CREE-LED XLAMP XP Series User manual

SOLDERING & HANDLING
Cree LED / 4001 E. Hwy. 54, Suite 2000 / Durham, NC 27709 USA / +1.919.313.5330 / www.cree-led.com
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 1
XLamp®XP Family LEDs
INTRODUCTION
This application note applies to XLamp®XP Family LEDs, which
have order codes in the following formats.
XPCxxx-xx-xxxx-xxxxxx
XPExxx-xx-xxxx-xxxxxx
XPGxxx-xx-xxxx-xxxxxx
XPLxxx-xx-xxxx-xxxxxxxxx
XPPxxx-xx-xxxx-xxxxxxxxx
This application note explains how XLamp XP Family LEDs and
assemblies containing these LEDs should be handled during
manufacturing. Please read the entire document to understand
how to properly handle XLamp XP Family LEDs.
TABLE OF CONTENTS
Handling XLamp®XP Family LEDs ..................................................2
Circuit Board Preparation & Layouts................................................6
Case Temperature (Ts) Measurement Point....................................7
Notes on Soldering XLamp®XP Family LEDs .................................7
Moisture Sensitivity ..........................................................................9
Low Temperature Operation.............................................................9
XLamp® XP Family LED Reow Soldering Characteristics.......... 10
Chemicals & Conformal Coatings................................................. 11
Assembly Storage & Handling....................................................... 12
Tape and Reel................................................................................. 13
Packaging & Labels ....................................................................... 23

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 2
HANDLING XLAMP®XP FAMILY LEDS
Manual Handling
Use tweezers to grab XLamp XP Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with ngers. Do
not push on the lens. Excessive force on the lens could damage the LED.
Cree LED recommends the following at all times when handling XLamp XP Family LEDs or assemblies containing these LEDs:
• Avoid putting mechanical stress on the LED lens.
• Never touch the optical surface with ngers or sharp objects. The LED lens surface could be soiled or damaged, which would affect
the optical performance of the LED.
• Cree LED recommends always handling XP Family LEDs with appropriate ESD grounding.
• Cree LED recommends handling XP Family LEDs wearing clean, lint-free gloves.
X
WRONG
P
CORRECT
P
CORRECT
X
WRONG

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 3
Pick & Place Nozzle
The following diagram shows an example of a pick & place tool to remove XLamp XP-C, XP-E and XP-G LEDs from the factory tape & reel
packaging.
All dimensions in mm
Tolerance: ±0.01
The following diagram shows an example of a pick & place tool to remove XLamp XP-E2, XP-G2, XP-G3, XP-G4 and XP-G4 Pro9 LEDs from
the factory tape & reel packaging. The nozzle is implemented in urethane.
All dimensions in mm
Tolerance: ±0.01
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone [phone]
Fax [phone]
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5°
.XXX± .010
.XX± .03
.X ± .06
FOR SHEET METAL PARTS ONLY
.XX± .01
.XXX± .005
X° ± .5°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
63
Ø 0.5
Ø 4
Ø3.06
0.439
Conical
120°
1/110.000
--
12001405
Pickup Tool #1
PEEK
10/15/09D. Seibel
REVISONS
REV DESCRIPTION BY DATEAPP'D
SECTION A-A
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone [phone]
Fax [phone]
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5°
.XXX± .010
.XX± .03
.X ± .06
FOR SHEET METAL PARTS ONLY
.XX± .01
.XXX± .005
X° ± .5°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
63
Ø 0.5
Ø 4
Ø3.06
0.439
Conical
120°
1/110.000
--
12001405
Pickup Tool #1
PEEK
10/15/09D. Seibel
REVISONS
REV DESCRIPTION BY DATEAPP'D
SECTION A-A
Top View
Side View
Top View
A A
3.302
0.130
1.016
0.040
3.734
0.147
SECTION A-A
A
B
C
D
CAD GENERATED DRAWING,
DO NOT MANUALLY UPDATE
SCALE
SIZE
CAD FILE:
DWG. NO.
A
SHEET
OF
REV.
DATE
APPROVALS
DRAWN
CHECKED
RESP ENG
MFG ENG
QUAL ENG
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
TOLERANCES ARE:
DECIMALS ANGLES
XX = <MOD-PM>.002
XXX = <MOD-PM>.001
MATERIAL
FINISH
32
DO NOT SCALE DRAWING
ITEM
NO.
PART OR
IDENTIFYING NO.
NOMENCLATURE
OR DESCRIPTION
MATERIAL
SPECIFICATION
QTY
REQD
PARTS LIST
1
2
3
4 5 6
7
8
THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF
COUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUT
THE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED.
A
B
C
D
1 2
3
4
5
6
7
8
XXXX = <MOD-PM>.0002
<MOD-PM> 1/2<MOD-DEG>
REVISIONS
Rev. DESCRIPTION DATE
APPROVED
A
PRINT RELEASE
JDL
10/11/2011
HEW Led and Tip
10/11/2011
Tuesday, October 11, 2011 1:16:44 PM
.957
3.734
3.734
3.734
.957
O
3.230
O
R1.867
3.734
3.734
4.734
1.016
3.230
30.00
3.062
.957
3.734
3.734
3.734
.957
O
3.230
O
R1.867
3.734
3.734
4.734
1.016
3.230
30.00
3.062
Side View
HANDLING XLAMP®XP FAMILY LEDS - CONTINUED

