Fn-Link 6189N-SFC User manual

6189N6)&
:L)L0RGXOH9
Module manual

6189N6)&:L)L0RGXOH9
Customer Approval :
Company
Title
Signature
Date
Fn-Link

6189N-SFC
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Revision History
Version Date Revision Content Draft Approved
1.0 2019/01/10 New version Lzm Lxy
1.1 2019/04/10 Update thickness dimension Lxy Szs
1.2 2019/08/06 Update packing information Lxy Szs
1.3 2019/11/12 Update module photo Lxy Szs

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CONTENTS
1 Overview....................................................................................................................................1
1.1 Introduction......................................................................................................................... 1
1.2 Features.............................................................................................................................. 1
1.3 General Specification........................................................................................................ 2
1.4 Recommended Operating Rating....................................................................................2
※1.5 EEPROM Information....................................................................................................2
2 General Specification.............................................................................................................2
2.1 Wi-Fi RF Specifications.....................................................................................................2
3 Pin Assignments..................................................................................................................... 3
3.1 Pin Outline...........................................................................................................................3
3.2 Pin Definition.......................................................................................................................4
4 Dimensions...............................................................................................................................5
4.1 Module Picture................................................................................................................... 5
4.2 Marking Description...........................................................................................................5
4.3 Module Physical Dimensions........................................................................................... 6
4.4 Layout Reference...............................................................................................................7
6 Host Interface Timing Diagram............................................................................................8
6.1 SDIO Pin Description........................................................................................................ 8
6.2 SDIO Default Mode Timing Diagram.............................................................................. 9
6.3 SDIO Power-on sequence................................................................................................9
7 Reference Design................................................................................................................. 10
8 Ordering Information........................................................................................................... 11
9 The Key Material List........................................................................................................... 11
10 Environmental Requirements..........................................................................................11
10.1 Recommended Reflow Profile..................................................................................... 11
10.2 Patch Wi-Fi modules installed before the notice...................................................... 12
11 Package................................................................................................................................. 13
11.1 Reel..................................................................................................................................13
11.2 Packaging Detail............................................................................................................ 13

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1 Overview
1.1 Introduction
6189N-SFC is a highly integrated and excellent performance Wireless LAN (WLAN)
SDIO network interface device. High-speed wireless connection up to 150 Mbps. It can
be easily manufactured on SMT process.
This WLAN Module design is based on Realtek RTL8189FTV-VC-CG. It is a highly
integrated single-chip Wireless LAN (WLAN) SDIO network interface controller
complying with the 802.11n specification. It combines a MAC, a 1T1R capable baseband,
and RF in a single chip. It is designed to provide excellent performance with low power
Consumption and enhance the advantages of robust system and cost-effective.
This compact module is a total solution for Wi-Fi technology. The module is specifically
developed for Smart phones and Portable devices.
1.2 Features
Operate at ISM frequency bands (2.4GHz)
CMOS MAC, Baseband PHY, and RF in a single chip for 802.11b/g/n compatible
WLAN
Wi-Fi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbps
downstream and 150 Mbps upstream PHY rates

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FN-LINK TECHNOLOGY LIMITED Proprietary & Confidential Information
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1.3 General Specification
Model Name 6189N6)&
Product Description S:L)L0RGXOH9
Dimension L x W x T: 23 x 21 x 4.8 (typical) mm
Wi-Fi Interface Support SDIO
Operating temperature 0°C to 70°C
Storage temperature -55°C to +125°C
1.4 Recommended Operating Rating
Min. Typ. Max. Unit
Operating Temperature 0 25 70 deg.C
VBAT 3.0 3.3 3.6 V
VDDIO 1.7 1.8 or 3.3 3.6 V
※1.5 EEPROM Information
WI-FI
Vendor ID 024C
Product ID F179
2 General Specification
2.1 Wi-Fi RF Specifications
Features Descriptions
Main Chipset Realtek RTL8189FTV-VC-CG
Operating Frequency 2.400～2.4835GHz
Operating Voltage 3.3Vdc ±10% I/O supply voltage
Host Interface SDIO/GSPI
WIFI Standard Wi-Fi:
IEEE 802.11b,
IEEE 802.11g,
IEEE 802.11n,
Modulation Wi-Fi:
802.11b: CCK(11, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps),
802.11 g/n: OFDM

