Fastwel CPC308 User manual

CPC308
PC/104-Plus Intel Atom N450/D510
Processor Module
User Manual
Ver. 0.4
December 2013
The product described in this manual is compliant
with all related CE standards.

CPC308 Processor Module
C P C 3 0 8 U s e r M a n u a l ©2013F a s t w e l V e r . 0 0 1 b E 2
Product Title: CPC308
Document name: CPC308 User Manual
Manual version: 0.4
Copyright © 2012, 2013 Fastwel Co. Ltd. All rights reserved.
Revision Record
Rev. Index
Brief Description
Product Index
Date
001
Initial version
CPC308
June 2012
001a
Partially corrected text
CPC308
February 2013
001b
Multiple text corrections
CPC308
March 2013
001c
ACS00041 accessory was excluded from the table 1-3, ACS00051
accessory was added to the table 1-3, purpose of contacts in ХР1
connector (table 3-4) was changed, section 7 was updated, errors were
eliminated.
CPC308
December 2013
0.4
Adjustment of subsection 2.3 Operating conditions.
CPC308
December 2013
Contact Information
Fastwel Co. Ltd
Fastwel Corporation US
Address:
108 Profsoyuznaya st.,
Moscow 117437,
Russian Federation
55 Washington St. #310
Brooklyn, New York 11201
USA
Tel.:
[phone]
[phone]
Fax:
[phone]
[phone]
Toll free:
[phone] (1-877-RURUGGED)
E-mail:
[email protected]
Web:
http://www.fastwel.com/

CPC308 Processor Module
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Contents
Contents...................................................................................................................................................................3
List of Tables............................................................................................................................................................5
List of Figures .......................................................................................................................................................... 6
Trademarks..............................................................................................................................................................7
Ownership Rights.....................................................................................................................................................7
Safety Requirements ...............................................................................................................................................8
High Voltage Safety Rules............................................................................................................................8
Board Handling Instructions.......................................................................................................................... 8
General Board Operation Rules...............................................................................................................................9
The Manufacturer's Guarantees ..............................................................................................................................9
1Introduction.......................................................................................................................................... 11
1.1 The Purpose of the Product........................................................................................................................ 11
1.2 Hardware Versions, Package Contents, Ordering Information ................................................................... 12
1.2.1 Hardware Versions, Ordering Information.................................................................................. 12
1.2.2 Package Contents ..................................................................................................................... 13
1.2.3 Additional Accessories............................................................................................................... 13
2Specifications ...................................................................................................................................... 14
2.1 Functional Structure of the Module............................................................................................................. 14
2.2 Module Power Supply................................................................................................................................. 15
2.3 Operating Conditions.................................................................................................................................. 16
2.4 Mechanical Characteristics......................................................................................................................... 16
2.5 Weight and Dimensions.............................................................................................................................. 16
2.6 MTBF:......................................................................................................................................................... 18
3The Module Structure and Functioning ............................................................................................ 19
3.1 Block Diagram of the Module...................................................................................................................... 19
3.2 The Module Main Elements Layout ............................................................................................................ 20
3.3 Operation Features of Functional Units...................................................................................................... 22
3.4 Module Interfaces and Connectors............................................................................................................. 24
3.4.1 PC/104-Plus Connectors ........................................................................................................... 24
3.4.2 Graphics Controller.................................................................................................................... 29
3.4.3 Audio Interface........................................................................................................................... 31
3.4.4 Serial Interfaces......................................................................................................................... 32
3.4.5 USB Interfaces........................................................................................................................... 36
3.4.6 Gigabit Ethernet Interface.......................................................................................................... 36
3.4.7 SerialATA Interface.................................................................................................................... 37
3.4.8 CompactFlash Connector.......................................................................................................... 38
3.4.9 PS/2 Keyboard/Mouse Interface................................................................................................ 40
3.4.10 Power Connector....................................................................................................................... 40
3.4.11 Discrete Input/Output Port ......................................................................................................... 41
3.4.12 External LEDs Connector (XP22) .............................................................................................. 43
3.4.13 Optically Isolated External Reset Input...................................................................................... 44
3.4.14 System Reset Connector........................................................................................................... 45
3.5 LED Indicators............................................................................................................................................ 45
3.6 Watchdog Timers........................................................................................................................................ 46
3.7 The Module Address Space ....................................................................................................................... 46
3.7.1 Distribution of the Memory Address Space................................................................................ 46
3.7.2 The Module Input/Output Address Space Distribution............................................................... 47
3.7.3 Interrupt Lines Distribution......................................................................................................... 48

