Chenbro RM23712 User manual

RM23712
Technical Product Specification
A document providing an overview of product features, functions, architecture,
and support specifications
Revision 1.0
Jan 2017
Chenbro RM Product Marketing

i
Revision History
Date
Revision Number
Modifications
2016/12/9
R0.9
Initial Release
2017/1/19
R1.0
Official version

RM23712 TPS
ii
Disclaimers
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by
this document.
Chenbro disclaimsall expressand implied warranties,including without limitation,the implied warranties
of merchantability,fitness for a particular purpose,and non-infringement, as well as any warranty arising
from course of performance,course of dealing,or usage in trade.
This document contains information on products, services and/or processes in development. All
information provided here is subject to change without notice. Contact your Chenbro representative to
obtain the latest TPS.
The products and services described may contain defects or errors known as errata which may
cause deviations from published specifications. Current characterized errata are available on
request.
Chenbro,and the Chenbro logo are trademarks of Chenbro MicornCo.,Ltd in the worldwide.
*Other names and brands may be claimed as theproperty of others
© 2017 Chenbro MicornCo.,Ltd.

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Table of Contents
1. Introduction............................................................................................................................................................1
1.1 Chapter Outline ..................................................................................................................................... 1
1.2 Server Board Use Disclaimer................................................................................................................. 1
1.3 Product Errata ........................................................................................................................................ 2
2. Product Overview ..................................................................................................................................................3
2.1 Operating System Support..................................................................................................................... 4
2.1.1 OS Validation Levels............................................................................................................................. 5
2.1.2 OS Technical Support Levels ................................................................................................................ 5
2.2 System Features Overview .................................................................................................................... 5
2.3 Server Board Features Overview........................................................................................................... 6
2.4 Back Panel Features............................................................................................................................... 9
2.5 Front Control Panel................................................................................................................................ 9
2.6 Front Drive Bay Options...................................................................................................................... 10
2.7 System Dimensions.............................................................................................................................. 10
2.7.1 Chassis Dimensions............................................................................................................................. 10
2.7.2 3.5’’ HDD Tray Dimensions .............................................................................................................. 11
2.7.3 Pull-out Tag Label Emboss Dimensions.......................................................................................... 12
2.8 Available Rack Mounting Kit Options............................................................................................ 13
2.9 System Level Environmental Limits ............................................................................................... 13
2.10 System Packaging............................................................................................................................... 14
2.10.1 RM23712 Weight Information......................................................................................................... 14
3. System Power........................................................................................................................................................15
3.1 General Description And Scope........................................................................................................... 15
3.1.1 Power Supply Module Mechanical Overview..................................................................................... 15
3.1.2 LED Marking and Identification.......................................................................................................... 16
3.1.3 Power Supply Card Edge Pin-Out ....................................................................................................... 17
3.1.4 Environmental Requirements............................................................................................................... 17
3.1.4.1 Temperature and Humidity Requirements.................................................................................17

