Cypress Semiconductor Nine-Output 3.3V Buffer CY2309NZ User manual

CY2309NZ
Nine-Output 3.3V Buffer
Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600
Document #: 38-07182 Rev. *E Revised September 23, 2008
Features
■One-input to nine-output buffer/driver
■Supports two DIMMs or four SO-DIMMs with one additional
output for feedback to an external or chipset PLL
■Low power consumption for mobile applications
❐Less than 32 mA at 66.6 MHz with unloaded outputs
■1-ns Input-Output delay
■Buffers all frequencies from DC to 133.33 MHz
■Output-output skew less than 250 ps
■Multiple VDD and VSS pins for noise and electromagnetic inter-
ference (EMI) reduction
■Space-saving 16-pin 150-mil SOIC package
■3.3V operation
■Industrial temperature available
Functional Description
The CY2309NZ is a low-cost buffer designed to distribute
high-speed clocks in mobile PC systems and desktop PC
systems with SDRAM support. The part has nine outputs, eight
of which can be used to drive two DIMMs or four SO-DIMMs, and
the remaining can be used for external feedback to a PLL. The
device operates at 3.3V and outputs can run up to 133.33 MHz.
The CY2309NZ is designed for low EMI and power optimization.
It has multiple VSS and VDD pins for noise optimization and
consumes less than 32 mA at 66.6 MHz, making it ideal for the
low-power requirements of mobile systems. It is available in an
ultra-compact 150-mil 16-pin SOIC package.
