HIMA HIMax X-AI 16 51 User manual

X-AI 16 51
HIMax®
Analog Input Module
Manual

HI 801 179 E Rev. 4.00 (1117)
All HIMA products mentioned in this manual are protected by the HIMA trade-mark. Unless noted
otherwise, this also applies to other manufacturers and their respective products referred to herein.
All of the instructions and technical specifications in this manual have been written with great care and
effective quality assurance measures have been implemented to ensure their validity. For questions,
please contact HIMA directly. HIMA appreciates any suggestion on which information should be
included in the manual.
Equipment subject to change without notice. HIMA also reserves the right to modify the written material
without prior notice.
For further information, refer to the CD-ROM and our website http://www.hima.de and
http://www.hima.com.
© Copyright 2011, HIMA Paul Hildebrandt GmbH + Co KG
All rights reserved
Contact
HIMA contact details:
HIMA Paul Hildebrandt GmbH + Co KG
P.O. Box 1261
68777 Brühl, Germany
Phone: [phone]
Fax: [phone]
E-mail: [email protected]
Type of Change
Revision
index
Revisions
technical editorial
4.00 First Edition of the Manual

X-AI 16 51 Table of Contents
HI 801 179 E Rev. 4.00 Page 3 of 64
Table of Contents
1Introduction ............................................................ 5
1.1 Structure and Use of this Manual......................................................................... 5
1.2 Target Audience..................................................................................................... 5
1.3 Formatting Conventions ....................................................................................... 6
1.3.1 Safety Notes ............................................................................................................ 6
1.3.2 Operating Tips ......................................................................................................... 7
2Safety...................................................................... 8
2.1 Intended Use .......................................................................................................... 8
2.1.1 Environmental Requirements................................................................................... 8
2.1.2 ESD Protective Measures........................................................................................ 8
2.2 Residual Risk ......................................................................................................... 9
2.3 Safety Precautions................................................................................................. 9
2.4 Emergency Information......................................................................................... 9
3Product Description .............................................. 10
3.1 Safety Function.................................................................................................... 11
3.1.1 Reaction in the Event of a Fault............................................................................. 11
3.2 Scope of Delivery................................................................................................. 11
3.3 Type Label ............................................................................................................ 11
3.4 Structure............................................................................................................... 12
3.4.1 Block Diagram........................................................................................................ 13
3.4.2 Indicators ............................................................................................................... 15
3.4.3 Module Status Indicators ....................................................................................... 16
3.4.4 System Bus Indicators ........................................................................................... 17
3.4.5 I/O Indicators.......................................................................................................... 17
3.5 Product Data......................................................................................................... 18
3.6 Connector Boards................................................................................................ 21
3.6.1 Mechanical Coding of Connector Boards .............................................................. 21
3.6.2 Coding of X-CB 020 5X Connector Boards............................................................ 22
3.6.3 Coding of X-CB 021 5X Connector Boards............................................................ 22
3.6.4 Connector Board with Screw Terminals................................................................. 23
3.6.5 Terminal Assignment for Connector Boards with Screw Terminals....................... 24
3.6.6 Connector Board with Cable Plug.......................................................................... 25
3.6.7 Pin Assignment for Connector Boards with Cable Plug......................................... 26
3.7 System Cable X-CA 014....................................................................................... 27
3.7.1 Cable Plug Coding................................................................................................. 28

