EPOX EP-4PEA User manual

TRADEMARK
All products and company names are trademarks or registered
trademarks of their respective holders.
These specifications are subject to change without notice.
Manual Revision 1.0
September 25, 2002
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Frequently Asked Questions For POST Port Only
Below is a list of some basic POST Codes possible problems and solutions. For
more detailed information about POST Codes refer to Appendix E in this manual.
POST CODE Probl em Sol uti on
FFh or CFh 1.BIOS chip inserted
incorrectly
2. Incorrect BIOS update
version
3. Mainboard problem
4. dd-on card inserted
incorrectly.
1. Reinsert the BIOS
chip
2. Download the correct
BIOS version update
from the manufacturer's
Web site.
3. Replace mainboard
4. Remove and replace the
add-on card
C1h - C5h 1. Memory module
inserted incorrectly
2. Memory compatibility
problem
3. Memory module
damaged
1. Reinsert memory
module
2. Replace memory
with correct type
3. Replace memory
module
2Dh 1. Error occured in VG
BIOS
2. VG card inserted
incorrectly
1. Replace VG card
2. Reinsert the VG
card
26h Overclock error Clear CMOS or press the insert
key to power on the system
07h - 12h 1. Init keyboard
controller error
2. RTC error
1. Ensure that the keyboard and
mouse are connected
correctly.
2. Replace the RTC battery.

Table of Contents
Section 1 Introduction
Components Checklist.............................................. 1-1
Overview
System Overview ....................................................... 1-2
Chipset Components ................................................. 1-3
Intel Pentium 4 Processors ...................................... 1-4
Accelerated Graphics Port ....................................... 1-6
Utlra ATA66/100 ....................................................... 1-6
Hardware Monitoring................................................ 1-6
IEEE 1394 (Optional) ............................................... 1-7
Serial ATA (Optional)................................................ 1-7
Bandiwdth Overview .................................................. 1-8
Mainboard Form-Factor............................................ 1-9
I/O Shield Connector ................................................ 1-10
Power-On/Off (Remote) .......................................... 1-10
System Block Diagram ............................................. 1-11
Section 2 Features
Mainboard Features ................................................... 2-1
Section 3 Installation
Mainboard Detailed Layout ...................................... 3-2
Easy Installation Procedure
CPU Installation ........................................................ 3-3
Jumper Settings ......................................................... 3-5
System Memory Configuration ................................ 3-6
Device Connectors.................................................... 3-8
External Modem Ring-in Power ON and
Keyboard Power ON Function (KBPO)................... 3-14
Page

STR (Suspend To RAM) Function .......................... 3-15
AGP Card 1.5V protection ....................................... 3-16
Section 4 Award BIOS Setup
Main Menu ................................................................ 4-1
Standard CMOS Setup ............................................... 4-2
Advanced BIOS Features........................................... 4-3
Advanced Chipset Features ....................................... 4- 8
Integrated Peripherals ............................................... 4-11
Power Management Setup ........................................ 4-17
PNP/PCI Configuration Setup .................................. 4-22
PC Health Status........................................................ 4-25
Frequency/Voltage Control ....................................... 4-27
Defaults Menu ........................................................... 4-30
Supervisor/User Password Setting ........................... 4-31
Exit Selecting ............................................................ 4-32
Section 5 Driver Installation
Easy Driver Installation............................................. 5-1
ALC650 Configuration Setup (6 Channel)............... 5-2
Appendi Appendi B
Avance Media Player Users Guide .......................... A-1
Appendi B
Update Your System BIOS ........................................ B-1
Appendi C
EEPROM BOIS Remover ......................................... C-1
Appendi D
GHOST 7 Quick Users Guide (Optional) ............... D-1
Appendi E
POST Codes .............................................................. E-1

Introduction
Page 1-1
Section 1
INTRODUCTION
Package Contents
A
B
USERS
MANUAL
F
H
G
Contents
A. (1) Mainboard
B. (1) Users manual
C. (1) Floppy cable or Floppy round
cable
D. (1) Hard drive cable or Hard drive
round cable
E. (1) Driver and u ili y
Optional Item
F. (1) USB2.0 Cable
G. (1) Game por cable
H. (1) I/O Shield
I. (1) IEEE 1394 2 por cable
J. (1) Blue oo h Module
K. (1) SPD650 card
L. (1) Serial ATA cable
K
J
I
L
CD
or or
E
or

