EPOX EP-3WEF2 User manual

TRADEMARK
All products and company names are trademarks or registered
trademarks of their respective holders.
These specifications are subject to change without notice.
Manual Revision 1.0
March 28, 2000
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mainboard (133/100/66MHz)d (133/100/66MHz)
d (133/100/66MHz)d (133/100/66MHz)
d (133/100/66MHz)
EP-3WEF2EP-3WEF2
EP-3WEF2EP-3WEF2
EP-3WEF2
EP-3WDF2EP-3WDF2
EP-3WDF2EP-3WDF2
EP-3WDF2

EP-3WEF2/3WDF2
User Notice
No part of this product, including the product and software may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any
language in any form without the express written permission of EPoX Computer
Company (hereinafter referred to as EPoX) except for documentation ept by the
purchaser for bac up purposes.
We provide this manual as is without warranty of any ind, either expressed or
implied, including but not limited to the implied warranties or conditions of
merchantability or fitness for a particular purpose. In no event shall EPoX be
liable for any loss of profits, loss of business, loss of use or data, interruption of
business or for indirect, special incidental, or consequential damages of any ind,
even if EPoX has been advised of the possibility of such damages arising from any
defect or error in the manual or product. EPoX may revise this manual from time
to time without notice. For updated BIOS, drivers, or product release information
you may visit our websites at http://www.epox.com or http://www.epox.com.tw.
Products mentioned in this manual are mentioned for identification purposes only.
Product names appearing in this manual may or may not be registered trademar s
or copyrights of their respective companies. The product name and revision
number are both printed on the mainboard itself.
Handling Procedures
Static electricity can severely damage your equipment. Handle the EP-3WEF2/
3WDF2 and any other device in your system with extreme care and avoid unneces-
sary contact with system components on the mainboard. Always wor on an
antistatic surface to avoid possible damage to the mainboard from static discharge.
Always have the power supply unplugged and powered off when inserting and
removing devices within the computer chassis. EPoX assumes no responsibility
for any damage to the EP-3WEF2/3WDF2 mainboard that results from failure to
follow instruction or failure to observe safety precautions.
CAUTION
The EP-3WEF2/3WDF2 mainboard is subject to
damage by static electricity.Al ays observe the
handling procedures.

EP-3WEF2/3WDF2
Technical Support Services
If you need additional information, help during installation or normal use of this
product, please contact your retailer. Your retailer will have the most current
information about your configuration. If your retailer cannot help, you may visit
our online technical support website and/or contact our support technicians at the
locations listed below.
Record your serial number before installing your EP-3WEF2/3WDF2 mainboard.
(The serial number is located near the PCI slots at the edge of the board.)
EP-3WEF2/3WDF2 serial number: _____________________
ontacting Technical Support
EPoX technical support is wor ing hard to answer all of your questions online.
From our website you can find answers to many common questions, drivers, BIOS
updates, tech notes, and important technical bulletins. If you are still unable to
locate the solution you are see ing, you always have the option to contact our
support technicians directly.
North American website (English language)
http://www.epox.com
[email protected]
[email protected]
European website (Multi-language)
http://www.epox.nl
[email protected]
[email protected]
Taiwan website (Chinese language)
http://www.epox.com.tw
[email protected]
[email protected]
Thank you for using EPoX mainboards!
Copyright 2000 EPoX Computer Company. All rights reserved.

EP-3WEF2/3WDF2
Table of Contents
ection 1 Introduction
Components Chec list ................................................... 1-1
Overview
Intel Celeron processors (P.P.G.A.) 370 ...................... 1-2
Intel Coppermine processors (FC-PGA) 370 ............... 1-3
Intel® 810 Series Chipset Feature .................................. 1-4
EP-3WEF2/3WDF2 Form-Factor ................................. 1-6
I/O Shield Connector ...................................................... 1-7
Power-On/Off (Remote) ................................................ 1-7
System Bloc Diagram ................................................... 1-8
ection 2 Features
EP-3WEF2/3WDF2 Features ........................................ 2-1
ection 3 Installation
EP-3WEF2/3WDF2 Detailed Layout ............................ 3-2
Easy Installation Procedure
CPU Insertion ................................................................. 3-3
Jumper Settings ............................................................... 3-5
System Memory Configuration ...................................... 3-6
Device Connectors ......................................................... 3-8
External Modem Ring-in Power ON and
Keyboard Power ON Function (KBPO) ........................ 3-10
STR (Suspend To RAM) Function .................................. 3-12
ection 4 Award BIO etup
Main Menu ...................................................................... 4-1
Standard CMOS Setup .................................................... 4-3
Advanced BIOS Features ................................................ 4-7
Advanced Chipset Features ............................................. 4-10
Integrated Peripherals..................................................... 4-13
Page

