Fibocom L-831-EA User manual

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L831-EA Module Hardware
User Manual
Version: V1.0.1
Date: 2015-02-12

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Confidential Material
This document contains information highly confidential to Fibocom Wireless Inc. (Fibocom). Fibocom
offers this information as a service to its customers, to support application and engineering efforts that use
the products designed by Fibocom. The information provided is based upon requirements specifically
provided to Fibocom by the customers. All specifications supplied herein are subject to change.
Disclosure of this information to other parties is prohibited without the written consent of Fibocom.
Copyright
Copy, Reproduce, Distribute and/or Edit of this document or part of it as well as utilization of its contents
and communication thereof to others without express authorization are prohibited. Offenders will be held
liable for payment of damages. All rights created by patent grant or registration of a utility model or design
patent are reserved. Copyright ©2015 Fibocom Wireless Inc. All rights reserved.
Trademarks Notice
The FIBOCOM Logo is registered by Fibocom Wireless Inc. All other product or service names or logos
are the property of their respective owners. Copyright ©2015 Fibocom Wireless Inc. All rights reserved.

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FOR FCC
Federal Communications Commission (FCC) Declaration of Conformity
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This device has been tested and found to comply with the limits for a Class B digital , pursuant to Part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiated radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help.
FCC Caution:
Changes or modifications not expressly approved by the party responsible for compliance could void the
user‘s authority to operate the equipment.
RF Exposure Information
This device meets the government’s requirements for exposure to radio waves.
This device is designed and manufactured not to exceed the emission limits for exposure to radio
frequency (RF) energy set by the Federal Communications Commission of the U.S. Government.

This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In
order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to
the antenna shall not be less than 20cm (8 inches) during normal operation.

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IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC
compliance requirement of the end product, which integrates this module. 20cm minimum distance has to
be able to be maintained between the antenna and the users for the host this module is integrated into.
Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled
environment can be satisfied.
Any changes or modifications not expressly approved by the manufacturer could void the user's authority
to operate this equipment.
USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm separation
with the antenna while this end product is installed and operated. The end user has to be informed that
the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end
user has to also be informed that any changes or modifications not expressly approved by the
manufacturer could void the user's authority to operate this equipment. If the size of the end product is
smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users
manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference and (2) this device must accept any
interference received, including interference that may cause undesired operation.
LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains TX FCC ID:
ZMOL831". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19
statement has to also be available on the label: This device complies with Part 15 of FCC rules.
Operation is subject to the following two conditions: (1) this device may not cause harmful interference
and (2) this device must accept any interference received, including interference that may cause
undesired operation.

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Revision History
Version
Date
Remarks
V1.0.0
2014-12-30
Initial version
V1.0.1
2015-02-12
Update the consumption and the power on/off timing

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Applicability Table
No.
Type
Note
1
L831-EA
The difference of L831-EA wireless module as listed below:
Model Type
LTE FDD
WCDMA
GSM/GPRS/EDGE
L831-EA
Band
1,2,3,4,5,7,8,13,17,
18,19,20
Band 1,2,4,5,8
850/900/1800/1900MHz

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Contents
IMPORTANT NOTE:................................................................................................................................................... 4
1 Preface..................................................................................................................................................................... 10
1.1 Outline........................................................................................................................................................... 10
1.2 Standards..................................................................................................................................................... 10
2 Introduction.............................................................................................................................................................. 12
2.1 Description................................................................................................................................................... 12
2.2 Specifications...............................................................................................................................................12
2.3 Appearance.................................................................................................................................................. 15
3 Mechanical...............................................................................................................................................................16
3.1 Dimension.....................................................................................................................................................16
3.2 Application Interface Description..............................................................................................................17
3.3 M.2 Connector............................................................................................................................................. 18
4 Hardware Overview................................................................................................................................................19
4.1 Pins Definition..............................................................................................................................................19
4.1.1 Pins Number.....................................................................................................................................19
4.1.2 Pins Description............................................................................................................................... 20
5 Hardware Interface.................................................................................................................................................24
5.1 Power Interface........................................................................................................................................... 24
5.1.1 Power Supply................................................................................................................................... 24
5.1.2 VSD2_1V8........................................................................................................................................ 24
5.2 Power on/off and Reset Signal................................................................................................................. 25
5.2.1 Power on/off Signal......................................................................................................................... 25
5.2.1.1 Power on................................................................................................................................25
5.2.1.2 Power off................................................................................................................................25
5.2.1.3 Recommended Circuit Design of Power on/off signals................................................. 26
5.2.2 RESET Signal.................................................................................................................................. 27
5.3 Index Signal................................................................................................................................................. 28
5.3.1 Index Signal Pins............................................................................................................................. 28
5.4 USB Interface...............................................................................................................................................28
5.4.1 Definition of USB Interface.............................................................................................................28
5.4.2 Application for USB Interface........................................................................................................ 29
5.5 USIM Interface.............................................................................................................................................29