Introduction
Page 1-2
System Overview
This board is designed wi h In el® 845PE chipse . The In el® 845PE chipse
includes MCH(FW82845PE), ICH4(FW82801DB) and FWH hree chips. The
In el® 845PE chipse is designed for In els FC-PGA2 socke 478 package
archi ec ure and suppor he 4X capabili y of he AGP 2.0 In erface Specifica ion.
A new chipse componen in erconnec , he hub in erface, is designed in o he
In el® 845PE chipse o provide more efficien communica ion be ween chipse
componen s.
Suppor of AGP 4X, 266/333MHz DDR SDRAM and he hub in erface provides a
balanced sys em archi ec ure for he Pen ium® 4 in he Socke 478 archi ec ure
processor minimizing bo lenecks and increasing sys em performance. By
increasing memory bandwid h o 2.128GB/s hrough he use of AGP 4X, he
In el® 845PE chipse will deliver he da a hroughpu necessary o ake advan age
of he high performance provided by he powerful Pen ium® 4 in he Socke 478
archi ec ure processor.
The In el® 845PE chipse archi ec ure removes he requiremen for he ISA
expansion bus ha was radi ionally in egra ed in o he I/O subsys em of In el
chipse s. This removes many of he conflic s experienced when ins alling
hardware and drivers in o legacy ISA sys ems. The elimina ion of ISA will provide
rue plug-and play for he In el® 845PE pla form.
In el® 845PE chipse con ains hree core componen s: he Memory Con roller
Hub (MCH), he I/O Con roller Hub (ICH4) and he Firmware Hub (FWH). The
MCH in egra es he da a ransfer ra e of 400/533MHz, Pen ium® 4 processor bus
con roller, AGP 2.0 con roller, 266/333MHz DDR SDRAM con roller and a high-
speed hub in erface for communica ion wi h he ICH4. The ICH4 in egra es an
Ul raATA/66/100 con roller, USB hos con roller, LPC in erface con roller, FWH
in erface con roller, PCI in erface con roller, and a hub in erface for communica-
ion wi h he MCH. The In el® 845PE chipse will provide he da a buffering and
in erface arbi ra ion required o ensure ha sys em in erfaces opera e efficien ly
and provide he sys em bandwid h necessary o ob ain peak performance he
Pen ium® 4 in he Socke 478 archi ec ure.

Introduction
Page 1-3
Chipset Components
The In el® 845PE chipse consis s of he Memory Con roller Hub (MCH), he I/O
Con roller Hub (ICH4) and he Firmware Hub (FWH).
!!
!!
!Memory Controller Hub (MCH)
The MCH provides he in erconnec be ween he DDR SDRAM and he sys em
logic. I in egra es:
- Suppor for single processor wi h a da a ransfer ra e of 400/533MHz.
- 200/266/333MHz DDR SDRAM in erface suppor ing 2GB of DDR SDRAM.
- 4X 1.5V AGP in erface (Only suppor 1.5V on AGP in erface).
- Downs ream hub link for access o he ICH4.
!!
!!
!I/O Controller Hub (ICH4)
The I/O con roller Hub provides he I/O subsys em wi h access o he res of
he sys em. Addi ionally, i in egra es may I/O func ions. The ICH4
in egra es:
- Ups ream hub link for access o he MCH
- 2 Channel Ul ra ATA/33/66/100 Bus Mas er IDE con roller
- USB con roller
- SMBus con roller
- FWH in erface
- LPC in erface
- PCI 2.2 in erface
- In egra ed Sys em Managemen Con roller
- In egra ed LAN Con roller
!!
!!
!Firmware Hub (FWH)
The FWH componen is a key elemen o enabling a new securi y and manage-
abili y infras ruc ure for he PC pla form. The device opera es under he FWH
in erface and pro ocol. The hardware fea ures of his device include a unique a
Random Number Genera or (RNG), regis er-based locking, and hardware-
based locking.

