CYNTEC TFP21 Series User manual

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TFP21 SERIES THIN FILM CHIP COUPLER
1. Part Number
TFP
—
21
—
S
—
190
—
A
(1) (2) (3) (4) (5)
Where (1) TFP Thin Film Coupler :
(2) Size :
Two digits of number ––
21 = 2.00×1.25 mm
(3) Design :
S = Single Band
D = Dual Band
(4) Coupling Value :
Three digits of number ––
140 = 14.0 dB
180 = 18.0 dB
190 = 19.0 dB
(5) Center Frequency :
A = 897.5M
B = 1747.5M

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2. Specifications
Part NO. Central Frequency Coupling Isolation (Typical) Insertion Loss
(max.)
V. S . W. R
(max.)
Handling
Power
S-148-A 897.5 r17.5 MHz 14.8 r1.0 dB 24 dB 0.50 dB 1.4 3W
S-187-A 897.5 r17.5 MHz 18.7 r1.5 dB 23 dB 0.40 dB 1.4 3W
S-190-A 897.5 r17.5 MHz 19.0 r1.5 dB 27 dB 0.40 dB 1.4 3W
S-140-B 1747.5 r37.5 MHz 14.0 r1.0 dB 27 dB 0.60 dB 1.4 1W
S-210-B 1747.5 r37.5 MHz 21.0 r1.0 dB 30 dB 0.50 dB 1.4 1W
3. Outline Dimension
4. Operation Temperature: -40℃to +85℃
Code Dimensions Code Dimensions
L 2.0 ± 0.1 b 0.20 ± 0.1
W 1.25 ± 0.1 e 0.35 ± 0.1
T 0.5 ± 0.1 P 0.65 ± 0.05
a 0.3 ± 0.1
Unit : mm
Terminal Configuration :
Terminal No. Terminal Name Terminal No. Terminal Name
(1) RF IN (4) RF OUT
(2) GND (5) GND
(3) Isolation (6) Coupling
b
a1eP
TL
W
(1)(2)(3)
(4) (5) (6)

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5. Measuring Method:
Line No
Item ⓐⓑ Terminated in 50Ω
Insertion Loss 1 4 3, 6
Return Loss 1 4 4, 6
Coupling 1 6 3, 4
Isolation 1 3 4, 6
6. Land Pattern (Commended) :
50
Ω
50
Ω
Network Analyzer
HP8753E
ⓑ
ⓐ
Line No.
A 1.0
B 0.35
C 2.8
P 0.65
Unit : mm
B P
C
A
①
③
④
⑥

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7. Life Test
Item Specification Condition
Vibration Electrical characteristics shall be
within specification
Without distinct damage in appearance
(1) Vibration Frequency:10 Hz to 55 Hz
to 10 Hz/min
(2) Vibration shall be applied in x, y, and
z direction respectively for 2 hours
(total 6 hours)
(3) Amplitude:1.5 mm
Shock Electrical characteristics shall be
within specification
Without distinct damage in appearance
(1) Peak value: 980N
(2) Duration of pulse: 6ms
(3) X1,X2,Y1,Y2,Z1,Z2 for 3 times each
(18 times in total)
Bending Test Electrical characteristics shall be
within specification
Without distinct damage in appearance
Mount on test board with bend with 3 mm
deflection for 30 seconds
Solder strength 9.8 N minimum Apply pushing force at 0.5 mm/s until
electrode pads are pealed off or ceramics are
broke
Solderability of
Termination
90% terminations is to be soldered
evenly and continuously.
The entire sample shall be dipped in solder
at 230 r5℃for 2
r0.5 seconds
JIS C 5102 8.11.1
Unit : mm
4545
Solder
Within
±
2mm
Test Board Component
Pressure
Pressure rod
R230
Amplitude
3mm
20 50