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3.1.4.2 Altitude Requirements........................................................................................................18
3.2 Electrical Performance.........................................................................................................................18
3.2.1 AC power Input Specification..............................................................................................................18
3.2.1.1 AC Inlet connector..............................................................................................................18
3.2.1.2 Input voltage and frequency specification..........................................................................18
3.2.1.3 HVDC Input voltage...........................................................................................................18
3.2.1.4 Input current........................................................................................................................19
3.2.1.5 AC Line Fuse......................................................................................................................19
3.2.1.6 AC line inrush.....................................................................................................................19
3.2.1.7 Input Power Factor Correction ...........................................................................................19
3.2.1.8 AC line dropout ..................................................................................................................19
3.2.1.9 Efficiency............................................................................................................................20
3.2.1.10 Suspeceptibility Requirements ...........................................................................................20
3.2.1.10.1 Electrical Discharge Susceptibility................................................................................20
3.2.1.10.2 Fast Transient/Burst.......................................................................................................20
3.2.1.10.3 Radiated Immunity........................................................................................................20
3.2.1.10.4 Surge Immunity.............................................................................................................21
3.2.1.10.5 AC Line Transient Specification...................................................................................21
3.2.1.10.6 AC line fast transient (EFT) specification.....................................................................21
3.2.1.11 Power Recovery..................................................................................................................22
3.2.1.12 Voltage Brown Out.............................................................................................................22
3.2.1.13 AC Line Leakage Current...................................................................................................22
3.2.2 DC output voltages...............................................................................................................................22
3.2.2.1 Grounding...........................................................................................................................22
3.2.2.2 Output rating.......................................................................................................................22
3.2.2.3 Auxiliary Output (Standby)................................................................................................22
3.2.2.4 No load operation ...............................................................................................................22
3.2.2.5 Voltage Regulation.............................................................................................................23
3.2.2.6 Ripple and Noise Regulation..............................................................................................23
3.2.2.7 Dynamic loading.................................................................................................................23
3.2.2.8 Capacitive load ...................................................................................................................23
3.2.2.9 Close loop stability.............................................................................................................24
3.2.2.10 Residual Voltage Immunity in Standby mode....................................................................24
3.2.2.11 Soft starting.........................................................................................................................24
3.2.2.12 Hot Swap Requirements .....................................................................................................24
3.2.2.13 Load sharing control...........................................................................................................24
3.2.3 Timing Requirements...........................................................................................................................25

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3.2.3.1 Output Voltage Timing....................................................................................................... 25
3.2.3.2 Overshoot ........................................................................................................................... 26
3.2.3.3 Undershoot ......................................................................................................................... 26
3.2.3.4 Temperature coefficient...................................................................................................... 26
3.2.4 Control and Indicator functions...........................................................................................................26
3.2.4.1 PSON# Input Signal (Power supply enable) ...................................................................... 26
3.2.4.2 Power OK (PG or PWOK) Output Signal.......................................................................... 27
3.2.4.3 SMBAlert# (PSAlert) Output Signal Pin............................................................................ 27
3.2.4.4 A0....................................................................................................................................... 28
3.2.4.5 A1....................................................................................................................................... 28
3.2.4.6 12VRS and Return Sense ................................................................................................... 28
3.2.4.7 Present ................................................................................................................................ 28
3.2.4.8 SDA and SCL..................................................................................................................... 28
3.3 Protection circuits ................................................................................................................................ 29
3.3.1 Over Voltage Protection (OVPmain & OVPauxilary )........................................................................ 29
3.3.2 Over Current and Short Circuit Protection (OCP/SCPmain & OCP/SCPauxilary )............................ 29
3.3.3 Over Temperature Protection (OTP).................................................................................................... 29
3.3.4 Fan Failure Protection.......................................................................................................................... 30
3.4 Power Supply Management................................................................................................................. 30
3.4.1 Hardware Layer ...................................................................................................................................30
3.4.2 Power Supply Management Controller (PSMC) ................................................................................. 31
3.4.2.1 Related Documents............................................................................................................. 31
3.4.2.2 Data Speed.......................................................................................................................... 31
3.4.2.3 Bus Errors........................................................................................................................... 31
3.4.2.4 Write byte/word.................................................................................................................. 32
3.4.2.5 Read byte/word................................................................................................................... 32
3.4.2.6 Block write/read ................................................................................................................. 33
3.4.2.7 Sensor Accuracy................................................................................................................. 33
3.4.2.8 PSMC Sensors.................................................................................................................... 34
3.4.3 Power Supply Field Replacement Unit (FRU) .................................................................................... 34
3.5 Smart On Function...............................................................................................................................40
3.5.1 PMBus command for Smart On........................................................................................................... 40
3.5.1.1 Hardware Connection......................................................................................................... 40
3.5.1.2 Configuring Smart On with SMART_ON_CONFIG (D0h).............................................. 40
3.5.2 Smart Standby Power Supply Operating State ....................................................................................40