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 4
The following diagram shows an example of a pick & place tool to remove XLamp XP-L High Density and XP-L2 LEDs from the factory tape
& reel packaging. Cree LED and several of Cree LED’s customers have had good success using nozzles fabricated from 95a urethane. The
following pick & place tool, designed in conjunction with Count On Tools, is specic to the XP-L High Density and XP-L2 LEDs.
All dimensions in mm [in]
Tolerance: ±0.025 [0.001]
The following diagram shows an example of a pick & place tool to remove XLamp XP-L High Intensity LEDs from the factory tape & reel
packaging. Cree LED recommends using a spring-relieved pick and place nozzle with a spring constant of 0.05 lb-ft (0.07 N-m). Cree LED
has had good success using nozzles fabricated from 95a urethane. The following pick & place tool is specic to the XP-L High Intensity
LED.
All dimensions in mm
Tolerance: ±0.001
3.175
[
ø 0.125]
3.683
[
ø 0.145]
1.016
[
ø 0.040]
A
A
5
[0.197]
118°
0.188
[0.007]
SECTION A-A
3.175
[
ø 0.125]
3.683
[
ø 0.145]
1.016
[
ø 0.040]
A
A
5
[0.197]
118°
0.188
[0.007]
SECTION A-A
Top View Side View
Side View
3.175
[
ø 0.125]
3.683
[
ø 0.145]
1.016
[
ø 0.040]
A
A
5
[0.197]
118°
0.188
[0.007]
SECTION A-A
.500 3.400
3.400
.500
Ø 1.000
3.300
.300
2.400
.500 3.400
3.400
.500
Ø 1.000
3.300
.300
2.400
Top View Side View
.500 3.400
3.400
.500
Ø 1.000
3.300
.300
2.400
HANDLING XLAMP®XP FAMILY LEDS - CONTINUED