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7. Life Test
Item Specification Condition
Resistance to
Soldering Heat
(Dipping)
Electrical characteristics shall be
within specification
Without distinct damage in appearance
Immerse the chip in the solder of 270 r5℃
for 10 r0.5 seconds after preheating for 1
min. at 120 to 150℃.
Resistance to
Soldering Heat
(Reflow)
Electrical characteristics shall be
within specification
Without distinct damage in appearance
Rapid change of
Temperature
Electrical characteristics shall be
within specification
Without distinct damage in appearance
(1) Repeat 100 cycle as follows :
(-40 r3℃,30minutes)
o(Room temperature, 2~3 minutes)
o(+85 r2℃,30minutes)
o(Room temperature, 2~3 minutes)
(2) Measuring resistance 1 hour after test
Moisture with
Load
Electrical characteristics shall be
within specification
Without distinct damage in appearance
(1) Environment condition :
40 r2℃, 90 ~ 95% RH
(2) Load : 630mA current
(3) Test period : (1.5 hour ON)
o(0.5 hour OFF) cycled for
total 1,000 + 48 / - 0 hours
Low Temperature
Load Life
Electrical characteristics shall be
within specification
Without distinct damage in appearance
(1) Store temperature : -40 r2℃
for total 1000+48/-0hr
(2) Load : 630mA current
High Temperature
Load Life
Electrical characteristics shall be
within specification
Without distinct damage in appearance
(1) Store temperature : +85 r2℃
for total 1000+48/-0hr
(2) Load : 630mA current
Temp.
20 ~ 40sec.
240
℃
220
℃
150r10℃
Time
60 ~ 120sec.

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8. Packaging
8-1 Dimensions
8-1-1 Tape Packaging Dimensions
Material : Paper
8-1-2 Reel Dimensions
Direction mark
P
0.65 r0.1
P(PITCH) = 4.0 r0.1
Chi
p
0.60 r0.05
B
A
P
8.0 r0.3
3.5 r0.05
1.75 r0.1
Carrier cavity Pulling direction
Unit : mm
Sprocket hole
2.0 r0.05
A=1.65 r0.2
B=2.4 r0.2
1.5 0.1
0.0
10.0 r0.15
Unit : mm 12.0 r1.5
3.0 r1.0
13.0
r1.0
20min.
178
r2.0
60.0
r1.0

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8-2 Peel Strength of Top Cover Tape
The peel speed shall be about 300 mm/minute
The peel strength of top cover tape shall be between 0.1 to 0.7N
8-3 Quantity per Reel
4000 pieces / reel
8-4 Marking
The following items shall be marked on the reel.
(1) Manufactures parts number
(2) Quantity
(3) Manufacturing date code
(4) Manufacturer’s name
(5) The country of origin
165~180°
Top Cover Tape
0.1N~0.7N

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9. Notice
9-1 Notice for Storage Environment, Method and Period :
To avoid damaging the soliderability of the external electrodes, be sure to observe the following :
(1) Store in 15 to 35℃ambient temperature, and 45 to 75% ambient RH.(In particular,
take note that an ambient temperature over 40℃may deform all the packages)
(2) Store where there are no corrosive gases containing sulfur, chorine ,etc.
(3) Stored the component should be used within 6 months. When using the components
over 6 months, check the soliderability before actual use.
9-2 Notice for Handling :
(1) Be careful in handling or transporting the components because excessive stress or mechanical
shock may break the components due to the nature of ceramics structure.
(2) Handling with care if the component may have cracks or damages on terminals, the
characteristics of the component may change. Do you touch the component with bear
hands, it may hands, that may result in poor soliderability on the components.
9-3 Notice for Chip Placer :
When placing the component on the PCB, the component may be stressed and broken by uneven
forces from worn-out chucking locating claw or the suction nozzle.
To prevent the component from damage, be sure to follow the specification for the
maintenance of the chip placer being used.
9-4 Standard PCB Design (Land Pattern and Dimensions) :
(1) All the ground terminals should be connected to the ground patterns. Furthermore, the
ground pattern should be provided betweem IN and OUT Terminals.
(2) The recommended land dimensions is as Cyntec’s standard, the characteristics of the
dimensions, land of forming method of NC terminals and the PCB material and thickness.
Therefore, be sure to verify the characteristic in the actual set. When using non-standard
lands, contact Cyntec beforehead.
9-5 Input Power Capacity :
The components shall be used in the input power capacity as specified in this specifications.
Inform Cyntec beforehand, in case that the components are used

