Fastwel CPC1302 User manual

-
CPC1302
CPU Module
User
Manual
IMES.467444.083 UM
August 2017
Version 1.01

Revision Record
Revision No
Brief description of changes
Board
index
Revision date
1:00
Initial version
CPC1302
November 2016
1.01
Graphics system characteristics were added. Adjustment
of the delivery checklist: added screw M2,5х16. The
subsection 1.3.3 has a clarification: recommended carrier-
board Adlink Express-BASE6. Subsection 3.6 was added
with clarification on fastening the module to Adlink
Express-BASE6 board. Subsection 4.1 has an adjustment
of BIOS update text.
CPC1302
May 2017
Contact Information
Fastwel Co. Ltd
Fastwel Corporation US
Address:
108 Profsoyuznaya st.,
Moscow 117437,
Russian Federation
6108 Avenida Encinas,
Suite B, Carlsbad,
CA92011,
Tel.:
[phone] Tel.:
[phone]
Fax:
[phone]
E-mail:
[email protected] Email:
[email protected]
Web:
http://www.fastwel.com/

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Table of contents
Table of contents ……………………………………………………………………………………………………………. 3
List of tables …………………………………………………………………………………………………………………. 4
List of figures ………………………………………………………………………………………………………………… 4
Trademarks………………………………………………………………………………………………………………….. 5
Ownership Rights ………………………………………………………………………………………………………….. 5
Notation Conventions………………………………………………………………….…………………………………… 6
General safety requirements……………….. ............................................................................................................7
High Voltage Safe Handling Rules…………………………………………………………………………………. 7
Board Handling Regulations.........................................................................................................................7
General Board Operation Rules……………………………………………………………………………………………. 8
MANUFACTURER'S WARRANTIES………………………………………………………………………………………. 8
1 Description and operation of CPC1302 CPU Module.......................................................................10
1.1 Purpose..................................................................................................................................................10
1.2 Versions, ordering information................................................................................................................ 10
1.2.1 Versions..................................................................................................................................... 10
1.2.2 Description of the supplied configurations .................................................................................11
1.2.3 Available options for CPC1302..................................................................................................11
1.3 Main and additional complete set...........................................................................................................12
1.3.1 Delivery checklist.......................................................................................................................12
1.3.2 Additional complete sets for heat removal ................................................................................. 12
1.3.3 Carrier-board for CPC1302........................................................................................................ 12
1.4 Technical features ..................................................................................................................................13
1.5 Module power supply and current consumption .....................................................................................14
1.5.1 Power supply reset and monitoring............................................................................................14
1.5.2 Power supply requirement ......................................................................................................... 14
1.5.3 Consumption currents of the modules .......................................................................................14
1.6 Resistance to climatic effects .................................................................................................................15
1.7 Resistance to mechanical effects...........................................................................................................15
1.8 Weight and dimensions characteristics (module and packaging) ........................................................... 15
1.8.1 Weight and dimensions of additional complete sets for heat removal........................................16
1.9 MTBF......................................................................................................................................................17
2 Description of operation of CPC1302 major components...............................................................18
2.1 Location of main components................................................................................................................. 18
2.2 Functional structure of CPC1302............................................................................................................20
2.3 Connectors COM Express A-B, C-D....................................................................................................... 23
2.4 Possible PCIe х16 Gen3 configuration options.......................................................................................23
2.5 Possible PCIe х8 Gen2 configuration options.........................................................................................24
2.6 Devices on SMBus .................................................................................................................................24
2.7 FRAM controller registers……………………………………………………………………………………….. 25
2.8 Watchdog timer ...................................................................................................................................... 26
2.8.1 Watchdog timer's registers......................................................................................................... 27
2.8.2 Description of watchdog timer's registers................................................................................... 28
2.9 I2C Controller/ I/O ports..........................................................................................................................29
2.9.1 Algorithm of I2C controller operation.......................................................................................... 30
2.9.2 Registers of I2C controller.......................................................................................................... 31
2.9.3 Description of I2C controller registers........................................................................................ 31
3 Intended use of CPC1302....................................................................................................................33
3.1 Reset of BIOS Setup settings.................................................................................................................33
3.2 Description of indicators .........................................................................................................................33