Table of Contents X-AI 16 51
Page 4 of 64 HI 801 179 E Rev. 4.00
4Start-up................................................................. 29
4.1 Mounting ...............................................................................................................29
4.2 Mounting and Removing the Module..................................................................30
4.2.1 Mounting a Connector Board .................................................................................30
4.2.2 Mounting and Removing the Module......................................................................32
4.3 Module and Channel Modes of Operation..........................................................34
4.3.1 Mode of Operation Module Settings....................................................................... 34
4.3.2 Mode of Operation Channel Settings .....................................................................34
4.3.3 OC Limit and SC Limit............................................................................................ 34
4.3.4 SP LOW and SP HIGH...........................................................................................35
4.3.5 Output of Measured Values.................................................................................... 35
4.4 Configuring the Module in SILworX....................................................................36
4.4.1 Tab: Module ...........................................................................................................37
4.4.2 Tab: I/O Submodule AI16_51.................................................................................38
4.4.3 Tab: I/O Submodule AI16_51: Channels................................................................ 40
4.4.4 Submodule Status [DWORD] ................................................................................. 42
4.4.5 Diagnostic Status [DWORD]...................................................................................43
4.5 Connection Variants.............................................................................................44
4.5.1 Single-Channel Input Wiring................................................................................... 44
4.5.2 Redundant Input Wiring..........................................................................................46
4.5.3 Three-Fold Redundant Input Wiring .......................................................................49
4.5.4 Wiring Transmitters via Field Termination Assembly .............................................53
5Operation .............................................................. 54
5.1 Handling................................................................................................................54
5.2 Diagnosis ..............................................................................................................54
6Maintenance.......................................................... 55
6.1 Maintenance Measures........................................................................................55
6.1.1 Loading the Operating System...............................................................................55
6.1.2 Proof Test...............................................................................................................55
7Decommissioning.................................................. 56
8Transport .............................................................. 57
9Disposal................................................................ 58
Appendix............................................................... 59
Applicable Thermocouples..................................................................................59
Glossary................................................................................................................60
Index of Figures....................................................................................................61
Index of Tables .....................................................................................................62
Index......................................................................................................................63

X-AI 16 51 1 Introduction
HI 801 179 E Rev. 4.00 Page 5 of 64
1 Introduction
The present manual describes the technical characteristics of the module and its use. It
provides information on how to install, start up and configure the module in SILworX.
1.1 Structure and Use of this Manual
The content of this manual is part of the hardware description of the HIMax programmable
electronic system.
This manual is organized in the following main chapters:
Introduction
Safety
Product Description
Start-up
Operation
Maintenance
Decommissioning
Transport
Disposal
Additionally, the following documents must be taken into account:
Name Content Document no.
HIMax
System manual
Hardware description of the
HIMax system
HI 801 001 E
HIMax
Safety manual
Safety functions of the HIMax
system
HI 801 003 E
HIMax
Communication manual
Description of communication
and protocols
HI 801 101 E
SILworX Online Help
(OLH)
Instructions on how to use
SILworX
-
First Steps Introduction to SILworX HI 801 103 E
Table 1: Additional Relevant Manuals
The latest manuals can be downloaded from the HIMA website at www.hima.com. The
revision index on the footer can be used to compare the current version of existing manuals
with the Internet edition.
1.2 Target Audience
This document addresses system planners, configuration engineers, programmers of
automation devices and personnel authorized to implement, operate and maintain the
devices and systems. Specialized knowledge of safety-related automation systems is
required.

1 Introduction X-AI 16 51
Page 6 of 64 HI 801 179 E Rev. 4.00
1.3 Formatting Conventions
To ensure improved readability and comprehensibility, the following fonts are used in this
document:
Bold: To highlight important parts
Names of buttons, menu functions and tabs that can be clicked and
used in SILworX.
Italics: System parameter and variables
Courier Literal user inputs
RUN Operating state are designated by capitals
Chapter 1.2.3 Cross references are hyperlinks even though they are not
particularly marked. When the cursor hovers over a hyperlink, it
changes its shape. Click the hyperlink to jump to the corresponding
position.
Safety notes and operating tips are particularly marked.
1.3.1 Safety Notes
The safety notes are represented as described below.
These notes must absolutely be observed to reduce the risk to a minimum. The content is
structured as follows:
Signal word: danger, warning, caution, notice
Type and source of danger
Consequences arising from the danger
Danger prevention
The signal words have the following meanings:
Danger indicates hazardous situation which, if not avoided, will result in death or serious
injury.
Warning indicates hazardous situation which, if not avoided, could result in death or
serious injury.
Warning indicates hazardous situation which, if not avoided, could result in minor or
modest injury.
Notice indicates a hazardous situation which, if not avoided, could result in property
damage.
NOTICE
Type and source of damage!
Damage prevention
SIGNAL WORD
Type and source of danger!
Consequences arising from the danger
Danger prevention

X-AI 16 51 1 Introduction
HI 801 179 E Rev. 4.00 Page 7 of 64
1.3.2 Operating Tips
Additional information is structured as presented in the following example:
iThe text corresponding to the additional information is located here.
Useful tips and tricks appear as follows:
TIP The tip text is located here.

