CREE-LED XLamp XQ Series User manual

SOLDERING & HANDLING
Cree LED / 4001 E. Hwy. 54, Suite 2000 / Durham, NC 27709 USA / +1.919.313.5330 / www.cree-led.com
© 2013-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp®and the Cree LED logo
are registered trademarks of Cree LED. Other trademarks, product and company names are the property of their respective owners and do not imply
specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a
warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP115
REV 7 1
INTRODUCTION
This application note applies to XLamp®XQ Family LEDs, which
have order codes in the following format.
XQxxxx-xx-xxxx-xxxxxxxxx
This application note explains how XLamp XQ Family LEDs and
assemblies containing these LEDs should be handled during
manufacturing. Please read the entire document to understand
how to properly handle XLamp XQ Family LEDs.
TABLE OF CONTENTS
Handling XLamp®XQ Family LEDs ..................................................2
Circuit Board Preparation & Layouts................................................4
Case Temperature (Ts) Measurement Point....................................4
Notes on Soldering XLamp®XQ Family LEDs .................................5
Moisture Sensitivity ..........................................................................6
ESD.....................................................................................................6
XLamp® XQ Family LED Reow Soldering Characteristics.............7
Chemicals & Conformal Coatings....................................................8
Assembly Storage & Handling..........................................................9
Tape and Reel................................................................................. 10
Packaging & Labels ....................................................................... 13
XLamp®XQ Family LEDs

XLAMP®XQ FAMILY LED SOLDERING & HANDLING
© 2013-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp®and the Cree LED logo
are registered trademarks of Cree LED. Other trademarks, product and company names are the property of their respective owners and do not imply
specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a
warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP115
REV 7 2
HANDLING XLAMP®XQ FAMILY LEDS
Manual Handling
Use tweezers to grab XLamp XQ Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with ngers. Do
not push on the lens.
Do not apply more than 600g of shear force onto the lens. Excessive force on the lens could damage the LED.
Cree LED recommends the following at all times when handling XLamp XQ Family LEDs or assemblies containing these LEDs:
• Avoid putting excessive mechanical stress on the LED lens.
• Never touch the optical surface with ngers or sharp objects. The LED lens surface could be soiled or damaged, which would affect
the optical performance of the LED.
• Cree LED recommends always handling XQ family LEDs with appropriate ESD grounding.
• Cree LED recommends handling XQ family LEDs wearing clean, lint-free gloves.
Whenever possible, Cree LED recommends the use of a pick & place tool to remove XLamp XQ Family LEDs from the factory tape & reel
packaging.
P
CORRECT
X
WRONG

