Fibocom L610-LA Installation instructions

Draft
FIBOCOM L610-LA Hardware Guide
Version: V1.1.1
Date: 2020-05-29

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Applicability type
No.
Product model
Description
1
L610-LA
MAIN_ANT, FDD/TDD/GSM, WiFi-Scan, BT

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Copyright
Copyright ©2020 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or transmit the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.

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Versions
Document
Version
Prepared
by
Reviewed
by
Approved
by
Update Date
Description
V1.0.0
Wang
Yuanguang
Wang Bo
Liu Ke
2019-11-21
Initial version
V1.0.1
Wang
Yuanguang
Wang Bo
Liu Ke
2019-12-06
Added OPEN pin multiplexing
V1.0.2
Wang
Yuanguang
Wang Bo
Liu Ke
2019-12-12
Modified some issues and added
pin support for I/O power domain
V1.0.3
Wang
Yuanguang
Wang Bo
Liu Ke
2019-12-17
Modified module thickness issue
V1.0.4
Wang
Yuanguang
Wang Bo
Liu Ke
2019-12-31
Added power consumption data
V1.0.5
Wang
Yuanguang
Wang Bo
Liu Ke
2020-01-15
Modified some issues
V1.0.6
Wang
Yuanguang
Wang Bo
Liu Ke
2020-02-13
Modified power consumption
data
V1.0.7
Wang
Yuanguang
Wang Bo
Liu Ke
2020-03-06
Modified power consumption
data
V1.0.8
He Jiazhao
He Jiazhao
Wang
Hailiang
2020-04-17
Standardized format
V1.0.9
Wang
Yuanguang
Wang Bo
Liu Ke
2020-05-07
Modified Structure size
V1.1.0
Wang
Yuanguang
Wang Bo
Liu Ke
2020-05-14
Add NEW models
V1.1.1
Wang
Yuanguang
Wang Bo
Liu Ke
2020-05-29
Add ADC accuracy

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Contents
1 Foreword...................................................................................................................................... 7
1.1 Introduction.................................................................................................................................. 7
1.2 Safety Instruction........................................................................................................................ 7
1.3 Reference Standard....................................................................................................................8
1.4 Related Documents.................................................................................................................... 8
2 Product Overview...................................................................................................................... 9
2.1 Product Introduction....................................................................................................................9
2.2 Product Specifications................................................................................................................9
2.3 Hardware Diagram....................................................................................................................10
3 Application Interface...............................................................................................................12
3.1 LCC+LGA Interface.................................................................................................................. 12
3.1.1 Pin Distribution...........................................................................................................................12
3.1.2 Pin Definition.............................................................................................................................. 13
3.1.3 Pin Multiplexing..........................................................................................................................21
3.2 Power Supply............................................................................................................................ 22
3.2.1 Power Supply.............................................................................................................................22
3.2.2 1.8V Output................................................................................................................................ 23
3.2.3 Power Consumption................................................................................................................. 23
3.3 Control Signal............................................................................................................................ 24
3.3.1 Module Power-on...................................................................................................................... 25
3.3.1.1 Power-on Circuit Reference....................................................................................................................25
3.3.1.2 Power-on Timing.......................................................................................................................................26
3.3.1.3 Auto Power-on.......................................................................................................................................... 26
3.3.2 Module Shutdown......................................................................................................................27
3.3.2.1 Shutdown Timing...................................................................................................................................... 27
3.3.3 Module Reset.............................................................................................................................27
3.3.3.1 Reset Circuit..............................................................................................................................................28
3.3.3.2 RESET_N Control Timing....................................................................................................................... 29
3.4 USB Interface............................................................................................................................ 29
3.4.1 USB Interface Definition...........................................................................................................29
3.5 USIM Interface.......................................................................................................................... 30
3.5.1 USIM Pin.....................................................................................................................................30