EP-3WEF2/3WDF2
Power Management Setup .............................................. 4-18
PNP/PCI Configuration Setup........................................ 4-21
PC Health Status ............................................................. 4-22
Frequency Control .......................................................... 4-24
Defaults Menu................................................................. 4-25
Supervisor/User Password Setting................................. 4-26
Exit Selecting .................................................................. 4-27
ection 5 810 eries VGA and ound Driver Installation
Easy Driver Installation .................................................. 5-1
Appendix
Appendix A
Memory Map................................................................... A-1
I/O Map ........................................................................... A-1
Timer & DMA Channels Map ......................................... A-2
Interrupt Map................................................................... A-2
RTC & CMOS RAM Map ............................................... A-3
Appendix B
POST Codes .................................................................... A-5
Appendix C
Load Optimized Defaults................................................ A-13
Appendix D
GHOST 5.1 Quic Users Guide .................................... A-15

EP-3WEF2/3WDF2
Page Left Blank

IntroductionEP-3WEF2/3WDF2
Page 1-1
Section 1
INTRODUCTION
Components Checklist
99
99
9A. (1) EP-3WEF2/3WDF2 mainboard
99
99
9B. (1) EP-3WEF2/3WDF2 users manual
99
99
9C. (1) Flopp ribbon cable
99
99
9D. (1) ATA66 Hard drive ribbon cable
99
99
9E. (1) RS-232 9-PIN ribbon cable
F. (1) PS/2 to AT ke board connector adapter (optional)
99
99
9G. (1) Onboard Graphic and Sound Driver
USERS
MANUAL
EP-3WEF2/
3WDF2
B
A
F
C
D
EG
or

Introduction EP-3WEF2/3WDF2
Page 1-2
Overview
Intel Celeron processors (P.P.G.A.) 370
The Intel Celeron processors provide power to handle the internet, educational
programs, interactive 3D games, and productivit applications. The Intel Celeron
processors at 533, 500, 466, 433, 400, 366, 333 and 300A MHz include integrated L2
cache 128Kb te. The core for the 533, 500, 466, 433, 400, 366, 333 and 300A MHz
processors have 19M transistors due to the addition of the integrated L2 cache
128Kb te. All the Intel Celeron processors are available in the plastic pin grid arra (P.
P.G.A.) form factor. The P.P.G.A. form factor is compatible with the 370 pin socket. All
the Intel Celeron processors are available in the plastic pin grid arra (PPGA) package.
The PPGA package is compatible with the 370 pin socket and provides more flexibilit
to design low cost s stems b enabling lower profile and smaller s stems and provid-
ing the potential for reducing costs of processor retention and cooling solutions. Like
the Intel Celeron processors that utilize S.E.P.P., the Intel Celeron processors that use
P.P.G.A., feature a P6-microarchitecture-based core processor on a single-sided sub-
strate without BSRAM componentr .
The Intel Celeron processor at 533, 500, 466, 433, 400, 366, 333, and 300A MHz. In-
cludes Intel MMX[tm] media enhancement technolog . Offers D namic Execution
technolog .
Includes a 32Kb te (16Kb te/16Kb te) non-blocking, level-one cache that provides
fast access to heavil used data. Intel Celeron processors at 533, 500, 466, 433, 400,
366, 333 and 300A MHz include integrated L2 cache 128Kb te. All the Intel Celeron
processor utilize the Intel P6 microarchitectures multi-transaction s stem bus at
66MHz. The 533, 500, 466, 433, 400, 366, 333 and 300A MHz processors utilize the Intel
P6 microarchitectures multi-transaction s stem bus with the addition of the L2 cache
interface. The combination of the L2 cache bus and the processor-to-main-memor
s stem bus increases bandwidth and performance over single-bus processors.
Intel MMX technolog includes new instructions and data t pes that allow
applications to achieve a new level of performance. Intels MMX technolog is
designed as a set of basic, general-purpose integer instructions that are easil