XLAMP®XQ FAMILY LED SOLDERING & HANDLING
© 2013-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp®and the Cree LED logo
are registered trademarks of Cree LED. Other trademarks, product and company names are the property of their respective owners and do not imply
specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a
warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP115
REV 7 3
Pick & Place Nozzle
For pick and place nozzles coming into contact with silicone-covered LED components, Cree LED recommends nozzles be constructed
of non-metallic materials. Cree LED and several of Cree LED’s customers have had good success using nozzles fabricated from 95a
urethane. The following pick & place tools are specic to the XQ Family LEDs.
All dimensions in mm.
Measurement tolerances: .xxx = .001mm
2.700
.200
Ø .800
Ø 1.000
1.016
Ø0.0400
0.787
Ø0.0310
30°
J. Lancaster
A
B
C
D
CAD GENERATED DRAWING,
DO NOT MANUALLY UPDATE
SCALE
SIZE
CAD FILE:
DWG. NO.
A
SHEET
OF
REV.
DATE
APPROVALS
DRAWN
CHECKED
RESP ENG
MFG ENG
QUAL ENG
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
TOLERANCES ARE:
DECIMALS ANGLES
XX = .002
XXX = .001
MATERIAL
FINISH
32
DO NOT SCALE DRAWING
ITEM
NO.
PART OR
IDENTIFYING NO.
NOMENCLATURE
OR DESCRIPTION
MATERIAL
SPECIFICATION
QTY
REQD
PARTS LIST
1
2
3
4 5 6
7
8
THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF
COUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUT
THE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED.
A
B
C
D
1 2
3
4
5
6
7
8
XXXX = .0002
1/2
REVISIONS
Rev. DESCRIPTION DATE
APPROVED
A
PRINT RELEASE
JDL
11/6/2014
2013-1565 Cree XQ LED tip
11/6/2014
Thursday, November 06, 2014 2:52:10 PM
1.016
Ø0.0400
0.787
Ø0.0310
30°
J. Lancaster
A
B
C
D
CAD GENERATED DRAWING,
DO NOT MANUALLY UPDATE
SCALE
SIZE
CAD FILE:
DWG. NO.
A
SHEET
OF
REV.
DATE
APPROVALS
DRAWN
CHECKED
RESP ENG
MFG ENG
QUAL ENG
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
TOLERANCES ARE:
DECIMALS ANGLES
XX = .002
XXX = .001
MATERIAL
FINISH
32
DO NOT SCALE DRAWING
ITEM
NO.
PART OR
IDENTIFYING NO.
NOMENCLATURE
OR DESCRIPTION
MATERIAL
SPECIFICATION
QTY
REQD
PARTS LIST
1
2
3
4 5 6
7
8
THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF
COUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUT
THE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED.
A
B
C
D
1 2
3
4
5
6
7
8
XXXX = .0002
1/2
REVISIONS
Rev. DESCRIPTION DATE
APPROVED
A
PRINT RELEASE
JDL
11/6/2014
2013-1565 Cree XQ LED tip
11/6/2014
Thursday, November 06, 2014 2:52:10 PM
1.016
Ø0.0400
0.787
Ø0.0310
30°
J. Lancaster
A
B
C
D
CAD GENERATED DRAWING,
DO NOT MANUALLY UPDATE
SCALE
SIZE
CAD FILE:
DWG. NO.
A
SHEET
OF
REV.
DATE
APPROVALS
DRAWN
CHECKED
RESP ENG
MFG ENG
QUAL ENG
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
TOLERANCES ARE:
DECIMALS ANGLES
XX = .002
XXX = .001
MATERIAL
FINISH
32
DO NOT SCALE DRAWING
ITEM
NO.
PART OR
IDENTIFYING NO.
NOMENCLATURE
OR DESCRIPTION
MATERIAL
SPECIFICATION
QTY
REQD
PARTS LIST
1
2
3
4 5 6
7
8
THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF
COUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUT
THE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED.
A
B
C
D
1 2
3
4
5
6
7
8
XXXX = .0002
1/2
REVISIONS
Rev. DESCRIPTION DATE
APPROVED
A
PRINT RELEASE
JDL
11/6/2014
2013-1565 Cree XQ LED tip
11/6/2014
Thursday, November 06, 2014 2:52:10 PM