CPC308 Processor Module
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4CPC308 Module Installation ............................................................................................................... 49
4.1 Safety Requirements.................................................................................................................................. 49
4.2 Possible Heat Removal Methods................................................................................................................ 50
4.3 The Procedure of CPC308 Installation ....................................................................................................... 50
4.4 The Procedure of the Module Dismounting ................................................................................................ 52
4.5 Installing Peripheral Devices onto the CPC308 Module ............................................................................. 52
4.5.1 Installing CompactFlash Memory Cards.................................................................................... 52
4.5.2 Connecting USB Devices........................................................................................................... 52
4.5.3 Battery Replacement ................................................................................................................. 53
4.5.4 Installing PC/104 and PC/104-Plus Expansion Modules............................................................ 53
5Configuring CPC308............................................................................................................................ 54
5.1 Selection of Buffers Power Voltage on the PCI Bus of PC/104-Plus Modules............................................ 54
5.2 Selecting TFT Panel Power Voltage........................................................................................................... 54
5.3 Restoring Factory CMOS Settings (Clear CMOS)...................................................................................... 55
5.4 BIOS Update............................................................................................................................................... 55
6CPC308 Programming ........................................................................................................................ 57
6.1 Work with WDT1 Watchdog Timer.............................................................................................................. 57
6.2 Work with WDT2 Watchdog Timer.............................................................................................................. 58
6.3 User LEDs Control: LED1, LED2................................................................................................................ 59
6.4 Discrete Input/Output Port Programming.................................................................................................... 59
7Phoenix® BIOS .................................................................................................................................... 61
7.1 Starting BIOS Setup Software .................................................................................................................... 61
7.2 Main............................................................................................................................................................ 62
7.2.1 IDE Primary/Master.................................................................................................................... 62
7.2.2 SATA Port 1 –Port 3 ................................................................................................................. 63
7.2.3 Memory Cache .......................................................................................................................... 64
7.2.4 Boot Features............................................................................................................................ 65
7.3 Advanced.................................................................................................................................................... 66
7.3.1 PnP Configuration...................................................................................................................... 67
7.3.2 Console Redirection................................................................................................................... 68
7.3.3 I/O Device Configuration............................................................................................................ 69
7.4 Intel............................................................................................................................................................. 70
7.4.1 CPU Control Sub-Menu............................................................................................................. 71
7.4.2 Video (Intel IGD) Control Sub-Menu.......................................................................................... 72
7.4.2.1 IGD –LCD Control Sub-Menu………………………………………………………………………73
7.4.3 ICH Control Sub-Menu............................................................................................................. 744
7.4.3.1 ICH USB Control Submenu…………………………………………………………………………75
7.5 Security..................................................................................................................................................... 766
7.6 Boot.......................................................................................................................................................... 777
7.7 Custom..................................................................................................................................................... 788
7.8 Exit............................................................................................................................................................ 799
8Transportation, Unpacking and Storage........................................................................................... 80
8.1 Transportation............................................................................................................................................. 80
8.2 Unpacking................................................................................................................................................... 80
8.3 Storage....................................................................................................................................................... 80
ACooler Development Recommendations........................................................................................ 811

