Fastwel CPC310 User manual

CPC310
CPU MODULE
User Manual
Revision 0.2
February 2018
The product described in this manual is compliant
with all related CE standards.

CPC310 CPU Module Specification
C P C 3 1 0 U s e r M a n u a l ©2 0 1 8 F a s t w e l V e r . 0 , 2 2
Product Title: CPC310
Document name: CPC310 User Manual
Manual version: 0.2
Copyright © 2018 Fastwel Co. Ltd. All rights reserved.
Revision Record
Revision
No.
Brief description of changes
Board index
Revision date
0.1
Initial version of CPC310 User Manual
CPC310
May 2016
0.2
Compliance assessment
CPC310
February 2018
Contact information
Fastwel Co. Ltd
Fastwel LLC
Address:
108 Profsoyuznaya st.,
Moscow 117437,
Russian Federation
4660 La Jolla Village Dr,
Suite 100,
San Diego, California 92122-1249
USA
Tel.:
[phone] Tel.:
[phone]
Fax:
[phone]
E-mail:
[email protected] E-mail:
[email protected]
Web:
http://www.fastwel.com/

CPC310 CPU Module Specification
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TABLE OF CONTENTS
Trademarks.................................................................................................................7
Ownership Rights........................................................................................................7
General Board Operation Rules..................................................................................8
TRANSPORTATION, UNPACKING AND STORAGE................................................................9
Transportation.............................................................................................................9
Unpacking...................................................................................................................9
Storage.....................................................................................................................10
MANUFACTURER'S WAARRANTY........................................................................................11
Warranty Liabilities.………………………………………………………………….……..11
Liability Limitation Right ............................................................................................11
Warranty Period.......................................................................................................11
Limitation of warranty liabilities..................................................................................11
Returning a product for repair ...................................................................................12
1. INTRODUCTION ..................................................................................................................13
1.1. Purpose…………………....…………………………………………………………13
1.2. Versions, delivery checklist, ordering information………………………………….13
2. SPECIFICATIONS…………………………………………………………………………………...16
2.1 Functional structure ........................................................................................... 16
2.2 Power supply ……………….……………………………….…………………………..17
2.3 Operation conditions …….……………………………………………………………..18
2.4 Mechanical features ……………………………………………………………………18
2.5 Module dimensions…..………………………………………………………………...18
2.6 MTBF…………………………………………………………………………………….19
3. STRUCTURE AND OPERATION……...…………………………………………………………..20
3.1. Module’s block diagram …………………………...…………...………….………….20
3.2. Location of module’s main components ……………….……………………………21
3.3. Aspects of functional units operation …...……………………………………….…..22

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3.4. Interfaces and connectors ……………..………………………….....………….……24
3.5 LEDs ……………………...……………………………………………………..….……41
3.6 Watchdog timers …..….……………………………………………………………..….41
3.7 Module address space …...……………………………………………………………..42
4. INSTALLATION OF CPB909………………………………………………………….…………...44
5. CPB909 CONFIGURATION….…..……………………………...…………………………………45
5.1 Selection of power supply voltage for the buffers on PCI bus for PC/104-Plus
modules …………………………………………….………..…...……………………………………..45
5.2 Clearing CMOS factory settings…………………..……..…………………………….45
5.3 BIOS update …………………….…………………..…………..………………………46
6. CPC308 PROGRAMMING …...…………………………………………………………………….47
6.1. Operation with digital I/O port……...……………...…………...………….………….47
6.2. Operation with watchdog timers …………..…………….……………………………47
7. BIOS …………………………………………………………………………………………………..48
7.1. Entering BIOS SETUP ……...………………….....…………...………….………….48
7.2. Main ………………………………...………..…………….……………………………49
7.3. Advanced……...……………...…………...………….………………………………...50
7.4. Chipset ……………………………..………..…………….……………………………63
7.5. Security………………………….…...……………...…………...………….………….70
7.6. Boot………………………………….………..…………….……………………………71
7.7. Save & Exit …………………...………………….....…………...………….………….72
ANNEX B DISCLAIMER……………………………………………………………………………….73