2 Safety X-AI 16 51
Page 8 of 64 HI 801 179 E Rev. 4.00
2 Safety
All safety information, notes and instructions specified in this manual must be strictly
observed. The product may only be used if all guidelines and safety instructions are
adhered to.
This product is operated in accordance with SELV or PELV. No imminent danger results
from the module itself. The use in Ex-Zone is permitted if additional measures are taken.
2.1 Intended Use
HIMax components are designed for assembling safety-related controller systems.
When using the components in the HIMax system, comply with the following general
requirements
2.1.1 Environmental Requirements
Requirement type Range of values
Protection class Protection class III in accordance with IEC/EN 61131-2
Ambient temperature 0...+60 °C
Storage temperature -40...+85 °C
Pollution Pollution degree II in accordance with IEC/EN 61131-2
Altitude < 2000 m
Housing Standard: IP20
Supply voltage 24 VDC
Table 2: Environmental Requirements
Exposing the HIMax system to environmental conditions other than those specified in this
manual can cause the HIMax system to malfunction.
2.1.2 ESD Protective Measures
Only personnel with knowledge of ESD protective measures may modify or extend the
system or replace modules.
NOTE
Device damage due to electrostatic discharge!
When performing the work, make sure that the working area is free of static and
wear an ESD wrist strap.
If not used, ensure that the device is protected from electrostatic discharge, e.g.,
by storing it in its packaging.

X-AI 16 51 2 Safety
HI 801 179 E Rev. 4.00 Page 9 of 64
2.2 Residual Risk
No imminent danger results from a HIMax module itself.
Residual risk may result from:
Faults in the engineering
Faults in the user program
Faults in the wiring
2.3 Safety Precautions
Observe all local safety requirements and use the protective equipment required on site.
2.4 Emergency Information
A HIMax controller is a part of the safety equipment of a system. If the controller fails, the
system adopts the safe state.
In case of emergency, no action that may prevent the HIMax systems from operating safely
is permitted.

3 Product Description X-AI 16 51
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3 Product Description
The X-AI 16 51 analog input module is intended for use in the programmable electronic
system (PES) HIMax.
The module can be inserted in any of the base plate slots with the exception of the slots
reserved for system bus modules. For more information, refer to the System Manual
(HI 801 001 E).
The module is used to evaluate up to 16 analog input signals.
Various modes of operation can be configured for the analog inputs:
Voltage/temperature, voltage measurement in mV
Thermocouples
Current, current measurement in mA
Pt100, (2-wire circuit, 4-wire circuit)
The module is designed for operation in accordance with the standards for Pt100
resistance thermometers (IEC 60751:2008) and thermocouples (IEC 60584-1:1998).
The module provides two current sources for operating the Pt100 resistance thermometer.
The module has been certified by the TÜV for safety-related applications up to SIL 1
(IEC 61508, IEC 61511 and IEC 62061).
A safety function in accordance with SIL 2 can be achieved with a 1oo2 modules structure
(Chapter 4.5.2), while a 1oo3 structure (Chapter 4.5.3) ensures a safety function in
accordance with SIL 3.
The module can be operated with safety-related modules within one base plate.
The module is non-reactive to the safety-related modules. In particular, this includes EMC,
electrical safety, communication to the X-SB and X-CPU modules and the user program.
Module and connector boards are mechanically coded, see Chapter 3.6.1.
Refer to the HIMax Safety Manual (HI 801 003 E) for more information on the standards
used to test and certify the modules and the HIMax system.