IntroductionEP-3WEF2/3WDF2
Page 1-3
applied to the needs of a wide diversit of multimedia and communications
applications. The highlights of the technolog are:
* Single Instruction, Multiple Data (SIMD) technique
* 57 new instructions
* Eight 64-bit wide MMX technolog registers
* Four new data t pes
Intel Coppermine processors (FC-PGA) 370
These Coppermine-128K and Coppermine-256K processor is the next addition to the
P6 micro architecture product famil . The FC-PGA package is a new addition to the
Intel IA-32 processor line and hereafter will be referred to as the Coppermine FC-
PGA processor, or simpl The processor. The package utilizes the same 370-pin
zero insertion force socket (PGA370) used b the Intel Celeron processor. Thermal
solutions are attached directl to the back of the processor core package without the
use of a thermal plate or heat spreader.
The Coppermine processor, like the Intel Celeron, Intel Pentium II and Pentium III in
the P6 famil processor, implement a D namic Execution micro architecture --- a unique
combination of multiple branch prediction, data flow anal sis, and speculative
execution. This enable these processors to deliver higher performance than the Intel
Pentium processor, while maintaining binar compatibilit with all previous Intel Ar-
chitecture processors. The processor also executes Intel MMX technolog instruc-
tions for enhanced media and communication performance just as its predecessor the
Intel Pentium III processor. Additionall the Coppermine FC-PGA processor executes
streaming SIMD (Single-Instruction Multiple Data) Extensions for enhanced floating
point and 3-D application performance. The concept of processor identification, via
CPUID, is extended in the processor famil with the addition of a processor serial
number. The processor utilizes multiple low-power states such as AutoHALT, Stop-
Grant, Sleep and Deep Sleep to conserve power during idle times.
The processor includes an integrated on-die, 128KB or 256KB, 8-wa set associative
level-two (L2) cache with a separated 16KB level one (L1) instruction cache and 16KB
level one (L1) data cache. These cache arra s run at the full speed of the processor

Introduction EP-3WEF2/3WDF2
Page 1-4
core. As with the Intel Pentium III processor, the Coppermine FC-PGA processor has
a dedicated L2 cache bus, thus maintaining the dual independent bus architecture to
deliver high bus bandwidth and performance. Memor is cacheable for 4GB/64GB of
addressable memor space, allowing significant headroom for desktop s stem.
Intel(R) 810 Series chipset features
The Intel(R) 810 series chipset that Built on the strong foundation of Intel(R)
440BX AGPset technolog , the Intel(R) 810 series chipset has re-engineered the
Value PC, providing next generation features and great graphics performance.
The 82810 series Graphics Memor Controller Hub (GMCH) features : Intel(R)
graphics technolog and software drivers, using Direct AGP (integrated AGP) to
create vivid 2D and 3D effects and images. The 82810 series chip feature
integrated Hardware Motion Compensation to improve soft DVD video qualit .
The Inte(R) 82810 series chipset use Intel(R) D namic Video Memor Technol-
og (D.V.M.T.) is an architecture that offers breakthrough performance for the
(motherboard) PC through efficient memor utilization and Direct AGP. The s stem
OS uses the Intel software drivers and intelligent memor arbiter to support richer
graphics applications.
The 82801 I/O Controller Hub (ICH) emplo s the Intel(R) Accelerated Hub
Architecture to make a direct connection from the graphics and memor to the
integrated AC97 controller, the IDE controllers (ATA/66 or ATA/33), dual USB
ports, and PCI add-in cards.
The Accelerated Hub Architecture provides twice the bandwidth of the PCI bus at
266 MB per second. This allows a wider flow of rich information from the I/O
controller to the memor controller, with optimized arbitration rules allowing more
functions to run concurrentl , enabling more life-like audio and video.
The Integrated Audio-Codec 97 controller enables software audio and modem
(AMR Riser Optional) b using the processor to run sound and modem software.
B reusing existing s stem resources, this feature adds flexibilit , improves sound
and modem qualit .

IntroductionEP-3WEF2/3WDF2
Page 1-5
The 82802 Firmware Hub (FWH, 4MB) stores s stem BIOS and video BIOS,
eliminating a redundant nonvolatile memor component. In addition, the 82802
contains a hardware Random Number Generator (RNG). The Intel(R) RNG
provides trul random numbers to enable fundamental securit building blocks
supporting stronger encr ption, digital signing, and securit protocols for the
future application program .