Logic Block Diagram
BUF_IN
OUTPUT2
OUTPUT3
OUTPUT4
OUTPUT5
OUTPUT6
OUTPUT7
OUTPUT8
OUTPUT9
OUTPUT1
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CY2309NZ
Document #: 38-07182 Rev. *E Page 2 of 6
Pinouts
Figure 1. CY2309NZ - 16 SOIC-Top View
Maximum Ratings
Supply Voltage to Ground Potential................–0.5V to +7.0V
DC Input Voltage (Except REF) ............–0.5V to VDD + 0.5V
DC Input Voltage REF .........................................–0.5V to 7V
Storage Temperature .................................–65°C to +150°C
Junction Temperature................................................. 150°C
Static Discharge Voltage
(per MIL-STD-883, Method 3015) ............................>2,000V
1
2
3
4
5
6
7
89
10
11
12
13
14
15
16
BUF_IN
OUTPUT1
OUTPUT2
VDD
GND
OUTPUT3
OUTPUT4
VDD
OUTPUT9
OUTPUT8
OUTPUT7
VDD
GND
OUTPUT6
OUTPUT5
GND
Table 1. Pin Description for CY2309NZ
Pin Signal Description
4, 8, 13 VDD 3.3V Digital Voltage Supply
5, 9, 12 GND Ground
1 BUF_IN Input Clock
2, 3, 6, 7, 10,
11, 14, 15, 16 OUTPUT [1:9] Outputs
Operating Conditions for Commercial and Industrial Temperature Devices
Parameter Description Min Max Unit
VDD Supply Voltage 3.0 3.6 V
TA(Ambient Operating Temperature) Commercial 0 70 °C
(Ambient Operating Temperature) Industrial –40 85 °C
CLLoad Capacitance, Fout < 100 MHz 30 pF
Load Capacitance,100 MHz < Fout < 133.33 MHz 15 pF
CIN Input Capacitance 7 pF
BUF_IN, OUTPUT [1:9] Operating Frequency DC 133.33 MHz
tPU Power up time for all VDDs to reach minimum specified
voltage (power ramps must be monotonic) 0.05 50 ms
Electrical Characteristics for Commercial and Industrial Temperature Devices
Parameter Description Test Conditions Min Max Unit
VIL Input LOW Voltage[1] 0.8 V
VIH Input HIGH Voltage[1] 2.0 V
IIL Input LOW Current VIN = 0V 50.0 μA
IIH Input HIGH Current VIN = VDD 100.0 μA
VOL Output LOW Voltage[2] IOL = 8 mA 0.4 V
VOH Output HIGH Voltage[2] IOH = –8 mA 2.4 V
IDD Supply Current Unloaded outputs at 66.66 MHz 32 mA
Notes
1. BUF_IN input has a threshold voltage of VDD/2.
2. Parameter is guaranteed by design and characterization. It is not 100% tested in production.
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CY2309NZ
Document #: 38-07182 Rev. *E Page 3 of 6
Switching Characteristics for Commercial and Industrial Temperature Devices[3]
Parameter Name Description Min Typ. Max Unit
Duty Cycle[2] = t2÷t1Measured at 1.4V 40.0 50.0 60.0 %
t3Rise Time[2] Measured between 0.8V and 2.0V 1.50 ns
t4Fall Time[2] Measured between 0.8V and 2.0V 1.50 ns
t5Output to Output Skew[2] All outputs equally loaded 250 ps
t6Propagation Delay, BUF_IN
Rising Edge to OUTPUT
Rising Edge[2]
Measured at VDD/2 1 5 9.2 ns
Switching Waveforms
Note
3. All parameters specified with loaded outputs.
t1
t2
1.4V 1.4V 1.4V
Figure 2. Duty Cycle Timing
OUTPUT
t3
3.3V
0V
0.8V
2.0V 2.0V
0.8V
t4
Figure 3. All Outputs Rise/Fall Time
1.4V
1.4V
t5
OUTPUT
OUTPUT
Figure 4. Output-Output Skew
VDD/2
t6
INPUT
OUTPUT
VDD/2
Figure 5. Input-Output Propagation Delay
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CY2309NZ
Document #: 38-07182 Rev. *E Page 4 of 6
Package Diagram
Figure 6. 16-Pin (150-Mil) SOIC S16
Ordering Information
Ordering Code Package Type Operating Range
CY2309NZSC–1H[4] 16-pin 150-mil SOIC Commercial
CY2309NZSC–1HT[4] 16-pin 150-mil SOIC – Tape and Reel Commercial
Pb-free
CY2309NZSXC–1H 16-pin 150-mil SOIC Commercial
CY2309NZSXC–1HT 16-pin 150-mil SOIC – Tape and Reel Commercial
CY2309NZSXI-1H 16-pin 150-mil SOIC Industrial
CY2309NZSXI-1HT 16-pin 150-mil SOIC – Tape and Reel Industrial
0.1 μF
VDD
0.1 μF
VDD
CLK out
CLOAD
OUTPUTS
GND
GND
Test Circuits
PIN 1 ID
0°~8°
16 Lead (150 Mil) SOIC
18
916
SEATING PLANE
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.386[9.804]
0.393[9.982]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
DIMENSIONS IN INCHES[MM] MIN.
MAX.
0.016[0.406]
0.010[0.254] X 45°
0.004[0.102]
REFERENCE JEDEC MS-012
PART #
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
PACKAGE WEIGHT 0.15gms
51-85068-*B
Note
4. Not recommended for new designs.
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CY2309NZ
Document #: 38-07182 Rev. *E Page 5 of 6
Document History Page
Document Title: CY2309NZ Nine-Output 3.3V Buffer
Document Number: 38-07182
REV. ECN Orig. of
Change Submission
Date Description of Change
** 111858 DSG 12/09/01 Change from Spec number: 38-00709 to 38-07182
*A 121834 RBI 12/14/02 Power-up requirements added to Operating Conditions Information
*B 130563 SDR 10/23/03 Added industrial operating temperature to operating conditions
*C 212991 RGL/GGK 03/30/04 Updated the propagation delay T6spec to 9.2 ns in the Switching
Characteristics table
*D 270149 RGL 10/04/04 Added Lead-free devices
Replaced 8.7ns Input/Output Delay to 1ns Input/Output Delayin the features
section
*E 2568533 AESA 09/23/08 Updated template. Added Note “Not recommended for new designs.”
Changed "SDRAM [1:9]" to "OUTPUT [1:9]" in Operating Conditions table.
Removed part number CY2309NZSI–1H and CY2309NZSI–1HT.
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Document #: 38-07182 Rev. *E Revised September 23, 2008 Page 6 of 6
All products and company names mentioned in this document may be the trademarks of their respective holders.
CY2309NZ
© Cypress Semiconductor Corporation, 2001-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion ofCypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified inthe applicable agreement. Any reproduction, modification, translation, compilation, or representation ofthis Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
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