component support
0402~5050, SOP, QFN and etc
Material support
8mm, 12mm, 16mm, 24mm
mount speed
do not use the visual: 6000 cph (max)
use visual: 4000 cph
Note: cph is chip per hour
SMT precision
±0.025mm
Nozzle
2
Material system
58pcs material stack
14pcs IC stack
Support custom IC tray
Visual system
Up camara automatic adjust(max 22mm*22mm)
Down camara PCB automatic MARK adjust
Controlling system
XY axis with motor for driving
Z axis with reset detection
All motors with S flexibility lower or faster speed
Pull needle auto reset
Vacuum detection
With 2 big no noise vacuum air pump, no need external air
pump
Air pressure: -92KPa
Leak detection
Vacuum detection, visual detection
Controlling PC
With good quality industrial PC
7 inch LCD touch screen
Embedded Linux system
Compatible software
Altium Designer
Power
AC 220V 50HZ/AC 110V 60HZ
Dimension
1320mm(L)*705mm(W)*335mm(H)
Power
250W
Net weight
89Kg

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3.MACHINE PROFILE
3.1.CHM-T36VA
Figure.3- 1
(1) PCB clamping area: fixing the PCB, let PCB close to left, top spring should be
compacted.
(2) Up camera: Used for calibrating the components position, angle, so as to
improve placement accuracy.
(3) IC material stack: used for place the big IC.
(4) Emergency stop switch: Emergency stop after press down, machine normal work
when clockwise rotation and bounce.
(5) IC tray area: Used for fixing IC tray.
(6) Nozzle & Pull needle: Nozzle used for absorbing materials and mount on PCB,
pull needle used for pull the material go ahead.
(7) Down camera: Used for observing and location, and PCB MARK auto adjust.
(8) Ordinary material stack : Place tape packaging materials.
(9) Belt receiving wheel : Used for collecting film.
(10)Tape placing area : Used for placing tape.

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3.2.CHM-T48VA
Figure.3- 2
(1) Up camera: Used for calibrating the components position, angle, so as to improve
placement accuracy.
(2) LCD touch screen: Used for operating the machine.
(3) IC material stack: used for place the big IC.
(4) USB port: Used for connect the USB storage device.
(5) Emergency stop switch: Emergency stop after press down, machine normal work
when clockwise rotation and bounce.
(6) Power button: Used for opening or off the machine.
(7) PCB clamping area: fixing the PCB, let PCB close to left, top spring should be
compacted.
(8) IC tray area: Used for fixing IC tray.
(9) Nozzle & Pull needle: Nozzle used for absorbing materials and mount on PCB,
pull needle used for pull the material go ahead.
(10)Down camera: Used for observing and location, and PCB MARK auto adjust.
(11)Ordinary material stack : Place tape packaging materials.
(12)Belt receiving wheel : Used for collecting film.

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(13)Tape placing area : Used for placing tape.
3.3.CHM-T48VB
Figure.3- 3
(1) Up camera: Used for calibrating the components position, angle, so as to improve
placement accuracy.
(2) IC material stack: used for place the big IC.
(3) LCD touch screen: Used for operating the machine.
(4) PCB clamping area: fixing the PCB, let PCB close to left, top spring should be
compacted.
(5) USB port: Used for connect the USB storage device.
(6) Emergency stop switch: Emergency stop after press down, machine normal work
when clockwise rotation and bounce.
(7) Power button: Used for opening or off the machine.
(8) Nozzle & Pull needle: Nozzle used for absorbing materials and mount on PCB,
pull needle used for pull the material go ahead.

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(9) Tape placing area A/B : Used for placing tape.
(10)Belt receiving wheel A/B : Used for collecting film.
(11)Ordinary material stack : Place tape packaging materials.
(12)IC tray area: Used for fixing IC tray.
(13)Down camera: Used for observing and location, and PCB MARK auto adjust.

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4.Installtion machine
For the CHMT36VA model, before using, need to be installed the USB to the serial port driver on
the user’s computer, connect the USB to the serial line and USB camera line, for details please
refer to our U disk video tutorial. For the 48 series of models, you can use power on and use it
directly.
5.START
Power on, For 48 series machine, machine self- check and operation system start, below
is home page. you can normal use it now.(Type 36 models need to manually open the PC
software on the computer side first, then the same with 48 series machine)
Figure.5- 1
(1) Alarm: check alarm content and the cause of alarm.
(2) Run: Used to manage and run the working file.
(3) Test: Used to test the machine’s function.
(4) Set: For setting the parameters of the machine.
(5) Log: Used to view statistics;
(6) System record: For checking all the records of the system.
(7) Files: Used to manage files and generating work.

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6.Run
The machine needs to select a work file to run, from the main page, click on the run
button to enter the page as below, through this page you can manage work file.
Figure.6- 1
(1) Work file list: The middle of the page displays a list of existing work files in the
system, click to select the work file, the upward double arrow on the right used for
paging up, upward single arrow used for selecting previous line, downward arrow
vice versa.
(2) New: Create a new work file;
(3) Delete: Delete the selected work file;
(4) Edit: Edit the selected work file;
(5) Load: Load the selected work file to run;
(6) Back: Click left arrow button on the upper right corner of the page to return to the
previous page, other pages similarly.
6.1. Edit Work File
The work file editing screen shown as below, can edit component, material stack,
batch, IC tray and PCB calibration respectively.

