Cypress EZ-BLE PSoC CYBLE-224116-01 User manual

CYBLE-224116-01
EZ-BLE™ PSoC®XT/XR BT 4.2 Module
Cypress Semiconductor Corporation 198 Champion Court San Jose,CA 95134-1709 408-943-2600
Document Number: 002-12524 Rev. *D Revised December 27, 2017
General Description
The Cypress CYBLE-224116-01 is a fully certified and qualified
module supporting BluetoothLow Energy (BLE) wireless
communication. The CYBLE-224116-01 is a turnkey solution
that includes onboard power amplifier (PA), low noise amplifier
(LNA), crystal oscillators, chip antenna, passive components,
and the Cypress PSoC4 BLE. Refer to the PSoC 4 BLE
datasheet for additional details on the capabilities of the
PSoC4 BLE device used on this module.
The EZ-BLE™ PSoC XT/XR module provides extended
industrial temperature operation (XT) as well as extended
communication range (XR). The EZ-BLE XT/XR module is a
scalable and reconfigurable platform architecture, combining
programmable and reconfigurable analog and digital blocks with
flexible automatic routing. The CYBLE-224116-01 also includes
digital programmable logic, high-performance analog-to-digital
conversion (ADC), opamps with comparator mode, and standard
communication and timing peripherals. The CYBLE-224116-01
includes a royalty-free BLE stack compatible with Bluetooth 4.2.
Module Description
■Module size: 9.5 mm ×15.4 mm × 1.80 mm (with shield)
❐Drop-in compatible with CYBLE-224110-00 (XT/XR 4.1)
■Extended Range:
❐Up to 400 meters bidirectional communication[1, 2]
❐Up to 450 meters in beacon only mode[1]
■Extended industrial temperature range: –40 °C to +105 °C
■Up to 25 GPIOs
■256-KB flash memory, 32-KB SRAM memory
■Bluetooth 4.2 qualified single-mode module
❐QDID: 88953
❐Declaration ID: D032784
■Certified to FCC, CE, MIC, KC, and IC regulations
■32-bit processor (0.9 DMIPS/MHz) operating at up to 48 MHz
■Watchdog timer with dedicated internal low-speed oscillator
Power Consumption
■TX output power: –18 dBm to +9.5 dBm
■RX Receive Sensitivity: –95 dBm
■Received signal strength indicator (RSSI) with 1-dB resolution
■1 Second connection interval with PA/LNA active: 26.3 µA
■TX current consumption:
❐BLE silicon: 15.6 mA (radio only, 0 dBm)
❐SE2438T: 20 mA (PA/LNA only, +9.5 dBm)
■RX current consumption of 16.4 mA (radio only)
❐BLE silicon: 16.4 mA (radio only)
❐SE2438T: 5.5 mA (PA/LNA only)
■Low power mode support
❐Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on
❐Hibernate: 150 nA with SRAM retention
❐Stop: 60 nA with XRES wakeup
Integrated PA/LNA
■Supports output power up to +9.5 dBm and RXSof –95 dBm
Programmable Analog
■Four opamps with reconfigurable high-drive external and
high-bandwidth internal drive, comparator modes, and ADC
input buffering capability; can operate in Deep-Sleep mode
■12-bit, 1-Msps SAR ADC with differential and single-ended
modes; channel sequencer with signal averaging
■Two current DACs (IDACs) for general-purpose or capacitive
sensing applications on any pin
■One low-power comparator that operate in Deep-Sleep mode
Programmable Digital
■Fourprogrammablelogicblockscalleduniversaldigitalblocks,
(UDBs), each with eight macrocells and datapath
■Cypress-provided peripheral Component library, user-defined
state machines, and Verilog input
Capacitive Sensing
■Cypress CapSense Sigma-Delta (CSD) provides best-in-class
SNR (> 5:1) and liquid tolerance
Segment LCD Drive
■LCD drive supported on all GPIOs (common or segment)
■Operates in Deep-Sleep mode with four bits per pin memory
Serial Communication
■Twoindependent runtime reconfigurable serial communication
blocks (SCBs) with I2C, SPI, or UART functionality
Timing and Pulse-Width Modulation
■Four 16-bit timer, counter, pulse-width modulator (TCPWM)
blocks
■Center-aligned, Edge, and Pseudo-random modes
Up to 25 Programmable GPIOs
■Any GPIO pin can be CapSense, LCD, analog, or digital
■Two overvoltage-tolerant (OVT) pins; drive modes, strengths,
and slew rates are programmable
Notes
1. Connection range tested module-to-module in full line-of-sight environment, free of obstacles or interference sources with output power of +9.5 dBm.
2. Specified as EZ-BLE XT/XR module to module range. Mobile phone connection will decrease based on the PA/LNA performance of the mobile phone used.
Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 2 of 47
More Information
Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to
quickly and effectively integrate the module into your design.