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List of Tables
Table 1-1: Ordering information ........................................................................................................................................12
Table 1-2: Package contents.............................................................................................................................................13
Table 1-3: Additional accessories .....................................................................................................................................13
Table 2-1: Required Power Source Parameters................................................................................................................15
Table 2-2: The Module Weight and Sizes .........................................................................................................................16
Table 3-1: XS1 PC/104-ISA Connector Contacts Designation..........................................................................................25
Table 3-2: Electrical Characteristics of the ISA Interface Lines.........................................................................................27
Table 3-3: The purpose of the PC/104-PCI (XS4) Connector Contacts............................................................................28
Table 3-4: The Purpose of the VGA CRT (XP1) Connector Contacts...............................................................................30
Table 3-5: The Purpose of the LVDS (XP8) Connector Contacts......................................................................................30
Table 3-6: The Purpose of the Audio Connectors Contacts..............................................................................................32
Table 3-7: The Purposes of COM1/COM2 (XP3 and XP6) Connectors Contacts.............................................................33
Table 3-8: The Purposes of COM3 and COM4 Connectors (XP17 and XP18) Contacts..................................................33
Table 3-9: The Purposes of USB1-USB4 Connectors (XP4, XP5) Contacts.....................................................................36
Table 3-10: The Purposes of the Gigabit Ethernet (XP11) Connector Contacts ...............................................................37
Table 3-11: The Purposes of SATA Connectors (XP7 and XP10) Contacts.....................................................................37
Table 3-12: The Purposes of the CompactFlash (XP12) Connector Contacts..................................................................39
Table 3-13: The purposes of PS/2 (XP15) Connector Contacts........................................................................................40
Table 3-14: The Purposes of the XP12 Power Connector Contacts .................................................................................41
Table 3-15: Discrete Input/Output Port Line Parameters in Output Mode.........................................................................41
Table 3-16: Discrete Input/Output Port Line Parameters in Input Mode............................................................................42
Table 3-17: The Purposes of the XP24 Discrete Input/Output Port Connector Contacts ..................................................42
Table 3-18: Purposes of the XP22 External LEDs Connector Contacts............................................................................44
Table 3-19: The Purposes of LED Indicators ....................................................................................................................45
Table 3-20: Distribution of the Memory Address Space....................................................................................................46
Table 3-21: Distribution of the Input/Output Address Space .............................................................................................47
Table 3-22: Interruption Lines Distribution.........................................................................................................................48
Table 6-1: WDT1 Watchdog Timer Control Registers.......................................................................................................57
Table 6-2: WDT2 Watchdog Timer Control Registers.......................................................................................................58
Table 6-3: User Light Emitting Diode LED1 Control Register............................................................................................59
Table A-1: Threshold Temperature Values of the Module Switching to Reduced Capacity Mode ..................................811

CPC308 Processor Module
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List of Figures
Fig. 1-1: CPC308 processor module ordering template 12
Fig. 2-1: Sizes and interface dimensions of the module (top view) 17
Fig. 2-2: Module sizes (side view) 18
Fig. 3-1: Block diagram of the module 19
Fig. 3-2: Layout of connectors and principal components on the TOP side 21
Fig. 3-3: Layout of connectors and principal components on the TOP side 22
Fig. 3-4: XS1 PC/104-ISA Connector Contacts 24
Fig. 3-5: PC/104-PCI (XS4) Connector Contacts 27
Fig. 3-6: VGA CRT (XP1) connector 29
Fig. 3-7: LVDS (XP8) Connector 30
Fig. 3-8: XP19 audio connector 31
Fig. 3-9: XP20 audio connector 31
Fig. 3-10: COM1/COM2 (XP3 and XP6) Connectors 33
Fig. 3-11: COM3 and COM4 ports connectors (XP17 and XP18) 33
Fig. 3-12 "Point-to-point" type connection of two devices through RS 422 interface 34
Fig. 3-13: Integration of several devices through the RS 485 interface 35
Fig. 3-14: USB1-USB4 connectors (XP4, XP5) 36
Fig. 3-15: Gigabit Ethernet (XP11) connector 36
Fig. 3-16: SATA connectors (XP7 and XP10) 37
Fig. 3-17: CompactFlash XP12 connector 38
Fig. 3-18: PS/2 (XP15) Connector 40
Fig. 3-19: XP25 power connector 41
Fig. 3-20: XP24 Discrete input/output port connector 42
Fig. 3-21: LEDs connection diagram 43
Fig. 3-22: XP22 External LEDs Connector 43
Fig. 3-23: XP21 optically isolated external reset input 44
Fig. 3-24: Diagram of the module discrete input optical isolation realization 45
Fig. 3-25: XP16 Reset Connector 45
Fig. 3-26: User LED indicators on CPC308 board 45
Fig. 3-27: Power indicator on CPC308 board 45
Fig. 4-1: Heat removal methods 50
Fig. 5-1: Status of the PCI VIO Selector (XP13) Switch Contacts 54
Fig. 5-2: TFT Digital Panel Power Voltage Switch 55
Fig. 7-1: Screen during module loading (POST) 61
Fig. 7-2: "Main" Tab Menu Screen 62
Fig. 7-3: “IDE Primary/Master” submenu screen 63
Fig. 7-4: "Memory Cache" submenu screen 64
Fig. 7-5: "Boot Features" submenu screen 65
Fig. 7-6: "Advanced" Tab Menu Screen 66
Fig. 7-7: "PnP Configuration" submenu screen 67
Fig. 7-8: "Console Redirection" submenu screen 68
Fig. 7-9: "I/O Device Configuration" submenu screen 69
Fig. 7-10: "Intel" Tab Menu Screen 70
Fig. 7-11: "CPU Control Sub-Menu" submenu screen 71
Fig. 7-12: "Video (Intel IGD) Control Sub-Menu" submenu screen 72
Fig. 7 13: IGD –LCD Control Sub-Menu Sub-Menu Screen 73
Fig. 7-14: "ICH Control SUB-Menu" submenu screen 744
Fig. 7-15: "ICH USB Control Sub-Menu" submenu screen 755
Fig. 7-16: "Security" Tab Menu Screen 766
Fig. 7-17: "Boot" Tab Menu Screen 777
Fig. 7-18: "Custom" Tab Menu Screen 788
Fig. 7-19: "Exit" Tab Menu Screen 799
Fig. A-1: Heat sink temperature as a function of the ambient temperature when using a radiator (ACS00035-01 kit) 811