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3.2.1 Description of HL3 indicator operation.......................................................................................33
3.3 Possible heat removal options................................................................................................................ 34
3.4 Heat removal requirements ....................................................................................................................35
3.5 Installation of CPC1302..........................................................................................................................37
3.5.1 Safety Requirements………………………………………………………………………………….. 37
3.6 Installation of CPC1302 to the carrier-board........................................................................................... 38
3.7 Procedure of module removal.................................................................................................................38
3.8 Elimination of CPC1302 malfunctions ....................................................................................................39
4 AMI® BIOS ............................................................................................................................................41
4.1 BIOS update...........................................................................................................................................41
5 Transportation, unpacking and storage 42
5.1 Transportation ........................................................................................................................................ 42
5.2 Unpacking...............................................................................................................................................42
5.3 Storage...................................................................................................................................................42
A Purpose of COM Express connector contacts........................................................................................43
B Disclaimer …...............................................................................................................................................53
List of tables
Table 1-1: CPC1302 ordering information ............................................................................................................................................ 10
Table 1-2: CPC1302 ordering options .................................................................................................................................................. 11
Table 1-3: CPC1302 Delivery checklist ..................................................................................................................................................12
Table 1-4: Installation kit IMES.467941.047 ...........................................................................................................................................12
Table 1-5: Additional sets for CPC1302..................................................................................................................................................12
Table 1-6: Consumption currents of CPC1302 .......................................................................................................................................14
Table 1-7: Consumption currents over input voltage +5V_STBY ............................................................................................................15
Table 1-8: Weight and dimensions of module and packaging.................................................................................................................15
Table 1-9: Weight and dimensions of additional complete sets for heat removal ....................................................................................16
Table 1-10: Weight and dimensions of additional complete sets for heat removal...................................................................................16
Table 1-11: MTBF..................................................................................................................................................................................17
Table 2-1: Possible PCIe х16 Gen3 configuration options ......................................................................................................................23
Table 2-2: Addresses of devices on SMBus...........................................................................................................................................24
Table 3-1: Reset of BIOS Setup settings of CPC1302 using XP1 switch ................................................................................................33
Table 3-2: Description of CPC1302 indicators........................................................................................................................................33
Table 3-3: Description of HL3 indicator of CPC1302...............................................................................................................................33
Table 3-4: Elimination of CPC1302 malfunctions....................................................................................................................................40
Table A-1: Purpose of COM Express connector contacts.......................................................................................................................43
List of figures
Fig. 1-1: Template for ordering CPC1302............................................................................................................................................. 11
Fig. 1-2: Overall and connecting dimensions of the module.................................................................................................................. 16
Fig. 2-1: Location of main components of CPC1302 (top view)...............................................................................................................18
Fig. 2-2: Location of COM Express connectors of CPC1302 (bottom view) ............................................................................................19
Fig. 2-3: Module block diagram ..............................................................................................................................................................20
Fig. 2-4: Algorithm of I2C controller operation (example of writing 1 byte of data to EEPROM Atmel AT24C02).....................................30
Fig. 3-1: Possible heat removal options..................................................................................................................................................34
Fig. 3-2: CPC1302 with the installed heat removal set ACS30076-02.....................................................................................................35
Fig. 3-3: Point for temperature control on heat-spreading plate ..............................................................................................................36
Fig. 3-4: Diagram of CPU temperature dependency on the temperature on plate (*) ..............................................................................36