XLAMP®XQ FAMILY LED SOLDERING & HANDLING
© 2013-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp®and the Cree LED logo
are registered trademarks of Cree LED. Other trademarks, product and company names are the property of their respective owners and do not imply
specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a
warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP115
REV 7 4
CIRCUIT BOARD PREPARATION & LAYOUTS
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specications before placing or
soldering XLamp XQ Family LEDs onto the PCB.
The diagram below shows the recommended PCB solder pad layout for XLamp XQ Family LEDs.
All dimensions in mm.
Measurement tolerance: .xx = .±13mm
High Density & High Intensity
CASE TEMPERATURE (TS) MEASUREMENT POINT
XLamp XQ Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s base as possible. This
measurement point is shown in the pictures below. Connect the thermocouple at a point where the voltage potential is below the rating
for the meter. XQ Family LEDs do not have an isolated thermal pad and care should be exercised to avoid bridging the anode and cathode
together, which may occur if the thermocouple bead is large. Cree LED recommends using a 36 AWG (0.01267mm2) thermocouple wire
for Ts measurements.
XQ-A XQ-E High Density XQ-E High Intensity
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XQ Family LED itself. In testing, Cree LED has
found such a solder pad to have insignicant impact on the resulting Ts measurement.
1.60
1.60
OPTICAL MODEL ORIGIN
OPTICAL MODEL ORIGIN
0.38
1.60
R0.936
1.50
0.60 0.60
0.30
1.50
ANODE
SIDE
CATHODE
SIDE
1.50
1.50
0.60
0.30
1.20
0.50
0.40
1.40
RECOMMENDED STENCIL OPENING RECOMMENDED PCB FOOTPRINT
BOTTOM VIEW SIDE VIEW TOP VIEW
D
C
B
A
B
C
D
1 2 3
4 5
6
7
8
8
7
6
5
4
3
2
1
E
F
E
F
A
© 2021 CreeLED, Inc. a subsidiary
of SMART Global Holdings, Inc.
THIRD ANGLE PROJECTION
DRAWING FILENAME
2610-160003A XQE XQA HD
CreeLED, Inc.
4400 SILICON DR
DURHAM, NC 27703
FINISH
A INITIAL DRAWING RELEASED
B
THE INFORMATION CONTAINED IN THIS
DRAWING IS THE SOLE PROPERTY OF
CREE LED. ANY REPRODUCTION IN
PART OR AS A WHOLE WITHOUT
WRITTEN PERMISSION OF CREE LED
IS PROHIBITED.
PROPRIETARY AND CONFIDENTIAL
REV DESCRIPTION
APPLICATION
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
• ANGULAR: MACH
0.5° BEND 1°
• ONE PLACE DECIMAL 0.5
• TWO PLACE DECIMAL 0.05
• INSIDE BEND RADII EQUAL
MATERIAL
• MACHINE/CASTING RADII 0.50
• RADII AND DIA: 0.10
INTERPRET GEOMETRIC
TOLERANCING PER:
MATERIAL
FINISH
MATERIAL
DRAWN
CHECKED
ENG APPR.
MFG APPR.
Q.A.
DATE
NAME
TITLE:
SIZE
C
DWG. NO.
REV
WEIGHT:
SCALE: 50:1
UNLESS OTHERWISE SPECIFIED:
TLING
24NOV21
2610-160003
XQE XQAHD
SHEET 1 OF 1
2
1
UPDATE TO OPTICAL MODEL ORIGIN B
Recommended PCB Footprint Recommended Stencil Opening

XLAMP®XQ FAMILY LED SOLDERING & HANDLING
© 2013-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp®and the Cree LED logo
are registered trademarks of Cree LED. Other trademarks, product and company names are the property of their respective owners and do not imply
specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a
warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP115
REV 7 5
NOTES ON SOLDERING XLAMP®XQ FAMILY LEDS
XLamp XQ Family LEDs are designed to be reow soldered to a PCB. Reow soldering may be done by a reow oven or by placing the PCB
on a hotplate and following the reow soldering prole listed on page 7.
Do not wave solder XLamp XQ Family LEDs. Do not hand solder XLamp XQ Family LEDs.
Solder Paste Type
Cree LED strongly recommends using “no clean” solder paste with XLamp XQ Family LEDs so that cleaning the PCB after reow soldering
is not required. Cree LED uses Kester®R276 solder paste internally.
Cree LED recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).
Solder Paste Thickness
The choice of solder and the application method will dictate the specic amount of solder. For the most consistent results, an automated
dispensing system or a solder stencil printer is recommended. Cree LED has seen positive results using solder thickness that results in a
4-mil (102-μm) bond line, i.e., the solder joint thickness after reow soldering.
X
WRONG
P
CORRECT
P
CORRECT
P
CORRECT
X
WRONG

XLAMP®XQ FAMILY LED SOLDERING & HANDLING
© 2013-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp®and the Cree LED logo
are registered trademarks of Cree LED. Other trademarks, product and company names are the property of their respective owners and do not imply
specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a
warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP115
REV 7 6
After Soldering
After soldering, allow XLamp XQ Family LEDs to return to room temperature before subsequent handling. Handling of the device, especially
around the lens, before cooling could result in damage to the LED.
Cree LED recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reow. This
can be done by X-ray or by shearing selected devices from the circuit board. The solder should appear completely re-owed (no solder
grains evident). The solder areas should show minimum evidence of voids on the backside of the package and the PCB.
Cleaning PCBs After Soldering
Cree LED recommends using “no clean” solder paste so that ux cleaning is not necessary after reow soldering. If PCB cleaning is
necessary, Cree LED recommends the use of isopropyl alcohol (IPA).
Do not use ultrasonic cleaning.
MOISTURE SENSITIVITY
Cree LED recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to
soldering.
Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Bare XLamp LEDs have a storage
temperature range of -40°C to 100°C. However, the MBP, reel, tape and box have a more limited storage temperature range.
Once the MBP is opened, XLamp XQ Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited oor life in
conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree LED recommends sealing any unsoldered LEDs
in the
original MBP.
ESD
XQ-A LEDs have an ESD class rating of 1. Cree LED recommends following the JESD 625 standard, “Requirements for Handling
Electrostatic-Discharge-Sensitive (ESDS) Devices,” when handling XQ-A LEDs or any LED component. Passing a static charge through an
electrostatic-discharge-sensitive device can result in performance degradation or catastrophic failure of the device.

