Hewlett Packard Enterprise R8000/3 NA Assembly instructions

MF877-00 Page 1
Template Revision A
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HPE R8000/3 NA & INTL UPS / AF431A & AF432A
HPE R12000/3 NA & INTL UPS / AF429A & AF430A
HPE RP12000/3 NA & INTL UPS / AF436A & AF437A
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
8
Batteries
All types including standard alkaline and lithium
coin or button style batteries
40
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
5 in NA
models; 8
in INTL
models
External electrical cables and cords
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Phillips Screw driver
#2
Phillips Screw driver
Phillips Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove Bezel (located at front of unit, No tools required.) Dispose of components properly.
2. Remove screws from Battery Cover.
3. Remove Battery Packs and set aside.
4. Remove retaining screw from EM.
5. Remove EM and set aside
6. Cut the external power cord with cutting tool. (Located on rear of unit).
7. Remove screws from X-Slot cards and remove X-Slot cards (If installed).
8. Remove screws from Rear Panel
9. Remove Top Cover by sliding towards rear of unit.
10. Caution: Be sure the Battery Packs are removed before continuing or risk of electrical shocks exists. Cut wires retaining
the Rear Panel. Remove and disassemble.
11. Cut wires from Power I/O and Signal I/O and remove.
12. Remove X-Slot enclosure by squeezing and lifting off.
13. Remove capacitors greater than 2.5 cm.
14. Separate the Power I/O and signal I/O assemblies and discard components properly.
15. Remove EMI Board and discard components properly.
16. Remove screws from front of EM and remove 4 screws on side and 2 nuts next to Fans.
17. Slide the lid away from fans and separate. Remove Fans with metal support bracket.
18. Remove cables by unplugging or by using cutting tool.
19. With flat head screwdriver pry capacitors greater than 2.5 cm, remove and discard properly.
20. Remove boards and dispose of components properly.
21. Disassembly of Battery Module Caution: Avoid wearing jewelry during disassembly that can be exposed for electrical
shock. Caution: Batteries are an energy hazard and can cause shock, or burn from high short circuit current. Observe
proper precautions.
22. Expose battery connections by lifting plastic covering. Cutting tape as necessary.
23. Remove battery Terminals and wire harness
24. Remove battery connector and harness. Dispose of components properly.
25. Remove batteries from plastic covering. Dispose of components properly. Batteries should be disposed of at a local
recycling /reuse or hazardous waste center.

MF877-00 Page 3
Template Revision A
HPE instructions for this template are available at MF877-01
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Step 2 – Remove screws from Battery cover

MF877-00 Page 4
Template Revision A
HPE instructions for this template are available at MF877-01
Step 6: Cut the external power cord with cutting tool. (Located on rear of unit.)
Step 7: Remove screws from X-Slot cards and remove X-Slot cards. (If installed)
Step 8: Remove screws from Rear Panel

MF877-00 Page 5
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HPE instructions for this template are available at MF877-01
Step 10: Caution: Be sure the Battery Packs are removed before continuing or risk of
electrical shocks exists. Cut wires retaining the Rear Panel. Remove and disassemble.
Step 11: Cut wires from Power I/O and Signal I/O and remove.

MF877-00 Page 6
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Step 12: Remove X-Slot enclosure by squeezing and lifting off.
Step 13: Remove capacitors greater than 2.5 cm

MF877-00 Page 7
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Step 14: Separate the Power I/O and signal I/O assemblies and discard components
properly

MF877-00 Page 8
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MF877-00 Page 9
Template Revision A
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Step 21: Disassembly of Battery Module
Step 22: Expose battery connections by lifting plastic covering. Cutting tape as necessary.
Step 23: Remove battery Terminals and wire harness.

MF877-00 Page 10
Template Revision A
HPE instructions for this template are available at MF877-01
.