CPC308 Processor Module
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Trademarks
"Fastwel" logotype is a trademark belonging to Fastwel Group Co. Ltd., Moscow, Russian
Federation.
Besides, this document may contain names, corporate logotypes and trade marks being
registered trade marks; consequently, property rights to them belong to their respective legitimate
owners.
Ownership Rights
This document contains information being the property of Fastwel Group Co. Ltd. It can
neither be copied nor transferred with the utilization of known media nor be stored in data storage
and search systems without the prior written authorization of Fastwel Group Co. Ltd. To our best
knowledge, the data in this document does not contain errors. However, Fastwel Group Co. Ltd
cannot take responsibility for any inaccuracies and their consequences, as well as responsibility
arising as a result of utilization or application of any diagram, product or example cited in this
document. Fastwel Group Co. Ltd reserves the right to alter and update both this document and
the product presented therein at its own discretion without additional notification.

CPC308 Processor Module
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Safety Requirements
This product of Fastwel Group Co. Ltd has been developed and tested with the purpose of
ensuring its compliance with electrical safety requirements. Its design provides long-term trouble-
free functioning. The product service life can be significantly shortened because of its incorrect
handling during unpacking and installation. Therefore, for your safety and ensuring of the correct
operation of the product you should adhere to the recommendations given below.
High Voltage Safety Rules
Any work with this device must be performed only by sufficiently skilled personnel.
Before installing the board into your system, make sure that the mains power supply is
disconnected. This is also true for the installation of expansion boards.
There is a serious hazard of electrocution in the process of the product installation, repair
and maintenance; therefore, always unplug the power cord during work performance. This is also
true for other power cables.
Board Handling Instructions
Electronic boards and their components are static sensitive. Therefore, special attention is
needed to ensure safety and normal operation while handling those devices.
Do not leave the board without protective package when it does not operate.
Always work with the board on static-safe workplaces if possible. If it is impossible, the
user must remove static charge from him/herself before touching the product with
his/her hands or tools. This is best done by touching a metal part of the system body.
It is especially important to observe precaution while replacing expansion boards,
jumpers, etc. Since there is a battery powering memory and real-time clock on the
board, do not put it on conductive surfaces, like antistatic carpets or sponges. They
may cause a short circuit and inflict damage to the battery and the board conductors,
as well as loss of real-time clock (RTC) data.