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3.5.2.1 Powering on Smart Standby supplies to maintain best efficiency......................................41
3.5.2.2 Powering on Smart Standby supplies during a fault or over current condition..................41
3.5.3 The Way to Enable Smart On Function...............................................................................................41
3.6 ENVIRONMENTAL...........................................................................................................................41
3.6.1 Temperature .........................................................................................................................................42
3.6.2 Humidity ..............................................................................................................................................42
3.6.3 Altitude.................................................................................................................................................42
3.6.4 Vibration ..............................................................................................................................................42
3.6.5 Mechanical Shock................................................................................................................................42
3.6.6 Thermal shock (Shipping)....................................................................................................................42
3.6.7 Catastrophic Failure.............................................................................................................................42
3.6.8 EMI ......................................................................................................................................................42
3.6.9 Magnetic Leakage Fields .....................................................................................................................43
3.6.10 Voltage Fluctuations and Flicker.........................................................................................................43
3.7 Reliability / Warranty / Service............................................................................................................43
3.7.1 Mean Time between Failures (MTBF).................................................................................................43
3.7.2 Warranty...............................................................................................................................................43
3.7.3 Serviceability........................................................................................................................................43
4. Thermal Management..........................................................................................................................................44
4.1 Thermal Operation and Configuration Requirements..........................................................................45
4.2 Thermal Management Overview..........................................................................................................46
4.2.1 Fan Speed Control................................................................................................................................47
4.2.2 Programmable Fan PWM Offset..........................................................................................................47
4.2.3 Hot-Swap Fans.....................................................................................................................................47
4.2.4 Fan Redundancy Detection ..................................................................................................................48
4.2.5 Fan Domains........................................................................................................................................48
4.2.6 Nominal Fan Speed..............................................................................................................................48
4.2.7 Thermal and Acoustic Management ....................................................................................................48
4.2.8 Thermal Sensor Input to Fan Speed Control........................................................................................49

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4.3 System Fans......................................................................................................................................... 50
4.4 Power Supply Module Fans................................................................................................................. 51
5. System Storage and Peripheral Drive Bay Overview.......................................................................................52
5.1 Front Mount Drive Support ................................................................................................................. 52
5.2 System Fan RVI and Hard Disk Drive Storage Performance.............................................................. 52
5.3 External Hot Swap Drive Carriers....................................................................................................... 52
5.4 Peripheral Power Sources.................................................................................................................... 54
5.5 Storage Backplane Optional ................................................................................................................ 55
5.5.1 SGPIO Functionality............................................................................................................................ 56
5.5.2 I2C Functionality................................................................................................................................. 56
5.5.3 12 x 3.5”Drive Hot-Swap Backplane Overview................................................................................. 56
5.5.3.1 12G Mini SAS HD 12 Port Backplane............................................................................... 56
5.5.3.1.1 SW Function........................................................................................................................................ 61
5.6 2 x 2.5’’ Hot Swap Drive Bay Accessory Kit...................................................................................... 62
5.7 Low Profile eUSB SSD Support.......................................................................................................... 65
5.8 SATA DOM Support........................................................................................................................... 65
6. Front Control Panel and I/O Panel Overview...................................................................................................68
6.1 I/O Panel Features................................................................................................................................ 68
6.2 Control Panel Features......................................................................................................................... 68
6.2.1 LED Board with Cable and Connectors............................................................................................... 69
7. PCIe* Riser Card Support..................................................................................................................................71
7.1 Riser Card Assembly ...........................................................................................................................71
7.2 Riser Card Option................................................................................................................................ 72
7.2.1 2-Slot PCIe Riser Card –Chenbro Product Code: 80H09323702A1 .................................................. 72
7.2.2 3-Slot PCIe Riser Card –Chenbro Product Code: 80H09323701A0 .................................................. 72
8. Intel® I/O Module Support.................................................................................................................................74
9. Basic and Advanced Server Management Features .........................................................................................75
9.1.1 Dedicated Management Port................................................................................................................ 76
9.1.2 Embedded Web Server ........................................................................................................................ 76