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All information in this document is provided for reference only, with no warranty of its suitability for any specific purpose. This information has been thoroughly
checked and is believed to be entirely reliable and consistent with the product that it describes. However, Fastwel accepts no responsibility for inaccuracies,
omissions or their consequences, as well as liability arising from the use or application of any product or example described in this document.
Fastwel Co. Ltd. reserves the right to change, modify, and improve this document or the products described in it, at Fastwel's discretion without further notice.
Software described in this document is provided on an “as is” basis without warranty. Fastwel assumes no liability for consequential or incidental damages
originated by the use of this software.
This document contains information, which is property of Fastwel Co. Ltd. It is not allowed to reproduce it or transmit by any means, to translate the
document or to convert it to any electronic form in full or in parts without antecedent written approval of Fastwel Co. Ltd. or one of its officially
authorized agents.
Fastwel and Fastwel logo are trademarks owned by Fastwel Co. Ltd., Moscow, Russian Federation. Ethernet is a registered trademark of Xerox
Corporation. IEEE is a registered trademark of the Institute of Electrical and Electronics Engineers Inc. Microsoft is a trademark of the Microsoft
corporation. In addition, this document may include names, company logos and trademarks, which are registered trademarks and, therefore, are
property of their respective owners.
Fastwel welcomes suggestions, remarks and proposals regarding the form and the content of this Manual.
Trademarks
"Fastwel" logotype is a trademark belonging to Fastwel Group Co. Ltd., Moscow, Russian
Federation.
Besides, this document may contain names, corporate logotypes and trademarks being
registered trademarks; consequently, property rights to them belong to their respective legitimate
owners.
Ownership Rights
This document contains information being the property of Fastwel Group Co. Ltd. It can
neither be copied nor transferred with the utilization of known media nor be stored in data storage
and search systems without the prior written authorization of Fastwel Group Co. Ltd. To our best
knowledge, the data in this document does not contain errors. However, Fastwel Group Co. Ltd
cannot take responsibility for any inaccuracies and their consequences, as well as responsibility
arising as a result of utilization or application of any diagram, product or example cited in this
document. Fastwel Group Co. Ltd reserves the right to alter and update both this document and
the product presented therein at its own discretion without additional notification.

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Notation
Conventions
Warning, high voltage!
This sign and inscription warn you about the dangers associated with
electric discharges (> 60 V) at the time you touch the device or its
parts. Noncompliance with the safety precautions, mentioned or
prescribed by the rules could endanger your life or health, or lead to
product damages. We also recommend you to familiarize with the
below subsection dedicated to the high voltage safe handling rules.
Warning!
ESD Sensitive Device!
This symbol draws your attention to the information related to electro
static sensitivity of your
product and its components. To keep product safety and operability it
is necessary to handle it with care and follow the ESD safety
directions.
Warning! Hot surface!
This sign marks warnings about hot surfaces. The surface of the
heatsink and some components can get very hot during operation.
Take due care when handling, avoid touching hot surfaces!
Warning!
Information marked by this symbol is essential for human and
equipment safety.
Read this information attentively, be watchful.
Note
This symbol and title marks important information to be read attentively
for your own benefit.

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General safety requirements
This product is designed and tested for the purpose of ensuring compliance with the electric
safety requirements. Its design guarantees long-term failsafe operation. Life cycle of the device
can be sufficiently reduced due to improper handling during unpacking and installation. Therefore,
for your own safety and in order to ensure the proper operation of the device, you should observe
the below recommendations. It is also required to observe safety regulations outlined in subsection
3.5.1.
High Voltage Safe Handling Rules
Warning!
All the works that involve this device should be carried out by the
appropriately qualified personnel.
Warning, high voltage!
Before installing the board into the carrier-board, make sure that
the mains supply is switched off.
During installation, repairs and maintenance of the device there is a
real danger of exposure to electric shock, therefore you should
always disconnect the power supply feeding cable from the socket
at the time of works.
Board Handling Regulations
ESD Sensitive Device!
Electronic boards and their components are sensible to static
electricity. This is why you should give special attention to
handling
with these devices in order to ensure their integrity and working
efficiency.
- Do not leave the board without protective packaging, when it is not operated.
- When applicable, always operate the board at the workplace equipped with protection
against static electricity. If it is impossible, the user should remove a static discharge
before touching the device by hand or using tools. The best way to do it is touch a
metal part of system enclosure.
You should observe safety precautions during operations for installation of jumpers
etc.. It is prohibited to remove/install jumpers when the power is on.