CPC308 Processor Module
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General Board Operation Rules
To preserve the manufacturer's guarantee, the product must not be reworked or altered
in any way. Any alterations and improvements not authorized by Fastwel Group Co. Ltd
company, except those described in this Manual or obtained from the Fastwel Group
Co. Ltd technical support service in the form of a set of instructions describing their
performance cancel the guarantee.
This device must be only installed into and connected to systems meeting all
necessary technical and climatic requirements. This relates to the operating
temperatures range of the specific board design version. The temperature limitations of
the batteries installed on the board should be taken into account as well.
Please follow only the instructions of this Manual while performing all necessary
installation and configuring operations.
Keep original package to store the product in the future or to transport it in case of a
guarantee event. Should it become necessary to transport or store the board, pack it in
the same way it was packed upon receipt.
Take particular care during handling the product and its unpacking. Act in accordance
with the instructions of the above section and Chapter 8 Transportation, Unpacking and
Storage.
The Manufacturer's Guarantees
Guarantee Liabilities
The Manufacturer hereby guarantees the product conformity with the requirements of TU
4013-004-52415667-05 specifications, provided the Consumer abides by the conditions of
operation, transportation, storage, installation and assembly established by the accompanying
documents.
The Manufacturer hereby guarantees that the products supply thereby are free from defects
in workmanship and materials, provided operation and maintenance norms were observed during
the currently established guarantee period. The Manufacturer's obligation under this guarantee is
to repair or replace free of charge any defective electronic component being a part of a returned
product.
Products that broke down through the Manufacturer's fault during the guarantee period will
be repaired free of charge. Otherwise the Consumer will be invoiced as per the current labor
remuneration rates and expendable materials cost.
Liability Limitation Right
The Manufacturer shall not be liable for the damage inflicted to the Consumer's property
because of the product breakdown in the process of its utilization.
Guarantee Period
The guarantee period for the products made by the manufacturer company is 36 months
since the sale date (unless otherwise provided by the supply contract).
The guarantee period for the products made to special order is 60 months since the sale
date (unless otherwise provided by the supply contract).

CPC308 Processor Module
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The warranty set forth above does not extend to and shall not apply to:
1. Products, including software, which have been repaired or altered by other than
Fastwel personnel, unless Buyer has properly altered or repaired the products in
accordance with procedures previously approved in writing by Fastwel.
2. Products, which have been subject to power supply reversal, misuse, neglect, accident,
or improper installation.
Returning a product for repair
1. Apply to Fastwel company or to any of the Fastwel's official representatives for the
Product Return Authorization.
2. Attach a failure inspection report with a product to be returned in the form, accepted by
customer, with a description of the failure circumstances and symptoms.
3. Carefully package the product in the antistatic bag, in which the product had been
supplied. Failure to package in antistatic material will VOID all warranties. Then
package the product in a safe container for shipping.
4. The customer pays for shipping the product to Fastwel or to an official Fastwel
representative or dealer.

СРС308 Processor Module Introduction
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1 Introduction
1.1 The Purpose of the Product
This Operation manual (hereinafter, the Manual) is intended to inform about the design,
operation and basic information necessary for the commissioning, proper use and maintenance
of the product known as CPC308 Processor Module (hereinafter, the module).

NOTE: THIS DOCUMENT PRESENTS THE ACTIVE VERSION 0.1 OF THE MANUAL.
The module is a single-board, PC/104-Plus format computer. It is intended for onboard
applicationыrequiring high performance and low power consumption.
The module has a CompactFlash connector, two Ethernet channels, two USB ports, two
Serial ATA ports, four serial ports and NAND Flash data storage.
It is possible to expand the module functionality by connecting complementary PC/104 and
PC/104-Plus format modules.
The module is delivered with pre-installed FreeDOS operation system (hereinafter, the OS). It
is compatible with the following OSs: 2) QNX 6.5, Windows XP (embedded) and Linux 2.6.
The Manual gives instructions on correct and safe installation, enabling and configuring of the
module, its connection to and interaction with expansion modules or external devices.
The Manual also covers the matters of starting, debugging and running programs from
among basic and utility software (hereinafter, the Software).
For safe and correct operation of the module during its established service life, one must
familiarize oneself with this manual beforehand.
WARNING: THE MODULE OPERATION WITHOUT OBSERVING SAFETY
REQUIREMENTS, UTILIZATION AND OPERATION INSTRUCTION IS
NOT PERMITTED! 3)
ATTENTION: THE MODULE CONTAINS STATIC SENSITIVE COMPONENTS! 4)
FORBIDDEN: OPERATION, MAINTENANCE AND REPAIRS OF THE MODULE BY
PERSONS LACKING THE RESPECTIVE SKILLS AND THE REQUIRED
LEVEL OF SPECIAL TRAINING! 5)
 The graphic symbol (sign) is hereinafter used together with the explanatory word "Note" and the
explanation text.
2) Unless operating system presets were ordered separately. See Table 1-1 below.
3) The graphic symbol (safety sign as per GOST R 12.4.026-2001) is hereinafter used jointly with the
warning word "WARNING" and the warning text (as per GOST 2.601-2006).
4) The graphic symbol (safety sign as per GOST R 12.4.026-2001) is hereinafter used jointly with the
warning word "ATTENTION" and the warning text (as per GOST 2.601-2006).
5) The graphic symbol (safety sign as per GOST R 12.4.026-2001) is hereinafter used jointly with the
warning word "FORBIDDEN" and the warning text (as per GOST 2.601-2006).