X-AI 16 51 3 Product Description
HI 801 179 E Rev. 4.00 Page 11 of 64
3.1 Safety Function
The module does not perform any safety-related functions.
The module measures the voltage of resistance thermometers and thermocouples with
metrological accuracy.
The module measures the current of sensors with metrological accuracy.
3.1.1 Reaction in the Event of a Fault
If a fault occurs, the initial value (default value = 0) is transmitted to the user program for
the process values. The initial values must be defined by the users. If the raw value is
evaluated instead of the process value, the user must program the monitoring function and
the value in the event of faults from within the user program.
The module activates the Error LED on the front plate.
3.2 Scope of Delivery
The module must be installed on a suitable connector board to be able to operate. If a FTA
is used, a system cable is required to connect the connector board to the FTA. Connector
boards, system cables and FTAs are not included within the scope of delivery.
The connector boards are described in Chapter 3.6, the system cables are described in
Chapter 3.7. The FTAs are described in own manuals.
3.3 Type Label
The type label specifies the following important details:
Product name
Mark of conformity
Bar code (2D or 1D code)
Part number (Part-No.)
Hardware revision index (HW Rev.)
Software revision index (SW Rev.)
Operating voltage (Power)
Ex specifications (if applicable)
Production year (Prod-Year:)
Figure 1: Sample Type Label

3 Product Description X-AI 16 51
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3.4 Structure
The module has 16 inputs which are electrically isolated from one another. The inputs
measure the analog input signals and provide the values to the user program.
The module is equipped with two power sources which can supply current to up to eight
Pt100 resistance thermometers. One of the current sources supplies the odd inputs and the
other the even inputs.
The 16 analog inputs may be used to evaluate the measured values of sensors, Pt100 and
thermocouples.
The type of connector board to be used depends on the mode of operation. The X-CB 020
connector board must be used for the Voltage / Temperature mode of operation, the
X-CB 021 connector board must be used for the Current mode of operation.
The processor system for the I/O module controls and monitors the I/O level. The data and
states of the I/O module are made available to the processor modules via the redundant
system bus. The system bus has a redundant structure for reasons of availability.
Redundancy is only ensured if both system bus modules are inserted in the base plates
and configured in SILworX.
The module is equipped with LEDs to indicate the status of the analog inputs, see
Chapter 3.4.2.

X-AI 16 51 3 Product Description
HI 801 179 E Rev. 4.00 Page 13 of 64
3.4.1 Block Diagram
The following block diagrams illustrate the structure of the modules.
Block Diagram for Connecting Pt100 and Thermocouples
The X-CB 020 connector boards must be used for connecting Pt100 (resistance
thermometer) and thermocouples.
Field Side: Pt100 and Thermocouples
Current Source
Interface
Processor System
System Busses
Figure 2: Block Diagram for Connecting Pt100 and Thermocouples

3 Product Description X-AI 16 51
Page 14 of 64 HI 801 179 E Rev. 4.00
Block Diagram for Connecting Sensors
The X-CB 021 connector boards must be used for connecting sensors.
Field Side: Sensors
Current Source
Interface
Processsor System
System Busses
Figure 3: Block Diagram for Connecting Sensors

X-AI 16 51 3 Product Description
HI 801 179 E Rev. 4.00 Page 15 of 64
3.4.2 Indicators
The following figure shows the LED indicators for the module.
Figure 4: Indicators

3 Product Description X-AI 16 51
Page 16 of 64 HI 801 179 E Rev. 4.00
The LEDs indicate the operating state of the module.
The LEDs on the module are divided into three groups:
Module status indicators (Run, Error, Stop, Init)
System bus indicators (A, B)
I/O indicators (AI 1...16, Field)
When the supply voltage is switched on, a LED test is performed and all LEDs briefly flash
simultaneously.
Definition of Blinking Frequencies
The following table defines the blinking frequencies of the LEDs:
Name Blinking Frequencies
Blinking1 Long (approx. 600 ms) on, long (approx. 600 ms) off
Blinking2 Short (approx. 200 ms) on, short (approx. 200 ms) off, short (approx. 200
ms) on, long (approx. 600 ms) off
Blinking-x Ethernet communication: Flashing in sync with data transfer
Table 3: Blinking Frequencies of LEDs
3.4.3 Module Status Indicators
These LEDs are located on the front plate, on the upper part of the module.
LED Color Status Description
On Module in RUN, normal operation
Blinking1 Module state:
STOP/OS_DOWNLOAD or
OPERATE (only with processor modules)
Run Green
Off Module not in RUN,
observe the other status LEDs
On/Blinking1 Internal module faults detected by self-tests, e.g.,
hardware, software or voltage supply.
Fault while loading the operating system
Error Red
Off Normal operation
On Module state:
STOP / VALID CONFIGURATION
Blinking1 Module state:
STOP / INVALID CONFIGURATION or
STOP / OS_DOWNLOAD
Stop Yellow
Off Module not in STOP, observe the other status LEDs
On Module state: INIT, observe the other status LEDs
Blinking1 Module state: LOCKED, observe to the other status
LEDs
Init Yellow
Off Module state: neither INIT nor LOCKED, observe
the other status LEDs
Table 4: Module Status Indicators