■Overview: EZ-BLE Module Portfolio, Module Roadmap
■EZ-BLE PSoC Product Overview
■PSoC 4 BLE Silicon Datasheet
■Application notes: Cypress offers a number of BLE application
notescovering a broadrange of topics, frombasic to advanced
level. Recommended application notes for getting started with
EZ-BLE modules are:
❐AN96841 - Getting Started with EZ-BLE Module
❐AN94020 - Getting Started with PSoC®4 BLE
❐AN97060 - PSoC®4 BLE and PRoC™ BLE - Over-The-Air
(OTA) Device Firmware Upgrade (DFU) Guide
❐AN91162 - Creating a BLE Custom Profile
❐AN91184 - PSoC 4 BLE - Designing BLE Ap PSoC 4 BLE -
Designing BLE Applications
❐AN92584 - Designing for Low Power and Estimating Battery
Life for BLE Applications
❐AN85951 - PSoC®4 CapSense®Design Guide
❐AN95089 - PSoC®4/PRoC™ BLE Crystal Oscillator Selec-
tion and Tuning Techniques
❐AN91445 - Antenna Design and RF Layout Guidelines
■Technical Reference Manual (TRM):
❐PSoC®4 BLE Technical Reference Manual
❐PSoC®4 BLE Registers Technical Reference Manual
❐PRoC™ and PSoC® Programming Specifications
■Knowledge Base Article
❐KBA216235 - Pin Mapping Differences Between the
EZ-BLE™PSoC®EvaluationBoard(CYBLE-224116-EVAL)
and the BLE Pioneer Kit (CY8CKIT-042-BLE)
❐KBA97095 - EZ-BLE™ Module Placement
❐KBA213260 - RF Regulatory Certifications for CY-
BLE-224110-00 and CYBLE-224116-01 EZ-BLE™ PSoC®
XT/XR Modules
❐KBA213976-FAQforBLEandRegulatoryCertificationswith
EZ-BLE modules
❐KBA210802 - Queries on BLE Qualification and Declaration
Processes
■Development Kits:
❐CYBLE-224116-EVAL, CYBLE-224116-01 Evaluation Board
❐CY8CKIT-042-BLE, Bluetooth®Low Energy (BLE) Pioneer
Kit
❐CY8CKIT-002, PSoC®MiniProg3 Program and Debug Kit
■Test and Debug Tools:
❐CYSmart, Bluetooth®LE Test and Debug Tool (Windows)
❐CYSmart Mobile, Bluetooth®LE Test and Debug Tool
(Android/iOS Mobile App)
Two Design Environments to Get You Started Quickly
PSoC®Creator™IntegratedDesignEnvironment(IDE)
PSoC Creator is an Integrated Design Environment (IDE) that enables concurrent hardware and firmware editing, compiling and
debugging of PSoC 3, PSoC 4, PSoC 5LP, PSoC 4 BLE, PRoC BLE and EZ-BLE module systems with no code size limitations. PSoC
peripherals are designed using schematic capture and simple graphical user interface (GUI) with over 120 pre-verified,
production-ready PSoC Components™. PSoC Components are analog and digital ”virtual chips” represented by an icon that users
can drag-and-drop into a design and configure to suit a broad array of application requirements.
Bluetooth Low Energy Component
The Bluetooth Low Energy Component inside PSoC Creator provides a comprehensive GUI-based configuration window that lets you
quickly design BLE applications. The Component incorporates a Bluetooth Core Specification v4.1 compliant BLE protocol stack and
provides API functions to enable user applications to interface with the underlying Bluetooth Low Energy Sub-System (BLESS)
hardware via the stack.
EZ-Serial™ BLE Firmware Platform
The EZ-Serial Firmware Platform provides a simple way to access the most common hardware and communication features needed
in BLE applications. EZ-Serial implements an intuitive API protocol over the UART interface and exposes various status and control
signals through the module’s GPIOs, making it easy to add BLE functionality quickly to existing designs.
Use a simple serial terminal and evaluation kit to begin development without requiring an IDE. Refer to the EZ-Serial webpage for
User Manuals and instructions for getting started as well as detailed reference materials.
EZ-BLE modules are pre-flashed with the EZ-Serial Firmware Platform. If you do not have EZ-Serial pre-loaded on your module, you
can download each EZ-BLE module’s firmware images on the EZ-Serial webpage.
Technical Support
■Frequently Asked Questions (FAQs): Learn more about our BLE ECO System.
■Forum: See if your question is already answered by fellow developers on the PSoC 4 BLE and PRoC BLE forums.
■Visit our support page and create a technical support case or contact a local sales representatives. If you are in the United States,
you can talk to our technical support team by calling our toll-free number: [phone]. Select option 2 at the prompt.
Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 3 of 47
Contents
Overview............................................................................ 4
Module Description...................................................... 4
Pad Connection Interface ................................................ 6
Recommended Host PCB Layout ................................... 8
Digital and Analog Capabilities and Connections....... 10
Power Supply Connections and Recommended External
Components.................................................................... 12
Connection Options................................................... 12
External Component Recommendation .................... 12
Critical Components List ........................................... 15
Antenna Design......................................................... 15
Enabling Extended Range Feature........................... 16
Power Saving Measures with PA/LNA Operation ..... 17
Electrical Specifications................................................ 18
GPIO ......................................................................... 20
XRES......................................................................... 22
Analog Peripherals.................................................... 22
Digital Peripherals..................................................... 26
Serial Communication............................................... 28
Memory ..................................................................... 29
System Resources.................................................... 29
Environmental Specifications....................................... 35
Environmental Compliance ....................................... 35
RF Certification.......................................................... 35
Safety Certification.................................................... 35
Environmental Conditions ......................................... 35
ESD and EMI Protection ........................................... 35
Regulatory Information.................................................. 36
FCC........................................................................... 36
Innovation, Science and Economic Development (ISED)
Canada Certification......................................................... 37
European Declaration of Conformity......................... 38
MIC Japan................................................................. 38
KC Korea................................................................... 38
Packaging........................................................................ 39
Ordering Information...................................................... 41
Part Numbering Convention...................................... 41
Acronyms........................................................................ 42
Document Conventions................................................. 44
Units of Measure....................................................... 44
Document History Page................................................. 45
Sales, Solutions, and Legal Information...................... 47
Worldwide Sales and Design Support....................... 47
Products.................................................................... 47
PSoC® Solutions ...................................................... 47
Cypress Developer Community................................. 47
Technical Support ..................................................... 47
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 4 of 47
Overview
Module Description
The CYBLE-224116-01 is an integrated wireless module designed to be soldered to the main host board.
Module Dimensions and Drawing
Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE
module functionality. Such selections will guarantee that all height restrictions of the component area are maintained. Designs should
be completed with the physical dimensions shown in the mechanical drawings in Figure 1. All dimensions are in millimeters (mm).
Table 1. Module Design Dimensions
See Figure 1 on page 5 for the mechanical reference drawing for CYBLE-224116-01.
Dimension Item Specification
Module dimensions Length (X) 9.50 ± 0.15 mm
Width (Y) 15.40 ± 0.15 mm
Antenna location dimensions Length (X) 7.00 mm
Width (Y) 5.00 mm
PCB thickness Height (H) 0.50 ± 0.10 mm
Shield height Height (H) 1.10 ± 0.10 mm
Maximum component height Height (H) 1.30-mm typical (chip antenna)
Total module thickness (bottom of module to highest component) Height (H) 1.80-mm typical
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 5 of 47
Figure 1. Module Mechanical Drawing
Top View
Bottom View (Seen from Bottom)
Side View
Note
3. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on
recommended host PCB layout, see Figure 3, Figure 4, Figure 5, and Figure 6 and Table 3.
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 6 of 47
Pad Connection Interface
As shown in the bottom view of Figure 1 on page 5, the CYBLE-224116-01 connects to the host board via solder pads on the back of
the module. Table 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-224116-01 module.
Figure 2. Solder Pad Dimensions (Seen from Bottom)
Table 2. Solder Pad Connection Description
Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch
SP 32 Solder Pads 0.71 mm 0.41 mm 0.76 mm
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 7 of 47
To maximize RF performance, the host layout should follow these recommendations:
1. The ideal placement of the Cypress BLE module is in a corner of the host board with the antenna located on the edge of the host
board. This placement minimizes the additional recommended keep-out area shown in item 2. Refer to AN96841 for module
placement best practices.
2. To maximize RF performance, the area immediately around the Cypress BLE module chip antenna should contain an additional
keep-out area, where no grounding or signal traces are contained. The keep-out area applies to all layers of the host board. The
recommended dimensions of the host PCB keep-out area are shown in Figure 3 (dimensions are in mm).
Figure 3. Recommended Host PCB Keep-Out Area Around the CYBLE-224116-01 Chip Antenna
Host PCB Keep-Out Area Around Chip Antenna
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 8 of 47
Recommended Host PCB Layout
Figure 4, Figure 5, Figure 6, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the
CYBLE-224116-01. Dimensions are in millimeters unless otherwise noted. The minimum recommended host PCB pad length is 0.91
mm (0.455 mm from center of the pad to either side) is recommended as shown in Figure 6. The host PCB layout pattern can be
completed using either Figure 4, Figure 5, or Figure 6. It is not necessary to use all figures to complete the host PCB layout pattern.
Figure 4. Host Layout Pattern for CYBLE-224116-01 Figure 5. Module Pad Location from Origin
Top View (Seen on Host PCB)
Top View (Seen on Host PCB)
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 9 of 47
Table 3 provides the center location for each solder pad on the CYBLE-224116-01. All dimensions are referenced to the center of the
solder pad. Refer to Figure 6 for the location of each module solder pad.