СРС308 Processor Module Introduction
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1.2 Hardware Versions, Package Contents, Ordering Information
1.2.1 Hardware Versions, Ordering Information
The module hardware versions and their designation for the purposes of ordering (ordering
information) are shown in the table and the figure below:
Table 1-1: Ordering information
Name
Conventional
designation
Ordering designation
Note
CPC308
processor
module
CPС308
CPC308-011)
Intel Pineview N450/1GB DDR2 RAM/ 4GB NAND
Flash/ Compact Flash/ 2xSATA/ Discrete IO/ 2x
Ethernet/ 4x USB 2.0/ 2x RS232/ 2x RS422/485/
VGA/ LVDS
CPC308-032)
Intel Pineview D510/1GB DDR2 RAM/ 4GB NAND
Flash/ Compact Flash/ 2xSATA/ Discrete IO/ 2x
Ethernet/ 4x USB 2.0/ 2x RS232/ 2x RS422/485/
VGA/ LVDS
CPC308-xx\LNX3)
Module option with a preinstalled Linux 2.6.
operating system
CPC308-xx\yy\Coated4)
A moisture protected module option
1) The module contains a complete set of hardware interfaces and functional elements.
2) Unlike CPC308-01, the module has an Intel Pineview D510 dual core processor installed.
3) Where xx –is the module version (01, 03).
4) Where yy –is the operating system (LNX) preinstallation option.
Fig. 1-1: CPC308 processor module ordering template

СРС308 Processor Module Introduction
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1.2.2 Package Contents
Package contents for all the module versions are shown in the table below:
Table 1-2: Package contents
Ordering
designation
Decimal number
Description
CPС308-01,
CPC308-03.
ИМЕС.467444.308,
ИМЕС.467444.308-02
CPC308 processor module
ACS00023
–
Adapter cable (DB9F –IDC10) for connecting to XP3, XP6 (СОМ1,
COM2) connectors
ACS00027
–
Adapter cable (DB15F –IDC10) for VGA monitor connecting to XP
connector
ACS00043
–
Adapter cable for connecting a PS/2 keyboard and mouse to XP15
connector
ACS00057
–
Power socket with contacts for connecting to XP25 power
connector
–
–
Package
1.2.3 Additional Accessories
Additional accessories for connecting to the module are shown in the table below.
Table 1-3: Additional accessories
Ordering
designation
Description
ACS00031-01
ACS00031-01 installation kit. The kit includes a JST PHR-5 socket and a SPH-002T-
P0.5S set of contacts for connecting to XP18 and XP19 (COM3, COM4, Audio)
connectors of the module
ACS00031-02
ACS00031-02 installation kit. The kit includes a JST PHR-6 socket and a SPH-002T-
P0.5S set of contacts for connecting to XP15 (KB/Mouse) connector of the module
ACS00031-03
ACS00031-03 installation kit. The kit includes a JST PHR-2 socket and a SPH-002T-
P0.5S set of contacts for connecting to XP20, XP21 (Mic In, Opto Reset) connectors of
the module
ACS00037
ACS00037 installation kit. The kit includes a Hirose DF13-20DS-1.25C socket and a
DF13-2630SCF set of contacts for connecting to XP8 (LVDS) connector of the module
ACS00040-01
ACS00040-01 installation kit. The kit includes a Leotronics 2040-3102 socket for
connecting to XP3, XP6, XP4, XP5, XP1 (COM1, COM2, USB1,2, USB3,4, VGA)
connectors of the module
ACS00040-04
ACS00040-04 installation kit. The kit includes a Leotronics 2040-320 socket for
connecting to XP11 (2xEthernet) connector of the module
ACS00051
Cable IDC2-10 –2xUSBA for the connection to XP4, XP5 (USB)
ACS00035-01
A radiator and installation screws.

NOTE: ADDITIONAL ACCESSORIES FOR CONNECTING TO THE MODULE ARE NOT
DELIVERED WITH IT; THEY ARE PURCHASED SEPARATELY.