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9.1.3 Advanced Management Feature Support (RMM4 Lite) ......................................................................77
9.1.3.1 Keyboard, Video, Mouse (KVM) Redirection ...................................................................78
9.1.3.2 Remote Console..................................................................................................................79
9.1.3.3 Performance........................................................................................................................79
9.1.3.4 Security...............................................................................................................................79
9.1.3.5 Availability.........................................................................................................................79
9.1.3.6 Usage ..................................................................................................................................79
9.1.3.7 Force-enter BIOS Setup......................................................................................................80
9.1.3.8 Media Redirection ..............................................................................................................80
Appendix A: Integration and Usage Tips...................................................................................................................82
Appendix B: POST Code Diagnostic LED Decoder..................................................................................................83
Appendix C: POST Code Errors................................................................................................................................88
Appendix D: System Cable Routing Diagram...........................................................................................................95

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List of Figures
Figure 1.System Components Overview........................................................................................................ 6
Figure 2.Top Cover Features.......................................................................................................................... 6
Figure 3.Server Board S2600WT Features...................................................................................................7
Figure 4.On-board Diagnostic LEDs............................................................................................................. 8
Figure 5.DIMM Fault LEDs........................................................................................................................... 8
Figure 6.System Reset and Configuration Jumpers..................................................................................... 9
Figure 7. Back Panel Feature Identification.................................................................................................9
Figure 8. Front Control Panel Options........................................................................................................ 10
Figure 9.3.5’’ Drive Bay-12 Drive Configuration....................................................................................... 10
Figure 10. Chassis Dimensions..................................................................................................................... 11
Figure 11. 3.5’’ HDD Tray Dimensions.......................................................................................................12
Figure 12. Pull-out Tag Label Emboss Dimensions.................................................................................... 12
Figure 13. 800W AC Fixed Power Supply................................................................................................... 15
Figure 14. FSP800W-20ERM Power Supply Mechanical drawings.........................................................16
Figure 15. FSP800W-20ERM Card Edge Diminsion.................................................................................16
Figure 16.Turn On/Off Timing (Power Supply Signals)............................................................................ 26
Figure 17.Write byte protocol with PEC..................................................................................................... 32
Figure 18.Write Word protocol with PEC.................................................................................................. 32
Figure 19.Read byte protocol with PEC......................................................................................................32
Figure 20.Read Word protocol with PEC ...................................................................................................32
Figure 21.Block Write with PEC..................................................................................................................33
Figure 22.Block Read with PEC................................................................................................................... 33
Figure 23.System Air Flow and Fan Identification .................................................................................... 44
Figure 24.Fan Control Model.......................................................................................................................50
Figure 25.System Fan Connector Locations ............................................................................................... 50
Figure 26.System Fan Assembly................................................................................................................... 51
Figure 27. 12x3.5’’ Drive Bay Configuration..............................................................................................52
Figure 28. Hot Swap Storage Device Carrier Removal..............................................................................53
Figure 29. 2.5’’ SSD mounted to 3.5’’ Drive Tray...................................................................................... 53
Figure 30.3.5''HDD Installation...................................................................................................................53
Figure 31.3.5''HDD Removal........................................................................................................................ 54
Figure 32. Drive Tray LED Identification................................................................................................... 54
Figure 33.Server Board Peripheral Power Connectors .............................................................................55
Figure 34. Backplane Installation................................................................................................................ 56
Figure 35. 12G Mini SAS HD 12 Port Backplane–front view .................................................................. 57
Figure 36. 12G Mini SAS HD 12 Port Backplane –rear view...................................................................58
Figure 37.SW Function.................................................................................................................................61
Figure 38.2 x 2.5'' Rear Mount Backplane Kit Placement ........................................................................ 62
Figure 39.2 x 2.5'' Hot Swap Backplane...................................................................................................... 63