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General Board Operation Rules
To keep the warranty, the product should not be altered or modified in any way. Any
alterations or improvements not authorized by Fastwel LLC, except for those specified
in this document or obtained from the technical support department of Fastwel LLC as
a set of instructions for their implementation, cancel the warranty.
This device should be installed and connected only to the systems, meeting all the
necessary technical and climatic requirements. This above is also true to the operating
temperature range of a particular version of the board.
While performing all the required operations for installation and adjustment, please
follow the instructions specified only in this document.
Keep the original package for subsequent storage of the device and transportation in
the warranty event. If it is necessary to transport or store the board, please pack it
the same way as it was packed upon delivery.
Exercise special care when unpacking and handling the device. Act in accordance with
the instructions given above and in the paragraph 5 Transportation, unpacking and
storage.
MANUFACTURER'S WARRANTIES
Warranty liabilities
The manufacturer guarantees that device's quality corresponds to the requirements of
technical specification TU 4013-022-72782511-08 provided that the Consumer meets operation,
storage, transportation and installation conditions and procedures, specified by accompanying
documents.
The Manufacturer hereby guarantees that the products supplied thereby are free from
defects in workmanship and materials, provided operation and maintenance norms were observed
during the currently established warranty period. The Manufacturer's obligation under this warranty
is to repair or replace free of charge any defective electronic component being a part of a returned
product.
Products that broke down through the Manufacturer's fault during the warranty period will be
repaired free of charge. Otherwise the Consumer will be invoiced as per the current labor
remuneration rates and expendable materials cost.
Liability limitation right
The Manufacturer shall not be liable for the damage inflicted to the Consumer's property
because of the product breakdown in the process of its utilization.
Warranty period
The warranty period for the products made by Fastwel LLC is 36 months since the sale date
(unless otherwise provided by the supply contract).
The warranty period for the custom-made products is 60 months since the sale date (unless
otherwise provided by the supply contract.

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Limitation of warranty obligations
The above warranty obligations shall not be applied:
 To the products (including software), which were repaired or were amended by the
employees, that do not represent the manufacturer. Exceptions are the cases where the
customer has made repairs or made amendments to the devices in the strict compliance with
instructions, preliminary agreed and approved by the manufacturer in writing;
 To the products, broken down due to unacceptable polarity reversal (to the opposite sign)
of the power supply, improper operation, transportation, storage, installation, mounting or
accident.
Procedure of device returning for repairs
Sequence of activities when returning the products for repairs:
 Apply to Fastwel company or to any of the Fastwel's official representatives for the Product
Return Authorization;
 Attach a failure inspection report with a product to be returned in the form, accepted by the
Manufacturer, with a description of the failure circumstances and symptoms;
 Carefully package the product in the antistatic bag and carton box, in which the product
had been supplied. Then package the product in a safe container for shipping. Failure to
package in antistatic material will VOID all warranties.
 The customer pays for shipping the product to Fastwel or to an official Fastwel
representative or dealer.