Introduction EP-3WEF2/3WDF2
Page 1-6
EP-3WEF2/3WDF2 Form-Factor
The EP-3WEF2/3WDF2 is designed with FlexATX form factor - the new industr
standard of chassis. The FlexATX form factor of Maximum board size is 9.0
inches (229mm)*7.5 inches (191mm) for FlexATX addendum version 1.0. This
FlexATX addendum allows enhanced flexibilit where conforming motherboards
ma be enclosed; that is all-in-one computing devices, or standard desktop
s stems. In fact, it does focus on delivering one method to implement some of
the features of an Ease of Use personal computer. To mount a FlexATX
motherboard in an ATX 2.03 - compliant chassis, two new mounting holes are
required in the chassis. The ATX form factor is essentiall a Bab -AT baseboard
rotated 90 degrees within the chassis enclosure and a new mounting configuration
for the power suppl . With these changes the processor is relocated awa from
the expansion slots, allowing them all to hold full length add-in cards. ATX
defines a double height aperture to the rear of the chassis which can be used to
host a wide range of onboard I/O. Onl the size and position of this aperture is
defined, allowing PC manufacturers to add new I/O features (e.g.; TV input, TV
output, modem, LAN, etc.) to s stems. This will help s stems integrators
differentiate their products in the marketplace, and better meet our needs.
 Smaller size promotes a smaller s stem size.
 I/O shield does not need to be retooled in an ATX 2.03 or later. The
Mainboard should be used in an ATX 2.03 (or later) compliant case.
 A smaller power suppl cam be used. High integration on mainboard reduces
the s stem costs.
Full length
slots
Expandable I/O
5 1/4"
Bay
3 1/2"
Bay
Figure 2: Summary of ATX chassis features
CPU located near
Power Suppl
Single chassis
fan for s stem
ATX
Power
Supply
ATX power
connector
Flopp / IDE
connectors
close to
peripheral
ba s

IntroductionEP-3WEF2/3WDF2
Page 1-7
I/O Shield Connector
The EP-3WDF/3WEF is equipped with an I/O back panel.
Power-On/Off (Remote)
The EP-3WDF/3WEF has a single 20-pin connector for ATX power supplies. For
ATX power supplies that support the Remote On/Off feature, this should be
connected to the s stems front panel for s stem Power On/Off button. The
s stems power On/Off button should be a momentar button that is normall open.
The EP-3WDF/3WEF has been designed with Soft Off" functions. You can turn
Off the s stem from one of two sources: The first is the front panel Power On/Off
the button, and the other is the "Soft Off" function controlled b the operating
s stem such as Windows 95/98. When a user clicks to Shutdown the s stem; the
power will be turn off automaticall .
Case (chassis) Power
ON/OFF butto
Figure 4: Simple ATX Power ON/OFF Co troller
J3
ATX
POWER SUPPLY
Figure 3: I/O back pa el layout
VGA1 LANPort
(RJ45)
PS/2 Mouse
PS/2
KEYBOARD

Introduction EP-3WEF2/3WDF2
Page 1-8
Figure 5: System Block Diagram
System Block Diagram

FeaturesEP-3WEF2/3WDF2
Page 2-1
Section 2
FEATURES
EP-3WEF2/3WDF2 Features:
 EP-3WEF2/3WDF2 is based on the Socket 370 Processors including PPG &
FC-PG operating at 500 ~700MHz. The board is configured by a BIOS setting
to match your CPU clock speed.
 The 3WDF2 designed with Intel 810DC100 chipset that supports P.P.G.
Celeron of 66MHz and FC-PG Coppermine of 100MHz Front Side Bus
CPU.
The 3WEF2 designed with Intel 810E chipset that provides optimized sup-
port for P.P.G. Celeron of 66MHz and FC-PG Coppermine of 100/
133MHz Front Side Bus CPU.
 The 810E of GMCH direct GP enhancement by utilizing 133MHz 4MB
Display Cache Memory. (Optional)
 Supports up to 512 MB of DR M (minimum of 16 MB) on board, You can
use 168-pin DIMM x 2. It will run Synchronous DR M memory (SDR M)
at 100MHz.
 64-bit system memory interface with optimized support for SDR M at
100MHz.
 Integrated 2D & 3D Graphics Engine, H/W Motion Compensation Engine,
230MHz D C and 4MB Display Cache.(Optional)
 C97 2.1 udio CODEC onboard for enables the software udio.
 Supports (2) 32 bit PCI slots, provides (2) independent high performance PCI
IDE interfaces capable of supporting PIO Mode 3/4 and Ultra DM 66
devices. The EP-3WEF2/3WDF2 supports (3) PCI Bus Master slots and a
jumperless PCI INT# control scheme which reduces configuration confusion
when plugging in PCI card(s).
 Supports T PI (e.g. CD-ROM) devices on both Primary and Secondary
IDE interfaces.
 Designed with Winbond W83627HF LPC (Low Pin Count) I/O: (1) floppy
port, (1) parallel port (EPP, ECP), (2) serial ports (16550 Fast U RT),
IrD version SIR protocol or SH RP SK-IR protocol, (1) Game port and
MIDI port.