Table 3. Module Solder Pad Location Figure 6. Solder Pad Reference Location
Solder Pad
(Center of Pad) Location (X,Y) from Orign (mm) Dimension from Orign (mils)
1 (0.26, 3.37) (10.24, 132.68)
2 (0.26, 4.13) (10.24, 162.68)
3 (0.26, 4.89) (10.24, 192.68)
4 (0.26, 5.66) (10.24, 222.68)
5 (0.26, 6.42) (10.24, 252.68)
6 (0.26, 7.18) (10.24, 282.68)
7 (0.26, 7.94) (10.24, 312.68)
8 (0.26, 8.70) (10.24, 342.68)
9 (0.56, 15.14) (22.05, 596.06)
10 (1.32,15.14) (51.97, 596.06)
11 (2.08, 15.14) (81.89, 596.06)
12 (2.84,15.14) (111.81, 596.06)
13 (3.61, 15.14) (142.13, 596.06)
14 (4.37, 15.14) (172.13, 596.06)
15 (5.13, 15.14) (202.13, 596.06)
16 (5.89, 15.14) (231.89, 596.06)
17 (6.65,15.14) (261.81, 596.06)
18 (7.42, 15.14) (292.13, 596.06)
19 (8.18, 15.14) (322.05, 596.06)
20 (8.94, 15.14) (351.97, 596.06)
21 (9.24, 14.04) (363.78, 552.76)
22 (9.24, 13.28) (363.78, 522.83)
23 (9.24, 12.51) (363.78,492.52)
24 (9.24, 11.75) (363.78, 462.60)
25 (9.24,10.99) (363.78, 432.68)
26 (9.24,10.23) (363.78, 402.76)
27 (9.24, 9.47) (363.78, 372.83)
28 (9.24, 8.70) (363.78, 342.52)
29 (9.24, 7.94) (363.78, 312.60)
30 (9.24, 7.18) (363.78, 282.68)
31 (9.24, 6.42) (363.78, 252.76)
32 (9.24,5.66) (363.78, 222.83)
Top View (Seen on Host PCB)
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 10 of 47
Digital and Analog Capabilities and Connections
Table 4 and Table 5 detail the solder pad connection definitions and available functions for each connection pad. Table 4 lists the
solder pads on CYBLE-224116-01, the BLE device port-pin, and denotes whether the digital function shown is available for each
solder pad. Table 5 denotes whether the analog function shown is available for each solder pad. Each connection is configurable for
a single option shown with a ✓.
Table 4. Digital Peripheral Capabilities
Pad
Number Device Port Pin UART SPI I2CTCPWM[4,5] Cap- Sense WCO Out ECO OUT LCD SWD GPIO
1GND
[6] Ground Connection
2 XRES External Reset Hardware Connection Input
3P1.5
✓(SCB0_TX) ✓(SCB0_MISO) ✓(SCB0_SCL) ✓(TCPWM) ✓✓✓
4P1.1 ✓(SCB1_SS1) ✓(TCPWM) ✓✓✓
5P1.0 ✓(TCPWM) ✓✓✓
6P0.1✓(SCB1_TX) ✓(SCB1_MISO) ✓(SCB1_SCL) ✓(TCPWM) ✓✓✓
7P0.4✓(SCB0_RX) ✓(SCB0_MOSI) ✓(SCB0_SDA) ✓(TCPWM) ✓✓✓ ✓
8P0.5✓(SCB0_TX) ✓(SCB0_MISO) ✓(SCB0_SCL) ✓(TCPWM) ✓✓✓
9P0.7✓(SCB0_CTS) ✓(SCB0_SCLK) ✓(TCPWM) ✓✓
✓
(SWDCLK)
✓
10 P1.3 ✓(SCB1_SS3) ✓(TCPWM) ✓✓✓
11 VDDR Radio Power Supply (2.0 V to 3.6 V)
12 P0.6 ✓(SCB0_RTS) ✓(SCB0_SS0) ✓(TCPWM) ✓✓✓
(SWDIO) ✓
13 P1.2 ✓(SCB1_SS2) ✓(TCPWM) ✓✓✓
14 VDD Digital Power Supply Input (2.0 V to 3.6 V)
15 P1.4 ✓(SCB0_RX) ✓(SCB0_MOSI) ✓(SCB0_SDA) ✓(TCPWM) ✓✓✓
16 P2.1 ✓(SCB0_SS2) ✓(TCPWM) ✓✓✓
17 VDDA Analog Power Supply Input (2.0 V to 3.6 V)
18 P2.2 ✓(SCB0_SS3) ✓(TCPWM) ✓✓✓
19 P2.6 ✓(TCPWM) ✓✓✓
20 P3.0 ✓(SCB0_RX) ✓(SCB0_SDA) ✓(TCPWM) ✓✓✓
21 P2.3 ✓(TCPWM) ✓✓ ✓ ✓
22 VREF Reference Voltage Input
23 P3.4 ✓(SCB1_RX) ✓(SCB1_SDA) ✓(TCPWM) ✓✓✓
24 P3.5 ✓(SCB1_TX) ✓(SCB1_SCL) ✓(TCPWM) ✓✓✓
25 P3.7 ✓(SCB1_CTS) ✓(TCPWM) ✓✓ ✓ ✓
26 P3.1 ✓(SCB0_TX) ✓(SCB0_SCL) ✓(TCPWM) ✓✓✓
27 P3.6 ✓(SCB1_RTS) ✓(TCPWM) ✓✓✓
28 P2.5 ✓(TCPWM) ✓✓✓
29 P5.0 ✓(SCB1_RX) ✓(SCB1_SS0) ✓(SCB1_SDA) ✓(TCPWM3_P) ✓✓✓
30 P5.1 ✓(SCB1_TX) ✓(SCB1_SCLK) ✓(SCB1_SCL) ✓(TCPWM3_N) ✓✓✓ ✓
31 P2.4 ✓(TCPWM) ✓✓✓
32 GND[6] Ground Connection
Notes
4. TCPWM stands for timer, counter, and PWM. If supported, the pad can be configured to any of these peripheral functions.