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 5
The following diagram shows an example of a pick & place tool to remove XLamp XP-P LEDs from the factory tape & reel packaging.
For pick and place nozzles coming into contact with silicone-covered LED components, Cree LED recommends nozzles be constructed
of non-metallic materials. Cree LED and several of Cree LED’s customers have had good success using nozzles fabricated from 95a
urethane.
All dimensions in [mm] in
Measurement tolerances: .xxx = .001in
1.016
0.0400
0.787
0.0310
30°
J. Lancaster
A
B
C
D
CAD GENERATED DRAWING,
DO NOT MANUALLY UPDATE
SCALE
SIZE
CAD FILE:
DWG. NO.
A
SHEET
OF
REV.
DATE
APPROVALS
DRAWN
CHECKED
RESP ENG
MFG ENG
QUAL ENG
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
TOLERANCES ARE:
DECIMALS ANGLES
XX = .002
XXX =
.001
MATERIAL
FINISH
32
DO NOT SCALE DRAWING
ITEM
NO.
PART OR
IDENTIFYING NO.
NOMENCLATURE
OR DESCRIPTION
MATERIAL
SPECIFICATION
QTY
REQD
PARTS LIST
1
2
3
4 5 6
7
8
THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF
COUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUT
THE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED.
A
B
C
D
1 2
3
4
5
6
7
8
XXXX = .0002
1/2
REVISIONS
Rev. DESCRIPTION DATE
APPROVED
A
PRINT RELEASE
JDL
11/6/2014
2013-1565 Cree XQ LED tip
11/6/2014
Thursday, November 06, 2014 2:52:10 PM
HANDLING XLAMP®XP FAMILY LEDS - CONTINUED