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Figure 40.Low Profile eUSB SSD.................................................................................................................65
Figure 41. Apacer* and Innodisk* Dimension............................................................................................66
Figure 42.SATA DOM Placement................................................................................................................66
Figure 43. Front I/O Panel Features............................................................................................................68
Figure 44. Front Panel Control and Buttons...............................................................................................68
Figure 45.LED BoardwithCableandConnectors...........................................................................................69
Figure 46.LED Connectors Pin-out..............................................................................................................70
Figure 47. Riser Card Bracket 1...................................................................................................................71
Figure 48. Riser Card Bracket 2...................................................................................................................71
Figure 49. Riser Card Assembly...................................................................................................................72
Figure 50. 2-Slot PCIe Riser Card ...............................................................................................................72
Figure 51. 2-Slot PCIe Riser Card ...............................................................................................................73
Figure 52. Intel ® I/O Module Placement....................................................................................................74
Figure 53. Intel® RMM4 Lite Activation Key Installation........................................................................76
Figure 54. POST Diagnostic LED Location ................................................................................................83

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List of Tables
Table 1.Reference Documents........................................................................................................................ 1
Table 2. Chenbro RM23712 Feature Set.......................................................................................................3
Table 3. Operating System Support List....................................................................................................... 4
Table 4. Operating System Validation Levels............................................................................................... 4
Table 5. System Environmental Limits Summary......................................................................................13
Table 6. RM23712 Weight Information ...................................................................................................... 14
Table 7.LED Status Information.................................................................................................................. 16
Table 8.LED Status Information.................................................................................................................. 17
Table 9.Temperature Requirements............................................................................................................ 17
Table 10.Altitude Requirements ..................................................................................................................18
Table 11.Rated output power for each input voltage range ......................................................................18
Table 12.HVDC input voltage range............................................................................................................18
Table 13.Maximum input current................................................................................................................ 19
Table 14.Power Factor correction................................................................................................................ 19
Table 15.H0ld-up time until Power output goes out of regulations..........................................................20
Table 16.Module efficiency requirements................................................................................................... 20
Table 17.Performance criteria...................................................................................................................... 20
Table 18.AC Line SAG transient performance ..........................................................................................21
Table 19.AC Line SURGE transient performance.....................................................................................21
Table 20.Output Power and Current Ratings............................................................................................. 22
Table 21.Output Voltage regulation ............................................................................................................ 23
Table 22.Ripple and Noise Regulation......................................................................................................... 23
Table 23.Transient Load Requirements......................................................................................................23
Table 24.Capacitive Loading Conditions .................................................................................................... 24
Table 25.Load share bus output characteristics.........................................................................................25
Table 26.Turn on/off timing .........................................................................................................................25
Table 27.PS ON#signal characteristics........................................................................................................26
Table 28.PWOK signal characteristics........................................................................................................27
Table 29.PWOK signal characteristics........................................................................................................28
Table 30.Over Voltage Protection requirements........................................................................................ 29
Table 31.Over Current/Short Circuit Protection.......................................................................................29
Table 32.Over Temperature Protection ......................................................................................................30
Table 33.Fan Failure Protection................................................................................................................... 30
Table 34.Fan Failure Protection................................................................................................................... 31
Table 35.Sensor Accuracy............................................................................................................................. 33
Table 36.PSMC Sensor list ........................................................................................................................... 34
Table 37.Sensor Accuracy............................................................................................................................. 34
Table 38.FRU Data Format.......................................................................................................................... 35
Table 39.SMART_ON_CONFIG................................................................................................................. 40