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Description and operation of CPC1302 CPU Module
CPC1302
1 Description and operation of CPC1302
CPU Module
1.1 Purpose
CPC1302 CPU Module is implemented in COM Express Type 6 (PICMG COM.0 r.2.1)
standard based on the 4th generation Intel Core i5 CPUs and 5th generation Core i7 CPU and
is designed for embedded applications requiring high performance, low power consumption and
high reliability.
1.2 Versions, ordering information
1.2.1 Versions
Module's versions and their designations at the time of the order (ordering information) are
given in the table below 1-1:
Table 1-1: CPC1302 ordering information
Versions
CPU
RAM
SSD
Temperature
1
CPC1302-01
Intel Core i7-5850EQ
2.7 GHz 4C 37 W
8 GB 1600
DDR3L
16 GB
-40…+85C
2
CPC1302-02
Intel Core i7-5850EQ
2.7 GHz 4C 37 W
8 GB 1600
DDR3L
-
-40…+85C
3
CPC1302-03
Intel Core i5-4422E
1.8 GHz 2C 25 W
4 GB 1600
DDR3L
16 GB
-40…+85C
4
CPC1302-04
Intel Core i5-4422E
1.8 GHz 2C 25 W
4 GB 1600
DDR3L
-
-40…+85C

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Description and operation of CPC1302 CPU Module
CPC1302
Fig. 1-1: Template for ordering CPC1302
1.2.2 Description of the supplied configurations
CPC1302-01: CPC1302 CPU Module, Intel Core i7-5850EQ 2.7 GHz 4 Core, 8GB DDR3L
SDRAM, embedded SSD 16GB, -40…+85C
CPC1302-02: CPC1302 CPU Module, Intel Core i7-5850EQ 2.7 GHz 4 Core, 8GB
DDR3L SDRAM, -40…+85C
CPC1302-03: CPC1302 CPU Module, Intel Core i5-4422E 1.8 GHz 2 Core, 4GB
DDR3L SDRAM, embedded SSD 16GB, -40…+85C
CPC1302-04: CPC1302 CPU Module, Intel Core i5-4422E 1.8 GHz 2 Core, 4GB
DDR3L SDRAM, -40…+85C
1.2.3 Available options for CPC1302
Table 1-2: CPC1302 ordering options
Pre-installed operating system (*)
\LNX
Linux 3.8.x
(*) OS pre-installation is possible only for the versions with SSD.
Coating
\COATED
Conformal coating

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Description and operation of CPC1302 CPU Module
CPC1302
1.3 Main and additional complete set
1.3.1 Delivery checklist
CPC1302 Module is delivered ready-assembled with the heat-spreading plate. Cooling
system is delivered as an option.
Table 1-3: CPC1302 Delivery checklist
Notation
Conventions
Name
Number
IMES.467941.047
Installation kit
1
IMES.421945.069
Packaging
1
Table 1-4: Installation kit IMES.467941.047
1
Screw DIN7985-M2,5х6-A2
5
2
Screw DIN7985-M2, 5x16-A2
5
For mounting to the
carrier-board Adlink
Express-BASE6
3
Washer DIN125-2,7-A2
5
4
Washer DIN6798А-2,7-A2
5
5
Rack WE p/n 971 080 154
5
L=8 mm
6
Jumper TE Connectivity
p/n 382575-2
1
Pitch 2 mm
1.3.2 Additional complete sets for heat removal
Additional accessories for heat-removal are specified in the table below:
Table 1-5: Additional sets for CPC1302
Heat-removal system (**)
ACS30076-01
Heatsink
ACS30076-02
Heatsink with a fan
(**) Module is delivered ready-assembled with the heat-spreading plate.
Additional complete-sets for heat-removal are supplied as an option. Weigh and
dimensions of the complete sets are given in the subsection 1.8.1.
1.3.3 Carrier-board for CPC1302
CPC1302Module can be installed on the carrier-board compatible with the COM Express
Type 6 (r.2.1) standard. We recommend using Adlink Express-BASE6 board as the carrier-board
(to be purchased as an option). Procedure of module installation to the carrier-board is provided in
the subsection 3.6.