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List of tables
Table. 1-1: Ordering information …………….………………………………………………………………….…...14
Table. 1-2: Delivery checklist …………………………………………………………….…………………………..14
Table 1-3: Additional accessories ……………………………………………………...…………………………...15
Table 2-1: Requirements to power source parameters ………………………………...…………………...........17
Table 2.2: Weight and size of the module ………………………………………………………………………….18
Table 3-1: Purpose of PC/104-ISA (XS2) connector contacts …………………………………………………...25
Table 3-2: Purpose of PCI/104-PCI (XS1) connector contacts ..…………………………………………………27
Table 3-3: Purpose of VGA (XP22) connector contacts ………………..…………………………………………29
Table 3-4: Purpose of LVDS (XP19, XP14) connector contacts …………………………………….…………..29
Table 3-5: Purpose of Audio connector contacts ………………………………………………………………….30
Table 3-6: Purpose of COM1, COM2 connector contacts (XP15, XP16) ……………………………………….31
Table 3-7: Purpose of COM3 and COM4 connectors contacts (XP20, XP21) …………………………………32
Table 3-8: Purpose of LPT connector contacts (XP6) ……………………..……………………………………...34
Table 3-9: Purposes of contacts of USB1,2, USB3,4 connectors (XP2, XP1)………………………………….35
Table 3-10: Purpose of contacts of Gigabit Ethernet connector (XP3).………………………………………….35
Table 3-11: Purpose of CFast connector’s contacts (XS4) ……………………………………………………….36
Table 3-12: Purpose of PS/2 connector contacts (XP7)……………… ……………………………………….…37
Table 3-13: Purpose of XP5 power connector’s contacts …. …………………………………………………….38
Table 3-14: Purpose of contacts of XP9 digital I/O port connector …………………………….………………..38
Table 3-15: Purpose of connector contacts for connection of external LEDs XP8 …………………………….41
Table 3-16: Purpose of LEDs ………………………………………………………………………………………..41
Table 3-17: Allocation of memory address space ….……………………………………………………………...42
Table 3-18: Allocation of I/O address space ….………………………………………………………………...….42
Table 3-19: Allocation of interrupt lines …….………….…………………………………………………………...43
Table 6-1: Registers for control the WDT2 watchdog timer …….………………………………………………..47
List of Figures
Fig. 2-1: Overall and connecting dimensions of the module (top view) ………………………………...…….…19
Fig. 2-2: Overall dimensions of the module (side view) ……………………………………………………….…19
Fig. 3-1: Module block diagram ……………………………………………………………………………………...20
Fig. 3-2: Location of connectors and main components on the TOP side ….……………….………………….21
Fig. 3-3: Location of connectors and main components on the BOTTOM side ……………………………….22
Fig. 3-4: PC/104-ISA (XS2) connector …………………………………………………………………………...…25
Fig. 3-5: Contacts of PCI-104 (XS1) connector ..…………………..…………………………...…………...........27
Fig. 3-6: VGA CRT (XP22) connector ………………………………………………………………………………28
Fig. 3-7: LVDS (XP19, XP14) connectors ………………………………………………………………………….29
Fig. 3-8: Audio-connector XP17 ………….…..……………….……………………………………………………..30
Fig. 3-9: Audio-connector XP18 …………………………………………………………..…………………………30
Fig. 3-10: COM1/COM2 connector (XP15 and XP16) …......………………………………………………….….31
Fig. 3-11: Connectors of COM3, COM4 ports (XP20, XP21) ....………………………………………………….31
Fig. 3-12 Point-to-point connection of two devices using RS 422 interface …………………………………...32