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 6
CIRCUIT BOARD PREPARATION & LAYOUTS
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specications before placing or
soldering XLamp XP Family LEDs onto the PCB.
The diagrams below show the recommended PCB solder pad layout for XLamp XP Family LEDs.
XP-C, XP-E, XP-G
XP-E2, XP-E2 Torch, XP-G2, XP-G3, XP-G3 Photophyll™ Select, XP-G4, XP-G4 Pro9, XP-L High Density & High Intensity,
XP-L2, XP-P
Notes:
• Cree LED recommends using thermal pad kickouts to maximize component thermal performance.
• Cree LED recommends using white solder mask material to minimize system optical loss.
* This stencil has been tested and optimized for the avoidance of voiding when using ALPHA®LUMET®P30 Maxrel solder paste. For
other solder pastes, a “window pane” design for the thermal pad stencil may result in a lower voiding percentage. Contact your local
Cree LED Field Applications Engineer for consultation regarding your specic application.
Recommended PCB Footprint Recommended Stencil Opening
3.45
3.45
OPTICAL
MODEL ORIGIN
ANODE
SIDE
CATHODE
SIDE
0.73
0.58
2.00
R1.30
OPTICAL
MODEL ORIGIN
3.30
0.50
1.30
2.30
0.50
ANODE
SIDE
CATHODE
SIDE
CENTER PAD
IS ELECTRICALLY
ISOLATED
SOLDERMASK
MAY BE PRESENT
3.30 REF.
3.30 REF.
CENTER PAD
IS ELECTRICALLY
ISOLATED
SOLDERMASK
MAY BE PRESENT
3.30
3.30
0.50
1.30
0.50
3.30
3.30
0.75
0.25
1.01
0.64
2.30
0.28
2.30
ALTERNATE BOTTOM VIEW
BOTTOM VIEW
SIDE VIEW
TOP VIEW
RECOMMENDED STENCIL OPENING RECOMMENDED PCB FOOTPRINT
D
C
B
A
B
C
D
1 2 3
4 5
6
7
8
8
7
6
5
4
3
2
1
E
F
E
F
A
© 2021 CreeLED, Inc. a subsidiary
of SMART Global Holdings, Inc.
THIRD ANGLE PROJECTION
DRAWING FILENAME
20610-350008 XPC XPE XPG
CreeLED, Inc.
4400 SILICON DR
DURHAM, NC 27703
FINISH
A DRAWING INITIATED
B
THE INFORMATION CONTAINED IN THIS
DRAWING IS THE SOLE PROPERTY OF
CREE LED. ANY REPRODUCTION IN
PART OR AS A WHOLE WITHOUT
WRITTEN PERMISSION OF CREE LED
IS PROHIBITED.
PROPRIETARY AND CONFIDENTIAL
REV DESCRIPTION
APPLICATION
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
• ANGULAR: MACH
0.5° BEND 1°
• ONE PLACE DECIMAL 0.5
• TWO PLACE DECIMAL 0.05
• INSIDE BEND RADII EQUAL
MATERIAL
• MACHINE/CASTING RADII 0.50
• RADII AND DIA: 0.10
INTERPRET GEOMETRIC
TOLERANCING PER:
MATERIAL
FINISH
MATERIAL
DRAWN
CHECKED
ENG APPR.
MFG APPR.
Q.A.
DATE
NAME
TITLE:
SIZE
C
DWG. NO.
REV
WEIGHT:
SCALE: 20:1
UNLESS OTHERWISE SPECIFIED:
TLING
24AUG22
XPC
XPE
XPG
SHEET 1 OF 1
350008
2
1
B OPTICAL MODEL ORIGIN
Recommended PCB Footprint Recommended Stencil Opening*
3.45
3.45
OPTICAL
MODEL ORIGIN
TOP VIEW
CATHODE
SIDE
ANODE
SIDE
0.58
0.73
2.26
R1.53
OPTICAL
MODEL ORIGIN
3.30
0.50
2.30
0.50
1.30
3.30
CENTER PAD
IS ELECTRICALLY
ISOLATED
SOLDERMASK
MAY BE PRESENT
ANODE
SIDE
CATHODE
SIDE
3.30
3.30
0.50 1.30 0.50
0.50 0.50
0.43
0.29 TYP
0.50 0.56
3.30
0.18 TYP
0.18
0.18
3.30
0.08
0.08
0.83 (2 PLACES)
0.18
0.50
0.56
RECOMMENDED STENCIL OPENING
3.30 REF.
3.30 REF.
CENTER PAD
IS ELECTRICALLY
ISOLATED
SOLDERMASK
MAY BE PRESENT
SIDE VIEW
BOTTOM VIEW
RECOMMENDED PCB FOOTPRINT
ALTERNATE BOTTOM VIEW
D
C
B
A
B
C
D
1 2 3
4 5
6
7
8
8
7
6
5
4
3
2
1
E
F
E
F
A
© 2021 CreeLED, Inc. a subsidiary
of SMART Global Holdings, Inc.
THIRD ANGLE PROJECTION
DRAWING FILENAME
2610-350011B
CreeLED, Inc.
4400 SILICON DR
DURHAM, NC 27703
FINISH
A INITIAL DRAWING RELEASED
B
THE INFORMATION CONTAINED IN THIS
DRAWING IS THE SOLE PROPERTY OF
CREE LED. ANY REPRODUCTION IN
PART OR AS A WHOLE WITHOUT
WRITTEN PERMISSION OF CREE LED
IS PROHIBITED.
PROPRIETARY AND CONFIDENTIAL
REV DESCRIPTION
APPLICATION
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
• ANGULAR: MACH
0.5° BEND 1°
• ONE PLACE DECIMAL 0.5
• TWO PLACE DECIMAL 0.05
• INSIDE BEND RADII EQUAL
MATERIAL
• MACHINE/CASTING RADII 0.50
• RADII AND DIA: 0.10
INTERPRET GEOMETRIC
TOLERANCING PER:
MATERIAL
FINISH
MATERIAL
DRAWN
CHECKED
ENG APPR.
MFG APPR.
Q.A.
DATE
NAME
TITLE:
SIZE
C
DWG. NO.
REV
WEIGHT:
SCALE 20:1
UNLESS OTHERWISE SPECIFIED:
TLING
24AUG22
XPEB
XPEB TORCH
XPEB PLUS
XPG2
SHEET 1 OF 1
2
1
350011
B UPDATED OPTICAL MODEL ORIGIN

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 7
CASE TEMPERATURE (TS) MEASUREMENT POINT
XLamp XP Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This
measurement point is shown in the picture below.
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XP Family LED itself. In testing, Cree LED has
found such a solder pad to have insignicant impact on the resulting Tsmeasurement.
NOTES ON SOLDERING XLAMP®XP FAMILY LEDS
XLamp XP Family LEDs are designed to be reow soldered to a PCB. Reow soldering may be done by a reow oven or by placing the PCB
on a hotplate and following the reow soldering prole listed on page 10.
Do not wave solder XLamp XP Family LEDs. Do not hand solder XLamp XP Family LEDs.
X
WRONG
P
CORRECT
P
CORRECT