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PHY Data rates Wi-Fi:
802.11b: 11, 5.5, 2, 1 Mbps
802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps
802.11n: up to 150Mbps
Transmit Output
Power
Wi-Fi:
802.11b@11Mbps 15±2dBm
802.11g@54Mbps 14±2dBm
802.11n@65Mbps 14±2dBm
Other rate power control by power by rate.
EVM 802.11b /11Mbps: EVM≦-9dB
802.11g /54Mbps: EVM≦-25dB
802.11n /65Mbps: EVM≦-28dB
Receiver Sensitivity
(HT20)
802.11b@8% PER
11Mbps< -82dBm
802.11g@10% PER
54Mbps< -71dBm
802.11n@10% PER
MCS 7 <-67dBm
Operating Channel Wi-Fi 2.4GHz:
11: (Ch. 1-11) – United States(North America)
13: (Ch. 1-13) – Europe
14: (Ch. 1-14) – Japan
Media Access Control Wi-Fi: CSMA/CA with ACK
Network Architecture Wi-Fi: Ad-hoc mode (Peer-to-Peer )
Infrastructure mode
Software AP
Wi-Fi Direct
Security Wi-Fi: WPA, WPA-PSK, WPA2, WPA2-PSK, WEP 64bit & 128bit,
Antenna On Board antenna
OS Supported Android /Linux/ Win CE /iOS /XP/WIN7
Dimension Typical L x W x H 23x21x4.8mm
3 Pin Assignments
3.1 Pin Outline
<TOP>

6189N6)&
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1
2
3
45678910 11 12 13 14 15 16
17
18
19
GND
VBAT
NC
VDDIO
GND CHIP_EN
WL_WAKE_HOST
SD_D2 SD_D3 SD_CMD SD_CLK SD_D0 SD_D1
GND
GND
GND
GND
GND
GND
3.2 Pin Definition
NO. Name Type Description Voltage
1 GND Ground connections
2 GND Ground connections
3 GND Ground connections
4 VBAT P Supply 3.3V 3.3V
5 NC Floating (Don’t connected to
ground)
6 VDDIO P I/O Voltage supply input 1.8V to
3.3V 1.8V ~ 3.3V
7 GND Ground connections
8 CHIP_EN I Wi-Fi enable pin, default pull high 3.3V
9 WL_WAKE_HOST I/O WLAN to wake-up HOST 1.8V ~ 3.3V
10 SD_D2 I/O SDIO Data line 2 1.8V ~ 3.3V
11 SD_D3 I/O SDIO Data line 3 1.8V ~ 3.3V
12 SD_CMD I/O SDIO Command Input 1.8V ~ 3.3V
13 SD_CLK I SDIO Clock Input 1.8V ~ 3.3V

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14 SD_D0 I/O SDIO Data line 0 1.8V ~ 3.3V
15 SD_D1 I/O SDIO Data line 1 1.8V ~ 3.3V
16 GND Ground connections
17 GND Ground connections
18 GND Ground connections
19 GND Ground connections
4.2 Marking Description

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4.3 Module Physical Dimensions
10.5
11.5
0.35
1.15
2.65
4.15
5.65
7.15
8.65
2.65
4.15
5.65
1
23
21
0.7

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4.4 Layout Reference
(unit: mm )
0.35
1.15
2.65
4.15
5.65
7.15
8.65
2.65
4.15
5.65
1
23
21
0.7
11.75
10.75

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6 Host Interface Timing Diagram
6.1 SDIO Pin Description
The module supports SDIO version 2.0 for all 1.8V 4-bit UHSI speeds: SDR12(25 Mbps),
and SDR25(50Mbps) in addition to the 3.3V default speed(25MHz) and high speed (50
MHz). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO
pin. This ‘out-of-band’ interrupt signal notifies the host when the WLAN device wants to
turn on the SDIO interface. The ability to force the control of the gated clocks from within
the WLAN chip is also provided.
SDIO Pin Description
SD 4-Bit Mode
DATA0 Data Line 0
DATA1 Data Line 1 or Interrupt
DATA2 Data Line 2 or Read Wait
DATA3 Data Line 3
CLK Clock
CMD Command Line

6189N-SFC
FN-LINK TECHNOLOGY LIMITED Proprietary & Confidential Information
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6.2 SDIO Default Mode Timing Diagram
6.3 SDIO Power-on sequence
Symbol
Min
Typical
Max
Unit
T33ramp
0.2
-
No Limit
ms
Toff
250
500
1000
ms
T33ramp
0.2
0.5
2.5
ms
T12ramp
0.1
0.5
1.5
ms
TPOR
2
2
8
ms
Tnon_rdy
1
2
10
ms

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7 Reference Design
Note:
1. chip_EN could not use for module power off, please switch the 3.3V power for module on/off.
2.please keep the antenna on no metal area.