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Table 40. System Volumetric Air Flow........................................................................................................44
Table 41. System Fan Connector Pin-out....................................................................................................50
Table 42 Drive Power LED/Activity LED States........................................................................................54
Table 43.12G Mini SAS HD 12 Port Backplane..........................................................................................56
Table 44.Connector Pin-out –Mini SAS HD Backplane............................................................................58
Table 45.SW Function Setting......................................................................................................................62
Table 46.12G SAS 2 Port Backplane............................................................................................................62
Table 47.2 x 2.5'' Rear Backplane Connectors............................................................................................63
Table 48.SATA Connector Pin-out ..............................................................................................................66
Table 49. Front Control Panel Buttons And Indicators.............................................................................69
Table 50.LED Board Specification...............................................................................................................69
Table 51. Supported Intel® I/O Modules....................................................................................................74
Table 52. Intel®Remote Management Module 4 (RMM4) Options..........................................................75
Table 53. Basic and Advanced Server Management Features Overview.................................................75
Table 55.POST Progress Code LED Example............................................................................................83
Table 56.MRC Progress Codes.....................................................................................................................84
Table 57.MRC Fatal Error Codes................................................................................................................85
Table 58.Diagnostic LED POST Code Decoder..........................................................................................86
Table 59.POST Error Messages and Handling...........................................................................................89
Table 60.POST Error Beep Codes ...............................................................................................................93
Table 61.Integrated BMC Beep Codes ........................................................................................................94

1
1. Introduction
This document describes the embedded functionality and available features of the integrated
server system which includes: the chassis layout, system boards, power subsystem, cooling
subsystem, storage subsystem options, and available installable options. Note that some system
features are provided as configurable options and may not be included standard in every system
configuration offered.
Server board specific detail can be obtained by referencing the Intel®Server Board S2600WT
Technical Product Specification.
NOTE: Some of the documents listed in the following table are classified as “Chenbro
Confidential”. These documents are made available under a Non-Disclosure Agreement (NDA)
with Chenbro and must be ordered through your local Chenbro representative.
Table 1.Reference Documents
Document Title
Document
Classification
RM23712 Datasheet
Chenbro Confidential
RM23712 Sales kit
Chenbro Confidential
RM23712 System Test Report
Chenbro Confidential
Intel® Server Board S2600WT Family Technical Product
Specification 1.0
Intel Confidential
1.1 Chapter Outline
This document is divided into the following chapters:
Chapter 1 –Introduction
Chapter 2 –Product Overview
Chapter 3 –System Power
Chapter 4 –Thermal Management
Chapter 5 –System Storage and Peripherals Drive Bay Overview
Chapter 6 –Front Control Panel and I/O Panel Overview
Chapter 7 –PCIe* Riser Card Support
Chapter 8 –Intel® I/O Module Support
Chapter 9 –Basic and Advanced Server Management Features
Appendix A –Integration and Usage Tips
Appendix B –POST Code Diagnostic LED Decoder
Appendix C –POST Code Errors
Appendix D –System Cable Routing Diagram
1.2 Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density
VLSI and power delivery components that need adequate airflow to cool. Chenbro ensures through
its own chassis development and testing that when Intel® server building blocks are used together,
the fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Chenbro-developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount of

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airflow required for their specific application and environmental conditions. Chenbro Corporation
cannot be held responsible if components fail or the server board does not operate correctly when
used outside any of their published operating or non-operating limits.
1.3 Product Errata
Shipping product may have features or functionality that may deviate from published specifications.
These deviations are generally discovered after the product has gone into formal production.
Chenbro terms these deviations as product Errata. Known product Errata will be embedded in the
TPS for the given product which can be downloaded from the following Chenbro web site:
http://www.chenbro.com