5. TCPWM connections on ports 0, 1, 2, and 3 can be routed through the Digital Signal Interconnect (DSI) to any of the TCPWM blocks and can be either positive
or negative polarity. TCPWM connections on port 5 are direct and can only be used with the specified TCPWM block and polarity specified above.
6. The main board needs to connect both GND connections (Pad 1 and Pad 32) on the module to the common ground of the system.
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 11 of 47
.
Table 5. Analog Peripheral Capabilities
Pad Number Device Port Pin SARMUX OPAMP LPCOMP
1GND
[6] Ground Connection
2 XRES External Reset Hardware Connection Input
3P1.5 ✓(CTBm1_OA1_INP)
4P1.1 ✓(CTBm1_OA0_INN)
5P1.0 ✓(CTBm1_OA0_INP)
6P0.1
7P0.4 ✓(COMP1_INP)
8P0.5 ✓(COMP1_INN)
9P0.7
10 P1.3 ✓(CTBm1_OA1_OUT)
11 VDDR Radio Power Supply (2.0 V to 3.6 V)
12 P0.6
13 P1.2 ✓(CTBm1_OA0_OUT)
14 VDD Digital Power Supply Input (2.0 V to 3.6 V)
15 P1.4 ✓(CTBm1_OA1_INN)
16 P2.1 ✓(CTBm0_OA0_INN)
17 VDDA Analog Power Supply Input (2.0 V to 3.6 V)
18 P2.2 ✓(CTBm0_OA0_OUT)
19 P2.6 ✓(CTBm0_OA0_INP)
20 P3.0 ✓
21 P2.3 ✓(CTBm0_OA1_OUT)
22 VREF Reference Voltage Input (Optional)
23 P3.4 ✓
24 P3.5 ✓
25 P3.7 ✓
26 P3.1 ✓
27 P3.6 ✓
28 P2.5 ✓(CTBm0_OA1_INP)
29 P5.0
30 P5.1
31 P2.4 ✓(CTBm0_OA1_INN)
32 GND Ground Connection
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 12 of 47
Power Supply Connections and Recommended External Components
Power Connections
The CYBLE-224116-01 contains three power supply connec-
tions,VDD,VDDA, andVDDR.The VDD and VDDAconnections
supply power for the digital and analog device operation respec-
tively. VDDR supplies power for the device radio and PA/LNA.
VDD, VDDA, and VDDR accept a supply range of 2.0 V to 3.6 V.
These specifications can be found in Table 13. The maximum
power supply ripple for both power connections on the module is
100 mV, as shown in Table 11.
The power supply ramp rate of VDD and VDDA must be equal
to or greater than that of VDDR when the radio is used.
Connection Options
Two connection options are available for any application:
1. Single supply: Connect VDD, VDDA, and VDDR to the same
supply.
2. Independent supply: Power VDD, VDDA, and VDDR
separately.
External Component Recommendation
In either connection scenario, it is recommended to place an
external ferrite bead between the supply and the module
connection. The ferrite bead should be positioned as close as
possible to the module pin connection.
Figure 7 details the recommended host schematic options for a
single supply scenario. The use of one or three ferrite beads will
depend on the specific application and configuration of the
CYBLE-224116-01.
Figure 8 details the recommended host schematic for an
independent supply scenario.
Therecommendedferritebeadvalueis330, 100 MHz.(Murata
BLM21PG331SN1D).
Figure 7. Recommended Host Schematic Options for a Single Supply Option
Three Ferrite Bead Option (Seen from Bottom)
Single Ferrite Bead Option (Seen from Bottom)
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 13 of 47
Figure 8. Recommended Host Schematic for an Independent Supply Option
Independent Power Supply Option (Seen from Bottom)
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 14 of 47
The CYBLE-224116-01 schematic is shown in Figure 9.
Figure 9. CYBLE-224116-01 Schematic Diagram
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 15 of 47
Critical Components List
Table 6 details the critical components used in the CYBLE-224116-01 module.
Table 6. Critical Component List
Antenna Design
Table 7 details the antenna used on the CYBLE-224116-01 module. The Cypress module performance improves many of these
characteristics. For more information, see Table 12.
Table 7. Chip Antenna Specifications
Power Amplifier (PA) and Low Noise Amplifier (LNA)
Table 8 details the PA/LNA that is used on the CYBLE-224116-01 module. For more information, see Table 12.
Table 8. Power Amplifier/Low Noise Amplifier Details
Table 9 details the power consumption of the integrated PA/LNA used on the CYBLE-224116-01 module. Table 9 only details the
current consumption of the SE2438T PA/LNA. VCC = VCC1 = VCC2 = 3 V, TA= +25 °C, measured on the SE2438T evaluation board,
unless otherwise noted.
Table 9. Power Amplifier/Low Noise Amplifier Current Consumption Specifications
Component Reference Designator Description
Silicon U1 76-pin WLCSP Programmable System-on-Chip (PSoC) with BLE
Crystal Y1 24.000 MHz, 10PF
Crystal Y2 32.768 kHz, 12.5PF
Item Description
Chip Antenna Manufacturer Johanson Technology Inc.
Chip Antenna Part Number 2450AT18B100
Frequency Range 2400 – 2500 MHz
Peak Gain 0.5-dBi typical
Average Gain –0.5-dBi typical
Return Loss 9.5-dB minimum
Item Description
PA/LNA Manufacturer Skyworks Inc.