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 8
NOTES ON SOLDERING XLAMP®XP FAMILY LEDS - CONTINUED
Solder Paste Type
Cree LED strongly recommends using “no clean” solder paste with XLamp XP Family LEDs so that cleaning the PCB after soldering is not
required. Cree LED uses Kester®R276 solder paste internally.
Cree LED recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).
Solder Paste Thickness
The choice of solder and the application method will dictate the specic amount of solder. For the most consistent results, an automated
dispensing system or a solder stencil printer is recommended. Cree LED has seen positive results using solder thickness that results in a
4-mil (102-μm) bond line, i.e., the solder joint thickness after reow soldering.
After Soldering
After soldering, allow XLamp XP Family LEDs to return to room temperature before subsequent handling. Premature handling of the
device, especially around the lens, could result in damage to the LED.
Cree LED recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reow. After
shearing selected devices from the circuit board the solder should appear completely re-owed (no solder grains evident). The solder
areas should show minimum evidence of voids on the backside of the package and the PCB.
Cleaning PCBs After Soldering
Cree LED recommends using “no clean” solder paste so that ux cleaning is not necessary after reow soldering. If PCB cleaning is
necessary, Cree LED recommends the use of isopropyl alcohol (IPA).
Do not use ultrasonic cleaning.
P
CORRECT
X
WRONG

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 9
MOISTURE SENSITIVITY
Cree LED recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to
soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Bare XLamp LEDs have a
storage temperature range of -40°C to 100°C. However, the MBP, reel, tape and box have a more limited storage temperature range.
Once the MBP is opened, XLamp XP Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited oor life
in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree LED recommends sealing any unsoldered
LEDs in the original MBP.
LOW TEMPERATURE OPERATION
The minimum operating temperature of these XLamp components is -40 °C. To maximize lifetime, Cree LED recommends avoiding
applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0°C.

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 10
XLAMP®XP FAMILY LED REFLOW SOLDERING CHARACTERISTICS
In testing, Cree LED has found XLamp XP Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As
a general guideline, Cree LED recommends that users follow the recommended soldering prole provided by the manufacturer of the
solder paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.
Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.
Prole Feature Lead-Free Solder
Average Ramp-Up Rate (Tsmax to Tp)1.2°C/second
Preheat: Temperature Min (Tsmin) 120 °C
Preheat: Temperature Max (Tsmax)170 °C
Preheat: Time (tsmin to tsmax) 65-150 seconds
Time Maintained Above: Temperature (TL)217 °C
Time Maintained Above: Time (tL) 45-90 seconds
Peak/Classication Temperature (Tp) 235 - 245 °C
Time Within 5°C of Actual Peak Temperature (tp) 20-40 seconds
Ramp-Down Rate 1 - 6 °C/second
Time 25 °C to Peak Temperature 4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
IPC/JEDEC J-STD-020C
TP
TL
Temperature
Time
t 25˚C to Peak
Preheat
ts
tL
tP
25
Ramp-down
Ramp-up
Critical Zone
TL to TP
Tsmax
Tsmin

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 11
CHEMICALS & CONFORMAL COATINGS
Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and current
list of recommended chemicals, conformal coatings and harmful chemicals consult Cree LED’s Chemical Compatibility Application Note.
The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree LED has developed for testing the compatibility of
chemicals and materials with LEDs. You should also consult your regional Cree LED Field Applications Engineer.
Recommended Chemicals
In testing, Cree LED has found the following chemicals to be safe to use with XLamp XP Family LEDs.
• Water
• Isopropyl alcohol (IPA)
Chemicals Tested as Harmful
In general, subject to the specics in Cree LED’s Chemical Compatibility Application Note, Cree LED has found certain chemicals to be
harmful to XLamp XP Family LEDs. Cree LED recommends not using these chemicals anywhere in an LED system containing XLamp XP
Family LEDs. The fumes from even small amounts of the chemicals may damage the LEDs.
• Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)
• Methyl acetate or ethyl acetate (i.e., nail polish remover)
• Cyanoacrylates (i.e., “Superglue”)
• Glycol ethers (including Radio Shack®Precision Electronics Cleaner - dipropylene glycol monomethyl ether)
• Formaldehyde or butadiene (including Ashland®PLIOBOND®adhesive)
Hermetically Sealing Luminaires
For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment
that contains oxygen. Simply allowing the LEDs to ventilate to air is sufcient; no extraordinary measures are required. Hermetically
sealing LEDs in an enclosed space is not recommended.