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10. Soldering Condition
10-1 Carefully perform preheating so that the temperature difference (△T) between the solder and
the component surface should be in the follow range.
When the components are immersed in solvent after mounting, pay special attention to
maintain the temperature difference within 100℃.
Soldering must be carried out by the above mentioned conditions to prevent the components
from damage (crack etc.).
Contact Cyntec before use if concerning other soldering conditions.
Soldering method Temperature
Soldering iron method
Reflow method
△T <= 130℃
zWhen correcting the component with a soldering iron, the following conditions should be met.
Item Kind of iron Nichrome heater Ceramics heater
Soldering iron wattage < = 30 W < = 18 W
Temperature of iron-tip < = 280℃< = 250℃
zDiameter of iron-tip:φ3.0 mm max.
zDo not allow the iron-tip to directly touch the ceramic element.
10-2 Use rosin type flux or weakly active flux with a chlorine content of 0.2 Wt% or less.
10-3 Use eutectic crystal solder.
10-4 Amount of solder paste
Ensure that solder is applied smoothly to a minimum height of 0.2 ~ 0.5 mm at the end surface of
the external electrodes. If too much or little solder is applied, there is high possibility that the
mechanical strength will be insufficient , creating the variation of the characteristics.
10-5 Manual hot gas soldering – available with the following condition
Pre-heating temperature : 120 ~ 150℃.
Maximum temperature : 275℃, within 10.5 seconds

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11. Notice for Cleaning:
11-1 The total cleaning time of soaking, ultrasonic and steam method should be within 5 minutes.
11-2 Consult with Cyntec concerning the cleaning solvent. In order to totally abolish ODC (Freon,
Trichrolethan), Cyntec has carried out testing on non-cleaning and water cleaning (water-soluble
flux, water-soluble cream solder, water-based cleaning solvent). Therefore, be sure to contact
Cyntec beforehand for details when applying any of the above-mentioned cleaning fluid.
11-3 The ultrasonic cleaning conditions are indicated below:
Power : 20 W per liter
Frequency : 50 ~ 60kHz
Temperature : 40℃or less
If the ultrasonic output power is too high, the PCB may resonate and the components mounted
on the PCB may be damaged. The ultrasonic cleaning conditions may change depending on the
size of the vessel and size of the PCB. Be sure to check when setting the conditions. Contact
Cyntec regarding conditions other than those stated above.
12. Operational Environment Conditions:
12-1 The components are designed to work for electronic products under normal environmental
conditions (ambient temperature, humidity and pressure). Therefore, the components have no
problems to be used under the similar condition to the above-mentioned. However, if the
components are used under the following circumstances, it may damage the components and
leakage of electricity and abnormal temperature may occur.
In an atmosphere containing corrosive gas (Cl2, NH3, SOx, NOxetc.).
In an atmosphere containing combustible and volatile gases.
Dustyplace
Direct sunlight place, Water splashing place, Humid place where water condenses.
Freezingplace.
12-2 If there are possibilities for the components to be used under the preceding clause, consult with
Cyntec before actual use.
Beyond such input power capacity range.

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13. Restrictions on Application:
If the components should be used in application that required extremely high reliability, contact
Cyntec before use.
zSpace activities (Man-made satellite, Rocket etc.)
zSubmarine activities (Relay station, Submarine equipment)
zMilitary activities
zUnits related to safety and control of transportation vehicles (Automobile, Airplane, Train, etc.)
zControllers for power plants (Atomic energy power, Hydro-electric power, Thermal power)
zMedical equipment directly related to the support of human life (Life-supporting device, Cardiac
defibrillator, Artificial dializer, etc.)
zInformation processing system (support computer, etc.)
zAnother application similar to the above.
14. Warning
14-1 It shall be understood that this specification is to warrant the quality of the component solely, not
being mounted on the circuit of your set. The electrical performance of the component may vary
depending on the conditions where this component is mounted (e.g. circuit patterning, condition
of ground pattern. Etc.). Thai component, therefore, shall be preliminarity evaluated under your
designed circuit conditions prior to your actual use of this component.
14-2 Cyntec shall be free from any liability and damage which you may suffer as a result of your use
this component under any conditions not specified or described in this specifications.