PA/LNA Part Number SE2438T
Power Supply Range 2.0 V ~ 3.6 V
Parameter Symbol Test Condition Min Typ Max Units
Total supply current ICC_Tx14 Tx mode POUT = +14 dBm – 33 – mA
Total supply current ICC_Tx12 Tx mode POUT = +12 dBm – 25 – mA
Total supply current ICC_Tx10 Tx mode POUT = +10 dBm – 20 – mA
Quiescent current ICQ_Tx No RF – 6 – mA
Total supply current ICC_RXHG Rx Low Noise Amplifier (LNA) High Gain mode – 5.5 – mA
Total supply current ICC_RXLG Rx LNA Low Gain mode – 2.7 – mA
Total supply current ICC_RXBypass Rx Bypass mode – – 10 µA
Sleep supply current ICC_OFF No RF – 0.05 1.0 µA
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 16 of 47
Enabling Extended Range Feature
The CYBLE-224116-01 module comes with an integrated Power Amplifier/Low Noise Amplifier to allow for extended communication
range of up to 400 meters full line-of-sight. This section describes the firmware steps required to enable extended range operation of
the CYBLE-224116-01 module. For detailed step-by-step instructions, refer to the Getting Started with EZ-BLE Module Application
Note, Appendix B.2.3.2.
The PA/LNA integrated on the CYBLE-224116-01 module must be configured properly in order for the module to function as intended.
In cases which require radio transmission without extended range functionality, the PA/LNA must be set to Bypass mode in order to
ensure that the RF signal reaches the antenna. If the PA/LNA is disabled instead, the antenna will be unable to radiate any signal.
Refer to Table 10 for the correct CSD and CPS configurations for PA/LNA Bypass mode.
The Skyworks SE2438T PA/LNA is controlled by PSoC4 BLE and uses four pins:
1.Two pins for the radio enable (CPS - P0[2], CSD - P0[3]). The CPS and CSD pins are controlled in the firmware application code
of the CYBLE-224116-01.
2.One pin to control the PA enable (P3[2]). The PA enable pin is controlled directly by the BLE Link Layer.
3.One pin to control the LNA enable (P3[3]). The LNA enable pin is controlled directly by the BLE Link Layer.
4.Ensure that the PSoC®4 BLE silicon device “Adv/Scan TX Power Level (dBm)” and “Connection TX Power Level (dBm)” in the BLE
component are both set to -6 dBm[7].
To enable the extended range functionality, follow the steps outlined below.
1.Drag and drop two “Digital Output Pin” components from the Component Catalog to the schematic page in PSoC Creator
2.Double-click the pins and rename them as CPS and CSD. The HW connection option in the component configuration should be
unchecked as these are Firmware GPIOs.
3.To configure the CPS and CSD pins, open your project's Design-Wide Resources file (for example, “Project_Name.cydwr”) from
your Workspace Explorer and click the “Pins” tab. The “Pins” tab is used to select the physical device connections for the outputs
(CPS, CSD). These pins are connected to the enable pins of the Skyworks SE2438T Power Amplifier. In order for extended range
operation to function, it is required to configure the CPS and CSD pins to P0[2] and P0[3] respectively.
4.Open your project’s main.c file and write the below code to define the register at the top of the code.
5.Locate/add the event “CYBLE_EVT_STACK_ON" in the application code and insert the below four lines of code to enable the
Skyworks SE2438T.
/* define the test register to switch the PA/LNA hardware control pins */
#define CYREG_SRSS_TST_DDFT_CTRL 0x40030008
/* Mandatory events to be handled by BLE application code */
case CYBLE_EVT_STACK_ON:
/* Enable the Skyworks SE2438T PA/LNA */
CSD_Write(1);
CPS_Write(1);
/* Configure the Link Layer to automatically switch PA control pin P3[2] and LNA control pin P3[3] */
CY_SET_XTND_REG32((void CYFAR *)(CYREG_BLE_BLESS_RF_CONFIG), 0x0331);
CY_SET_XTND_REG32((void CYFAR *)(CYREG_SRSS_TST_DDFT_CTRL), 0x80000302);
Note
7. The CYBLE-224116-01 module is certified for FCC, IC, CE, MIC and KC regulations at an output power of +9.5 dBm. To achieve this output power, RFO2
(PSoC 4 BLE silicon PA level) must be set to the -6 dBm setting in firmware. Settings higher than this will result in higher output power than specified in the
CYBLE-224116-01 certifications.
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 17 of 47
Power Saving Measures with PA/LNA Operation
The section will describe power saving measures available for controlling the integrated PA/LNA on the CYBLE-224116-01 module.
Table 10 lists the states available through via the CSD and CPS logic control signals.
Table 10. PA/LNA Logic Controls and Power Modes
Power Optimization Tips with Extended Range Functionality
If left in High Power TX and High Gain RX mode continuously, the integrated PA/LNA on the CYBLE-224116-01 module will draw
morecurrent than may bedesired. Optimizing the averagepowerconsumption of the CYBLE-224116-01 module can be accomplished
via the CSD and CPS logic control signals explained in Enabling Extended Range Feature and shown in Table 10.