Features EP-3WEF2/3WDF2
Page 2-2
 Includes a PS/2 mouse connector.
 llows use of a PS/2 keyboard.
 Features ward Plug & Play BIOS. With 4MB(FWH) Flash Memory you can
always upgrade to the current BIOS.
 EP-3WEF2/3WDF2 utilizes a Lithium battery which provides environmental
protection and longer battery life.
 The onboard ICH(82801 ) chip provides the means for connecting PC
Interface and peripherals such as; PCI Bus I/F, LPC I/F, SM Bus, IDE and
USB.
 Built-in TX 20-pin power supply connector.
 Software power-down when using Windows® 95/98.
 Supports ring-in feature (remote power-on through external modem, allow
system to be turned on remotely.
 Resume by larm - llow your system to turn on according to setup
schedule in the BIOS.
 Supports CPU Hardware sleep and SMM (System Management Mode).
 Supports Hot key, ny key or password Keyboard power ON function
(KBPO).
 Supports the CPU and Chassis fan uto stop in the sleep mode.
 Supports the System Power LED (P NEL) blinks in the sleep mode.
 Built-in WOL (Wake On Lan) Connector.
 Supports the MR Connector for enables the software modem.
 Y2K Compliant.
 dvanced Configuration Power Interface ( CPI) ready.
 Supports USDM software to offer motherboard various status on Windows®
95/98.
 Supports the STR (Suspend To R M) power management by CPIs S3.
(Optional)
 Supports the STR indicator red LED (D8) to avoid pluging or un-pluging
DIMM modules when in a STR mode or power on mode.(Optional)
 Supports TV-Out and Flat Panel Connector (optional), provides EP-TV2, EP-
PL2 Card. You can use TV or LCD Monitor or CRT Monitor for best choice.

InstallationEP-3WEF2/3WDF2
Page 3-1
Section 3
INSTALLATION

Installation EP-3WEF2/3WDF2
Page 3-2
Figure 1
EP-3WEF2/3WDF2 Detailed Layout

InstallationEP-3WEF2/3WDF2
Page 3-3
Easy Installation Procedure
The following must be completed before powering on your new system:
3-1. CPU Insertion
3-2. Jumper Settings
3-3. System memory Configuration
3-4. Device Connectors
3-5 xternal Modem Ring-in Power ON and Keyboard Power ON
Functions (KBPO)
3-6. STR (Suspend To RAM) Function(Optional)
Section 3-1
CPU Insertion
CPU Insertion: (use CuMineTM for reference)
Step 1
Open the socket by r ising the ctu tion
lever.
Figure 2
Step 2
Insert the processor.
Ensure proper pin 1 orient tion by ligning
the FC-PGA corner m rking with the
socket corner closest to the ctu tion rm
tip. The pin field is keyed to prevent mis-
oriented insertion.
Dont force processor into socket. If it does
not go in e sily, check for mis-orient tion
nd debris.
M ke sure the processor is fully inserted
into the socket on ll sides.
Figure 3

Installation EP-3WEF2/3WDF2
Page 3-4
Step 3
Close the socket by lowering nd locking
the ctu tion lever.
Note: Intels reference design thermal solution is an active heatsink; an extruded alumi-
num heatsink based and a fan attached to the top on the fin array. ( ee Figure 5)
Figure 4
Figure 5