Introduction
Page 1-4
Intel Pentium 4 processors
Formally known as he Willame e, he Pen iumTM 4 is he nex genera ion IA-32
processor from In el. This nex genera ion design is based upon a new micro-
archi ec ure ha brings higher clock speeds and performance han previous
processors could deliver. Among o her advanced fea ures he Pen ium 4 offers
S reaming SIMD ex ensions 2, Advanced Dynamic Execu ion, Hyper Pipelined
Technology, and a da a ransfer ra e of 400/533MHz sys em bus.
Streaming SIMD Extensions
Building upon he founda ions of core fea ures of heir previous line of proces-
sors he Pen ium 4, his new version in roduces S reaming SIMD Ex ensions 2
echnology commonly referred o as SSE2. Bu wha does his mean? SIMD s ands
for Single Ins ruc ion Mul iple Da a. Usually, processors process one da a
elemen in one ins ruc ion, called Single Ins ruc ion Single Da a, or SISD. In
con ras , wi h Single Ins ruc ion Single Da a (SISD), SIMD has he abili y o
process more han one piece of da a elemen during one ins ruc ion.
This echnology is useful for 3D graphics applica ions ha handle considerable
amoun s of floa ing-poin numbers. Wi h SIMD applica ions such as 3D graphics
will be able o processor more da a per ins ruc ion when equa es o be er
performance. This echnology adds 144 new ins ruc ions o he CPU core ha can
be used in a wide varie y of applica ions. Sof ware programmers can for example,
ake advan age of hese new ins ruc ions and wri e more op imized code ha ake
advan age of newer SIMD double-precision floa ing-poin , in eger, and cache
abili y ins ruc ions. In heory his will enable be er nex genera ion services such
as In erac ive Digi al TV o be produced.
Advanced Dynamic Execution
Advanced Dynamic Execu ion describes he improved implemen a ion and
abili ies over he older P6 processor lines ou -of-order decoupled super scalar
execu ion. Dynamic execu ion allows ins ruc ions o he processor o be execu ed
wi hou he need o do so in order. The abili y o do his can add a significan
performance increase versus ordered execu ion.

Introduction
Page 1-5
Hyper Pipelined Technology & 400/533MHz System Bus
Hyper Pipelined Technology doubles he pipeline dep h he Pen ium 4 delivers o
20 s ages. This significan ly increases he performance and frequency capabili ies.
Pen ium 4 also in roduces a 400/533MHz sys em bus as opposed o he 100 and
133MHz bus seen in previous Pen ium III processors. This allows 3.2Gby es per
second of hroughpu while he Pen ium III had a limi ed 1.06Gby e/s hroughpu .
Willame e will repor edly be in roduced in he 0.18-micron using aluminum.
Hyper-Threading Technology
Hyper-Threading Technology is a new fea ures in he IA-32 In el Archi ec ure ha
provides a performance boos for fu ure In el-32 processors based on he In el
Ne Burs TM micro archi ec ure. This echnology enables a single processor o run
wo separa e hreads simul aneously, his arrangemen looks like wo processors.
Hyper-Threading Technology makes a single physical processor appear as mul iple
logical processors, here is one copy of he archi ec ure s a e for each logical
processor, and he logical processor share a single se of physical execu ion
resources. From a sof ware or archi ec ure perspec ive, his means opera ing
sys ems and user programs can schedule processors or hreads o logical proces-
sors as hey would on conven ional physical processors in a mul i-processor
sys em. From a micro archi ec ure perspec ive , his means ha ins ruc ions form
logical processors will persis and execu e simul aneously on shared execu ion
resources.
For more information about all the new features the Pentium 4 delivers check
out the Intel website at http://www.intel.com

Introduction
Page 1-6
Accelerated Graphics Port (AGP or A.G.P.)
Typically, 3D graphics rendering requires a remendous amoun of memory, and
demands ever increasing hroughpu speed as well. As 3D produc s for he
personal compu er become more and more popular, hese demands will only
increase. This will cause a rise in cos s for bo h end users and manufac urers.
Lowering hese cos s as well as improving performance is he primary mo iva ion
behind AGP. By providing a massive increase in he bandwid h available be ween
he video card and he processor, i will assis in relieving some of hese pressures
for qui e some ime.
The board provides he AGP 2.0 in erface. The AGP In erface Specifica ion
revision 2.0 enhances he func ionali y of he original AGP In erface Specifica-
ion (revision 1.0) by allowing 4X da a ransfers (4 da a samples per clock) and
1.5 vol (power supply) opera ion. The AGP 2.0 in erface, along wi h SDRAM
memory echnology, allows graphics con rollers o access main memory a over
1GB/s. In order o ma ch he 4X AGP Card. The board used he Universal AGP
connec or. (1.5 vol AGP Card suppor s only).
Ultra ATA/66/100
The ICH4 provides wo channel Ul ra ATA/66/100 Bus Mas er IDE con rollers, ha
suppor Ul ra ATA/66/100 pro ocols, perfec for such demanding applica ions as
real- ime video, mul imedia, and high performance opera ing sys em. A new IDE
cable is required for Ul ra ATA/66/100. This cable is an 80 conduc or cable;
however he connec ors are, of course, backwards compa ible wi h ATA/33.
Hardware Monitoring
Hardware moni oring allows you o moni or various aspec s of your sys ems
opera ions and s a us. The fea ures include CPU empera ure, vol age and RPM of
fan.