To minimize power consumption of a BLE solution that is utilizing the extended range feature of the CYBLE-224116-01, the PA/LNA
should be set to either Mode 0 (All Off) or Mode 1 (Standby). Transitioning the PA/LNA from Mode 3 (High Power and High Gain) to
either Mode 0 or 1 needs to be taken care of in the application firmware. The recommendations below should be followed when
changing modes of the PA/LNA on the CYBLE-224116-01 module.
1.To set the PA/LNA to a low power mode, either Power Mode 0 or Power Mode 1 should be entered just before the BLE application
firmware transitions the PSoC®4 BLE silicon device to a Sleep or Deep Sleep mode. To execute the transition of the PA/LNA to a
lower power mode, the below code should be used in the low power routine in the application firmware. Power Mode 0 and Power
Mode 1 PA/LNA commands are both shown.
2.WhentheBLEsystemis transitioningtoActivemode(i.e.waking fromlowpowermode)andextendedrangefunctionalityisrequired,
it is necessary to enable the PA/LNA to Power Mode 3. Enabling the PA/LNA should be the first action completed during when
transitioning the PSoC®4 BLE silicon device from a low power mode to active mode. Enabling the PA/LNA to Power Mode 3 can
be completed using the following commands in the wakeup routine of the application firmware.
3.Power Mode 2 (TX/RX Bypass) is not recommended for typical low power mode use. Bypass mode should be considered if a
transition from Extended Range functionality to short-range communication is desired on-the-fly. Transitions from Active mode to
Bypass mode are only recommended after a BLE event has completed and no RF activity is in process.
PA/LNA Mode CSD (P0[3]) Logic State CPS (P0[2]) Logic State Description
0 0 0 All Off. Lowest Power Mode
PA and LNA are off
1 0 1 Standby Mode
Recommended mode for low power operation
2 1 0 TX and RX Bypass Mode
3 1 1 High Power TX and High Gain RX
/* Set the Skyworks SE2438T PA/LNA to Power Mode 0 (All Off)*/
CSD_Write(0);
CPS_Write(0);
/* Set the Skyworks SE2438T PA/LNA to Power Mode 1 (Standby)*/
CSD_Write(0);
CPS_Write(1);
/* Set the Skyworks SE2438T PA/LNA to Power Mode 3 (High Power and High Gain)*/
CSD_Write(1);
CPS_Write(1);
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 18 of 47
Electrical Specifications
Table 11 details the absolute maximum electrical characteristics for the Cypress BLE module.
Table 11. CYBLE-224116-01 Absolute Maximum Ratings
Table 12 details the RF characteristics for the Cypress BLE module.
Table 12. CYBLE-224116-01 RF Performance Characteristics
Table 13 through Table 55 list the module-level electrical characteristics for the CYBLE-224116-01. All specifications are valid for
–40 °C TA 105 °C, except where noted. Specifications are valid for 2.0 V to 3.6 V, except where noted.
Parameter Description Min Typ Max Units Details/Conditions
VDD_ABS VDD, VDDA and VDDR supply relative to VSS
(VSSD = VSSA)-0.3 – 3.6 V Restricted by SE2438T
VCCD_ABS Direct digital core voltage input relative to VSSD –0.5 – 1.95 V Absolute maximum
VDD_RIPPLE Maximum power supply ripple for VDD, VDDA and
VDDR input voltage ––100mV
3.0-V supply
Ripple frequency of 100 kHz
to 750 kHz
VGPIO_ABS GPIO voltage –0.5 – VDD +0.5 V Absolute maximum
IGPIO_ABS Maximum current per GPIO –25 – 25 mA Absolute maximum
IGPIO_injection GPIO injection current: Maximum for VIH > VDD and
minimum for VIL < VSS –0.5 – 0.5 mA Absolute maximum current
injected per pin
LU Pin current for latch up –200 200 mA –
Parameter Description Min Typ Max Units Details/Conditions
RFO1[8] RF output power on ANT
PA active –3.5 0 9.5 dBm Configurable via register
settings. PA active.
RFO2 = –6 dBm
PA/LNA active.
RFO2 RF output power on ANT
PA bypassed -18 0 3 dBm PSoC 4 BLE Silicon. Config-
urable via register settings.
PA in bypass mode.
RXS1 RF receive sensitivity on ANT
LNA active – –95 – dBm Measured value
RXS2 RF receive sensitivity on ANT
LNA bypassed – –87 – dBm Measured value
FRModule frequency range 2402 – 2480 MHz –
GPPeak gain – 0.5 – dBi –
RL Return loss – –10 – dB –
Table 13. CYBLE-224116-01 DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
VDD Power supply input voltage (VDD, VDDA, VDDR) 2.0 – 3.6 V Restricted by SE2438T
VDDR VDD
Active Mode, VDD =2.0Vto3.6V
IDD3 Execute from flash; CPU at 3 MHz – 1.7 – mA T = 25 °C,
VDD = 3.3 V
IDD4 Execute from flash; CPU at 3 MHz – – – mA T = –40 °C to 105 °C
Note
8. The CYBLE-224116-01 module is certified for FCC, ISED, CE, MIC, and KC regulations at an output power of +9.5 dBm. To achieve this output power, RFO2
must be set to the –6 dBm setting in firmware. Settings higher than this willresult in higher output power than specified in the CYBLE-224116-01 certifications.