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5.5.1 USIM Pins......................................................................................................................................... 30
5.5.2 Description of USIM........................................................................................................................ 30
5.5.2.1 “Normally Closed”SIM Circuit Design............................................................................ 30
5.5.2.2 “Normally Open” SIM Circuit Design.................................................................................31
5.5.3 USIM Design Points........................................................................................................................ 31
5.5.4 USIM Hot Plug..................................................................................................................................32
5.5.4.1 Hardware Connection..........................................................................................................32
5.5.4.2 Software Configuration........................................................................................................32
5.6 Digital Audio................................................................................................................................................. 32
5.6.1 Description of I2S Interface............................................................................................................33
5.6.2 Description of PCM Interface.........................................................................................................33
5.7 Android/Win8Dual System Switch Control Interface.............................................................................34
5.8 W_DISABLE# Interface............................................................................................................................. 34
5.8.1 Description of WWAN_DISABLE# Interface...............................................................................34
5.8.2 Description of GPS_DISABLE# Interface................................................................................... 35
5.9 TX_BLANKING Interface........................................................................................................................... 35
5.10 The WAKEUP_HOST Interface..............................................................................................................35
5.11 BODY_SAR Interface............................................................................................................................... 36
5.12 Description of I2C Interface.................................................................................................................... 36
5.13 Clock Interface.......................................................................................................................................... 36
5.14 Config Interface......................................................................................................................................... 36
5.15 RF Interface............................................................................................................................................... 37
5.15.1 Description of RF Connector....................................................................................................... 37
5.15.2 Description of RF Connecting Seat............................................................................................37
5.15.3 Main Performance of RF Connector.......................................................................................... 38
5.16 Other Interfaces........................................................................................................................................ 39
6 Electrical and Environmental................................................................................................................................ 40
6.1 Electrical....................................................................................................................................................... 40
6.2 Environmental..............................................................................................................................................40
7 RF Interface............................................................................................................................................................. 41
7.1 Operating Band........................................................................................................................................... 41
7.1.1 Antenna Band...................................................................................................................................41
7.2 RF PCB Design........................................................................................................................................... 41
7.2.1 Routing Principle..............................................................................................................................41

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7.2.2 Impedance Design...........................................................................................................................42
7.3 Antenna Design........................................................................................................................................... 42
7.3.1 Antenna Design Requirements..................................................................................................... 42

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1 Preface
1.1 Outline
The document outlines the electrical, RF performance, mechanical size and application environment of
L831-EA wireless module. Under the help of the document and others application notice, the application
developer could understand quickly the performance of L831-EA series wireless module, and developing
the product.
1.2 Standards
The products `reference design standard as listed below:
3GPP TS 27.007 -v6.9.0: AT command set for User Equipment (UE)
3GPP TS 27.005 -v6.0.1: Use of Data Terminal Equipment -Data Circuit terminating Equipment
(DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
3GPP TS 23.040 -v6.9.0: Technical realization of Short Message Service (SMS)
3GPP TS 24.011 -v6.1.0: Point- to - Point (PP) Short Message Service (SMS) support on mobile
radio interface
3GPP TS 27.010 -v6.0.0: Terminal Equipment to User Equipment (TE-UE) multiplexer protocol
3GPP TS 27.060 -v6.0.0: Packet domain; Mobile Station (MS) supporting Packet Switched services
3GPP TS 25.304-v6.10.0: User Equipment (UE) procedures in idle mode and procedures for cell
reselection in connected mode
3GPP TS 25.308 -v6.4.0: High Speed Downlink Packet Access (HSDPA); Overall description;
Stage 2
3GPP TS 25.309 -v6.6.0: FDD enhanced uplink; Overall description; Stage 2
3GPP TS 23.038 -v6.1.0: Alphabets and language - specific information
3GPP TS 21.111 -v6.3.0: USIM and IC card requirements
3GPP TS 31.111 -v6.11.0 "USIM Application Toolkit (USAT)"
3GPP TS 45.002 -v6.12.0: Multiplexing and multiple access on the radio path
3GPP TS 51.014 -v4.5.0: Specification of the SIM Application Toolkit for the Subscriber Identity
Module - Mobile Equipment (SIM-ME) interface
3GPP TS 51.010 -1 -v6.7.0: Mobile Station (MS) conformance specification; Part 1: Conformance
specification
3GPP TS 22.004 -v6.0.0: General on supplementary services