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3.5.2 USIM Interface Circuit.............................................................................................................. 30
3.5.2.1 SIM Card Slot with Detection Signal..................................................................................................... 30
3.5.2.2 SIM Card Slot without Detection Signal................................................................................................32
3.5.3 USIM Hot Plug........................................................................................................................... 32
3.5.4 USIM Design Requirements....................................................................................................33
3.6 UART Interface..........................................................................................................................33
3.6.1 UART Interface Definition........................................................................................................ 33
3.6.2 UART Interface Application..................................................................................................... 34
3.7 Status Indicator......................................................................................................................... 35
3.7.1 NET_MODE Signal................................................................................................................... 35
3.8 Low Power Consumption Mode..............................................................................................37
3.8.1 Flight Mode.................................................................................................................................37
3.8.2 Sleep Mode................................................................................................................................ 37
3.9 ADC Function............................................................................................................................ 37
4 RF Interface............................................................................................................................... 38
4.1 L610 Operating Band............................................................................................................... 38
4.2 L610 RF Output Power............................................................................................................ 38
4.3 L610 RF Receiving sensitivity.................................................................................................39
4.4 RF PCB Design.........................................................................................................................39
4.4.1 Antenna RF Connector.............................................................................................................39
4.5 Antenna Design.........................................................................................................................40
5 Electrical Characteristics...................................................................................................... 43
5.1 Limiting Voltage Range............................................................................................................ 43
5.2 Ambient Temperature Range.................................................................................................. 43
5.3 Electrical Characteristics of the Interface in Operating Status.......................................... 43
5.4 Environmental Reliability Requirements............................................................................... 44
5.5 ESD Characteristics................................................................................................................. 45
6 Structure Specification.......................................................................................................... 46
6.1 Product Appearance.................................................................................................................46
6.2 Structural Dimension................................................................................................................ 47
6.3 SMT Patch................................................................................................................................. 47
7 Warnning.................................................................................................................................... 47

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1 Foreword
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L610 wireless modules. With the assistance of the document and other instructions,
the developers can quickly understand the hardware functions of L610 modules and develop product
hardware.
1.2 Safety Instruction
By following the safety guidelines below, you can ensure your personal safety and help protect the
product and work environment from potential damage. Product manufacturers need to communicate the
following safety instructions to end users. In case of failure to comply with these safety rules, Fibocom will
not be responsible for the consequences caused by the user’s misuse.
Road safety first! When you drive, do not use the handheld devices even if it has a
hand-free feature. Please stop and call.
Please turn off the mobile device before boarding. The wireless feature of the
mobile device is not allowed on the aircraft to prevent interference with the aircraft
communication system. Ignoring this note may result in flight safety issue or even
violate the law.
When in a hospital or health care facility, please be aware of restrictions on the use
of mobile devices. Radio frequency interference may cause medical equipment to
malfunction, so it may be necessary to turn off the mobile device.
The mobile device does not guarantee that an effective connection can be made
under any circumstances, for example, when there is no prepayment for the mobile
device or the (U)SIM is invalid. When you encounter the above situation in an
emergency, remember to use an emergency call, while keeping your device turned
on and in areas where signal is strong.
Your mobile device receives and transmits RF signals when it is powered on.
Radio interference occurs when it is near televisions, radios, computers, or other

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electronic devices.
Keep the mobile device away from flammable gases. Turn off the mobile device
when you get near to gas stations, oil depots, chemical plants or explosive
workplaces. There are potential safety hazards when operating electronic
equipment in any potentially explosive area.
1.3 Reference Standard
This design of the product complies with the following standards:
3GPP TS 51.010-1 V10.5.0: Mobile Station (MS) conformance specification; Part 1: Conformance
specification
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification; Radio transmission
and reception (FDD); Part 1: Conformance specification
3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio transmission
and reception (TDD)
3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission
and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
(SIM-ME) interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit (USAT)
3GPP TS 36.124 V10.3.0: Electro Magnetic Compatibility (EMC) requirements for mobile terminals
and ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)
3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment
(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
1.4 Related Documents
FIBOCOM EVK-GT8230-NL User Guide
FIBOCOM ADP-L610 User Guide
FIBOCOM L610 SMT Design Guide
FIBOCOM Design Guide_RF Antenna
FIBOCOM L610 AT Commands