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8 Ordering Information
Part No. Description
FG6189NSFC-00 RTL8189FTV-VC-CG b/g/n, Wi-Fi, 1T1R, 23X21mm, SDIO,
PCB V1.0 with antenna
9 The Key Material List
Main Shielding
cover
6189N-SFC V1.0 Shielding cover no insulation layer
14.79x10.72-full height of 1.4 copper, no positioning pin
Main Crystal 26mhz 3225 ±10ppm, 10.5pF, E3SB26E00002SE10C0BB
(HOSONIC)
Main ESD 0402 5.5V 0.1pF GESD1005H5R5CR10GPT(Sunlord)
Main Chipset RTL8189FTV-VC-CG
10 Environmental Requirements
10.1 Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : ≤2 times

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10.2 Patch Wi-Fi modules installed before the notice
Wi-Fi module installed note:
1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness
When open a stencil.
2. Take and use the WIFI module, please insure the electrostatic protective measures.
3. Reflow soldering temperature should be according to the customer the main size of
the products, such as the temperature set at 250 + 5 ℃for the MID motherboard.
About the module packaging, storage and use of matters needing attention are as
follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months,
storage environment conditions: temperature in: < 40 ℃, relative humidity: < 90% r.h.
2. The module vacuum packing once opened, time limit of the assembly:
Card:1) check the humidity display value should be less than 30% (in blue), such as:
30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption.
2.) factory environmental temperature humidity control: ≦-30 ℃,≦60% r.h..
3). Once opened, the workshop the preservation of life for 168 hours.
3. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption.
2). The baking temperature: 125 ℃, 8 hours.
3). After baking, put the right amount of desiccant to seal packages.

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11 Package
11.1 Reel
A roll of 350pcs
11.2 Packaging Detail
the take-up package
Using self-adhesive tape
Size of black tape:44mm*12.48m the cover tape :37.5mm*12.48m
Color of plastic disc:blue
A roll of 350pcs

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NY bag size:420mm*450mm size ：335*335*55mm
The packing case size:335*255*360mm

RF Exposure Information and Statement
This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance of 20 cm
between the radiator and your body. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
5、FCC and IC Statement
This device complies with part 15 of the FCC rules and RSS-247 of Industry Canada. Operation
is subject to the following two conditions: (1) this device may not cause harmful interference,
and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil
ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.
NOTE: The manufacturer is not responsible for any radio or TV interference caused by
unauthorized modifications to this equipment. Such modifications could void the user’ s
authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment
generates uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
-Consult the dealer or an experienced radio/TV technician for help
- This device and its antenna(s) must not be co-located or operating in conjunction with any
other antenna or transmitter.

Instructions to the OEM/Integrator:
This module has been granted modular approval for mobile applications. OEM integrators for host
products may use the module in their final products without additional FCC/ISED (Innovation,
Science and Economic Development Canada) certification if they meet the following conditions.
Otherwise, Additional FCC/IC approvals must be obtained.
The OEM must comply with the FCC labeling requirements. If the module’s label is not visible
when installed, then an additional permanent label must be applied on the outside of the
finished product which states: ”Contains transmitter module FCC ID: 2ASV9-6189N”.
Additionally, the following statement should be included on the label and in the final
product’s user manual:
“This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions: (1) This device may not cause harmful interferences, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.”
The user’s manual for the host product must clearly indicate the operating requirements
and conditions that must be observed to ensure compliance with current FCC / IC RF exposure
guidelines.
The final host / module combination may also need to be evaluated against the FCC Part 15B
criteria for unintentional radiators in order to be properly authorized for operation as
a Part 15 digital device.
This Module is full modular approval, it is limited to OEM installation ONLY.
The module is limited to installation in mobile application.
A separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and difference antenna configurations.
The OEM integrator is responsible for ensuring that the end-user has no manual instruction
to remove or install module.
The Grantee will provide guidance to the Host Manufacturer for compliance with the Part
15B requirements if requested.
Any modifications made to the module will void the Grant of certification ,including
antenna replacement ,the OEM integrator will be responsible for re-evaluating radiated
emission of part 15C,and obtain a separate FCC authorization.
IC labeling requirement for the final end product:
The final end product must be labeled in a visible area with the following “Contains IC:
24909-8188U1PS”
The Host Marketing Name (HMN) must be indicated at any location on the exterior of the host
product or product packaging or product literature, which shall be available with the host
product or online.
Le produit final doit être noté dans une zone visible “Contains IC: 24909-6189N”
Le nom du présentateur (HMN) doit être indiqué dans toute location sur le nom du produit hôte
ou du label ou de la littérature du produit,
Qui doit être disponible avec le produit hôte ou en ligne.