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Figure.6- 2
6.1.1.Component edit
The screen as shown above, used for managing components on PCB.
(1) Component list: Show all components contained in the selected work file.
(2) Add: Add a component on the end of the sheet.
(3) Insert: Insert a new component before current component.
(4) Delete: Delete the selected component.
(5) Edit: edit the selected component, see below for details.
(6) Save: after amend the component list you need to save, if not save in time, the
save button will twinkle ,then press the button and save ,the twinkle end.
6.1.1.1.Edit Component
The pop up screen as shown below, the top left of the screen displays the current
component’s line number (start from 0),the arrows on both sides, used for selecting a
component before or after, also can click the middle button pop up keyboard to input
device line number directly.

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Figure.6- 3
(1)Component ID: set the component ID, there should not be the same ID in one work file.
(2)Material stack: The appointed material stack for component, when appointed a new
stack, the work file will be added a new stack.
(3)Speed: Set the mounting speed, 0 is for machine’s system speed, for mounting IC, you
can lower down the speed a little, it will be more accuracy, if lower the speed to 50%, the
machine work speed can’t be lower than 30%.
(4)Height: it is used for component height setting. The value is small for height means the
nozzle is more go down. (Note: machine general height is 0.5mm, the general PCB
thickness is 1.6mm, you can adjust the height according to the thickness of your PCB)
(5)Angle: Setting for rotate angle of component, anticlockwise is plus, clockwise is minus.
(6)Identification: component identification, such as R1,R2,C1,U1 etc.
(7) Comments: component information, such as 0402, 0805 etc.
(8)Machine head: nozzle for this component.
(9)Coordinate X: usually work file generated from software no need to change the setting.
(10)Coordinate Y: usually work file generated from software no need to change the
setting.
(11)Skip component: selected means not place this component, after skip, it will be grey.
(12)Vacuum detect: selected means forbid throwing materials due to lack of vacuum. Note:
if no component, this function also valid, if not absorbing the material, it will absorb again,
if still get the material, it will absorb 2 times, if still get it, the machine will be alarm and
stopping, when mounting the cylindrical glass component, please open this function.

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(13)Enable vision: selected means open vision positioning, when mounting IC open this
function can increases its precision.
(14)Coordinate Set: used for component coordinate X and Y by nozzle or upside camera,
details please refer to below.
6.1.1.2.Coordinate Setting
Screen shown as below, please note when the machine need location it will be pop
up this page.
Figure.6- 4
(1) Coordinate: the window left upside display the coordinate after movement
comparing with previous coordinate.
(2) Machine head/Vision: exchange nozzle positioning and vision positioning, we
suggest use vision positioning, nozzle position not that accurate.
Left-up corner right-down corner

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Figure.6- 5
(3)Move: In the left side of the window four arrows control the mount head moving in four
directions respectively, movement speed can changed by H/L button, L indicate low speed,
H indicate high speed;
(4)Enlarge: zoom up the image;
(5)Find Target: Locating component position automatically, principle explains as follows,
the algorithm search from the image center to around, the first searched close graph is
deemed to the target which marked with red rectangle. Note, the border of the target must
be clear and closed, silk printing is found generally; capture target is just auxiliary function,
silk printing position not always be the right position of component since the deviation of
process technology, user should set coordinate according to the position of footprint;
(6)Auto. center: Move nozzle to the center of target if target was captured;
(7)MHead n(n is MHead number): When use nozzle to positioning, click this button then
specified nozzle press down, for the convenience of observation;
(8)Apply: Click to apply changes.

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6.1.2.Material Stack edit
Screen show as below, in this page can manage different kinds of component’s place
position.
Figure.6- 6
(1) M Stack list: display all the stacks.
(2) Add: add a new stack at the end of stack list, the ordinary material stack is from
1~29(36VA, 48VA)/58(48VB), The IC from 60~79 stack, IC tray from 80~99
stack(details see below)
(3) Insert: insert a new stack
(4) Delete: delete the selected stack, note: delete this stack, the components will be
delete as well.
(5) Edit: edit selected stack, image as below:

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Figure.6-7
a) Stack ID: Set current material stack ID, value can’t repeat, all of components’ ID
that use this material stack in the component list will be changed too.
b) Feed: The center distance between two successive components in the tape, unit
is millimeter.
c) Ec size X\Y: The size of components in this stack, unit is millimeter.
d) Height: Functionally just like corresponding item in component edit, all of relevant
component will be changed.
e) Speed: Functionally just like corresponding item in component edit, all of relevant
component will be changed.
f) Comments: Set material stack comments.
g) Skip comp.: Functionally just like corresponding item in component edit, all of
relevant component will be changed.
h) Vacuum detect: Functionally just like corresponding item in component edit, all of
relevant component will be changed.
i) Enable vision: Functionally just like corresponding item in component edit, all of
relevant component will be changed.
j) Coord. set: Functionally just like corresponding item in component edit, see
figure below, there will appear a pull needle button in the top right corner of the
window when set coordinate by nozzle, click it then machine will pull tape one
time, in order to make the component in a certain place, then calibrating the feed
place of material by camera or nozzle, see figure below, adjusting the tape let the

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red circle touches the blue line, the place of green rectangle is just the suggested
feed place.
Figure.6-8
Figure.6- 9