СРС308 Processor Module Specifications
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2 Specifications
2.1 Functional Structure of the Module
The module includes the following basic functional elements:
Intel Pineview-M (N450)
1
)or Intel Pineview-D (D510)
2
) microprocessor:
–Single 32/64-bit x86 core (for N450),
–Two 32/64-bit x86 cores (for D510),
–SSE2, SSE3, SSSE3 support,
–Hyperthreading support,
–64-bit memory bus,
–Level I cache - 32 KB programs area, 24 KB data area),
–Level II cache - 512 KB (for N450),
–Level II cache - 1 MB (for D510),
–Intel SpeedStep technology support (for N450);
DDR2 SDRAM 667 MHz system memory (soldered) - 1 GB;
Flash BIOS:
–16 Mbit,
–In-system modification possible;
Two SATA interfaces: two standard onboard connectors;
NAND Flash storage (soldered and connected to the SATA interface) - 4 GB;
CompactFlash connector:
–Type I / Type II devices support,
–UDMA mode support;
Video controller:
–2D/3D accelerator,
–Video memory size (allocated from system memory) –256 MB max,
–Connectivity for LCD panels (LVDS 18-bit) with resolution up to 1280 x 800
(60 Hz) and VGA interface monitors with resolution up to 1400 x 1050 (60 Hz)
3
),
–Connectivity for LCD panels (LVDS 18-bit) with resolution up to 1366 x 768
(60 Hz) and VGA interface monitors with resolution up to 2048 x 1536 dots (60 Hz)
4
),
Two 10/100/1000 Mb Ethernet controllers
USB ports:
–Up to four devices;
–USB 1.1 and USB 2.0 specifications support;
–Supported OS loading from USB media;
Serial ports:
–СОМ1, COM2: RS 232, nine-cable (complete) console input/output enabled, maximum
data exchange rate 115.2 Kbit/s,
1
) Installed in the CPC308-01 module
2
) Installed in the CPC308-03 module
3
) For CPC308-01 module
4
) For CPC308-03 module

СРС308 Processor Module Specifications
C P C 3 0 8 U s e r M a n u a l ©2013F a s t w e l V e r . 0 0 1 b E 15
–COM3, COM4: RS 422/485, galvanically isolated (breakdown voltage 500 V),
maximum data exchange rate 9221 Kbit/s;
HD Audio controller;
–Stereo line input/output,
–Microphone input;
PS/2 keyboard and mouse port;
Discrete input/output port:
–8 separately programmable input/output lines;
Optically isolated external reset/interrupt input:
–dielectric breakdown voltage - 500 V;
Real time clock (RTC);
CMOS+Serial FRAM (for system configuration storage);
Two watchdog timers (WDTs):
–WDT1 - with a fixed timeout period - 1.6 s,
–WDT2 - with a programmable timeout period - from 1 to 255 minutes;
The module is software compatible with the following OS: FreeDOS, QNX 6.5,
Windows XP (embedded), Linux 2.6.
2.2 Module Power Supply
Electric power supply of the module must meet the requirements cited in the table below.
The module may be powered through both the power connector (XP25) and through the
PC/104 bus connector. The module's maximum current consumption value is 3.1 A 1) without
external devices.
Table 2-1: Power Supply Requirements
Output voltage, V
Rated load current, A
Output buildup time to the +4.75 V level,
ms
From +4.75 to +5.25
6
Maximum 10
1) For CPC308-03 module

СРС308 Processor Module Specifications
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2.3 Operating Conditions
The module must be used under the following operating conditions:
–Operating temperature range: –40 to +85°С
1
),
Modules are resistant to alteration (change) of ambient temperature in the specified
temperature range, at relative humidity up to 80%, without moisture condensation.
FORBIDDEN: USE THE MODULE AT AMBIENT TEMPERATURE EXCEEDING 70°С
WITHOUT ACS00035-01 ACCESSORY OR ANOTHER HEATSINK
ATTACHED TO THE HEAT-SPREADING PLATE (ANOTHER RADIATOR,
THE DEVICE BODY, ETC.).
2.4 Mechanical Characteristics
The module has the following mechanical characteristics:
–Vibration resistance: 5g max.
–Single shock resistance: 100 g max.
–Multiple shock resistance: 50 g max.
2.5 Weight and Dimensions
The weight and dimension values for various hardware versions of the module are shown in the
table below:
Table 2-2: The Module Weight and Sizes
Module
Weight, kg, max.
Weight, kg, in
package
Dimensions, mm, max.
Package dimensions, mm,
CPC308
0.3 1)
0,484± 0,05
116* x 96* x 29* 2)
230x155x45 mm
1) Without CompactFlash
device.
2) “*” - dimensions for reference.
The general sizes and interface dimensions of the module are shown on figures below.
1
) The value of the top temperature limit (plus 85°С) is valid when the module is used with the ACS00035-01
accessory or when it is used as a part of a cabinet device where heat is withdrawn from the heat-spreading
plate to the device body.