X-AI 16 51 3 Product Description
HI 801 179 E Rev. 4.00 Page 17 of 64
3.4.4 System Bus Indicators
The system bus LEDs are labeled Sys Bus.
LED Color Status Description
On Physical and logical connection to the system bus
module in slot 1.
Green
Blinking1 No physical connection to the system bus module in
slot 1.
A
Yellow Blinking1
The physical connection to the system bus module
in slot 1 has been established.
No connection to a (redundant) processor module
running in system operation.
On Physical and logical connection to the system bus
module in slot 2.
Green
Blinking1 No physical connection to the system bus module in
slot 2.
B
Yellow Blinking1
The physical connection to the system bus module
in slot 2 has been established.
No connection to a (redundant) processor module
running in system operation.
A+B Off Off Neither physical nor logical connection to the
system bus modules in slot 1 and slot 2.
Table 5: System Bus Indicators
3.4.5 I/O Indicators
LED Color Status Description
On
Blinking2
Channel
1...16
Yellow
Off
Depending on the mode of operation, see Chapter 4.3.
Blinking2 Field fault on at least one channel, e.g., open-circuit,
short-circuit, etc. Depending on the configured current
thresholds.
Field Red
Off No field fault displayed!
Table 6: I/O Indicators

3 Product Description X-AI 16 51
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3.5 Product Data
General
Supply voltage 24 VDC, -15 %...+20 %, rP≤5 %, SELV, PELV
Current input min. 500 mA (without channels/current sources)
max. 600 mA
Operating temperature 0...+60 °C
Storage temperature -40...+85 °C
Humidity max. 95 % relative humidity, non-condensing
Type of protection IP20
Dimensions (H x W x D) in mm 310 x 29.2 x 230
Weight approx. 1.4 kg
Table 7: Product Data
Figure 5: Views

X-AI 16 51 3 Product Description
HI 801 179 E Rev. 4.00 Page 19 of 64
Analog inputs
Number of inputs (number of
channels)
16, electrically isolated
Operating range
Current measurement
Voltage measurement
0/4...20 mA
-280…+280 mV
Digital resolution 14-bit
Shunt for current measurement 12.5 Ω, mounted on connector board X-CB 021
Maximum permitted current via shunt 50 mA
Withstand voltage of the input 30 VDC
Interference voltage suppression > 60 dB (common mode 50/60 Hz)
Refresh of measured values (in the
user program)
Cycle time of the user program
Sampling time 2 ms
Metrological accuracy
Metrological accuracy on the entire
temperature range (-10 °C...+70 °C)
± 4 ‰ of final value
Settling time to 99 % of the process
value when the input signal changes
15 ms
Table 8: Specifications for the Analog Inputs

3 Product Description X-AI 16 51
Page 20 of 64 HI 801 179 E Rev. 4.00
Table 25 specifies the tolerances for the thermocouples released for this module.
Metrological accuracy
Temperature range Tolerance 25 °C Tolerance (0...60 °C)
Pt100, snsors -200...+850 °C ± 2 °C ± 2 °C
Table 9: Metrological Accuracy
Current sources
Number of surrent sources 2
Output voltage current sources 28.5 VDC, +0/-10 %
Output current current sources 0.5 mA
Table 10: Product Data for the Current Sources