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2. Product Overview
This chapter provides a high-level overview of the system features and available options as
supported in different system models within this product. Greater detail for each major
sub-system, feature, or option is provided in the following chapters.
Table 2. Chenbro RM23712 Feature Set
Feature
Description
Chassis Type
2U Rack Mount Chassis
Server Board
•Intel®Server Board S2600WT w/Dual 1GbE ports –(Intel product code - S2600WT2)
Processor Support
•Two LGA2011-3 (Socket R3) processor sockets
•Support for one or two Intel®Xeon®processors E5-2600 v3 product family
•Maximum supported Thermal Design Power (TDP) of up to 145 W.
24 DIMM slots –3 DIMMs/Channel –4 memory channels per processor
Memory
•Registered DDR4 (RDIMM), Load Reduced DDR4 (LRDIMM)
•Memory data transfer rates:
o DDR4 RDIMM: 1600 MT/s (3DPC), 1866 MT/s (2DPC) and 2133 MT/s (1DPC)
o DDR4 LRDIMM: 1600 MT/s (3DPC), 2133 MT/s (2DPC& 1DPC)
•DDR4 standard I/O voltage of 1.2V
Chipset
Intel®C612 chipset
External I/O
connections
•DB-15 Video connectors
o Back on storage systems
•RJ-45 Serial Port A connector
•Dual RJ-45 Network Interface connectors supporting either :
o 1 GbERJ-45 connectors
•Dedicated RJ-45 server management port
•Three USB 2.0 / 3.0 connectors on back panel
•Two USB 2.0 / 3.0 ports on front panel (non-storage models only)
•One USB 2.0 port on rack handle (storage models only)
Internal I/O
connectors/
Headers
•One Type-A USB 2.0 connector
•One 2x5 pin connector providing front panel support for two USB 2.0 ports
•One 2x10 pin connector providing front panel support for two USB 2.0 / 3.0 ports
•One 2x15 pin SSI-EEB compliant front panel header
•One 2x7pin Front Panel Video connector
•One 1x7pin header for optional Intel®Local Control Panel (LCP) support
•One DH-10 Serial Port B connector
Intel®I/O Module
Accessory
Options
The server board includes a proprietary on-board connector allowing for the installation of
a variety of available I/O modules. An installed I/O module can be supported in addition to
standard on-board features and add-in PCIe cards.
•AXX4P1GBPWLIOM –Quad port RJ45 1 GbEbased on Intel®Ethernet Controller I350
•AXX10GBTWLIOM3 –Dual port RJ-45 10GBase-T based on Intel® Ethernet Controller x540
•AXX10GBNIAIOM –Dual port SFP+ 10 GbEmodule based on Intel®82599 10 GbEcontroller
•AXX1FDRIBIOM –Single port QSFP FDR56 GT/S speed InfiniBand* module
•AXX2FDRIBIOM –Dual port QSFP FDR56 GT/S speed infiniband* module
•AXX1P40FRTIOM –Single port QSFP+ 40 GbEmodule
•AXX2P40FRTIOM –Dual port QSFP+ 40 GbEmodule
System Fans
•Six managed hot swap system fans
•One power supply fan for each installed power supply module