XLAMP®XQ FAMILY LED SOLDERING & HANDLING
© 2013-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp®and the Cree LED logo
are registered trademarks of Cree LED. Other trademarks, product and company names are the property of their respective owners and do not imply
specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a
warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP115
REV 7 7
XLAMP®XQ FAMILY LED REFLOW SOLDERING CHARACTERISTICS
In testing, Cree LED has found XLamp XQ Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As
a general guideline, Cree LED recommends that users follow the recommended soldering prole provided by the manufacturer of the
solder paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.
Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.
Prole Feature Lead-Free Solder
Average Ramp-Up Rate (Tsmax to Tp)1.2°C/second
Preheat: Temperature Min (Tsmin) 120 °C
Preheat: Temperature Max (Tsmax)170 °C
Preheat: Time (tsmin to tsmax) 65-150 seconds
Time Maintained Above: Temperature (TL)217 °C
Time Maintained Above: Time (tL) 45-90 seconds
Peak/Classication Temperature (Tp) 235 - 245 °C
Time Within 5°C of Actual Peak Temperature (tp) 20-40 seconds
Ramp-Down Rate 1 - 6 °C/second
Time 25 °C to Peak Temperature 4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
IPC/JEDEC J-STD-020C
TP
TL
Temperature
Time
t 25˚C to Peak
Preheat
ts
tL
tP
25
Ramp-down
Ramp-up
Critical Zone
TL to TP
Tsmax
Tsmin

XLAMP®XQ FAMILY LED SOLDERING & HANDLING
© 2013-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp®and the Cree LED logo
are registered trademarks of Cree LED. Other trademarks, product and company names are the property of their respective owners and do not imply
specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a
warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP115
REV 7 8
CHEMICALS & CONFORMAL COATINGS
Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and current
list of recommended chemicals, conformal coatings and harmful chemicals consult Cree LED’s Chemical Compatibility Application Note.
The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree LED has developed for testing the compatibility of
chemicals and materials with LEDs. You should also consult your regional Cree LED Field Applications Engineer.
Recommended Chemicals
In testing, Cree LED has found the following chemicals to be safe to use with XLamp XQ Family LEDs.
• Water
• Isopropyl alcohol (IPA)
Chemicals Tested as Harmful
In general, subject to the specics in Cree LED’s Chemical Compatibility Application Note, Cree LED has found certain chemicals to be
harmful to XLamp XQ Family LEDs. Cree LED recommends not using these chemicals anywhere in an LED system containing XLamp XQ
Family LEDs. The fumes from even small amounts of the chemicals may damage the LEDs.
• Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)
• Methyl acetate or ethyl acetate (i.e., nail polish remover)
• Cyanoacrylates (i.e., “Superglue”)
• Glycol ethers (including Radio Shack®Precision Electronics Cleaner - dipropylene glycol monomethyl ether)
• Formaldehyde or butadiene (including Ashland®PLIOBOND®adhesive)
Hermetically Sealing Luminaires
For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment
that contains oxygen. Simply allowing the LEDs to ventilate to air is sufcient; no extraordinary measures are required. Hermetically
sealing LEDs in an enclosed space is not recommended.