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2 Product Overview
2.1 Product Introduction
L610 modules are wideband wireless terminal products applicable to various network formats and
multi-bands including FDD-LTE/GSM.
The frequency band division of L610 series products is as follows:
Band
L610-LA
LTE FDD
Band 1,2,3,4,5,7,8,28,66
LTE TDD
NO Support
GSM
850/900/1800/1900
ANT
Main+WIFI
Built-in ESIM
NO Support
2.2 Product Specifications
Specifications
Operating band
LTE FDD: Band 1,2,3,4,5,7,8,28,66
GSM/GPRS: 850/900/1800/1900
Data
transmission
LTE FDD Rel.13
10Mbps DL/5Mbps UL
GPRS
GPRS:85.6kbps DL/85.6kbps UL (multi-slot class 12)
Power supply
3.4V~4.3V (3.8V recommended)
Temperature
Normal operation: -30°C~+75°C
Extended operation: -40°C ~+85°C
Storage: -40°C ~+90°C
Power
consumption
Sleep mode: 3mA
Idle mode: 15mA
Physical
characteristics
Package: LCC 80PIN+LGA 64PIN
Size: 31.0×28.0×2.35 mm
Weight: About 5.5g

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Interface
Antenna
Antenna: main x 1, WIFI x 1
Function
interface
USIM 3.0V/1.8V
USB 2.0 x 1
System status indication
ADC*3
Software
Protocol stack
Embedded TCP/IP and UDP/IP protocol stack
AT command
3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT
Firmware update
USB
Voice service
AMR, caller ID, call forwarding, call hold, call waiting and multi-party call, etc.
SMS service
Point-to-point MO, MT, cell broadcast, Text and PDU modes
Note:
When the normal operating temperature range of -30°C ~+75°C is exceeded, the RF
performance of the module may slightly exceed the requirements of 3GPP Specification.
2.3 Hardware Diagram
Figure 2-2 hardware diagram shows the main hardware features of L610 module, including baseband and
RF features.
Baseband includes:
GSM/LTE TDD/LTE FDD controller
PMIC
UART, SIM, PCM, I2C, SPI, SDIO, ADC, KEY
RF includes:
RF Transceiver
RF PA
RF filter
Antenna

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Figure 2-2 Hardware diagram

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3 Application Interface
3.1 LCC+LGA Interface
L610 modules adopt LCC 80PIN+LGA 64PIN packaging, with a total of 144 pins.
3.1.1 Pin Distribution
Figure 3-1 Pin Distribution Diagram (TOP plan perspective view)
Note:
“85-->112” is the thermal pin, and the module is grounded internally. It is recommended that the

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heat sink pad is reserved for PCB packaging and welded.
3.1.2 Pin Definition
The pins are defined as follows:
Pin
Pin Name
I/O
Level
Reset
Value
Description
1
WAKEUP_IN
I
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
L
External device wake-up module
Left floating when not in use
2
AP_READY
I
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
H
The module detects whether the host
is sleeping
Left floating when not in use
3
SLEEP_IND
O
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
SLEEP_IND
Left floating when not in use
4
W_DISABLE#
I
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
L
Module flight mode control
Left floating when not in use
5
NET_MODE
O
VOHmin=1.35V
VOLmax=0.45V
L
Module state indication
Left floating when not in use
6
NET_STATUS
O
VOHmin=1.35V
VOLmax=0.45V
L
7
VDD_EXT
PO
1.8V
Module digital level, 1.8V output
Left floating when not in use
8
GND
G
-
Ground
9
GND
G
-
Ground
10
USIM_GND
G
-
Ground
11
DBG_RXD
I
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
DEBUG serial port Receive
Left floating when not in use
12
DBG_TXD
O
VOLmax=0.45V
VOHmin=1.35V
DEBUG serial port Transmit
Left floating when not in use
13
USIM_PRESENCE
I
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
USIM hot plug detection; no need to
connect 10k to Ground in series;