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3GPP TS 23.090 -v6.1.0: Unstructured Supplementary Service Data (USSD); Stage 2
3GPP TS 24.008 v6.19, Mobile radio interface Layer 3 specification;
3GPP TS 25.101 V7.18.0: User Equipment (UE) radio transmission and reception (FDD)
3GPP TS 36.101 V9.18.0: User Equipment (UE) radio transmission and reception
3GPP TS 36.104 V9.13.0: Base Station (BS) radio transmission and reception
3GPP TS 36.106 V9.4.0: FDD Repeater radio transmission and reception
3GPP TS 36.113 V9.5.0: Base Station (BS) and repeater ElectroMagnetic Compatibility (EMC)
3GPP TS 36.124 V9.2.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals
and ancillary equipment
3GPP TS 36.133 V9.18.0: Requirements for support of radio resource management
3GPP TS 34.121-1 version 7.2.0: The requirements and this test apply to all types of UTRA for the
FDD UE
3GPP TS 36.521-1 User Equipment (UE) conformance specification; Radio transmission and
reception; Part 1: Conformance testing
3GPP TS 34.122 V5.7.0: Technical Specification Group Radio Access Network; Radio transmission
and reception (TDD)
3GPP TS 45.005 9.4.0: Digital cellular telecommunications system (Phase 2+);Radio transmission
and reception

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2 Introduction
2.1 Description
L831-EA modules are highly integrated LTE M.2 wireless communication modules, supports 3 module 12
band and the global main 4G/3G/2G modes (LTE FDD/WCDMA/GSM) These bands support the mobile
operators `cellular network of the Europe & Asia-Pacific and American marketing.
2.2 Specifications
Specifications
Bands
L831-EA
LTE FDD: Band 1,2,3,4,5,7,8,13,17,18,19,20
WCDMA HSPA+: Band 1,2,4,5,8
GSM/GPRS/EDGE: 850/900/1800/1900MHz
Data
LTE FDD
Category 4 (150Mbps DL,50Mbps UL)
UMTS/HSDPA/HSUPA
3GPP Rel.8
DC-HSDPA 42Mbps(Cat24)/42Mbps(Cat20)
HSUPA 11.5Mbps(Cat7)
GSM 3GPP release 7
EDGE (E-GPRS) multi-slot class 33(296kbps DL，
236.8kbps UL)
GPRS multi-slot class 33 (107kbps DL，85.6kbps UL)
Physical
Dimension : 32mm x 42mm x 2.3 mm
Interface : M.2
Weight : 5.9 grams
Environment
Operating Temperature: -30℃~ +55℃
Storage Temperature: -40℃~ +85℃
Performance
Operating Voltage
Voltage：3.135V ~ 4.4V Normal：3.3V
Operating Current
(Typical Value)
5.5mA (Sleep Mode)
3G Idle：16mA
LTE FDD Idle: 17mA
LTE FDD DATA：700mA
WCDMA Talk：580mA

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2G Talk：300mA (GSM PCL5)
Interfaces
RF Interface
Antenna : Mainx1，Diversityx1
Function Interface
1 x USB 2.0，Multiple Profiles over USB
SIM Support，I2C Support，I2S/PCM Support
GPIO，Clock
Data Features
Protocol Stack
Embedded TCP/IP and UDP/IP protocol stack
EDGE
Multi-slot class 33 (5 Down; 4 Up; 6 Total)
Coding Scheme MCS1~9
GPRS
Multi-slot class 33 (5 Down; 4 Up; 6 Total)
Coding Scheme MCS1~4
CSD
UMTS(14.4kbps)，GSM(9.6kbps)
USSD
Support
SMS
MO / MT Text and PDU modes
Cell broadcast
Audio
Digital Audio
Voice coders :EFR/HR/FR/AMR
VoLTE (not support yet）
Audio Control
Gain control
Character Set
IRA，GSM，UCS2，HEX
AT commands
FIBOCOM proprietary AT commands
GSM 07.05
GSM 07.07
Accessories
Firmware Loader Tool over USB
User Manual
Developer Kit