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 19 of 47
Table 14. AC Specifications
IDD5 Execute from flash; CPU at 6 MHz – 2.5 – mA T = 25 °C,
VDD = 3.3 V
IDD6 Execute from flash; CPU at 6 MHz – – – mA T = –40 °C to 105 °C
IDD7 Execute from flash; CPU at 12 MHz – 4 – mA T = 25 °C,
VDD = 3.3 V
IDD8 Execute from flash; CPU at 12 MHz – – – mA T = –40 °C to 105 °C
IDD9 Execute from flash; CPU at 24 MHz – 7.1 – mA T = 25 °C,
VDD = 3.3 V
IDD10 Execute from flash; CPU at 24 MHz – – – mA T = –40 °C to 105 °C
IDD11 Execute from flash; CPU at 48 MHz – 13.4 – mA T = 25 °C,
VDD = 3.3 V
IDD12 Execute from flash; CPU at 48 MHz – – – mA T = –40 °C to 105 °C
Sleep Mode, VDD and VDDR = 2.0 V to 3.6 V, PA/LNA in All Off mode
IDD13 IMO on – – – mA T = 25 °C, VDD = 3.3 V,
SYSCLK = 3 MHz
Sleep Mode, VDD and VDDR = 2.0 V to 3.6 V, PA/LNA in All Off mode
IDD14 ECO on – – – mA T = 25 °C, VDD = 3.3 V,
SYSCLK = 3 MHz
Deep-Sleep Mode, VDD and VDDR = 2.0 V to 3.6 V, PA/LNA in All Off mode
IDD15 WDT with WCO on – 2.3 – µA T = 25 °C,
VDD = 3.3 V
IDD16 WDT with WCO on – – – µA T = –40 °C to 105 °C
IDD18 WDT with WCO on – – – µA T = –40 °C to 105 °C
Hibernate Mode, VDD and VDDR = 2.0 V to 3.6 V, PA/LNA in All Off mode
IDD27 GPIO and reset active – 150 – nA T = 25 °C,
VDD = 3.3 V
IDD28 GPIO and reset active – – – nA T = –40 °C to 105 °C
Stop Mode, VDD = VDDR = 2.0 V to 3.6 V, PA/LNA in All Off
IDD33 Stop-mode current (VDD)–20–nA
T = 25 °C,
VDD = 3.3 V
IDD34 Stop-mode current (VDDR) – 540 –- nA T = 25 °C,
VDDR = 3.3 V
IDD35 Stop-mode current (VDD) – – – nA T = –40 °C to 105 °C
IDD36 Stop-mode current (VDDR)–––nA
T = –40 °C to 105 °C,
VDDR = 2.0 V to 3.6 V
Parameter Description Min Typ Max Units Details/Conditions
FCPU CPU frequency DC – 48 MHz 2.0 V VDD 3.6 V
TSLEEP Wakeup from Sleep mode – 0 – µs Guaranteed by character-
ization
TDEEPSLEEP Wakeup from Deep-Sleep mode – – 25 µs 24-MHz IMO. Guaranteed
by characterization
THIBERNATE Wakeup from Hibernate mode – – 2 ms Guaranteed by character-
ization
TSTOP Wakeup from Stop mode – – 2 ms Guaranteed by character-
ization
Table 13. CYBLE-224116-01 DC Specifications (continued)
Parameter Description Min Typ Max Units Details/Conditions
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.

CYBLE-224116-01
Document Number: 002-12524 Rev. *D Page 20 of 47
GPIO
Note
9. VIH must not exceed VDD + 0.2 V.
Table 15. GPIO DC Specifications
Parameter Description Min Typ Max Units Details/Conditions
VIH[9] Input voltage HIGH threshold 0.7 × VDD – – V CMOS input
LVTTL input, 2.0 V VDD 2.7 V 0.7 × VDD – – V –
LVTTL input, 2.7 V VDD 3.6 V 2.0 – – V –
VIL
Input voltage LOW threshold – – 0.3 × VDD V CMOS input
LVTTL input, 2.0 V VDD 2.7 V – – 0.3 × VDD V–
LVTTL input, 2.7 V VDD 3.6 V – – 0.8 V –
VOH Output voltage HIGH level VDD –0.6 – – V IOH = 4 mA at 3.3-V VDD
VOL Output voltage LOW level – – 0.6 V IOL = 8 mA at 3.3-V VDD
RPULLUP Pull-up resistor 3.5 5.6 8.5 k–
RPULLDOWN Pull-down resistor 3.5 5.6 8.5 k–
IIL Input leakage current (absolute value) – – 2 nA 25 °C, VDD = 3.3 V
IIL_CTBM Input leakage on CTBm input pins – – 4 nA –
CIN Input capacitance – – 7 pF –
VHYSTTL Input hysteresis LVTTL 25 40 – mV 2.7 V VDD 3.6 V
VHYSCMOS Input hysteresis CMOS 0.05 ×VDD – – 1 –
IDIODE Current through protection diode to VDD/VSS – – 100 µA –
ITOT_GPIO Maximum total source or sink chip current – – 200 mA –
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.