CPC310 CPU Module Specification
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Fig. 3-13: Combining several devices via RS 485 interface ……………………….……………………………33
Fig. 3-14: LPT connector (XP6) ……………………………………………………………………………………..34
Fig. 3-15: USB1,2, USB3,4 connectors (XP2 and XP1) …………………………………………………………34
Fig. 3-16: Gigabit Ethernet connector (XP3) ………………………………………………………………………35
Fig. 3-17: CFast XS4 connector ……...………………………………………………….………………………….36
Fig. 3-18: PS/2 connector (XP7) ……….………………………………………………………………………...….37
Fig. 3-19: XP5 power supply connector……………………………………………………………………………..38
Fig. 3-20: Connector of XP9 digital I/O port ………….…………………………………………………………….38
Fig. 3-21: Optoisolated external reset input XP23…………………………………………………………………39
Fig. 3-22: Diagram for implementation of module’s digital input optical isolation ……………………………..39
Fig. 3-23: Reset XP12 connector ………………………………………………………………………….………...39
Fig. 3- 24: Connector Ext. Batt XP13 ………………………………………………….……………………………40
Fig. 3-25: Reset XP8 connector ………………………………………………………………………......…………40
Fig. 3-26: XP8 connector for external LEDs ………………………………………………………………………..41
Fig. 5-1: State of contacts of PCI VIO switch (XP10) ……………………………………………………………..45
Fig. 7- 1: Screen during the module booting process (POST)……………………………………………………48
Fig. 7- 2: Screen of the “Main” menu tab……………………………………………………………………………49
Fig. 7- 3: Screen of the “Advanced” menu tab……………………………………………………………………...50
Fig. 7- 4: Screen of the “ACPI Settings” submenu………………………………………………………………....51
Fig. 7- 5: Screen of the “Onboard Device Configuration” submenu……………………………………………...52
Fig. 7- 6: Screen of the “ISA Bridge Settings” submenu…………………………………………………………..53
Fig. 7- 7: Screen of the “SCH3114x Super IO Configuration” submenu…………………………………………54
Fig. 7- 8: Screen of the “Hardware Monitor” submenu…………………………………………………………….55
Fig. 7- 9: Screen of the “Serial Port Console Redirection” submenu…………………………………………….56
Fig. 7- 10: Screen of the “Serial Port Console Redirection” submenu…………………………………………...57
Fig. 7- 11: Screen of the “SATA Configuration” submenu…………………………………………………………58
Fig. 7- 12: Screen of the “Miscellaneous Configuration” submenu………………………………………………59
Fig. 7- 13: Screen of the “LPSS & SCC Configuration” submenu………………………………………………..60
Fig. 7- 14: Screen of the “CSM Configuration” submenu………………………………………………………….61
Fig. 7- 15: Screen of the “USB Configuration” submenu………………………………………………………….62
Fig. 7- 16: Screen of the “Chipset” menu tab………………………………………………………………………63
Fig. 7- 17: Screen of the “North Bridge” submenu…………………………………………………………………64
Fig. 7- 18: Screen of the “Intel IGD Configuration” submenu…………………………………………………….65
Fig. 7- 19: Screen of the “LVDS Control” submenu………………………………………………………………..66
Fig. 7- 20: Screen of the “South Bridge” submenu…………………………………………………………………67
Fig. 7- 21: Screen of the “Azalia HD Audio” submenu……………………………………………………………..68
Fig. 7- 22: Screen of the “USB Configuration” submenu…………………………………………………………..69
Fig. 7- 23: Screen of the “Security” tab……………………………………………………………………………...70
Fig. 7- 24: Screen of the “Boot” menu tab…………………………………………………………………………..71
Fig. 7- 25: Screen of the “Save & Exit” menu tab…………………………………………………………………..72
All information in this document is provided for reference only, with no warranty of its suitability for any specific purpose. This information
has been thoroughly checked and is believed to be entirely reliable and consistent with the product that it describes. However, Fastwel accepts no
responsibility for inaccuracies, omissions or their consequences, as well as liability arising from the use or application of any product or example
described in this document.
Fastwel Co. Ltd. reserves the right to change, modify, and improve this document or the products described in it, at Fastwel's discretion
without further notice. Software described in this document is provided on an “as is” basis without warranty. Fastwel assumes no liability for
consequential or incidental damages originated by the use of this software.

CPC310 CPU Module Specification
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This document contains information, which is property of Fastwel Co. Ltd. It is not allowed to reproduce it or transmit by any means, to
translate the document or to convert it to any electronic form in full or in parts without antecedent written approval of Fastwel Co. Ltd. or one of its
officially authorized agents.
Fastwel and Fastwel logo are trademarks owned by Fastwel Co. Ltd., Moscow, Russian Federation. Ethernet is a registered trademark of
Xerox Corporation. IEEE is a registered trademark of the Institute of Electrical and Electronics Engineers Inc. Intel is a trademark of Intel Corporation.
Pentium M and Celeron M are trademarks of Intel Corporation. Microsoft is a trademark of the Microsoft corporation. In addition, this document may
include names, company logos and trademarks, which are registered trademarks and, therefore, are property of their respective owners.
Fastwel welcomes suggestions, remarks and proposals regarding the form and the content of this Manual.
Trademarks
"Fastwel" logotype is a trademark belonging to Fastwel Group Co. Ltd., Moscow, Russian
Federation.
Besides, this document may contain names, corporate logotypes and trademarks being
registered trademarks; consequently, property rights to them belong to their respective
legitimate owners.
Ownership Rights
This document contains information being the property of Fastwel Group Co. Ltd. It can
neither be copied nor transferred with the utilization of known media nor be stored in data
storage and search systems without the prior written authorization of Fastwel Group Co. Ltd. To
our best knowledge, the data in this document does not contain errors. However, Fastwel Group
Co. Ltd cannot take responsibility for any inaccuracies and their consequences, as well as
responsibility arising as a result of utilization or application of any diagram, product or example
cited in this document. Fastwel Group Co. Ltd reserves the right to alter and update both this
document and the product presented therein at its own discretion without additional notification.

CPC310 CPU Module Specification
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General Board Operation Rules
To keep the warranty, the product should not be altered or revised in any way. Any
alterations or improvements not authorized by Fastwel LLC, except for those specified in
this document or obtained from the technical support department of Fastwel LLC as a set
of instructions for their implementation, cancel the warranty.
This device should be installed and connected only to the systems, meeting all the
necessary technical and climatic requirements.
This above is also true of the operating temperature range of a particular version of the
board.
While performing all the required operations for installation and adjustment, please follow
the instructions specified only in this document.
Keep the original package for subsequent storage of the device and transportation in the
warranty event. If it is necessary to transport or store the board, please pack it the same
way as it was packed upon delivery.
Exercise special care when unpacking and handling the device. Act in accordance with
the instructions given in the paragraph above.

CPC310 CPU Module Specification
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TRANSPORTATION, UNPACKING AND STORAGE
Transportation
The module should be transported in a separate packaging box (transport packaging) of
the manufacturing facility, which consists of an individual antistatic bag and a cardboard box, in
the closed transport (automobile, railway, air transportation in heated and pressurized
compartments) in storage conditions 5 defined in the GOST standard 15150-69 (IEC 721-2-1
standard) or in storage conditions 3 during sea transportation.
It is possible to transport modules, packaged in individual antistatic packages, in multiple
packaging (transport packaging) of the manufacturing facility.
The packaged modules should be transported in accordance with the shipping rules,
operating with this particular type of transport.
During handling and transportation operations, the packaged modules should not
undergo sharp pounding, falls, shocks and exposure to atmospheric precipitation. The
packaged modules should be stored in a carrier vehicle in such a manner which will prevent
their moving.
Unpacking
Prior to unpacking, before transportation at subzero temperature of ambient air the
modules should be kept within 6 hours under storage conditions 1 defined in the GOST
standard 15150-69 (IEC 721-2-1 standard).
It is prohibited to place the packaged module close to the heat source, prior to
unpacking.
While unpacking, it is required to comply with all safety precautions, which ensure its
safety, as well as marketable condition of consumer packaging of the manufacturing company.
At the time of unpacking it is required to check the module that it has no external
mechanical damages after transportation.

CPC310 CPU Module Specification
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Storage
Module storage conditions for group 1 are defined in the GOST standard 15150-69 (IEC
721-2-1 standard).

CPC310 CPU Module Specification
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MANUFACTURER'S WAARRANTY
Warranty Liabilities
The Manufacturer hereby guarantees the product conformity with the requirements of the
ТУ 4013-006-52415667-05 technical conditions provided that the Consumer complies with the
operating, storage, transportation and installation conditions and procedures, specified by the
accompanying documents.
The Manufacturer hereby guarantees that the products supplied thereby are free from
defects in workmanship and materials, provided operation and maintenance norms were
observed during the currently established warranty period. The Manufacturer's obligation under
this warranty is to repair or replace free of charge any defective electronic component being a
part of a returned product.
Products that broke down through the Manufacturer's fault during the warranty period will
be repaired free of charge. Otherwise the Consumer will be invoiced as per the current labor
remuneration rates and expendable materials cost
Liability Limitation Right
The Manufacturer shall not be liable for the damage inflicted to the Consumer's property
because of the product breakdown in the process of its utilization.
Warranty Period
The warranty period for the products made by Fastwel LLC is 36 months since the sale
date (unless otherwise provided by the supply contract).
The warranty period for the custom-made products is 60 months since the sale date
(unless otherwise provided by the supply contract.
Limitation of warranty liabilities
The above warranty liabilities shall not be applied:
To the products (including software), which were repaired or were amended by the
employees, that do not represent the manufacturer. Exceptions are the cases where the
customer has made repairs or made amendments to the devices in the strict compliance with
instructions, preliminary agreed and approved by the manufacturer in writing;

CPC310 CPU Module Specification
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To the products, broken down due to unacceptable polarity reversal (to the opposite
sign) of the power supply, improper operation, transportation, storage, installation, mounting or
accident.
Returning a product for repair
1. Apply to Fastwel company or to any of the Fastwel's official representatives for the
Product Return Authorization.
2. Attach a failure inspection report with a product to be returned in the form, accepted by
the Manufacturer, with a description of the failure circumstances and symptoms.
3. Carefully package the product in the antistatic bag, in which the product had been
supplied. Failure to package in antistatic material will VOID all warranties. Then package the
product in a safe container for shipping.
4. The customer pays for shipping the product to Fastwel or to an official Fastwel representative
or dealer

CPC310 CPU Module Specification
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1 INTRODUCTION
1.1 Purpose
This User Manual (hereinafter referred to as the User Manual) is designed for providing you with
valuable information on the device, principle of its operation and other data, required for
commissioning, intended use and maintenance of CPC310 CPU Module (hereinafter referred to
as the “module”).
The module is PC/104-Plus single-board computer and is designed for embedded applications
that require high-performance and low power consumption.
The module contains: CFast connector, 2x Ethernet channels, 4x USB ports, 1x Serial ATA port,
4x serial ports, NAND Flash drive.
Extension of module’s functional capabilities is possible when connecting additional modules of
PC/104, PC/104-Plus, PCI-104 formats.
The module is supplied with the installed operating system (hereinafter referred to as the OS)
FreeDOSand is compatible with the following operating systems: QNX, Windows Embedded
Standard 7, Linux.
The User Manual contains guidelines for proper and safe installation, module switching-on and
configuring, connection and interaction with extension modules or external devices.
The manual also covers issues related to running, debugging and use of programs from among
base and service software (hereinafter referred to as the ‘”software”).
For safe and proper operation of the module within the specified life period, you’ll need first
read and understand the contents of this User Manual.
WARNING: USING THE MODULE WITHOUT OBSERVING SAFETY REQUIREMENTS,
OPERATION AND APPLICATION NOTES IS NOT ALLOWED!
ATTENTION: MODULE CONTAINS COMPONENTS, SENSITIVE TO ELECTROSTATIC
DISCHARGE!
1.2 Versions, delivery checklist, ordering information
1.2.1 Versions, ordering information
Module versions and their ordering names (ordering information) are specified in the Table 1.1
below:

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Table 1-1: Ordering information
Name
Reference name
Ordering name
Note
CPC310 CPU Module
CPC310
CPC310-011)
Intel Atom E3825 /4GB DDR3
RAM ECC/ 8GB
NAND Flash/ CFast/ SATA/
Digital IO/ 2x Ethernet/
4x USB 2.0/ 2x RS232/ 2x
RS422/485/ VGA/
2xLVDS/-40…+75 °C
CPC310-022)
Intel Atom E3815 /2GB DDR3
RAM ECC/ 4GB
NAND Flash/ CFast/ SATA/
Digital IO/ 2x Ethernet/
4x USB 2.0/ 2x RS232/ 2x
RS422/485/ VGA/
2xLVDS/-40…+85 °C
CPC310-033)
Intel Atom E3825 /4GB DDR3
RAM ECC/ 4GB
NAND Flash/ CFast/ SATA/
Digital IO/ 2x Ethernet/
4x USB 2.0/ 2x RS232/ 2x
RS422/485/ VGA/
2xLVDS/-40…+75 °C
CPC310-043)
Intel Atom E3815 /2GB DDR3
RAM ECC/ 2GB
NAND Flash/ CFast/ SATA/
Digital IO/ 2x Ethernet/
4x USB 2.0/ 2x RS232/ 2x
RS422/485/ VGA/
2xLVDS /-40…+85 °C
CPC310-
xx\Coated4)
Option with the conformal coating
1) Module contains a complete set of integrated interfaces and functional elements.
2) Module differs from CPC310-01 by the installed single-core CPU Intel Atom E3815, RAM 2GB,
NAND Flash 4GB and operating temperature range from –40 to +85°C.
3) CPC310-03 and CPC310-04 modules differ from CPC310-01 and CPC310-02 by lack of NAND
Flash.
4) xx –any version: 01,02,03 and 04.
Note
When ordering the device with a conformal coating, suffix “/COATED” will be added.
1.2.2 Delivery checklist
The delivery checklist for all module versions is specified in the Table 1.2 below:
Table 1-2: Delivery checklist
Ordering name
Decimal number
Description
CPC310-01,
CPC310-02,
CPC310-03,
CPC310-04.
IMES.467444.076,
IMES.467444.076-01,
IMES.467444.076-02,
IMES.467444.076-03
CPC310 CPU Module
ACS00023-04
FAPI.685611.082-04
Cable adaptor (DB9M –IDC10)
for the connection to XP15, XP16
(СОМ1, COM2)
ACS00027-02
IMES.685611.123-02
Cable adaptor (DB15F –IDC10)
for connection of VGA Monitor to

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XP22
ACS00043
IMES.685611.156
Cable adaptor fort the
connection of PS/2 keyboard and
mouse to XP7
ACS00057
IMES.467941.029
Power outlet with contacts for the
connection to XP5
-
-
Jumper 2 mm
Screw DIN7985-M3x6-A2
-
Screws (4 pcs), from the
installation kit
Nut DIN985-M3-A2
-
Nuts (4 pcs) from among the
installation kit
Washer DIN125-3,2-A2
-
Washers (4 pcs) from among the
installation kit
Washer DIN6798А-3,2-A2
-
Washers (4 pcs) from among the
installation kit
Rack WE p/n 971150324
-
Racks (4 pcs) from among the
installation kit
-
-
-
-
IMES.421945.065
Packaging
1.2.3 Additional accessories
Additional accessories for connection to the module are specified in the Table 1.3 below.
Table 1-3: Additional accessories
Ordering name
Description
ACS00031-01
Installation kit ACS00031-01. The kit contains JST PHR-5 socket and a
set of contacts SPH-002T-P0.5S for connection to XP20, XP21, XP17
(COM3, COM4, Audio) of the module.
ACS00031-02
Installation kit ACS00031-02. The kit contains JST PHR-6 socket and a
set of contacts SPH-002T-P0.5S for connection to XP7 (KB/Mouse) of the
module.
ACS00031-03
Installation kit ACS00031-03. The kit contains JST PHR-2 and a set of
contacts SPH-002T-P0.5S for connection to XP12, XP13, XP18, XP23
(Reset, Ext BAT, Mic In, Opto Reset) of the module.
ACS00037
Installation kit ACS00037. The kit contains Hirose DF13-20DS-1.25C
socket and a set of contacts DF13-2630SCF for connection to XP19,
XP14 (LVDS1,LVDS2) of the module
ACS00040-03
Installation kit ACS00040-03. The kit contains Leotronics 2040-3262
socket for connection to XЗ6 (LPT) of the module.
ACS00064
Installation kit ACS00064. The kit contains Amphenol FCI 89947-710LF
socket for slotting the flat-ribbon cable for connection to XP15, XP16,
XP22 (COM1, COM2, VGA) of the module.
ACS00064-01
Installation kit ACS00064-01. The kit contains Amphenol FCI 10073599-
010LF socket with a latch and a set of contacts 77138-101LF for the
connection to XP15, XP16, XP22 (COM1, COM2, VGA) of the module.
ACS00064-02
Installation kit ACS00064-02. The kit contains Amphenol FCI 89947-
720LF socket for slotting the flat-ribbon cable for connection to XPЗ
(2xGBE) of the module.
ACS00064-03
Installation kit ACS00064-03. The kit contains Amphenol FCI 10073599-
020LF socket with a latch and a set of contacts 77138-101LF for the
connection to XPЗ(2xGBE) of the module.
NOTE: ADDITIONAL ACCESSORIES FOR CONNECTION TO THE MODULE ARE NOT
INCLUDED INTO THE SCOPE OF DELIVERY AND ARE OFFERED AS AN OPTION.

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2 Specifications
2.1 Functional structure
The module contains the following main functional elements:
• CPU: Intel Atom E3825 or Intel Atom E3815 (for CPC310-01, CPC310-03) or Intel Atom
E3815 (for CPC310-02, CPC310-04):
–2x 32-/64-bit x86 cores (for E3825),
–single 32-/64-bit x86 core (for E3815),
–64-bit memory bus,
–L1 cache –32 KB for program area, 24 KB for data area,
–L2 cache –1 MB,
–support of SSE4.1, SSE4.2
–support of Intel SpeedStep technology;
• DDR3 SDRAM 1066 MHz with ECC (soldered onboard) – 4 GB (for CPC310-01, CPC310-03);
• DDR3 SDRAM 1066 MHz with ECC (soldered onboard) – 2 GB (for CPC310-02, CPC310-04);
• Flash BIOS:
–64 Mb,
–modifiable within the system;
• SATA interface (switched with CFast connector) routed to the StackPC connector:
–support of SATA II specification;
• NAND Flash drive (soldered and connected to SATA interface) –8 GB (for CPC310-01):
–support of SATA II specification
• NAND Flash drive (soldered and connected to SATA interface) – 4 GB (for CPC310-02):
–support of SATA II specification;
• Connector for CFast (switched with SATA interface):
–support of SATA II specification;
•PCI bus:
–support of v.3.0 specification,
–32-bit / 33MHz;
–Connection of up to 3хbus master devices;
•SMBUS:
–support of v.2.0 specification,
–rate of up to 100 Kb/sec;
• Video controller:
–2D/3D accelerator,
–VGA output (resolution of up to 2560x1600, 60 Hz),
–2x LVDS ports, resolution of up to 1600x1200, 60Hz, 18/24 bit;
•Two Ethernet controllers 10/100/1000 Mb;
•USB ports:
–connection of up to 4x devices,
–support of USB 1.1, USB 2.0 specifications,

CPC310 CPU Module Specification
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–support of OS booting from USB drive;
• Serial ports:
–СОМ1, COM2: RS-232, 9-wire (full), with possibility of console I/O, with data exchange rate of
no more than –115,2 Kb/sec,
–COM3, COM4: RS-422/485, with galvanic isolation (breakdown voltage of 500 V), with data
exchange rate of no more than –921 Kb/sec;
• Universal parallel port (with support of EPP, ECP modes);
•HD Audio controller:
–linear stereo input/output,
–input for microphone connection;
• PS/2 keyboard and mouse port;
•Digital I/O port:
–8x separately programmable I/O lines;
•Opto-isolated input of external reset/interrupt:
–Insulation breakdown voltage –500 V;
•Real-Time Clock (RTC);
•Serial FRAM (for storing user configuration);
•Two watchdog timers (WDT):
–WDT1 –with fixed actuation interval –1.6 sec,
–WDT2 –with the programmable actuation interval –from 1 sec to 255 min;
Module is compatible with the following OS: FreeDOS, QNX, Windows Еmbedded Standard 7,
Linux.
2.2 Power supply
Module’s power supply should correspond to the requirements, specified in the Table 2.1.
The module can be fed with power via a power supply connector (XP5), as well as via PC/104
bus connector. Maximum current consumption value is 2A for CPC310-01, CPC310-03 and 1.6
A for CPC310-02 and CPC310-04 modules, exclusive of connected external devices.
Table 2-1: Requirements to power source parameters
Output voltage, V
Rated load current, A
Output voltage buildup time to
the level of +4,75 V, ms
From +4,75 to +5,25
4
No more than 10
IT IS PROHIBITED TO RESTART THE MODULE LESS THAN 5 SECONDS AFTER ITS SHUTDOWN.

CPC310 CPU Module Specification
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2.3 Operation conditions
The module should be used under the following operation conditions:
–Operating temperature range:
CPC310-01, CPC310-03 –from - 40 to + 75 °С,
CPC310-02, CPC310-04 –from - 40 to + 85 °С,
The modules are resistant to ambient temperature changes within the specified temperature
range, with the relative humidity of up to 80% without condensation.
2.4 Mechanical features
The module corresponds to the following mechanical features:
- Resistance to sinusoidal vibration within the range of frequencies: from 10 to 500 Hz,
acceleration amplitude no more than –5g;
–Single shock resistance, peak acceleration is no more than –100 g,
–Multiple shock resistance (number of shocks: 1000), peak acceleration is no more than –50 g.
2.5 Module dimensions
Weight and size values for module’s versions are specified in the Table 2.2 below:
Table 2.2: Weight and size of the module
Module
Weight in kg, no
more than
Packaged weight
in kg, no more
than
Dimensions in
mm, no more
than
Package
dimensions in
mm
CPC310-01
СРС310-02
CPC310-03
СРС310-04
0,200 1)
0,354±0,05
116,0 x 96,0 x 24,5
230 x 155 x 45
1) Not including the weight of CFast device.
General overall and connecting dimensions of the module are shown in Figure 2.1 and Figure
2.2 below.

CPC310 CPU Module Specification
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Fig. 2-1: Overall and connecting dimensions of the module (top view)
Fig. 2-2: Overall dimensions of the module (side view)
2.6 MTBF
The MTBF value for the module is –150 000 hours.
Note
This MTBF value is calculated using the Telcordia Issue 1 model, Method I Case 3,
for continuous operation when located on the ground under conditions corresponding
to the moderately cold climate 4 in accordance with the GOST standard 15150-69, at
the ambient temperature of + 30°С.

CPC310 CPU Module Specification
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3 Structure and operation
3.1 Module’s block diagram
Module’s block diagram is shown in Figure 3-1 below:
Fig. 3-1: Module block diagram
The module' block diagram shows main functional units:
–Intel Atom E3825 and Intel Atom E3815 (for CPC310-01, CPC310-03) CPUs (for CPC310-02,
CPC310-04);
–DDR3 SDRAM (4 GB for CPC310-01, CPC310-03 and 2 GB for CPC310-02, CPC310-04);
–Flash BIOS (64 Mb);
–NAND Flash drive (8 GB for CPC310-01 and 4 GB for CPC310-02);