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Description and operation of CPC1302 CPU Module
CPC1302
1.4 Technical features
Intel Core i7-5850EQ 2.7Ghz CPU 5th Gen 37W
▪4 cores Intel x64;
▪3 graphics engines;
▪6 MB of cash-memory.
Intel Core i5-4422E 1.8Ghz CPU 4th Gen 25W
▪2 cores Intel x64;
▪2 graphics engines;
▪3 MB of cash-memory.
RAM:
▪DDR3L-1600 SDRAM up to 8 GB (depending on the version) with ECC support;
▪64-bit data bus.
Graphics subsystem characteristics:
▪64 bit 25.6 GB/sec;
▪Graphics in CPC1302-01 (-02):
▪Intel Iris Pro Graphics 6200;
▪Memory: up to 4GB;
▪DirectX 12, OpenGL 4.4, OpenCL 2.0, H.264/MPEG-4 (AVC), VC1, MPEG-2, VP8;
▪Graphics in CPC1302-03 (-04):
▪Intel HD Graphics 4600;
▪Memory: up to 2 GB;
▪DirectX 11.1, OpenGL 4.0, OpenCL 1.2, H.264/MPEG-4(AVC), MPEG-2.
FLASH BIOS:
▪128 Mb SPI-Flash;
▪modifiable within the system;
FRAM 32 Kbyte (SPI port) for storing user data
COM-Express Type 6 connector:
▪1 port PCIe x16 GEN3, 8 GT/s;
▪7(8) ports PCIe x1 GEN2, 5 GT/s;
▪8x ports USB 2.0;
▪4x ports USB 3.0;
▪4x ports SATA III 6Gbps;
▪Port "LAN 0": Gbit Ethernet Intel 210;
▪Port SPI (External Boot);
▪Port "LVDS Channel ": LVDS Dual Channel 24bit 1920x1200@60Hz or port eDP
3840x2160@60H;
▪3 x ports DDI 4096x2304@60Hz;
▪1x port VGA CRT 1920x2000@60Hz;
▪Port LPC (Specification Rev. 1.1);
▪Port SMBus;
▪Port I2C;
▪Port HD Audio;
▪Speaker Out;
▪4x ports GPIO;
▪2x ports RS-232 (TTL, 128-byte FIFO, up to 3Mbps).
Real-Time Clock (with power fed from "RTC battery" port)
SSD 16GB on SATA interface
Watchdog timer:
Monitor of 7 power supply voltages, monitor of PCB temperature

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Description and operation of CPC1302 CPU Module
CPC1302
Console I/O via serial ports (COM1 / COM2)
Software compatibility:
▪Linux 3.8.x;
▪QNX 6.5;
▪Microsoft Windows Embedded Standard 7.
1.5 Module power supply and current consumption
1.5.1 Power supply reset and monitoring
CPU reset signal is generated from the following sources:
▪from supervisor at power on;
▪from Reset button;
▪from watchdog timer;
▪from external reset signal.
Forbidden!
To restart the Module less than in5 seconds after shutdown.
1.5.2 Power supply requirements
As the main power supply voltage, the board uses the voltage of +12 V from COM-Express
connector. In order to support the sleep modes, the standby voltage is used.
+5V_STBY from COM-Express connector (optional).
At 12 V input, protection against over-voltage and pulse interference is provided.
Acceptable range of the main supply voltage: 8-14 V.
Acceptable range of the standby supply voltage: 4.75-5.25 V.
1.5.3 Consumption currents of the modules
Table 1-6: Consumption currents of CPC1302
CPU Module
Module input voltage
(Vin)
Average current A) at
TDP load
Starting current
(A) (*)
Peak current (А)
during OS
booting
CPC1302-01
47 W
8V
~[8.9], 7.6
~3
~12
12V
~[6.3], 5.2
~2.3
~7.5
14V
~[5.3], 4.4A
~2.3
~6.2
CPC1302-01
37 W
8V
~[7.5], 6.1
~3
~11.4
12V
~[5.1], 4.2
~2.2
~8
14V
~[4.3], 3.5
~2.3
~6.2
CPC1302-03
8V
~[5.5], 4.6
~2.5
~6.7
12V
~[3.68], 3.1
~2
~4.8
14V
~[3.2], 2.7
~1.9
~3.6
Note:
Average current under load by synthetic benchmarks. (*)
Peak current within the range up to 100 ms.