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Pin
Pin Name
I/O
Level
Reset
Value
Description
software shutdown detection function
14
USIM_VDD
PO
For 1.8V USIM:
Vmax=1.9V
Vmin=1.7V
For 3.0V USIM:
Vmax=3.05V
Vmin=2.7V
I/Omax=50mA
USIM power supply
15
USIM_DATA
I/O
For 1.8V USIM:
VILmax=0.6V
VIHmin=1.2V
VOLmax=0.45V
VOHmin=1.35V
For 3.0V USIM:
VILmax=1.0V
VIHmin=1.95V
VOLmax=0.45V
VOHmin=2.55V
USIM data signal cable
16
USIM_CLK
O
For 1.8V USIM:
VOLmax=0.45V
VOHmin=1.35V
For3.0V USIM:
VOLmax=0.45V
VOHmin=2.55V
USIM clock signal cable
17
USIM_RST
O
For 1.8V USIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V USIM:
VOLmax=0.45V
VOHmin=2.55V
USIM reset signal cable
18
NC
-
-
NC
19
GND
G
-
Ground
20
RESET_N
I
VIHmax=VBAT
VILmax=0.5V
Module reset signal, active low
21
PWRKEY
I
VIHmax=VBAT
VILmax=0.5V
Module power-on/power-off, active
low
22
GND
G
-
Ground
23
SD_DET
I
-
SD detection
Left floating when not in use
24
PCM_IN
I
VILmin=-0.3V
VILmax=0.6V
L
PCM data input

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Pin
Pin Name
I/O
Level
Reset
Value
Description
VIHmin=1.2V
VIHmax=2.0V
Left floating when not in use
25
PCM_OUT
O
VOLmax=0.45V
VOHmin=1.35V
L
PCM data output
Left floating when not in use
26
PCM_SYNC
I/O
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
PCM data synchronization signal
Left floating when not in use
27
PCM_CLK
I/O
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
PCM clock
Left floating when not in use
28
SDC2_DATA_3
I/O
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
H
SDC2_DATA_3
Left floating when not in use
29
SDC2_DATA_2
I/O
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
H
SDC2_DATA_2
Left floating when not in use
30
SDC2_DATA_1
I/O
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
H
SDC2_DATA_1
Left floating when not in use
31
SDC2_DATA_0
I/O
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
H
SDC2_DATA_0
Left floating when not in use
32
SDC2_CLK
O
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
SDC2_CLK
Left floating when not in use
33
SDC2_CMD
O
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
H
SDC2_CMD
Left floating when not in use
34
VDD_SDIO
PO
-
VDD_SDIO
35
WIFI_ANT
I
-
WIFI antenna
Left floating when not in use

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Pin
Pin Name
I/O
Level
Reset
Value
Description
36
GND
G
-
Ground
37
SPI_CS_N
I
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
SPI_CS_N
Left floating when not in use
38
SPI_MOSI
I
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
SPI_MOSI
Left floating when not in use
39
SPI_MISO
O
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
SPI_MISO
Left floating when not in use
40
SPI_CLK
O
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
SPI_CLK
Left floating when not in use
41
I2C_SCL
OD
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
H
I2C interface clock signal
Left floating when not in use
42
I2C_SDA
OD
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
H
I2C interface data signal
Left floating when not in use
43
ADC2
I
-
Analog to digital converter interface 2
Connect 1k in series when in use; left
floating when not in use
44
ADC1
I
-
Analog to digital converter interface 1
Connect 1k in series when in use; left

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Pin
Pin Name
I/O
Level
Reset
Value
Description
floating when not in use
45
ADC0
I
-
Analog to digital converter interface 0
Connect 1k in series when in use; left
floating when not in use
46
GND
G
-
Ground
47
NC
-
-
NC
48
GND
G
-
Ground
49
ANT_MAIN
I/O
-
Main antenna
50
GND
G
-
Ground
51
GND
G
-
Ground
52
GND
G
-
Ground
53
GND
G
-
Ground
54
GND
G
-
Ground
55
NC
-
-
NC
56
GND
G
-
Ground
57
VBAT_RF
PI
Vmax=4.2V
Vmin=3.4V
Vnorm=3.8V
RF power input (3.4V-4.2V)
58
VBAT_RF
PI
Vmax=4.2V
Vmin=3.4V
Vnorm=3.8V
RF power input (3.4V-4.2V)
59
VBAT_BB
PI
Vmax=4.2
Vmin=3.4V
Vnorm=3.8V
Baseband power input (3.4V-4.2V)
60
VBAT_BB
PI
Vmax=4.2
Vmin=3.4V
Vnorm=3.8V
Baseband power input (3.4V-4.2V)
61
STATUS
O
VOHmin=1.35V
VOLmax=0.45V
L
Reserved
Left floating when not in use
62
RI*
O
VOLmax=0.45V
VOHmin=1.35V
L
Module output ring indicator
Left floating when not in use
63
DCD*
O
VOLmax=0.45V
VOHmin=1.35V
L
Module output carrier detection
Left floating when not in use
64
RTS
O
VOLmax=0.45V
VOHmin=1.35V
L
DTE request to send data
Left floating when not in use

