
© 2011 Fairchild Semiconductor Corporation 2 FEBFSB127H_T001 • Rev. 1.0.0
Table of Contents
1.Overview................................................................................................................................... 3
2.Board Configuration ................................................................................................................. 3
3.Schematic.................................................................................................................................. 4
4.PCB Layout............................................................................................................................... 5
5.Test Results............................................................................................................................... 6
5.1.Brown-in / Brownout...................................................................................................... 6
5.2.AC Trim Up and Trim Down ......................................................................................... 6
5.3.Line and Load Regulation .............................................................................................. 6
5.4.DC Output Rise Time..................................................................................................... 7
5.5.DC Transient Response .................................................................................................. 8
5.6.Ripple and Noise ............................................................................................................ 8
5.7.Capacitive Load.............................................................................................................. 9
5.8.Power Saving................................................................................................................ 10
5.9.Efficiency ..................................................................................................................... 10
5.10.Short-Circuit Protection ............................................................................................... 11
5.11.X-Cap Discharge .......................................................................................................... 11
5.12.Over-Power Protection ................................................................................................. 12
5.13.Surge and ESD ............................................................................................................. 12
5.14.EMI Conduction ........................................................................................................... 12
6.Bill of Materials ...................................................................................................................... 13
7.Transformer............................................................................................................................. 14
7.1.Transformer Specification.............................................................................................. 14
8.Revision History ..................................................................................................................... 15