СРС308 Processor Module Specifications
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Fig. 2-1: Overall and Mounting Dimensions of the Module (Top View)

СРС308 Processor Module Specifications
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Fig. 2-2: Dimensions (Side View)
2.6 MTBF:
The MTBF value for the module is 120,000 hours.

NOTE: THIS MTBF VALUE HAS BEEN CALCULATED ACCORDING TO THE TELCORDIA
ISSUE 1 CALCULATION MODEL, METHOD I CASE 3 CALCULATION
PROCEDURE, FOR CONTINUOUS OPERATION ON EARTH UNDER THE
CONDITIONS MEETING UKHL4 UNDER GOST 15150-69, AT AMBIENT
TEMPERATURE +30С.

СРС308 Processor Module The Module Structure and Functioning
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3 The Module Structure and Functioning
3.1 Block Diagram of the Module
Block diagram of the module is shown below:
Fig. 3-1: Block Diagram of the Module
SPI
BIOS
16Mbit
Pineview-M /
Pineview-D
Gigabit
Ethernet
i82574
x4 DMI
Soldered DDR2
SDRAM
1GB
SMBus -
GPIO
CK-505
& SS
Clocking
ICH8-M
PCI 32bit Bus
Supervisor
WDT
PCI BUS
32-bit
Super I/O
SMSC
SCH3114
HD Audio
Codec
RS485
COM3
RS485
COM4
SATA
Port1
Compact
Flash
LVDS
Gigabit
Ethernet
i82574
SATA NAND
FLASH
Controller
PS/2 port
Opto-isolation
FRAM
PCIE-5
PCIE-6
IDE
DC +5V
IN
DC/DC
3.3V VR
CPU Core VR
Memory VR
Chipset VR
SATA
Port2
VGA
CRT
RS232
COM1
RS232
COM2
USB 3,4
Gigabit
LAN 1,2
AUDIO
(IN,OUT)
ISA BUS
16-bit
PCI-ISA
Bridge
AUDIO
(MIC)
Digital
I/O
External
LEDS
Isolated
IRQ/Reset
Opto-isolation
USB 1,2
SATA Port 3
SMBus
Soldered
NAND FLASH
4GB
XP1
XP8
XP12
XP7
XP10
XP17
XP18
XP3
XP6
XP15
XS1
XS4
XP5
XP4
XP11
XP19
XP20
XP24
XP22
XP21
XP25

СРС308 Processor Module The Module Structure and Functioning
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The following functional elements are shown in the module block diagram:
–Intel Atom N450 or Intel Atom D510 microprocessor (depending on the module version);
–DDR2 SDRAM system memory (up to 1 GB);
–Flash BIOS (16 Mbit);
–NAND Flash data storage (4 GB);
–VGA monitor port (XP1);
–LVDS interface connector for TFT panel connecting (XP8);
–2 SATA channels (XP7 and XP10);
–CompactFlash connector (XP12);
–Two 10/100/1000 Mb Ethernet channels (XP11);
–4x USB 2.0 channels (XP4 and XP5);
–СОМ1 (RS232) (XP3), COM2 (RS 232) (XP6), COM3 (RS422/285) (XP17),
COM4 (RS 422/485) serial ports (XP18);
–PS/2 keyboard and mouse port (XP15);
–Discrete input/output port (XP24);
–External indication connector (XP22);
–HD Audio controller with line input/output and microphone connectors (XP19 and XP20);
–External optoisolated reset (XP21);
–16 bit ISA bus (XS1);
–32 bit, 33 MHz PCI bus(XS4);
–Serial FRAM (for system configuration storage);
–Two watchdog timers (WDTs).
Technical features of the module's main functional elements are described in subsection 2.1
of the Manual.
3.2 The Module Main Elements Layout
The layout of main components, their corresponding connectors, as well as jumper switches
for top and bottom sides is shown, respectively, in Fig. 3-2 and Fig. 3-3.
The default positions of jumpers in jumper switches are also shown in Fig. 3-2, and
jumpers settings by functions are shown in Section 5 Configuring CPC308.