XLAMP®XQ FAMILY LED SOLDERING & HANDLING
© 2013-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp®and the Cree LED logo
are registered trademarks of Cree LED. Other trademarks, product and company names are the property of their respective owners and do not imply
specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a
warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP115
REV 7 9
ASSEMBLY STORAGE & HANDLING
Do not stack PCBs or assemblies containing XLamp XQ Family LEDs so that anything rests on the LED lens. Force applied to the LED lens
may result in the lens being knocked off. PCBs or assemblies containing XLamp XQ Family LEDs should be stacked in a way to allow at
least 1cm clearance above the LED lens.
Do not use bubble wrap directly on top of XLamp XQ Family LEDs. Force from the bubble wrap can potentially damage the LED.
X
WRONG
P
CORRECT
P
CORRECT

XLAMP®XQ FAMILY LED SOLDERING & HANDLING
© 2013-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp®and the Cree LED logo
are registered trademarks of Cree LED. Other trademarks, product and company names are the property of their respective owners and do not imply
specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a
warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP115
REV 7 10
TAPE AND REEL
All Cree LED carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Except as noted, all dimensions in mm [in].
Measurement tolerances unless indicated otherwise: .xx = ±.15 mm
XQ-A High Density White and Colors
Item Ao Bo Ko Po P1 P2 T E F Do D1 W R
Dim. 1.75 1.75 1.60 4.00 4.00 2.00 0.30 1.75 3.50 1.50 0.70 8.00 5°
XQ-E High Density White and Colors (except PC Amber)
Item Ao Bo Ko Po P1 P2 T E F Do D1 W R
Dim. 1.85 1.85 1.65 4.00 4.00 2.00 0.30 1.75 3.50 1.50 1.00 8.00 3°
XQ-E High Density PC Amber
Item Ao Bo Ko Po P1 P2 T E F Do D1 W 10Po
Dim. 1.85 1.85 1.9 4.00 4.00 2.00 0.30 1.75 3.50 1.50 1.00 8.00 40.0
±0.20
XQ-E High Intensity
Item Ao Bo Ko Po P1 P2 T E F Do D1 W R
Dim. 1.85 1.85 1.20 4.00 4.00 2.00 0.30 1.75 3.50 1.50 1.00 8.00 3°
D1
Ao
P1
P2
Po Do
Bo
Ko
W
F
E
1) All Cree LED carrier tapes conform to EIA-481D, Automated Component handling Systems Standard
NOTICE
ITEM
Dim.
FDo
Ao
A-A SECTION
ITEM
Dim.
Bo
D1 W
DETAIL"I"
Ko Po
R
"I"
A
A
DETAIL"H"
P2
P1 TE
B
B-B SECTION
"H"
T
Ao (on a place in the
bottom of the corner
radii)
Bo (on a place in the
bottom of the corner radii)
R
R
Anode side
2) Measurement tolerances unless indicated otherwise: .xx = ±.15 mm
2402-M022 XML3
5.40 5.40 3.35 4.00 8.00 2.00 0.36 1.75
5.50 1.50 1.50 12.00 3deg

XLAMP®XQ FAMILY LED SOLDERING & HANDLING
© 2013-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp®and the Cree LED logo
are registered trademarks of Cree LED. Other trademarks, product and company names are the property of their respective owners and do not imply
specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a
warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP115
REV 7 11
TAPE AND REEL - CONTINUED
XQ-A & XQ-E High Density
7”
13 mm
Cover Tape
Pocket Tape
END START
Feed Direction
Feed Direction
Trailer
Min. 160 mm empty pockets
sealed with tape
Loaded Pockets
2000 Lamps
Leader
Min. 400 mm empty pockets
with min. 100 mm sealed

XLAMP®XQ FAMILY LED SOLDERING & HANDLING
© 2013-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp®and the Cree LED logo
are registered trademarks of Cree LED. Other trademarks, product and company names are the property of their respective owners and do not imply
specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a
warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP115
REV 7 12
TAPE AND REEL - CONTINUED
XQ-E High Intensity
7”
13 mm
Cover Tape
Pocket Tape
END START
Feed Direction
Feed Direction
Trailer
Min. 160 mm empty pockets
sealed with tape
Loaded Pockets
3000 Lamps
Leader
Min. 400 mm empty pockets
with min. 100 mm sealed

XLAMP®XQ FAMILY LED SOLDERING & HANDLING
© 2013-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp®and the Cree LED logo
are registered trademarks of Cree LED. Other trademarks, product and company names are the property of their respective owners and do not imply
specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a
warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP115
REV 7 13
PACKAGING & LABELS
The diagrams below show the packaging and labels Cree LED uses to ship XLamp XQ Family LEDs. XLamp XQ Family LEDs are shipped
in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag.