Fibocom FM101-NA-20 Installation instructions

FM101-NA-20
Hardware Guide
V1.0
Fibocom Confidential

Copyright
Copyright ©2021 Fibocom Wireless Inc. All rights reserved. Without the prior written
permission of the copyright holder, any company or individual is prohibited to excerpt,
copy any part of or the entire document, or transmit the document in any form.
Notice
The document is subject to update from time to time owing to the product version
upgrade or other reasons. Unless otherwise specified, the document only serves as the
user guide. All the statements, information and suggestions contained in the document
do not constitute any explicit or implicit guarantee.
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.
Contact
Website: https://www.fibocom.com/en/
Address: Floor 10, Building A, Shenzhen International Innovation Valley, First Stone Road,
Xili Community, Xili Street, Nanshan District, Shenzhen
Tel: [phone]
Fibocom Confidential

Contents
Change History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê4
1. Foreword. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê5
1.1. Document Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê5
1.2. Safety Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê5
2. Product Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê7
2.1. Product Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê7
2.2. Product Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê7
2.2.1. Radio Frequency Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê7
2.2.2. Other Key Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê8
2.3. Supported CA Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê10
2.4. Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê10
2.5. Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê12
3. Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê13
3.1. Pin Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê13
3.2. Pin Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê14
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê21
4.1. Limit Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê21
4.1.1. Absolute Limit Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê21
4.1.2. Recommended Operating Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê21
4.2. Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê22
5. Functional Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê25
5.1. Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê25
5.2. Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê27
5.2.1. Power on/off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê27
5.2.1.1. Power on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê27
5.2.1.2. Power-on Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê28
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Fibocom Confidential

5.2.1.3. Power Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê28
5.2.2. Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê29
5.3. LED1# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê30
5.4. (U)SIM Card Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê31
5.4.1. (U)SIM Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê31
5.4.2. (U)SIM Interface Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê32
5.4.3. (U)SIM Card Hot Plug . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê33
5.4.4. (U)SIM Design Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê34
5.5. USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê35
5.5.1. USB Interface Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê35
5.5.2. USB Routing Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê36
5.5.2.1. USB 2.0 Routing Rules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê36
5.5.2.2. USB 3.0 Routing Rules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê37
5.6. PCM and I2S Digital Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê37
5.6.1. PCM Interface Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê37
5.6.2. PCM Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê38
5.7. PCIe Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê39
5.7.1. PCIe Routing Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê40
5.7.2. PCIe Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê41
5.8. Flight Mode Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê42
5.9. Sleep/Wakeup Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê43
6. Radio Frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê44
6.1. RF Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê44
6.1.1. RF Interface Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê44
6.1.2. RF Connector Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê44
6.1.3. RF Connector Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê45
6.2. Operating Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê46
6.3. Transmitting Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê47
6.4. Receiving Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê47
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6.5. GNSS Receiving Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê48
6.6. Antenna Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê49
6.7. PCB Routing Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê50
6.7.1. Routing Rules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê50
6.7.2. Impedance Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê50
6.7.3. 3W Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê51
6.7.4. Impedance Design for Four-layer Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê51
6.8. Main Antenna Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê53
6.8.1. External Antenna. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê53
6.8.2. Internal Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê54
6.8.2.1. Design Principle of Internal Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê54
6.8.2.2. Internal Antenna Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê54
6.8.3. Surrounding Environment Design of Internal Antenna . . . . . . . . . . . . . . . . . . . . . Ê59
6.8.3.1. Handling of Speaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê59
6.8.3.2. Handling of Metal Structural Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê59
6.8.3.3. Handling of Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê59
6.8.3.4. Location of Large Components in Antenna Area . . . . . . . . . . . . . . . . . . . . . . . Ê60
6.8.4. Common Problems of Internal Antenna Overall Design . . . . . . . . . . . . . . . . . . . . Ê61
6.9. Diversity and MIMO Antenna Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê62
6.10. Other Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê63
7. Thermal Design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê64
8. Electrostatic Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê65
9. Structural Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê66
9.1. Product Appearance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê66
9.2. Structural Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê66
9.3. Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê67
9.4. Storage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê68
Appendix A: Acronyms and Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ê70
Contents
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Change History
V1.0 (2021-08-11) Initial version.
Change History
Copyright © Fibocom Wireless Inc. 4
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1. Foreword
1.1. Document Description
This document describes the electrical characteristics, RF performance, dimensions and
application environment, etc. of the FM101-NA-20 wireless module. With the assistance of
this document and other related documents, application developers can quickly
understand the hardware functions of the FM101-NA-20 module and develop product
hardware.
1.2. Safety Instructions
By following the safety guidelines below, you can ensure your personal safety and help
protect the product and work environment from potential damage. Product
manufacturers need to communicate the following safety instructions to end users.
Fibocom Wireless does not assume any responsibility for the consequences caused by
users' misuse because they do not comply with these safety rules.
Road safety first! When you are driving, do not use any handheld mobile
device even if it has a hand-free feature. Stop the car before making a
call.
Please turn off the mobile device before boarding. The wireless feature
of the mobile device is not allowed on the aircraft to prevent
interference with the aircraft communication system. Ignoring this note
may result in flight safety issue or even violate the law.
When in a hospital or health care facility, please be aware of restrictions
on the use of mobile devices. Radio frequency interference may cause
medical equipment to malfunction, so it may be necessary to turn off
the mobile device.
1. Foreword
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The mobile device does not guarantee that an effective connection can
be made under any circumstances, for example, when there is no
prepayment for the mobile device or (U)SIM is invalid. When you
encounter the above situation in an emergency, please remember to
use emergency calls, and ensure that your device is turned on and in an
area with strong signal.
Your mobile device receives and transmits RF signals when it is powered
on. Your mobile device will receive and transmit RF signals when it is
turned on. RF interference occurs when it is near a TV, radio, computer,
or other electronic device.
Keep mobile device away from flammable gases. Turn off the mobile
device when you are near to gas stations, oil depots, chemical plants or
explosive workplaces. There are potential safety hazards when
operating electronic equipment in any potentially explosive area.
1. Foreword
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2. Product Overview
2.1. Product Introduction
Fibocom FM101-NA-20 module is designed based on Qualcomm SDX12 platform,
supporting Cat 6 network level, and supporting CA network architecture. FM101-NA-20
integrates Baseband, Memory, PMIC, Transceiver, PA and other core devices, supporting
long-distance communication modes of FDD-LTE, TDD-LTE and WCDMA. The maximum
downlink rate supported in CA mode is 300 Mbps, and the maximum uplink rate is 50
Mbps. FM101-NA-20 is designed with M.2 package and is applicable to various scenarios
such as CPE, VR/AR, gateway, Internet TV set-top box, and intelligent monitoring.
2.2. Product Specifications
2.2.1. Radio Frequency Features
Table 1. Operating band
System FM101-NA-20
WCDMA Band 2/4/5
FDD-LTE Band 2/4/5/7/12/13/14/17/25/26/29/30/66/71
TDD-LTE Band 41 (194M)/42/43/46/48
Table 2. Transmission capacity
System FM101-NA-20
WCDMA
DL peak rate 42 Mbps
UL peak rate 11 Mbps
LTE
DL peak rate 300 Mbps
UL peak rate 50 Mbps
DL 2 × 2 MIMO
2. Product Overview
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Table 3. Modulation features
System FM101-NA-20
WCDMA
Support 3GPP R9/DC-HSDPA/HSPA+/HSDPA/HSUPA/WCDMA
Support 64QAM, 16QAM and QPSK modulation
LTE
Support 3GPP R12
Support DL 64QAM, 16QAM and QPSK modulations
Support UL 64QAM, 16QAM and QPSK modulation
Support RF bandwidth 1.4 MHz to 20 MHz
2.2.2. Other Key Features
Table 4. Other key features
Item Description
Power supply
DC: 3.135 V–4.4 V
Typical voltage: 3.8 V
Processor
Qualcomm SDX12, 14nm process, single-core ARM Cortex-A7, up to
1.28 GHz
Storage 2Gb LPDDR2 + 2Gb NAND Flash
Supported
systems Linux/Android/Windows
Power class
Class 3 (23.5dBm ± 2dB) for WCDMA bands
Class 3 (23dBm ± 2dB) for LTE bands
Satellite
positioning GPS/GLONASS/Galileo/BDS
SMS Support
Audio interface Support PCM/I2S digital audio interface
2. Product Overview
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Item Description
USB interface
A group of USB 3.0 superspeed (SS) interfaces with data transmission
rate up to 5 Gbps
Compatible with USB 2.0 highspeed (HS) interfaces, with data
transmission rate up to 480 Mbps
Used for AT command transmission, data transmission, software
debugging, software upgrading, etc.
PCIE interface
PCIE Gen2 x 1Lane, the maximum transmission rate is 5GT/s, and RC
mode is supported
SIM interface
2 groups of SIM card interfaces, supporting dual SIM dual standby
Support USIM: 1.8 V and 3 V
I2C interface 1 group I2C with a maximum speed of 3.4 Mbps
Physical
characteristic
Dimensions: 30 mm x 42 mm x 2.3 mm
Packaging: M.2
Weight: 5.65g ± 0.5g
Temperature
range
Operating temperature: –30°C to 75°C
The module works normally within this temperature range, and the
related performance meets the requirements of 3GPP standards.
Extended temperature: –40°C to 85°C
The module works normally within this temperature range, and the
baseband and RF functions are normal. However, some indicators
may exceed the range of 3GPP standards. When the temperature
returns to the normal working range of the module, all the indicators
of the module meet the requirements of 3GPP standards.
Storage temperature: –40°C to 90°C
The storage temperature range of the module when the module is
powered off.
Software
upgrade Through USB interface/FOTA
2. Product Overview
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Item Description
Environmental
standards RoHS and halogen-free
2.3. Supported CA Combinations
Table 5. CA combinations supported by FM101-NA-20
Combination 2A-2A/4A/5A/12A/13A/14A/29A/30A/46A/48A/66A/71A
4A-4A/5A/12A/13A/29A/30A/46A/71A
5A-5A/30A/46A/66A
7A-7A/12A
12A-30A/66A
13A-46A/66A
14A-30A/66A
29A-30A/66A
30A-66A
46A-66A
66A-66A/71A
41A-41A
2C
5B
12B
41C
42C
48C
66B
66C
2.4. Functional Block Diagram
Functional block diagram shows the main hardware functions of the FM101-NA-20
2. Product Overview
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module, including the baseband and RF functions.
Baseband section
•CPU
•PMIC
•LPDDR2
•NAND
•USB, PCIE, (U)SIM, PCM/I2S
•WCDMA/LTE TDD/LTE FDD controller
RF section
•RF Transceiver
•RF PA
•RF Switch
•RF filter
•Antenna
2. Product Overview
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Figure 1. Functional block diagram
2.5. Evaluation Board
Fibocom provides EVB-M.2 evaluation board to facilitate module debug and use. For how
to use it, see FIBOCOM EVB-M2 User Guide.
2. Product Overview
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3. Pin Definition
3.1. Pin Distribution
The FM101-NA-20 module uses M.2 packaging and have 75 pins in total. The following
figure shows the pin distribution.
Figure 2. Pin distribution
3. Pin Definition
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3.2. Pin Function
The FM101-NA-20 module pin function is described in the following table.
Table 6. LGA pin function description
Pin
Number Pin Name I/O
Reset
Status Pin Description Type
1 CONFIG_3 DO NC
NC, WWAN-PCIe is configured
for FM101-NA-20 module,
USB_SS interface type M.2
module
- -
2 VCC PI * Power input
Power
supply
3 GND - - - - Ground
Power
supply
4 VCC PI * Power input
Power
supply
5 GND - - - - Ground
Power
supply
6
FULL_CARD_
POWER_OFF
#
DI PU
Module on/off control, high-level
on, low-level off; internal pull-up CMOS
3.3V/1.8V
7 USB_DP DIO * USB 2.0 data 0.3V–3V
8
W_DISABLE1
#DI PU
Turn off WWAN of the module,
i.e. flight mode, active low
CMOS
3.3V/1.8V
9 USB_DM DIO * USB 2.0 data – 0.3V–3V
10 LED1# OD T System status indication, open
drain output *
3. Pin Definition
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Pin
Number Pin Name I/O
Reset
Status Pin Description Type
11 GND - - - - Ground
Power
supply
12 Notch * * Notch groove *
13 Notch * * Notch groove *
14 Notch * * Notch groove *
15 Notch * * Notch groove *
16 Notch * * Notch groove *
17 Notch * * Notch groove *
18 Notch * * Notch groove *
19 Notch * * Notch groove *
20 I2S_SCK DO PD I2S serial clock, reserved
CMOS
1.8V
21 CONFIG_0 - - NC
NC, WWAN-PCIe is configured
for FM101-NA-20 module,
USB_SS interface type M.2
module
- -
22 I2S_RX DI PD
I2S serial data receiving,
reserved
CMOS
1.8V
23 WOWWAN# DO PD Wakeup host
CMOS
1.8V
24 I2S_TX DO PD
I2S serial data transmission,
reserved
CMOS
1.8V
25 DPR DI PU
Dynamic power control for SAR
interrupt detection, active low,
reserved
CMOS
3.3V/1.8V
3. Pin Definition
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Pin
Number Pin Name I/O
Reset
Status Pin Description Type
26 W_DISABLE2
#DI PU
GNSS positioning is disabled,
active low, reserved
CMOS
3.3V/1.8V
27 GND - - - - Ground
Power
supply
28 I2S_WA DO PD I2S byte selection, left and right
channels, reserved
CMOS
1.8V
29 USB_SS_TX_
MDO *
Ultra high speed USB data
transmitting negative *
30 UIM1_RESET DO L SIM card 1 reset
CMOS
3V/1.8V
31 USB_SS_TX_P AO *
Ultra high speed USB data
transmitting positive *
32 UIM1_CLK DO L SIM card 1 clock
CMOS
3V/1.8V
33 GND - - - - Ground
Power
supply
34 UIM1_DATA DIO L SIM card 1 data
CMOS
3V/1.8V
35 USB_SS_RX_
MAI *
Ultra high speed USB data
receiving negative *
36 UIM1_PWR PO *
SIM card 1 power supply,
3V/1.8V
CMOS
3V/1.8V
37 USB_SS_RX_P AI *
Ultra high speed USB data
receiving positive *
38 WAKEUP_IN DI *
Peripheral wake-up module
control signal
CMOS
1.8V
3. Pin Definition
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Pin
Number Pin Name I/O
Reset
Status Pin Description Type
39 GND - - - - Ground
Power
supply
40 SIM2_DETEC
TDI *
SIM card 2 detection, and
external pull-up and pull-down
are required. A card is available
at high level by default,
SPI_MISO (Reserved)
CMOS
1.8V
41 PETn0 DO * PCIe data transmitting negative *
42 UIM2_DATA DIO L SIM card 2 data, SPI_MOSI
(Reserved)
CMOS
3V/1.8V
43 PETp0 DO * PCIe data transmitting positive *
44 UIM2_CLK DO L SIM card 2 clock, SPI_CLK
(Reserved)
CMOS
3V/1.8V
45 GND - - - - Ground
Power
supply
46 UIM2_RESET DO L SIM card 2 reset,
SPI_CS(Reserved)
CMOS
3V/1.8V
47 PERn0 DI * PCIe data receiving negative *
48 UIM2_PWR PO * SIM card 2 power supply
CMOS
3V/1.8V
49 PERp0 DI * PCIe data receiving positive *
50 PERST# DI PD
Module PCIe interface reset.
Active low, and an external pull-
up resistor is required
CMOS
3.3V/1.8V
51 GND - - - - Ground
Power
supply
3. Pin Definition
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Pin
Number Pin Name I/O
Reset
Status Pin Description Type
52 CLKREQ# DIO T
PCIe clock request signal, active
low, open drain output, an
external pull-up resistor needs
to be reserved
CMOS
3.3V/1.8V
53 REFCLKN DIO *
PCIe reference clock differential
negative signal *
54 PEWAKE# DO T
PCIe wake-up signal, active low,
open drain output, an external
pull-up resistor is required
CMOS
3.3V/1.8V
55 REFCLKP DIO *
PCIe reference clock differential
positive signal *
56 RFFE_SCLK DO PD RFFE-MIPI serial clock signal,
I2C_SCL (Reserved)
CMOS
1.8V
57 GND - - - - Ground
Power
supply
58 RFFE_SDATA DIO PD RFFE-MIPI serial data signal,
I2C_SDA (Reserved)
CMOS
1.8V
59 GRFC7 DO PD
A high level is output and the
5GHz WLAN LNAs is turned off
when the n79 transmitting
power exceeds 10dBm
CMOS
1.8V
60 COEX3/GPIO
86 DI *
Output a high level to the
module to turn off the n79 LNAs
when the external 5 GHz WLAN
transmitting power exceeds a
certain threshold
CMOS
1.8V
3. Pin Definition
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