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Description and operation of CPC1302 CPU Module
CPC1302
Table 1-7: Consumption currents over input voltage +5V_STBY
CPU Module
Average
current
during
module's
start (mА)
Peak current
during module's
start
(mА)
Average
current in S3
mode (mA)
Peak current
when switching
to S3 mode (mA)
CPC1302-01 (-03)
66
~340
200
280
1.6 Resistance to climatic effects
CPC1302 modules of industrial temperature range are resistant to the changes of ambient
temperature within the range from - 40 to + 85°С with relative humidity of up to 80 %, no
condensation, in accordance with the GOST 28209. Description of heat-removal features is given
in subsections 3.3 and 3.4.
CPC1302 Modules are resistant to cyclic damp heat at ambient temperatures of + (55
2)°С, relative humidity (93 3) % (for modules with conformal coating) in accordance with the
GOST 28216.
1.7 Resistance to mechanical effects
The modules complying with the GOST standard 28203 are resistant to sinusoidal vibrations
for frequencies from 10 to 500 Hz with acceleration of 2 g.
The modules complying with the GOST standard 28213 are resistant to single shocks with
the peak acceleration of 50 g.
The modules complying with the GOST standard 28215 are resistant to multiple shocks (with
1000 shocks) with the peak acceleration of 25 g.
1.8 Weight and dimensions characteristics (module and packaging)
Values of weight and overall dimensions of modules and packaging are given in the table
below:
Table 1-8: Weight and dimensions of module and packaging
CPU Module
Weight in
kg, no
more than:
Packaged
weight, in
kg
Overall dimensions with
head-spreading plate and
racks, in mm
Overall dimensions of
the packaging, in
mm
CPC1302
0.4
0.5
125 х 95 × 18
140 × 150 × 45
Overall and connection dimensions of the module are shown in figure below.

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Description and operation of CPC1302 CPU Module
CPC1302
Fig. 1-2: Overall and connecting dimensions of the module
1.8.1 Weight and dimensions of additional complete sets for heat removal
Table 1-9: Weight and dimensions of additional complete sets for heat removal
Additional complete set
Overall dimensions, no more than:
ACS30076-01
125,5х95,5х25,0
ACS30076-02
125,5х95,5х40,0
Table 1-10: Weight and dimensions of additional complete sets for heat removal
Additional complete set
Weight in kg, no
more than
ACS30076-01
280
ACS30076-02
380

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Description and operation of CPC1302 CPU Module
CPC1302
1.9 MTBF
Mean time between failure (MTBF) for ambient temperature of +30С corresponds to the
values given in the table.
Table 1-11: MTBF
CPU Module
MTBF in hours, not less than:
CPC1302
150,000
Note –MTBF values are calculated according to the Telcordia Issue 1 computational model (calculation
method - Method I Case 3) for continuous operation in case of the on-ground placement,
under conditions corresponding to the Moderately Cold Climate 4 climatic category, in
accordance with the GOST 15150-69, at the ambient temperature of + 30 С.

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Description of operation of CPC1302 major components
CPC1302
2 Description of operation of CPC1302 major
components
2.1 Location of main components
Location of main components and connectors is given in Figure 2-1 and Figure 2-2.
Purpose of indicators and XP1 switch is given in subsections 3.1 and 3.2.
CPU
HL1
HL2
HL3
XP1
PCH
Fig. 2-1: Location of main components of CPC1302 (top view)

CPC1302 User Manual
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Description of operation of CPC1302 major components
CPC1302
Connector
COM Express
C-D
Connector
COM Express
A-B
Fig. 2-2: Location of COM Express connectors of CPC1302 (bottom view)

CPC1302 User Manual
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Description of operation of CPC1302 major components
CPC1302
2.2 Functional structure of CPC1302
Block diagram of CPC1302 is shown in Figure 2-3:
Fig. 2-3: Module block diagram