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Note:
1. Please make sure the temperature for device will not be higher than 55˚C.
2. The minimum distance between the user and/or any bystander and the radiating structure of the
transmitter is 20cm.
3. Assessment of compliance of the product with the requirements relating to the Radio and
Telecommunication Terminal Equipment Directive (EC Directive 1999/5/EC) was performed by
PHOENIX TESTLAB (Notified Body No.0700),

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2.3 Appearance
The following pictures show the L831-EA wireless module.
Top view:
Figure 2- 1 Top View
Bottom view:
Figure 2- 2 Bottom View

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3 Mechanical
3.1 Dimension
Figure3- 1Dimension Diagram

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3.2 Application Interface Description
L831-EA module uses 75-pin gold fingers as the external interface, the size of the module please refer to
the section3.1.
As shown in Figure 4-2, L831-EA module uses the 75-pin fingers interface (67pin is the signal interface
and Pin8 is notch).
About the naming rules of M.2, L831-EA adopts the Type 3042-S3-B (30mmx42mm,the maximum
thickness of element layer of Top surface is 1.5mm, the thickness of PCB is 0.8mm, Key ID is B).

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3.3 M.2 Connector
Recommend to use the M.2 connector from LOTES, the type is APCI0026-P001A,the package of
connector design please refer to the relevant specifications.
As shown in Figure 3-2:
Figure 3-2 Size of APCI0026-P001A M.2 connector

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4 Hardware Overview
4.1 Pins Definition
4.1.1 Pins Number
CONFIG_2
75
74
+3.3V
GND
73
72
+3.3V
GND
71
70
+3.3V
CONFIG_1
69
68
CLK32K
RESET#
67
66
SIM_DETECT
ANTCTL3
65
64
NC
ANTCTL2
63
62
NC
ANTCTL1
61
60
NC
ANTCTL0
59
58
NC
GND
57
56
NC
NC
55
54
NC
NC
53
52
NC
GND
51
50
NC
NC
49
48
TX_BLANKING
NC
47
46
SYSCLK
GND
45
44
GNSS_IRQ
NC
43
42
GNSS_SDA
NC
41
40
GNSS_SCL
GND
39
38
NC
SSIC-TXP/USB3.0-TX+(NC)
37
36
UIM_PWR
SSIC-TXN/USB3.0-TX-(NC)
35
34
UIM_DATA
GND
33
32
UIM_CLK
SSIC-RXP/USB3.0-RX+(NC)
31
30
UIM_RESET
SSIC-RXN/USB3.0-RX-(NC)
29
28
I2S_WA
GND
27
26
W_DISABLE2#
DPR
25
24
I2S_RX
WOWWAN#
23
22
I2S_TX
CONFIG_0
21
20
I2S_CLK
Notch
Notch
Notch
Notch
Notch
Notch
Notch
Notch
GND
11
10
LED1#(3.3V)
USB D-
9
8
W_DISABLE1#(3.3V)
USB D+
7
6
FUL_CARD_POWER_OFF#(1.8V)
GND
5
4
+3.3V
GND
3
2
+3.3V

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CONFIG_3
1
Figure4- 2 Pins Definition (Top View)
4.1.2 Pins Description
The description of L831-EA pins as listed below:
Pin#
Name
I/O
Reset
Value
Idle
Value
Description
1
CONFIG_3
O
L
L
The internal connects with GND, the
interface type of L831-EA module is
WWAN-SSIC0.
2
+3.3V
PI
The main power input, the voltage
range is: 3.135V ~ 4.4V
3
GND
GND
4
+3.3V
PI
The main power input, the voltage
range is: 3.135V ~ 4.4V
5
GND
GND
6
FUL_CARD_POWER_OFF#
I
PU
PU
Off control signal，the internal 200K
ohm will be pulled down, CMOS 1.8V
7
USB D+
I/O
USB 2.0 signal+
8
W_DISABLE1#
I
PU
PU
WWAN Disable, Low active, CMOS
3.3V
9
USB D-
I/O
USB 2.0 signal-
10
LED1#
O
OD
OD
System status LED，drain output, low
level is available, CMOS 3.3V
11
GND
GND
12
Notch
Notch
13
Notch
Notch
14
Notch
Notch
15
Notch
Notch
16
Notch
Notch
17
Notch
Notch
18
Notch
Notch
19
Notch
Notch
20
I2S_CLK
O
T
T
I2S serial clock，CMOS 1.8V
21
CONFIG_0
O
NC
NC
NC，the interface type of L831-EA