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Pin
Pin Name
I/O
Level
Reset
Value
Description
65
CTS
I
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
Module clear to send
Left floating when not in use
66
DTR*
I
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
DTE ready
Left floating when not in use
67
TXD
O
VOLmax=0.45V
VOHmin=1.35V
Module Transmit data
Left floating when not in use
68
RXD
I
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
Module Receive data
Left floating when not in use
69
USB_DP
I/O
USB signal DP
Left floating when not in use
70
USB_DM
I/O
USB signal DM
71
USB_VBUS
PI
Vmax=5.25V
Vnorm=5.0V
USB plug detection
Left floating when not in use
72
GND
G
-
Ground
73
SPK_P
O
SPK_P
Left floating when not in use
74
SPK_N
O
SPK_N
Left floating when not in use
75
MIC_P
I
MIC_P
Left floating when not in use
76
GND
G
Ground
77
MIC_N
I
MIC_N
Left floating when not in use
78
KEYIN1
I
KEYIN1
Left floating when not in use
79
KEYIN2
I
KEYIN2
Left floating when not in use
80
KEYIN3
I
KEYIN3
Left floating when not in use

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved
FIBOCOM L610-LA Series Hardware Guide Page
19
of
49
Pin
Pin Name
I/O
Level
Reset
Value
Description
81
KEYIN4
I
KEYIN4
Left floating when not in use
82
KEYIN5
I
KEYIN5
Left floating when not in use
83
KEYOUT0
I
KEYOUT0
Left floating when not in use
84
KEYOUT1
I
KEYOUT1
Left floating when not in use
85-112
GND
G
-
Ground
113
KEYOUT2
I
KEYOUT2
Left floating when not in use
114
KEYOUT3
I
KEYOUT3
Left floating when not in use
115
USB_BOOT
I
-
USB_BOOT
Enter DL mode before upgrading
116
NC
-
NC
117
CLK26M_OUT
O
CLK26M_OUT
Left floating when not in use
118
NC
-
NC
119
LCD_FMARK
O
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
L
LCD_FMARK
Left floating when not in use
120
LCD_RSTB
O
H
LCD_RSTB
Left floating when not in use
121
SPILCD_SEL
O
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
L
SPILCD_SEL
Left floating when not in use
122
SPILCD_CS
O
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
L
SPILCD_CS
Left floating when not in use
123
SPILCD_CLK
O
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
L
SPILCD_CLK
Left floating when not in use

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved
FIBOCOM L610-LA Series Hardware Guide Page
20
of
49
Pin
Pin Name
I/O
Level
Reset
Value
Description
VIHmax=2.0/2.8V*
124
SPILCD_SDC
O
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
L
SPILCD_SDC
Left floating when not in use
125
SPILCD_SI/O
I/O
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/2.8V*
L
SPILCD_SI/O
Left floating when not in use
126
GPIO1
I/O
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
GPIO1
Left floating when not in use
127
PM_EN_WLAN
O
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
PM_EN_WLAN
Left floating when not in use
128
NC
-
NC
129
SD1_DATA3
I/O
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
SD1_DATA3
Left floating when not in use
130
SD1_DATA2
I/O
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
SD1_DATA2
Left floating when not in use
131
SD1_DATA1
I/O
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
SD1_DATA1
Left floating when not in use
132
SD1_DATA0
I/O
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
SD1_DATA0
Left floating when not in use
133
SD1_CLK
O
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
SD1_CLK
Left floating when not in use
134
SD1_CMD
I/O
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
SD1_CMD
Left floating when not in use
135
WAKE_WLAN
O
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
L
WAKE_WLAN
Left floating when not in use