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 12
ASSEMBLY STORAGE & HANDLING
Do not stack PCBs or assemblies containing XLamp XP Family LEDs so that anything rests on the LED lens. Force applied to the LED lens
may result in the lens being knocked off. PCBs or assemblies containing XLamp XP Family LEDs should be stacked in a way to allow at
least 1-cm clearance above the LED lens.
Do not use bubble wrap directly on top of XLamp XP Family LEDs. Force from the bubble wrap can potentially damage the LED.
P
CORRECT
X
WRONG
P
CORRECT

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 13
TAPE AND REEL
All Cree LED carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Except as noted, all dimensions in mm.
XP-C, XP-E
Item Ao Bo Ko Po P1 P2 T E F Do D1 W R
Dim. 3.75 3.75 2.10 4.00 8.00 2.00 0.30 1.75 5.50 1.50 1.50 12.00 8°

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 14
TAPE AND REEL - CONTINUED
XP-E2, XP-E2 Torch, XP-G2, XP-G3, XP-G3 Photophyll™ Select, XP-G4, XP-G4 Pro9
Item Ao Bo Ko Po P1 P2 T E F Do D1 W R
Dim. 3.70 3.70 2.40 4.00 8.00 2.00 0.30 1.75 5.50 1.55 1.50 12.00 5°

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 15
TAPE AND REEL - CONTINUED
XP-G
Item Ao Bo Ko Po P1 P2 T E F Do D1 W R
Dim. 3.75 3.75 2.10 4.00 8.00 2.00 0.30 1.75 5.50 1.50 1.50 12.00 8°

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 16
TAPE AND REEL - CONTINUED
XP-L High Density
Item Ao Bo Ko Po P1 P2 T E F Do D1 W R
Dim. 3.60 3.60 3.00 4.00 8.00 2.00 0.30 1.75 5.50 1.50 1.50 12.00 3°
Anode Side

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 17
TAPE AND REEL - CONTINUED
XP-L High Intensity
Item Ao Bo Ko Po P1 P2 T E F Do D1 W R
Dim. 3.70 3.70 1.20 4.00 8.00 2.00 0.30 1.75 5.50 1.50 1.50 12.00 3°
Anode Side

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 18
TAPE AND REEL - CONTINUED
XP-L2
Item Ao Bo Ko Po P1 P2 T E F Do D1 W R
Dim. 3.60 3.60 3.00 4.00 8.00 2.00 0.30 1.75 5.50 1.50 1.50 12.00 3°

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 19
TAPE AND REEL - CONTINUED
XP-P
Item Ao Bo Ko Po P1 P2 T E F Do D1 W R
Dim. 3.70 3.70 1.20 4.00 8.00 2.00 0.30 1.75 5.50 1.50 1.50 12.00 3°

XLAMP®XP FAMILY LED SOLDERING & HANDLING
© 2008-2023 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo, the Cree LED logo and XLamp® are
registered trademarks, and Photophyll is a trademark, of Cree LED. Other trademarks, product and company names are the property of their respective
owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree-led.com.
CLD-AP25
REV 26 20
TAPE AND REEL - CONTINUED
XP-C, XP-E, XP-G, XP-P
7”
13 mm
Cover Tape
Pocket Tape
END START
Feed Direction
Feed Direction
Trailer
Min. 160 mm empty pockets
sealed with tape
Loaded Pockets
1000 Lamps
Leader
Min. 400 mm empty pockets
with min. 100 mm sealed