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Riser Card
Support
Concurrent support for up to three riser cards.
•Riser #1 –PCIe* Gen3 x24 –up to 3 PCIe slots
•Riser #2 –PCIe* Gen3 x24 –up to 3 PCIe slots
•Riser #3 –PCIe* Gen3 x8 + DMI x4 (operating in PCIe mode) –up to 2 PCIe slots (Optional)
With three riser cards installed, up to 8 possible add-in cards can be supported:
•4 Full Height / Full Length + 2 Full Height / Half Length add-in cards via Risers #1 and #2
•2 low profile add-in cards via Riser #3 (option)
See Chapter 7 for available riser card options
Video
•Integrated 2D Video Controller
•16 MB DDR3 Memory
Security
•Intel® Trusted Platform Module (TPM) - AXXTPME5 (Accessory Option)
Server
Management
•Integrated Baseboard Management Controller, IPMI 2.0 compliant
•Support for Intel®Server Management Software
•On-board RJ45 management port
•Advanced Server Management via an Intel®Remote Management Module 4
Lite (Accessory Option)
Power Supply
Options
•FSP800W
Storage
Options
Hot Swap Backplane Options:
Note: All available backplane options have support for SAS 3.0 (12 Gb/sec)
•12 x 3.5” SAS/SATA
SAS /SATA Backplane Options
•Internal mount for 2.5” drive configurations
Storage Bay Options:
•12 x 3.5” SAS/SATA Hot Swap Drive Bay
Supported Rack
Mount Kit
Accessory
Option
• 84H314610-003 –Tool-less rack mount rail kit –560mm max travel length
2.1 Operating System Support
As of this writing, the Chenbro RM23712 provides support for the following operating systems.
This list will be updated as new operating systems are validated by Chenbro.
Table 3. Operating System Support List
Operating System
Operating System
Validation Level(P)
Windows Server 2012* R2 with Hyper-Vx64
& EFI
P1
Red Hat Enterprise Linux* 7.0
with KVM x64 & UEFI
P1
SuSELinux Enterprise Server* 12 with XEN x64
P1
Red Hat Enterprise Linux 6U5 with KVM x64 &
UEFI
P2
VMWare ESXi* 5.5 U3
P2
SuSELinux Enterprise Server 11 SP4 with
XEN x64
P2
Windows Server 2008 R2 SP1
P2
Windows 7*
P2
Ubuntu* 14.04
P2
FreeBSD* 10.1
P3
CentOS* 7.0
P3
Table 4. Operating System Validation Levels
Operating System Validation Levels
P1
P2
P3

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Basic Installation testing
Yes
Yes
Yes
Test all on-board I/O features in all modes
Yes
Adapter\Peripheral
Compatibility & Stress testing
Yes
Technical Support Level
T1
T2
T3
See the following sections for additional information regarding validation levels and technical
support levels as referenced in Table 4.
2.1.1 OS Validation Levels
Basic installation testing is performed with each supported operating system. The testing
validates that the system can install the operating system and that the base hardware feature set is
functional. A small set of peripherals is used for installation purposes only. Add-in adapter cards are
not tested.
Adapter compatibility validation (CV) testing uses test suites to gain an accurate view of how the
server performs with a wide variety of adapters under the primary supported operating systems.
These tests are designed to show hardware compatibility between the cards and the server platform
and include functional testing only. No heavy stressing of the systems or the cards is performed for
CV testing.
Stress Testing uses configurations that include add-in adapters in all available slots for a 48-hour
(two-day), or a 72-hour (three-day) test run without injecting errors. Each configuration passes an
installation test and a Network/Disk Stress test. Any fatal errors that occur require a complete test
restart.
2.1.2 OS Technical Support Levels
T1: Chenbro will provide support for issues involving the installation and/or functionality of a
specified operating system as configured with or without supported adapters and/or peripherals.
T2: Chenbro will provide and test operating system drivers for each of the server board’s integrated
controllers, provided that the controller vendor has a driver available upon request. Vendors will not
be required by Chenbro to develop drivers for operating systems that they do not already support.
Chenbro will NOT provide support for issues related to the use of any add-in adapters or peripherals
installed in the server system when an operating system that received only basic installation testing
is in use.
T3: Chenbro will not provide technical support for an open source operating system. All questions
and issues related to an open source operating system must be submitted to and supported by the
open source community supporting the given operating system.
2.2 System Features Overview

RM23712 TPS
6
Figure 1.System Components Overview
Figure 2.Top Cover Features
2.3 Server Board Features Overview
The following illustration provides a general overview of the server board, identifying key feature
and component locations. Please refer to Intel®Server Board S2600WT Technical Product
Specification for more information.
Front HS HDDs Front I/O PanelFront Control Panel Info.Tag
Cooling fans Rear HS HDDsPSU
Riser bracket
MB
HDD BP
Tool-less Top Cover Removal Latch